[IBIS] Package on package modelling.

I hope I'm not repeating any dicussions, but I did not find any info in
the archives.

Have we had any discussions on modelling package on package devices in
IBIS. That would mean modelling the package with forks
And 2 or possibly more IO's in the same device.

I realise that this could probably be done by using VHDL-AMS or possible
verilog-AMS, but than that model would contain two or more drivers and
principly one
Pad IO connected to the wrapper IBIS script, how would a simulator
control which of the drivers to simulate ?

It might also be done by a wrapped SPICE model with the same issues how
will the simulator control which IO to switch.

Another resort would be go to a multi board simulation construct with
two or more diffferent IBIS models, but that would  be simulator
dependent.

How does the Open IBIS forum suggest to model and distribute a model of
a package on package component from the component vendor ?

Best /Anders

---------------------------------------------------------------
Anders Ekholm
Senior Specialist Signal Integrity
CDU and DXU HW design

Ericsson Product Development Unit BTS
SE-164 80 Stockholm, Sweden
Tel: +46 8 404 27 58
Fax: +46 8 757 23 40
email: anders.ekholm@ericsson.com
---------------------------------------------------------------





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