[IBIS-Users] Ground Planes

Dear Masters,

	I have a doubt.

	I have a Thin Client motherboard working. Great! My first high-speed
design! A high-speed design that required traces with controlled impedance
and Signal Integrity knowledges.

	The matter is the follow.... We intend to prototype it through LPKF.
We would like to reduce the time of manufacturing it. So it was proposed to
me, fill the empty spaces of the internal planes of the board stack up with
cooper, and connecting these cooper spaces with the digital ground. 

	My asking... what are the effects of this procedure? What about the
traces impedance and the reference plane? Because I think that the board
will be almost with 3 ground planes...

	Trusting in your help,

Raul Moreira

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