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Date: Mon, 5 Mar 2001 12:56:25 -0800
From: guy@camarillo.innoveda.com (Guy de Burgh)
Message-Id: <200103052056.MAA08396@f22.innoveda.com>
To: ibis@eda.org
Subject: EIA IBIS Open Forum Meeting Minutes


Date: 3/5/01

SUBJECT: 3/02/01 EIA IBIS Open Forum Meeting Minutes

VOTING MEMBERS AND 2001 PARTICIPANTS LIST:
3Com (& CommWorks)             Roy Leventhal*
Agilent                        (Mark Chang)
Ansoft Corporation             (Eric Bracken)
Applied Simulation Technology  Raj Raghuram, Norio Matsui, Fred Balistreri
Avanti                         (Chen Hongyu)
Brocade Communications         Robert Badal
Cadence Design                 Ian Dodd*
Cisco Systems                  Syed Huq, Lungfu Chen
Compaq                         Peter LaFlamme, Ron Bellomio, Quang Dam
Cypress                        (Rajesh Manapat)
EMC Corporation                Brian Arsenault, Jinhua Chen
Fairchild Semiconductor        Adam Tambone*
IBM                            Michael Cohen, Greg Edlund*, Wes Martin,
                               Yeon-Chang Hahm, Bill DeVey, Pravin Patel*
Innoveda (& HyperLynx)         Guy de Burgh*, John Angulo*
Intel Corporation              Stephen Peters*, Arpad Muranyi*, Dave Lorang,
                               Michael Mirmak*, Qinglun Chen, Will Hobbs
LSI Logic                      Larry Barnes*
Mentor Graphics                Bob Ross*, Tom Dagostino, Chris Reid,
                               Mike Donnelly, Hazem Hegazy, Tony Dunbar,
                               Griff Derryberry, Dan Lake, Sherif Hammad
                               Mohammed Korany, Weston Beal
Micron Technology              Randy Wolff*, Yong Phan*
Mitsubishi                     (Tam (Tom) Cao)
Molex Incorporated             Gus Panella, Brian O'Malley
Motorola                       (Ron Werner)
National Semiconductor         Milt Schwartz
Nortel Networks                Calvin Trowell
North East Systems Associates  Edward Sayre
Philips Semiconductor          Zack Ciccone
Quantic EMC                    (Mike Ventham)
Robinson-Nugent, Inc.          (Alexander Barr)
Siemens AG                     Bernhard Unger, Helmut Katzier
Signal Integrity Software      Douglas Burns, Barry Katz, Walter Katz
SiQual                         Scott McMorrow, Rob Hinz, Bernard Voss,
                               Chris Brewster
Texas Instruments              Thomas Fisher, Stephen Nolan, Ramzi Ammar
Time Domain Analysis Systems   Dima Smolyansky, Steve Corey
Tyco Electronics               (Russell Moser)
Via Technologies               (Weber Chuang)
Zuken (& Incases)              (Werner Rissiek)

OTHER PARTICIPANTS IN 2001:
Actel Corporation              Silvia Montoya
Acuson                         Kim Helliwell
AMCC                           Jeff Smith
Apple Computer                 John Figueroa
ASIS Ltd                       David Wright
Cereva Networks                Bob Haller*
EIA                            Cecilia Fleming*
FCI                            Sercu Stefaan
Foundary Networks              Bertram Chan
Framatom Conectors             Danny Morlion
Fujitsu Ltd                    Tadashi Arai, Takeshi Murakami
Huawei Technologies            Rachild Chen
Hyundai Electronics            Jongho Kang
Intrinsix Corporation          Steven Chin
Nokia                          Tapani von Ravner
Oak Technology                 Darmin Jin
Plexus Technology Group        Joseph Socha
STMicroelectronics             Peter Hirt
Xilinx                         Susan Wu
Independent, Consultant        Al Davis

In the list above, attendees at the meeting are indicated by *. Principal
members or other active members who have not attended are in parentheses.
Participants who no longer are in the organization are in square brackets.

Upcoming Meetings:  The bridge numbers for future IBIS teleconferences are as
follows:

  Date                Bridge Number    Reservation #    Passcode
  March 16, 2001      European IBIS Summit Meeting - No Phone Bridge
  March 30, 2001       (916) 356-9200   2-524673         6244264
  April 20, 2001       (916) 356-9200   2-524674         3881934

All meetings are 8:00 AM to 9:55 AM Pacific Time.  We try to have agendas out
7 days before each Open Forum and meeting minutes out within 7 days after.
When you call into the meeting, ask for the IBIS Open Forum hosted by Will
Hobbs and give the reservation number and passcode.

NOTE: "AR" = Action Required.

-------------------------------- MINUTES -------------------------------------
INTRODUCTIONS AND MEETING QUORUM
Bob Haller from Cereva Networks (a 250 person "start-up" company) joined.  Bob
had been active in the past years with another company.  He is now involved as
actively uses IBIS models and is interested in accuracy issues.  Bob also
expressed interest in getting his company to become an official member of the
EIA IBIS Open Forum.

Adam Trambone of Fairchild Semiconductor had attended the Designcon 2001 IBIS
Summit Meeting.  He is responsible for producing IBIS models for several
technologies.


MEMBERSHIP UPDATE AND TREASURER'S REPORT
Bob Ross reported that Signal Integrity Software (SISoft) is now an official
EIA IBIS Open Forum member (and now listed in the Voting Members Participants
List).

Bob stated, as previously reported, that we have about 22 payments out of 36
invoices so far.  Bob said that he is working with Cecilia Fleming on the
final year 2000 results.  He expects credit for some additional revenue that
was not given in the preliminary report at the February 16, 2001 meeting.


REVIEW OF MINUTES AND AR'S
The February 16, 2001 IBIS Minutes were approved without change.

The AR's will be discussed during the meeting.


MISCELLANY/ANNOUNCEMENTS
None.


