Subject: RE: [IBIS-Users] IBIS Package Model with Multiple Ground Planes a nd Redundant Port s
From: Perrin, Jean-Claude (jc-perrin@ti.com)
Date: Wed Nov 13 2002 - 12:46:57 PST
Mike.
I think the best is to consider each bloc i/o with the same power supply as
an identity with its own IBIS model .
after the best is add parasitic elements due to bonding and package
connections and after is to consider each bloc is grounded to same power
plan (PCB) through
these parasitic element .
we have multiground plan as at the chip but it is mandatory for
communication to have a single plane in witch flow all return currents.
I am not sure to be right..
Best Regards
Jean claude Perrin
[Perrin, Jean-Claude] -----Original Message-----
From: Lamson, Mike
Sent: Monday, November 11, 2002 9:45 PM
To: IBIS-users@eda.org
Subject: [IBIS-Users] IBIS Package Model with Multiple Ground Planes and
Redundant Port s
How can an IBIS package model be constructed with multiple ground planes
that have the same input ports at the chip and the same output ports at the
package ball? That is, there are two current paths starting at the same
chip bump and going to the same package ball but on different planes. Does
anyone have an example?
Mike Lamson
|------------------------------------------------------------------
|For help or to subscribe/unsubscribe, email majordomo@eda.org
|with just the appropriate command message(s) in the body:
|
| help
| subscribe ibis <optional e-mail address, if different>
| subscribe ibis-users <optional e-mail address, if different>
| unsubscribe ibis <optional e-mail address, if different>
| unsubscribe ibis-users <optional e-mail address, if different>
|
|or email a written request to ibis-request@eda.org.
|
|IBIS reflector archives exist under:
|
| http://www.eda.org/pub/ibis/email_archive/ Recent
| http://www.eda.org/pub/ibis/users_archive/ Recent
| http://www.eda.org/pub/ibis/email/ E-mail since 1993
This archive was generated by hypermail 2b28 : Wed Nov 13 2002 - 13:02:35 PST