Re: [IBIS-Users] Re: How and where Alternate Package Models of IBIS Version 4.x gets used?

From: Siva Nageswara Rao Borra <siva_at_.....>
Date: Thu Sep 07 2006 - 01:31:50 PDT
Hi Michael,

Thank you very much.
While obtaining data for Pullup,Pulldown and waveform data,
we can consider only one package, the how would be the extra package 
information is useful to the user?

Regards,
Siva Borra.

Mirmak, Michael wrote:

>Siva,
>
>The alternate package keywords simply enable model authors to reference
>different package electrical descriptions for components that feature
>identical buffer designs.  For example, a component that is available in
>both DIP and surface-mount packages could be represented using one IBIS
>file.  This file would contain the buffer information in the appropriate
>[Model] keywords and include one set of package information under the
>[Package Model] keyword.  Electrical data for any other available
>package designs could be referenced under the [Alternate Package Model]
>keyword.
>
>- Michael Mirmak
>  Intel Corp.
>  Chair, EIA IBIS Open Forum 
>
>-----Original Message-----
>From: owner-ibis-users@server.eda.org
>[mailto:owner-ibis-users@server.eda.org] On Behalf Of Siva Nageswara Rao
>Borra
>Sent: Tuesday, September 05, 2006 00:20
>To: ibis-users@server.eda.org
>Cc: Siva Nageswara Rao Borra; deepti@india.nsc.com
>Subject: [IBIS-Users] Re: How and where Alternate Package Models of IBIS
>Version 4.x gets used?
>
>Hi Expert,
>
>  
>
>>               Can anybody give a clarity on how the 
>>additional/alternate package models are helpful
>>and also how they can be supplied?
>>This is regarding the [Alternate Package]/[End Alternate] Package 
>>models, available on IBIS version 4.x.
>>
>>Thanks in advance for your support.
>>
>>With best regards,
>>Siva Borra.
>>
>>
>>    
>>
>
>
>
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Received on Thu Sep 7 01:28:19 2006

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