PRESS AND WEB PAGE UPDATES
Bob Ross reported that Syed Huq made roster updates and added a new logo in
the Poster link.


NEW MODELS AVAILABLE, LIBRARY UPDATE
None.


OPENS FOR NEW ISSUES
During the Meeting, Bob Ross - Version 4.0 Release Plans


INTERNATIONAL/EXTERNAL PROGRESS
- IEC 62014-1 (IBIS Version 3.2) - Cecilia Fleming added more clarification
to the previous report that if the FDIS (Final Draft International Standard)
vote is successful, IBIS Version 3.2 can be published as an official
international standard sometime after April 13, 2001.

- pr EIAJ ED-5302 Standard for I/O Interface Model for Integrated Circuits
(IMIC) - No report.

- IEC PWI 93-1 Models of Integrated Circuits for EMI Behavioral Simulation
(formerly designated as IEC 93/67/NP IBIS and EMC Simulation) - Bob Ross
mentioned that there are three presentations planned at the European IBIS
Summit Meeting in Munich, Germany on March 16, 2001.  This will be discussed
later.  Also, there are two other related presentations on EMI and ground
bounce issues.

- JEDEC JC-16 - Modeling and Testing - No report.

- T10, Project 1414-DT - SCSI Signal Modeling (a Technical Committee of the
National Committee for Information Technology (NCITS)) - Larry Barnes reported
on the meeting held February 20-22, 2001.  Work is progressing on the SCSI
Signal Modeling (SSM) Technical Report.  The Committee is interested in
proposing a "fallback driver" function in IBIS similar to [Driver Schedule]
that reduces the strength of the buffer if a second consecutive bit is
specified.  This functionality is needed soon since the final specification
of the SCSI device will be ready in several months.  Larry also mentioned
that 3-level logic will become standardized in several years, but is not
pushing for this functionality in the current IBIS Standard.  Bob Ross stated
that this would be implemented better in IBIS-X.

Larry commented that the SSM report took much information from the IBIS
Cookbook and adapted it to the SCSI standard.  Bob also mentioned that had a
few editorial comments related to some nomenclature conventions we adopted
after the cookbook was issued.  The document can be retrieved from the
SCSI Signal Modeling Technical Report (SCM) link under:

  http://www.t10.org/ssm.htm

or directly at:

  ftp://ftp.t10.org/drafts/ssm/ssm-r02.pdf

Larry recommended to his Committee members to become involved with the IBIS
Open Forum.


DATE 2001 EUROPEAN IBIS SUMMIT MEETING
Bob Ross introduced the topic by giving the basic information so far on the
European IBIS Summit meeting to be held Friday, March 16, 2000 in Munich,
Germany along with the Design Automation and Testing in Europe (DATE 2001)
conference and exhibit.  The IBIS Summit Meeting is on the day after the trade
show portion of the show.  Bob stated that four companies are co-sponsors of
the meeting: Cadence, Innoveda, Mentor Graphics, and Zuken (Incases).  This
pays for the meeting room, refreshments and free lunch to participants.

Bob stated that a third Announcement was recently sent on February 27, 2001,
with about eleven presentations.  The program now completely filled with
about fourteen presentations, and the meeting will last all day.

So far, Bob estimates about 25 people have signed up, which translates into
about 40 attendees so far.  The next announcement will contain a revised
Agenda and will ask for signup responses to better anticipate the number of
reservations for lunch that is provided.

Bob then went over the additions to the program from the last announcement.
A draft Agenda is listed below.

                         EUROPEAN IBIS SUMMIT MEETING
                         Astron Hotel, Munich Germany
                              MARCH 16, 2001

8:30    REFRESHMENTS

9:00    INTRODUCTIONS AND PROGRAM
        Bob Ross, Mentor Graphics, USA

9:30    Experiences with and Tips for IBIS Models
        Eckhard Lenski, Siemens AG, Germany

10:00   Extraction of Key IBIS Parameters for Easier Model Selection
        John Berrie, Zuken, England

10:30   BREAK

10:45   DOGEN, A Siemens Internal Model Tool, Extension 1999 - 2001
        Hans Pichlmaier, Siemens AG, Germany

11:15   LVDS Modeling
        Hazem Hegazy and Mohammed Korany, Mentor Graphics, Egypt

12:00   LUNCH

13:00   STTL-2 Modeling Experiences
        Bernhard Unger, Siemens AG, Germany

13:30   CAN (Controller Area Network) Bus Modeling
        Manfred Maurer, Siemens AG, Germany

14:00   EMC Standardization Progress (title to be determined)
        Jean-Claude Perrin, Texas Instruments, France

14:15   EMC Models (title to be determined)
        Christian Marot, Siemens, France

14:30   Parasitic IC Emission Modeling
        Etienne Sicard, National Institute of Applied Science, Toulouse, France

15:00   BREAK

15:15   Ground-Noise Model
        Mariusz Faferko, Fraunhofer Institute Reliability and Microintegration,
        Germany

15:45   Radiated Emission Model for IC
        Peter Kralicek, Fraunhofer Institute Reliability and Microintegration,
        Germany

16:15   Points of View for High Frequency IBIS Models
        Gerald Bannert, Siemens AG, Germany

16:30   IBIS-X
        Arpad Muranyi, Intel, USA

16:55   Concluding Items

17:00   END

Arpad Muranyi stated that he plans to attend and can work with the final
twenty five minutes with information based on some previous presentations.


IBIS MODEL REVIEW COMMITTEE DISCUSSION
John Angulo stated (later in the meeting) that he has received no new models
since the report on the February 16, 2001 meeting.


CONNECTOR PROPOSAL REVIEW
Bob Ross summarized a meeting between he and Gus Panella held on February 27,
2001.  The main changes were to add the [Begin Header] and [End Header] syntax
as done in the IBIS-X document.  Bob also indicated that there will be a pass
to improve the document appearance including removing the left-hand bars.

