CONTENT OF THE ASIAN IBIS OPEN FORUM SUMMIT MEETING
November 14, 2014
Shanghai, China

   .zip  Compressed
   .ppt, .pps  Power Point
   .doc  Word
   .ps   Postscript
   .pdf  Acrobat
   .txt  Text
   .jpg  Pictures

ADMINISTRATIVE DOCUMENTS:

00readme.txt      This Document

a111414.txt        Agenda
m111414.pdf        Minutes

announcement_chinese.pdf  Announcement, Traditional Chinese

CONFERENCE RECORD:

cover.pdf          Cover Page
booklet.pdf        Conference booklet of presentations

cover.pptx         Original Files for editing
cover_poster.pptx

PRESENTATIONS AND ACTUAL TITLES (IN ACTUAL ORDER OF PRESENTATION):

mirmak.zip    Activities and Direction of IBIS (.pptx)
mirmak.pdf    Mirmak, Michael (Intel Corporation, USA)
              [Presented by Anders Ekholm (Ericsson, Sweden)]

biernacki.pdf Handling Of Overclocking Caused by Delay in
              Waveform Tables
              Biernacki, Radek*: Yan, Ming*; Wolff, Randy**;
              Butterfield, Justin**
              (*Keysight Technologies and **Micron Technology, USA)
              [Presented by Zhang, Tao (Keysight Technologies, China)]

chen.pdf      An Effective Solution to Simulate Composite Current
              When Over-clocking
              Chen, XueFeng (Synopsys, China)

sharma.pdf    True Differential IBIS Model for SerDes Analog Buffer
              Sharma, Shivani; Malik, Tushar; and Kukal, Taranjit
              (Cadence Design Systems, India)
              [Presented by Wen, YiTong (Cadence Design Systems, China)]

hou.pdf       Best Practices for High-Speed Serial Link Simulation
              Hou, MingGang (ANSYS, China)

dia.pdf       Connector Via Footprint Optimization for 25Gbps Channel Design
              Dai, WenLiang and Su, ZhouXiang (Xpeedic Technology, China)
              [Presented by Dai, WenLiang (Xpeedic Technology, China)

wei.pdf       Using IBIS-AMI Model for 25Gbps Retimer Simulation
              Wei, MaoXiang; Yin, ChangGang; and Zhu, ShunLin
              (ZTE Corporation, China)
              [Presented by Yin, ChangGang (ZTE Corporation, China)]

mahmod.pdf    IBIS AMI Validation
              Mahmod, Zilwan and Ekholm, Anders (Ericsson, Sweden)
              [Presented by Mahmod, Zilwan (Ericsson, Sweden)]

malik.pdf     Signing IBIS Model Against DDR4 Spec
              Malik, Tushar and Kukal, Taranjit (Cadence Design Systems, India)
              [Presented by Zhong, ZhangMin (Cadence Design Systems, China)]

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Ad Hoc Presentation:

wang.pdf      Inter-pair Skew Effect Analysis Using IBIS-AMI Simulation
              Wang, JianHua; Dong, XiaoQing (Huawei Technologies, China)
              [Presented by Wang, JianHua (Huawei Technologies, China)]

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ross.zip      Corner Consideratons (.pptx)
ross.pdf      Ross, Bob (Teraspeed Labs, USA)
              [Presented by Ekholm, Anders (Ericsson, Sweden)]