RE: [IBIS-Users] IBIS Question

From: Andy Joe <andy_joe123_at_.....>
Date: Wed Jul 27 2005 - 17:59:25 PDT
Thanks Arpad...
Can Mentor and Cadence tool vendors give comment about this if the tools applied the package RLC value to the power and ground pins as well? If not, may I know how the tools handle the effect caused by package parasitic i.e. IR drop?
Thanks.
-Andy

"Muranyi, Arpad" <arpad.muranyi@intel.com> wrote:
Andy,
 
The problem is that the IBIS spec doesn't spell out that
the package parameters are also to be applied to power
and GND pins.  In my opinion they should be used for those
too, but it doesn't mean that all tool vendors do it.
 
Arpad
===========================================================


---------------------------------
From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On Behalf Of Andy Joe
Sent: Wednesday, July 27, 2005 4:18 AM
To: ibis-users@eda.org
Subject: [IBIS-Users] IBIS Question




Hi,

 

I have a question regarding the [Package] keyword in an IBIS file. As far as I am concerned, the RLC values in this section applied to all the I/O pins, my question is if these RLC values also applied to power and ground pins as well? If they are not applied to power and ground pins, how can we address the effects of different packages to the power and ground pins in an IBIS model? (If R_pin, L_pin and C_pin for every single pin are not available, only package min, typ and max RLC are available)

Thanks.

 

-Andy



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Received on Wed Jul 27 18:00:20 2005

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