Ian Dodd had sent out a revised code proposal to the committee to bring its
syntax closer to the IBIS-X macro language proposed syntax.  Bob stated that
this revised code would be included.

The basic plan is to finish doing these changes and then issue a new document
for the IBIS Open Forum to review.  It would be in several formats including
.txt, .doc, and .pdf.  The plan is to schedule some time (15 to 30 minutes)
of each teleconference meeting to review specified portions of the document.

People can still comment on the document as a whole and we can continue to
work in the other areas.  Hopefully this review completion can be completed
in the targeted June 2001 time frame.


IBIS FUTURES (IBIS-X, API, BIRDxx)
Stephen Peters reported on the progress to date and on the February 20, 2001
meeting.  The next meeting will be on the two week schedule on March 6, 2001.

Stephen is working on another update of the specification document the
Working Group is developing.  The target is to get this document and the
IBIS-X macro language documented by the June 2001 time frame.

One item that needs more work is the pin to pad packaging portion.  There
might also be interest in applying the Swathing methods in the Connector
document.  Also, Bob Ross mentioned that a number of older proposals could be
reviewed.

Bob also mentioned that at the next Working Group meeting, Arpad's IBIS-X
presentation for the European IBIS Summit might be discussed.


IBISCHK3 BUG TRACKING
Bob Ross moved this agenda item ahead until Greg Edlund returned to the call.
Bob reported that Matthew Flora is working on the fix to BUG53 and BUG34.
Matthew will coordinate with Atul Agarwal and send the revised source code to
him.  BUG34 was authored by Matthew, and Bob felt that Matthew knew the issues
and possible areas of code that needed fixing.  Bob wants to get an ibischk3
Version 3.2.7 distributed quickly, even if that is the only fix.

- BUG54 - Corners with NA give Bad Test Load Warnings
  Bob Ross introduced BUG54, authored by Michael Mirmak.  It reports a Warning
  message for the timing test load Vmeas crossing for min and max column cases
  even when the min and max columns contain NA entries.

  Bob classified BUG54 as Annoying, Low, and Open.

  However, Bob expressed some concerns regarding BUG54.  While most of the min
  and max columns contained NA entries, three keywords ([Ramp], [Voltage
  Range], and [Temperature Range]) did contain min and max column numerical
  entries.  The problem may still exist if these entries were NA, but the
  example needs to be produced to test this.  Also, since most EDA tools
  should use default typical entries if NAs exist, the problem may still
  exist.  Bob thought that with such defaults, the model should work fine and
  should not produce Warning messages.  More investigation is needed in this
  area.

  Bob thought the actual set of tests and Warnings might become complicated
  and require effort to sort out combinations when only some keywords contain
  NA entries.  Bob was concerned about the effort involved versus the benefit
  obtained.

  Michael commented later in the meeting that he would issue a new version of
  BUG54 with a better example or examples.

  Bob planned more discussion at the next teleconference meeting to decide on
  whether or not to fix BUG54 and how to fix it.


BIRD69.1 - GOLDEN WAVEFORMS
Greg Edlund introduced BIRD69.1 by noting that it was issued in response to
comments of the February 16, 2001 meeting.  Briefly, the intent of BIRD69.1
is to provide golden waveforms within the IBIS model along with the test
configuration used to obtain these waveforms.  The user would have the golden
waveform information and could test the IBIS model using the specified test
configuration to validate the performance of the model.  The EDA tool could
also perform such a test.  However, since this information is contained in
new keywords, the EDA tool could also ignore these keywords.

Greg noted the changes made in BIRD69.1.  They are documented in BIRD69.1 and
include the following:

  Change Node to Test_point
  Remove Driver_model_name since it was redundant
  Add R_diff for differential models
  Change some terminology so that parallel terminators V_term1 and V_term2 can
    be attached to different voltages
  Add Pkg_pin to describe what package is to be used for the model

Bob Ross called for discussion.  Stephen Peters commented that it still called
for a big network with fixed topology.  The IBIS-X approach would support a
more general tester functionality.

Roy Leventhal commented that he favors BIRD69.1 since it could be specified
for IBIS Version 4.0 earlier than the anticipated IBIS-X.

Bob Haller is concerned about the accuracy of models.  He emphasized that the
the EDA tool could use or ignore the information.  But the golden waveform
provides important information about the accuracy of the model.

Stephen stated that while there may be merit, it might not be of as high a
priority as some other items.  We set a new agenda item to talk about the
possible new items needed for Version 4.0.

Greg stated that this should be a low impact BIRD.  However, it would increase
the size of the IBIS Standard, and create more work for updating ibischk3.

Yong Phan stated that one customer required golden data.  In the short term
this need was satisfied by suppling a Spice model as reference.

Bob provided some technical comments about BIRD69.1 and about some related
implications:

  One implication concerning the R_diff entry that both the Non-Inverting and
    Inverting drivers would have to be from the same model.  This is not an
    IBIS requirement.  The models could be different.  However, Bob did not
    know whether this restriction would be a problem.

  Bob was unsure that the Tref entry to state a time reference was needed or
    the best way to handle this.  EDA tools might do their own alignment of
    data.  The actual alignment might be shifted by leading edge removal that
    is implied by BIRD68.

  The Pkg_pin addition was a good idea.  Some of the golden data might be from
    measurements, and we need to know what pin is used.  However, the approach
    in IBIS is still ambiguous.  Some semiconductor vendors supply several
    components with a file that may reference the same model.  One reason for
    doing this is to cover package variations that are shipped.  These
    variations may even have different pin outs.

    Bob also stated another implication of this subparameter.  It is not clear
    clear what to do if Pkg_pin referred to a pin that was modeled using a
    coupled package model.  Greg stated that he did assume a single pin model
    configuration.  Bob noted that the original [Rising Waveform] and [Falling
    Waveform] keywords got around the pin ambiguity problem by adding R_dut,
    L_dut, and C_dut subparameters.  A similar approach could be used for the
    golden waveform keywords.

