As noted in the IBIS Summit at DesignCon last week, the IBIS-ISS
(Interconnect SPICE Subcircuits) document is officially submitted for IBIS
Open Forum review and approval as a specification by the IBIS Interconnect
Task Group.
The draft document may be found at http://www.eda.org/ibis/ibis-iss_wip/.
Comments and discussion are, of course, welcome. This will be discussed at
the next IBIS Open Forum teleconference, on Feb. 18.
Michael Mirmak
Intel Corp.
Chair, IBIS Open Forum
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