Subject: Re: [IBIS] Bird 74
From: Guy deBurgh (gdeburgh@innoveda.com)
Date: Mon Mar 25 2002 - 17:36:03 PST
Hi Pravin,
I would agree that the effect of the heatsink is dependent on the
enclosure, but not the parameter. The data I'm asking for is purely
geometric data and must be the same for all applications using the
same heatsink.
The usage (algorithm) of this data can take into account enclosure
geometry, but enclosure geometry is outside the scope of IBIS, and so
cannot be included here.
(Just as layer stackup is used in signal integrity but is not described
in IBIS.)
Guy
Pravin Patel wrote:
> Guy,
> Heatsink parameter is dependent on the form factor of your box
> design. It can very by box to box dependent on how the airflow define in
> the box. So If vendor provide the data may not be correct for your
> application.
>
> Heatsink 15.0mm 15.0mm 12.0mm
>
> Pravin Patel
> 3039 Cornwallis Road
> RTP, NC 27709
> Email: pravinp@us.ibm.com
> Phone: 919-543-3837
>
>
>
> Guy deBurgh
>
> <gdeburgh@innoved To: ibis@eda.org
>
> a.com> cc:
>
> Sent by: Subject: [IBIS] Bird 74
>
> owner-ibis@eda.or
>
> g
>
>
>
>
>
> 03/19/2002 06:54
>
> PM
>
>
>
>
>
> Attached is Bird 74 "EMI Parameters for IBIS"
>
> #### BIRD74.txt has been removed from this note on March 21 2002 by
> Pravin
> Patel
>
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