  Another implication of having [Golden Rising Waveform] and [Golden Falling
    Waveform] is that the golden responses would be for only one edge.  Bob
    thinks this is all right.  However, some semiconductor vendors might want
    to provide full cycle references.  Also there might be some implications
    if the IBIS model was actually derived from edges after several cycles.

  Finally, Bob stated that all of the subparameters should be optional.  A
    large list is currently required, as BIRD69.1 is now structured.  The
    defaults could be stated based on unspecified shunt elements being open
    and series elements being shorted.  Also, this resolves an inconsistency
    regarding requiring "none" if no Receiver model or Pkg_pin were needed.
    They should be included only if listed.

Bob felt that not all of the comments needed to be addressed by changes, but
some of the limitations should noted.  Bob asked Greg to consider the comments
and propose a response as BIRD69.2 for further discussion at the next
teleconference meeting.


VERSION 4.0 RELEASE PLANS - New Topic
Bob Ross opened the topic by noting that the six approved BIRDs could go
into IBIS Version 4.0 or could be implemented in IBIS-X as a Version 4.0
emulation mode.  Stephen Peters felt that IBIS Version 4.0 was needed along
with IBIS-X.  Arpad Muranyi commented that it is needed, and is about a year
late from when it was originally expected.

Larry Barnes stated that the fallback driver functionality is needed soon
since SCSI applications will have this feature in months.  Bob stated he would
work off line with Larry to propose a BIRD.  Bob noted that some other related
features that are needed could be included.  He favored using the Submodel
approach rather than a method patterned after [Driver Schedule].

Stephen noted that some PCI functionality concerning more timing thresholds
has been discussed on e-mail reflectors and is needed.  He plans to work on
this.  Greg Edlund commented that he and Syed Huq have also been concerned
about PCI specification needs and might join in helping define and review this
functionality.

Bob stated that he might want to include some possible improvements for SSO
(simultaneous switching output) modeling as proposed last year by Bernhard
Unger.

Bob stated that IBIS Version 4.0 is still intended to be a "minor" upgrade to
capture some of the recent needs for completeness.  However, some EDA tools
might actually use IBIS-X methods to implement the new features.

Bob also stated that in targeting a Version 4.0 release in the near futures,
all of the possible improvements need to be proposed soon.  He expects that a
few more BIRDs may also be proposed as part of the process to reach closure.


NEXT MEETING:
The next meeting will be the European IBIS Summit Meeting in Munich, Germany
on Friday, March 16, 2001.  No teleconference connection is planned.

The next teleconference meeting will be on Friday, March 30, 2001, from
8:00 AM to 10:00 AM.

==============================================================================
                                      NOTES

IBIS CHAIR: Bob Ross (503) 685-0732, Fax (503) 685-4897
            bob_ross@mentor.com
            Modeling Engineer, Mentor Graphics
            8005 S.W. Boeckman Road, Wilsonville, OR 97070

VICE CHAIR: Stephen Peters (503) 264-4108, Fax: (503) 264-4515
            stephen.peters@intel.com
            Senior Hardware Engineer, Intel Corporation
            M/S JF1-209
            2111 NE 25th Ave.
            Hillsboro, OR 97124-5961

SECRETARY:  Guy de Burgh (805) 988-8250, Fax: (805) 988-8259
            gdeburgh@innoveda.com
            Senior Manager, Innoveda
            1369 Del Norte Rd.
            Camarillo, CA 93010-8437

LIBRARIAN:  Roy Leventhal (837) 797-2152, Fax: (847) 222-2799
            roy_leventhal@3com.com
            Senior Engineer, CommWorks Corp. (a wholly owned 3Com subsidiary)
            1800 W. Central Rd.
            Mt. Prospect, IL 60056-2293

WEBMASTER:  Syed Huq (408) 525-3399, Fax: (408) 526-5504
            shuq@cisco.com
            Manager, Hardware Engineering, Cisco Systems
            170 West Tasman Drive
            San Jose, CA 95134-1706

POSTMASTER: John Angulo (425) 869-2320, Fax: (425) 881-1008
            jangulo@innoveda.com
            Development Engineer, Innoveda
            14715 N.E. 95th Street, Suite 200
            Redmond, WA 98052

This meeting was conducted in accordance with the EIA Legal Guides and EIA
Manual of Organization and Procedure.

The following e-mail addresses are used:

  ibis-request@eda.org
      To join, change, or drop from either the IBIS Open Forum Reflector
      (ibis@eda.org), the IBIS Users' Group Reflector (ibis-users@eda.org)
      or both.  State your request.

  ibis-info@eda.org
      To obtain general information about IBIS, to ask specific questions
      for individual response, and to inquire about joining the EIA-IBIS
      Open Forum as a full Member.

  ibis@eda.org
      To send a message to the general IBIS Open Forum Reflector.  This
      is used mostly for IBIS Standardization business and future IBIS
      technical enhancements.  Job posting information is not permitted.

  ibis-users@eda.org
      To send a message to the IBIS Users' Group Reflector.  This is
      used mostly for IBIS clarification, current modeling issues, and
      general user concerns.  Job posting information is not permitted.

  ibischk-bug@eda.org
      To report ibischk2/3 parser bugs.  The Bug Report Form Resides on
      eda.org in /pub/ibis/bugs/ibischk/bugform.txt along with reported bugs.

      To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms
      which reside under eda.org in /pub/ibis/bugs/s2ibis/bugs2i.txt,
      /pub/ibis/bugs/s2ibis2/bugs2i2.txt, & /pub/ibis/bugs/s2iplt/bugsplt.txt
      respectively.

