[IBIS] Asian IBIS Summit (China) Sixth Announcement

From: Bob Ross <bob_at_.....>
Date: Mon Aug 20 2007 - 16:36:31 PDT
To All:

The IBIS Open Forum is holding an Asian IBIS Summit Meeting in
Beijing, China, a major technology center on Tuesday, September 11.

Ten companies listed below are co-sponsoring this large event
to be held at the Park Plaza Hotel Bejing.  Like in previous years,
We are planning for about 150 - 200 attendees including several IBIS
experts from the USA.

The program is content is shown below with a full schedule of excellent
technical presentatons.

Note, we are also planning a Summit in Tokyo, Japan on September 14.
You may want to consider this in your travel plans.

Bob Ross
Teraspeed Consulting Group

Lance Wang
IO Methodology, Inc.


-----------------------------------------------------------------------
                          ASIAN IBIS SUMMIT (CHINA)
                        SIXTH CALL FOR PARTICIPATION
-----------------------------------------------------------------------

http://www.eda-stds.org/pub/ibis/summits/sep07a/announcement_chinese.pdf

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

               A S I A N   I B I S   S U M M I T   ( C H I N A )

Time/Date:  Tuesday, September 11, 2007, 8:00 AM to 5:30 PM
             Meeting starts at 9:00 AM

Location:   Park Plaza Hotel
             25 Zhichum Road
             Haiden District
             Beijing 100083
             CHINA

             Tel:     + 86-10-82356699
             E-mail:  beijing@parkplaza-bj.com

             http://www.parkplaza.com/beijingcn_sciencepark

             Venue: HongYun Room, 3rd floor, Beijing Park Plaza Hotel

Content:    Presentations and Discussions

Purpose:    Solicit and exchange IBIS and interconnect model related
             information and ideas.

Primary Sponsor:
             Huawei Technologies

Co-sponsors (in alphabetical order):
             Agilent Technologies, Ansoft Corporation,
             Cadence Design Systems, Intel Corporation,
             Mentor Graphics Corporation,
             Signal Integrity Software (SiSoft),
             Sigrity, Synopsys, and ZTE Corporation.

Cost:       FREE, including refreshments and buffet lunch

Vendors:    Some vendors will have information tables outside
             the meeting room

             Contact us for details regarding sponsorship.

BACKGROUND

    We have held twp successful meetings in Shenzhen and Shanghai.
    This year we are meeting in Beijing, the capital city of the Peoples
    Republic of China.  It contains many high technology companies and
    many development and sales offices of foreign companies.
    Many sites of interest are near the conference hotel.

    Our objective is to reach out internationally to communicate with
    the local experts and to learn of regional concerns.

CONFERENCE LANGUAGE

    The conference language is English, but we will plan for technical
    translations in English and Chinese.  So presenters can optionally
    deliver in Chinese as long as an English version of the material is
    available.

IBIS SUMMIT

    This meeting will be conducted as a formal IBIS Summit Meeting.
    Presentations will be archived in an electronic format on our
    Summits site, and minutes of the meeting will be issued.  However,
    no formal decisions requiring votes will be planned.

CALL FOR PARTICIPANTS

    People involved in IBIS and interconnect model development, EDA
    tool development, and digital circuit design are invited to
    participate to the Summit meeting.  If you plan to participate,
    please register using the information below (in English):

      Name:
      E-mail address:

      Company:
      Top-level Web Link:

      Country:
      Telephone:

      Comments:
        (Such as assistance for the travel requirements at the end)

    Send to BOTH:

      Bob Ross, Teraspeed Consulting Group   bob@teraspeed.com
      Lance Wang, IO Methology, Inc.         lwang@iometh.com

    SIGNUP DEADLINE: September 4, 2007

CALL FOR PRESENTATIONS

    The program is now full.

    Presentation Format:   LCD Projection from meeting laptop computer
    Time:                  15-30 Minutes including questions
    Electronic Archival:   All presentations will uploaded to our public
                           IBIS Summit archives
    Electronic Format:     Power Point or Acrobat
    Presentation Booklet:  Available at the meeting for all attendees

    Presentation Deadline: August 14, 2007 to produce the presentation
                           booklet for the meeting

    Note: Vendor promotional or business information is prohibited.
    Submitted presentations must be in English, although the delivery
    can be in English or Chinese.

AGENDA

    8:15 -   9:00  Sign in, casual conversation, vendor tables
    9:00 -  12:00  Presentations
    12:00 - 13:30  Free buffet lunch, vendor tables
    13:30 - 17:30  Presentations
    17:30 - 18:30  Casual conversations, vendor tables

    The specific agenda will be developed and published later, and
    the following contributions are planned:

    Wang Algebra and Interconnects
    Ross, Bob (Teraspeed Consulting Group, USA)

    IBIS-ATM Update: SerDes Modeling in IBIS
    Westerhoff, Todd (Signal Integrity Software (SiSoft), USA)

    Serial Link Analysis and PLL Model
    Huang, ChunXing (Huawei Technologies, China)

    A Review of Existing Multi-Gbps Serial Channel Analysis Methods and
    the Evolution of the Proposed ATM Algorithmic Modeling Standard
    Dodd, Ian*, Ward, Richard** and Gupta, Sanjeev* (*Agilent
    Technologies, USA and **Texas Instruments, USA)

    An Overview of High-Speed Serial Bus Validation Techniques
    Muranyi, Arpad and Dmitriev-Zdorov, Vladimir
    (Mentor Graphics, USA)

    Modeling and Simulation for Multi-Gigabit Interconnect System
    Zhu, ShunLin, Hu, WeiDong, and Chen, SongRui
    (ZTE Corporation, China)

    Power Deliver System Design Automation
    Xu, Tao (Sigrity, China)

    IBIS 4.2/AMS for DDR2 Timing Analysis
    Guan, Tao (Huawei Technologies, China)

    Validation for IBIS Models
    Wang, Lance*, Zhang, XinJun**, and Yan, Benny**
    (IO Methodology, *USA, **China)

    IBIS Algorithm Including Reactive Loads
    Chen, XueFeng (Synopsys, China)

    Understanding and Using ICM Models
    Meng, YaBao (Cadence Design Systems, China)

    Using S-Parameters for High Performance Simulation
    Li, BaoLong (Ansoft, China)

    Issues Combining Buffer and Interconnect Model
    Mirmak, Michael (Intel Corporation, USA)

    SerDes Modeling: IBIS-AMI Evaluation Toolkit
    Westerhoff, Todd (Signal Integrity Software (SiSoft), USA)

    IBIS AMI Model Developers Toolbox
    Shah, Hemant (Cadence Design Systems, USA)


LIST OF NEARBY HOTELS AND TRAVEL RULES

    Hotels in all price ranges can be found through internet searches.

    A link to the Park Plaza Beijing Science Park Hotel is:

      http://www.parkplaza.com/beijingcn_sciencepark

    Comply with your travel rules, such as indicated in the link
    below to China and Shanghai.  Work with your travel agent.  Notify
    us as a sign-up comment if you need assistance.  Visas, if needed,
    should fall in the visit/business category:

      http://www.travelchinaguide.com/china-visa/

-----------------------------------------------------------------

-- 
Bob Ross
Teraspeed Consulting Group LLC     Teraspeed Labs
121 North River Drive              13610 SW Harness Lane
Narragansett, RI 02882             Beaverton, OR 97008
401-284-1827                       503-430-1065
http://www.teraspeed.com           503-246-8048 Direct
bob@teraspeed.com

Teraspeed is a registered service mark of Teraspeed Consulting Group LLC


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Received on Mon Aug 20 17:36:22 2007

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