RE: [IBIS-Users] Package Modeling for W-element

Timmy,
 
Thanks for your note.  At present, neither IBIS 4.2 nor any earlier
version support trace modeling using the W-element (the W-element is a
proprietary format).
 
You are correct that the IBIS package model options under [Package],
[Pin] and [Package Model]/[Define Package Model] include lumped and
segmented RLC formats.  A third option using matrices is also available
under [Package Model].  We do recognize that all three capabilities in
IBIS may not be appropriate for today's fast-edge-rate designs,
particularly as the loss terms available are not frequency-dependent.  
 
At present, work is underway in the IBIS Open Forum to link the ICM
specification under IBIS to describe packages.  ICM (the IBIS
Interconnect Modeling specification) is available now and defines an
IBIS-like interface to interconnect data, including frequency-dependent
RLGC matrices and S-parameter data using the Touchstone(R) format.
Until ICM can be linked to a model directly under IBIS, users with
access to both can link IBIS buffers and ICM package models within the
system topology.
 
Support for ICM is growing in support in the industry, both in terms of
model providers and EDA tool vendors.  Check with your suppliers
regarding support.  The ICM specification and parser are available
through the IBIS websites linked below.
 
Coincidentally, presentations on both the package modeling problem and
the use of ICM were given at the recent IBIS Summits in Asia:
http://www.eda.org/ibis/summits/index-bydate.htm.
 
I hope this helps!
 
- Michael Mirmak
  Intel Corp.
  Chair, EIA IBIS Open Forum
  http://www.eigroup.org/ibis/
  http://www.eda.org/ibis/

________________________________

From: owner-ibis-users@server.eda.org
[mailto:owner-ibis-users@server.eda.org] On Behalf Of Ibis Model
Sent: Thursday, September 20, 2007 2:09 AM
To: ibis-users@server.eda.org
Subject: [IBIS-Users] Package Modeling for W-element


Hi
 
I'm just wondering if there are already keywords available in the IBIS
v4.1 Specification to represent the package modeling for W-element
model. From the IBIS Spec, I notice that there is the [Define Package
Model] keyword; however, there aren't any sub parameters that actually
represent the frequency dependant element. 
 
I would be glad if someone can answer my concern on bringing this
W-element package modeling in the IBIS file by using new keywords. The
current [Define Package Model] only cater for Lumped RLC and Segmented
RLC package modeling at the moment (please correct me if I'm wrong). So
is there any plan that the IBIS open Forum will look into the W-element
package modeling and add in extra keywords to support this? If yes, when
will it be available?  
 
Looking forward for your reply. Appreciate your attention on this.
 
Regards
Timmy   
 

________________________________

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