Information on IBIS technical contents, IBIS participants, and actual
IBIS models are available on the IBIS Home page found by selecting the
Electronic Information Group under:

  http://www.eigroup.org/ibis/ibis.htm

Check the pub/ibis directory on eda.org for more information on previous
discussions and results.  You can get on via FTP anonymous.
==============================================================================
 
From owner-ibis Mon Mar  5 13:04:51 2001
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To All:

Here is a draft Agenda of the European IBIS Summit Meeting
scheduled on Friday, March 16, 2001 in Munich Germany.
We will have a full, all day meeting with interesting
presentations and discussions.

If you plan to attend and have not yet signed up, please
notify Karine Loudet:

  karine_loudet@mentor.com

If any of the presenters have problems with the time
slots, let me know.  A final agenda will be sent out
later this week.

Bob Ross
Mentor Graphics
bob_ross@mentor.com

                         EUROPEAN IBIS SUMMIT MEETING
                           Astron Hotel/Neue Messe
                  Eggenfeldener Strasse 100, Munich Germany
                               MARCH 16, 2001

8:30    REFRESHMENTS

9:00    INTRODUCTIONS AND PROGRAM
        Bob Ross, Mentor Graphics, USA 

9:30    Experiences with and Tips for IBIS Models
        Eckhard Lenski, Siemens AG, Germany

10:00   Extraction of Key IBIS Parameters for Easier Model Selection
        John Barrie, Zuken, England

10:30   BREAK

10:45   DOGEN, A Siemens Internal Model Tool, Extension 1999 - 2001
        Hans Pichlmaier, Siemens AG, Germany

11:15   LVDS Modeling
        Hazem Hegazy and Mohammed Korany, Mentor Graphics, Egypt

12:00   LUNCH

13:00   STTL-2 Modeling Experiences
        Bernhard Unger, Siemens AG, Germany

13:30   CAN (Controller Area Network) Bus Modeling
        Manfred Maurer, Siemens AG, Germany

14:00   EMC Standardization Progress
        Jean-Claude Perrin, Texas Instruments, France

14:15   EMC Models
        Christian Marot, Siemens, France

14:30   Parasitic IC Emisson Modeling
        Etienne Sicard, National Institute of Applied Science, Toulouse, France

15:00   BREAK

15:15   Ground-Noise Model
        Mariusz Faferko, Fraunhofer Institute Reliability and Microintegration,
        Germany

15:45   Radiated Emission Model for IC
        Peter Kralicek, Fraunhofer Institute Reliability and Microintegration,
        Germany

16:15   Points of View for High Frequency IBIS Models
        Gerald Bannert, Siemens AG, Germany
  
16:30   IBIS-X
        Arpad Muranyi, Intel, USA

16:55   CONCLUDING ITEMS
        Bob Ross, Mentor Graphics, USA 

17:00   END
 
From owner-ibis Mon Mar  5 15:00:05 2001
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From: "Mirmak, Michael" <michael.mirmak@intel.com>
To: "'ibis@vhdl.org'" <ibis@vhdl.org>, "'ibis@eda.org'" <ibis@eda.org>
Subject: Proposal for treatment of BUG54...
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In Friday's IBIS Forum, I took an AR to examine how the parser treats 
IBIS files where all the min/max parameters are set to NA (rather than 
just the min/max V-I curves).  Recall that BUG54 was filed in order to 
correct the parser's treatment of models missing a [Pullup] section and 
max/min V-I curves.  The parser currently shows warnings regarding the 
inability of such a model to drive the buffer delay test load through 
the specified Vmeas point.

The parser continues to give errors on the missing max/min V-I curves, 
regardless of whether ramps, c_comp or voltage range min/max values 
are present or absent.  I have enclosed an additional example below.

Therefore, we may conclude that the parser is only looking for V-I curves
 in the min & max columns (for models without a [Pullup] section) to use 
in determining whether the model can satisfy the buffer delay voltage 
requirements.

To decide how to resolve BUG54, we need to decide how the parser should 
treat the keyword "NA" for this case.  The spec unfortunately allows two 
interpretations of "NA," according to the two rules below:

     Rule 1) "NA" means "no data" -- no assumption is to be made as to 
     the operation of the modeled device in  those columns under those 
     conditions.  This is the intent behind using NA to entirely replace 
     a column of  V-I, t-V, ramp, c_comp or operating condition data.

     Rule 2) "NA" means "no explicit data" -- data is not given for 
     this particular condition in this particular column, but the state 
     of the device at this point is to be inferred from the surrounding 
     context by the sim tool.  This is the normal usage of NA, when 
     mixed into a column of V-I or t-V data.  This is also the reason 
     behind prohibiting the use of NA as a starting or ending point in 
     a column of data.

Currently, the parser checks V-I curves using Rule 2 above for models 
where partial data is available in all three columns.  Rule 1 is used 
for most models where NA completely replaces V-I data in a min or max 
column.

BUG54 was filed because the parser incorrectly applies Rule 2 for models 
where the keyword [Pullup] is missing and entire V-I columns are 
replaced by NA.  For any other case where an entire column is missing,  
Rule 1 is the only rule applied.

So, to "fix" BUG54, I would suggest simply eliminating the warning 
messages and applying Rule 1 to all models without a [Pullup] section 
and without min/max V-I curves.  This makes the parser self-consistent 
and also gives sim tool vendors the same flexibility about the treatment 
of NA as they currently have.  No additional cases or interpretation 
would be required.

Any suggestions or advice?  I will incorporate any consensus here into a 
revised BUG54, which I will distribute for posting a week before the next 
IBIS meeting (March 30).

Thanks!

- Michael Mirmak, Intel Corp.


|***********************************************************************
|
[IBIS Ver]       3.2
[File Name]      bug54a.ibs
[File Rev]       0.0a
[Date]           05-March-2001
[Source]         File created from specification
[Notes]          Using the IBISCHK3 v3.2.5 & v3.2.6 parsers, the 
                 following file will show two misleading warnings 
                 related to the buffer delay fixture.
|
[Disclaimer]
    (C) Copyright 2001 Intel Corp.
    All rights reserved
    This model is for demonstration purposes only,
|
[Component]      GENERIC_IBIS
[Manufacturer]   Intel Corp.
|
[Package]
|                typ        min        max
R_pkg            6.0mO      NA         NA
L_pkg            5.0nH      NA         NA
C_pkg            1.0pF      NA         NA
|
|
[Pin]     signal_name      model_name    R_pin    L_pin    C_pin
1         TestSignal1      TestModel1
|
|************************************************************************
|
[Model]          TestModel1
Model_type       I/O_open_sink
|Model_type       I/O
Polarity         Non-Inverting
Enable           Active-Low
|
Vinl = 800mV
Vinh = 2.0V
|
Cref  = 0F
Rref  = 25ohms
Vref  = 5.0V
Vmeas = 2.5V
|
C_comp                    5.00pF          NA             NA
|
[Temperature Range]       27.00           NA             NA
[Voltage Range]           5.0V            NA             NA
|
|[Pullup]
|| voltage    I(typ)          I(min)         I(max)
||
|  -5.0000       0.0m             NA                  NA
|  -4.0000       0.0m             NA                  NA
|   0.0000       0.0m             NA                  NA
|   5.0000       0.0m             NA                  NA
|  10.0000       0.0m             NA                  NA
|
|
[Pulldown]
| voltage     I(typ)              I(min)              I(max)
|
  -5.0000      -40.0m             NA                  NA
  -4.0000      -39.0m             NA                  NA
   0.0000       0.0m              NA                  NA
   5.0000       200m              NA                  NA
  10.0000       400m              NA                  NA
|
|
[GND Clamp]
| voltage     I(typ)              I(min)              I(max)
|
  -5.0000    -3900.0mA            NA                  NA
  -0.7000      -80.0m             NA                  NA
  -0.6000      -22.0m             NA                  NA
  -0.5000       -2.4m             NA                  NA
  -0.4000        0.0A             NA                  NA
   5.0000        0.0A             NA                  NA
|
[Power Clamp]
| voltage     I(typ)              I(min)              I(max)
|
  -5.0000     4450.00m            NA                   NA
  -0.7000       95.0m             NA                   NA
  -0.6000       23.0m             NA                   NA
  -0.5000        2.4m             NA                   NA
  -0.4000        0.0m             NA                   NA
   0.0000        0.0m             NA                   NA
|
[Ramp]
|variable        typ              min                  max
dV/dt_r          2.20/1.06n       NA                  NA
dV/dt_f          2.46/1.21n       NA                  NA
R_load = 300ohms
|
|
|************************************************************************
[End]




 

From owner-ibis Wed Mar  7 17:11:12 2001
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From: Bob Ross <bob_ross@mentorg.com>
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To: "Mirmak, Michael" <michael.mirmak@intel.com>
CC: "'ibis@eda.org'" <ibis@eda.org>
Subject: Re: Proposal for treatment of BUG54...
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Michael:

Here are some thoughts.

I think your rule 1 proposal makes sense for the purposes of
ibischk3 testing.  However, it might
still be complicated.  The revised rule would be to not
perform the test if NA's exist for all entries of either
the [Pulldown] or [Pullup] tables.  The *_Open* cases have
to be treated separately with a different rule.  Many
models with typical only clamps exist, so NA's can still
exist in the typ columns only.

In practice, the EDA tools might apply rule 2 in some manner,
but ibischk3 cannot perform the check.

Anyway, there are a lot of implications.  I would favor a
proposal that removes erronous Warnings rather than tries
to sort out some possible acceptable combinations that
are not formally specified.

Bob Ross
Mentor Graphics



"Mirmak, Michael" wrote:
> 
> In Friday's IBIS Forum, I took an AR to examine how the parser treats
> IBIS files where all the min/max parameters are set to NA (rather than
> just the min/max V-I curves).  Recall that BUG54 was filed in order to
> correct the parser's treatment of models missing a [Pullup] section and
> max/min V-I curves.  The parser currently shows warnings regarding the
> inability of such a model to drive the buffer delay test load through
> the specified Vmeas point.
> 
> The parser continues to give errors on the missing max/min V-I curves,
> regardless of whether ramps, c_comp or voltage range min/max values
> are present or absent.  I have enclosed an additional example below.
> 
> Therefore, we may conclude that the parser is only looking for V-I curves
>  in the min & max columns (for models without a [Pullup] section) to use
> in determining whether the model can satisfy the buffer delay voltage
> requirements.
> 
> To decide how to resolve BUG54, we need to decide how the parser should
> treat the keyword "NA" for this case.  The spec unfortunately allows two
> interpretations of "NA," according to the two rules below:
> 
>      Rule 1) "NA" means "no data" -- no assumption is to be made as to
>      the operation of the modeled device in  those columns under those
>      conditions.  This is the intent behind using NA to entirely replace
>      a column of  V-I, t-V, ramp, c_comp or operating condition data.
> 
>      Rule 2) "NA" means "no explicit data" -- data is not given for
>      this particular condition in this particular column, but the state
>      of the device at this point is to be inferred from the surrounding
>      context by the sim tool.  This is the normal usage of NA, when
>      mixed into a column of V-I or t-V data.  This is also the reason
>      behind prohibiting the use of NA as a starting or ending point in
>      a column of data.
> 
> Currently, the parser checks V-I curves using Rule 2 above for models
> where partial data is available in all three columns.  Rule 1 is used
> for most models where NA completely replaces V-I data in a min or max
> column.
> 
> BUG54 was filed because the parser incorrectly applies Rule 2 for models
> where the keyword [Pullup] is missing and entire V-I columns are
> replaced by NA.  For any other case where an entire column is missing,
> Rule 1 is the only rule applied.
> 
> So, to "fix" BUG54, I would suggest simply eliminating the warning
> messages and applying Rule 1 to all models without a [Pullup] section
> and without min/max V-I curves.  This makes the parser self-consistent
> and also gives sim tool vendors the same flexibility about the treatment
> of NA as they currently have.  No additional cases or interpretation
> would be required.
> 
> Any suggestions or advice?  I will incorporate any consensus here into a
> revised BUG54, which I will distribute for posting a week before the next
> IBIS meeting (March 30).
> 
> Thanks!
> 
> - Michael Mirmak, Intel Corp.
> 
> |***********************************************************************
> |
> [IBIS Ver]       3.2
> [File Name]      bug54a.ibs
> [File Rev]       0.0a
> [Date]           05-March-2001
> [Source]         File created from specification
> [Notes]          Using the IBISCHK3 v3.2.5 & v3.2.6 parsers, the
>                  following file will show two misleading warnings
>                  related to the buffer delay fixture.
> |
> [Disclaimer]
>     (C) Copyright 2001 Intel Corp.
>     All rights reserved
>     This model is for demonstration purposes only,
> |
> [Component]      GENERIC_IBIS
> [Manufacturer]   Intel Corp.
> |
> [Package]
> |                typ        min        max
> R_pkg            6.0mO      NA         NA
> L_pkg            5.0nH      NA         NA
> C_pkg            1.0pF      NA         NA
> |
> |
> [Pin]     signal_name      model_name    R_pin    L_pin    C_pin
> 1         TestSignal1      TestModel1
> |
> |************************************************************************
> |
> [Model]          TestModel1
> Model_type       I/O_open_sink
> |Model_type       I/O
> Polarity         Non-Inverting
> Enable           Active-Low
> |
> Vinl = 800mV
> Vinh = 2.0V
> |
> Cref  = 0F
> Rref  = 25ohms
> Vref  = 5.0V
> Vmeas = 2.5V
> |
> C_comp                    5.00pF          NA             NA
> |
> [Temperature Range]       27.00           NA             NA
> [Voltage Range]           5.0V            NA             NA
> |
> |[Pullup]
> || voltage    I(typ)          I(min)         I(max)
> ||
> |  -5.0000       0.0m             NA                  NA
> |  -4.0000       0.0m             NA                  NA
> |   0.0000       0.0m             NA                  NA
> |   5.0000       0.0m             NA                  NA
> |  10.0000       0.0m             NA                  NA
> |
> |
> [Pulldown]
> | voltage     I(typ)              I(min)              I(max)
> |
>   -5.0000      -40.0m             NA                  NA
>   -4.0000      -39.0m             NA                  NA
>    0.0000       0.0m              NA                  NA
>    5.0000       200m              NA                  NA
>   10.0000       400m              NA                  NA
> |
> |
> [GND Clamp]
> | voltage     I(typ)              I(min)              I(max)
> |
>   -5.0000    -3900.0mA            NA                  NA
>   -0.7000      -80.0m             NA                  NA
>   -0.6000      -22.0m             NA                  NA
>   -0.5000       -2.4m             NA                  NA
>   -0.4000        0.0A             NA                  NA
>    5.0000        0.0A             NA                  NA
> |
> [Power Clamp]
> | voltage     I(typ)              I(min)              I(max)
> |
>   -5.0000     4450.00m            NA                   NA
>   -0.7000       95.0m             NA                   NA
>   -0.6000       23.0m             NA                   NA
>   -0.5000        2.4m             NA                   NA
>   -0.4000        0.0m             NA                   NA
>    0.0000        0.0m             NA                   NA
> |
> [Ramp]
> |variable        typ              min                  max
> dV/dt_r          2.20/1.06n       NA                  NA
> dV/dt_f          2.46/1.21n       NA                  NA
> R_load = 300ohms
> |
> |
> |************************************************************************
> [End]
 
From owner-ibis Thu Mar  8 18:21:32 2001
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To All:

Here is the Agenda for the European IBIS Summit Meeting .  It
has some updated titles and slight changes in the presentation
order.

If you plan to attend and have not yet signed up, please
let me know.

We are looking forward to a productive meeting.

Bob Ross
Mentor Graphics
bob_ross@mentor.com

                         EUROPEAN IBIS SUMMIT MEETING
                           Astron Hotel/Neue Messe
                  Eggenfeldener Strasse 100, Munich Germany
                               MARCH 16, 2001

8:30    REFRESHMENTS

9:00    INTRODUCTIONS AND PROGRAM
        Bob Ross, Mentor Graphics, USA 

9:30    Experiences with and Tips for IBIS Models
        Eckhard Lenski, Siemens AG, Germany

10:00   Extraction of Key IBIS Parameters for Easier Model Selection
        John Berrie, Zuken, England and Michael Schaeder, Zuken Germany

10:30   BREAK

10:45   DOGEN, A Siemens Internal Model Tool, Extensions 1999 - 2001
        Hans Pichlmaier, Siemens AG, Germany

11:15   LVDS Modeling
        Hazem Hegazy and Mohammed Korany, Mentor Graphics, Egypt

12:00   LUNCH

13:00   SSTL-2 Modeling Experiences
        Bernhard Unger, Siemens AG, Germany

13:30   CAN (Controller Area Network) Bus Modeling
        Manfred Maurer, Siemens AG, Germany

14:00   Parasitic IC Emission Modeling
        Etienne Sicard, National Institute of Applied Science, France

14:30   EMC Models
        Christian Marot, Siemens, France

14:45   EMC Standardization Progress
        Jean Claude Perrin, Texas Instruments, France

15:00   BREAK

15:15   Modelling of Ground-Noise for Circuits with Short-Channel Transistors
        Mariusz Faferko, Fraunhofer Institute Reliability and
        Microintegration, Germany

15:45   An Electromagnetic Emission Model for Integrated Circuits
        Peter Kralicek, Fraunhofer Institute Reliability and
        Microintegration, Germany

16:15   Points of View for High Frequency IBIS Models
        Gerald Bannert, Siemens AG, Germany
  
16:30   IBIS-X and the IBIS Macro Language
        Stephen Peters and Arpad Muranyi, Intel, USA

16:55   CONCLUDING ITEMS
        Bob Ross, Mentor Graphics, USA 

17:00   END
 
From owner-ibis Fri Mar  9 06:43:04 2001
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To All:

Here is the Agenda for the European IBIS Summit Meeting .  It
has some updated titles and slight changes in the presentation
order.

If you plan to attend and have not yet signed up, please
let me know.

We are looking forward to a productive meeting.

Bob Ross
Mentor Graphics
bob_ross@mentor.com

                         EUROPEAN IBIS SUMMIT MEETING
                           Astron Hotel/Neue Messe
                  Eggenfeldener Strasse 100, Munich Germany
                               MARCH 16, 2001

8:30    REFRESHMENTS

9:00    INTRODUCTIONS AND PROGRAM
        Bob Ross, Mentor Graphics, USA

9:30    Experiences with and Tips for IBIS Models
        Eckhard Lenski, Siemens AG, Germany

10:00   Extraction of Key IBIS Parameters for Easier Model Selection
        John Berrie, Zuken, England and Michael Schaeder, Zuken Germany

10:30   BREAK

10:45   DOGEN, A Siemens Internal Model Tool, Extensions 1999 - 2001
        Hans Pichlmaier, Siemens AG, Germany

11:15   LVDS Modeling
        Hazem Hegazy and Mohammed Korany, Mentor Graphics, Egypt

12:00   LUNCH

13:00   SSTL-2 Modeling Experiences
        Bernhard Unger, Siemens AG, Germany

13:30   CAN (Controller Area Network) Bus Modeling
        Manfred Maurer, Siemens AG, Germany

14:00   Parasitic IC Emission Modeling
        Etienne Sicard, National Institute of Applied Science, France

14:30   EMC Models
        Christian Marot, Siemens, France

14:45   EMC Standardization Progress
        Jean Claude Perrin, Texas Instruments, France

15:00   BREAK

15:15   Modelling of Ground-Noise for Circuits with Short-Channel
Transistors
        Mariusz Faferko, Fraunhofer Institute Reliability and
        Microintegration, Germany

15:45   An Electromagnetic Emission Model for Integrated Circuits
        Peter Kralicek, Fraunhofer Institute Reliability and
        Microintegration, Germany

16:15   Points of View for High Frequency IBIS Models
        Gerald Bannert, Siemens AG, Germany

16:30   IBIS-X and the IBIS Macro Language
        Stephen Peters and Arpad Muranyi, Intel, USA

16:55   CONCLUDING ITEMS
        Bob Ross, Mentor Graphics, USA

17:00   END

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From owner-ibis Fri Mar  9 11:03:22 2001
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From: Pat Diao <Pat_Diao@asat.com>
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I am working to install a s2ibis in my company.  Could you give me any info
on if any s2ibis for WinNT or Win2000 is available?  The only one I find on
your wedsite is for Win95.

Thanks a lot.


Pat Diao





__________________________________________________
Pat Diao, Ph.D.
Sr. Staff Engineer
Electronic packaging, Thermal/Electrical
ASAT Inc.
46335 Landing Parkway
Fremont, CA 94538
phone: 510-249-1227
fax: 510-249-9105
e-mail: pat_diao@asat.com
__________________________________________________



 
From owner-ibis Fri Mar  9 11:25:44 2001
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Dear Pat Diao,

The last link to SPICE-to-IBIS on the Web page
http://www.eigroup.org/ibis/tools.htm

Should work nicely.

Best regards,
Matthew Flora


----- Original Message ----- 
From: "Pat Diao" <Pat_Diao@asat.com>
To: <ibis@eda.org>
Sent: Friday, March 09, 2001 11:01 AM
Subject: IBIS


> 
> I am working to install a s2ibis in my company.  Could you give me any info
> on if any s2ibis for WinNT or Win2000 is available?  The only one I find on
> your wedsite is for Win95.
> 
> Thanks a lot.
> 
> 
> Pat Diao
> 
> 
> 
> 
> 
> __________________________________________________
> Pat Diao, Ph.D.
> Sr. Staff Engineer
> Electronic packaging, Thermal/Electrical
> ASAT Inc.
> 46335 Landing Parkway
> Fremont, CA 94538
> phone: 510-249-1227
> fax: 510-249-9105
> e-mail: pat_diao@asat.com
> __________________________________________________
> 
> 
> 

 
From owner-ibis Mon Mar 12 14:51:59 2001
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     This note is a request  to become a member of the IBIS Open Forum
Reflector as well as the IBIS Users' Group Reflector.   Please let me know
what is required of me to be added to the distribution list.

Regards,
Hirut Asfaw


Hirut Asfaw
ASIC I/O Developement
IBM Microelectronics Division
External:  (802) 769-0652   T/L: 6-0652
hasf@us.ibm.com


 
From owner-ibis Fri Mar 16 11:36:06 2001
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Subject: BIRD 70
To: ibis@vhdl.org
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Hi Everyone,

BIRD 69.1 has evolved into BIRD 70.  The main change is making one test
load
available to ALL models through a new keyword, [Test Load], and a new
subparameter under [Rising Waveform] and [Falling Waveform],
Golden_test_load.  Thanks to Al Davis and Bob Ross for their input.

Please see the section "ANALYSIS PATH" for the details.

I am very interested to know if this BIRD is "obvious to the casual
observer"
or "obscure to anyone not involved!"

Greg

p.s. A similar concept could be used for expanded standard loads,
e.g. PCI, etc.




*******************************************************************************
*******************************************************************************

BIRD ID#:      70
ISSUE TITLE:   Golden Waveforms
REQUESTOR:     Greg Edlund, IBM

DATE SUBMITTED:                       March 16, 2000
DATE REVISED:
DATE ACCEPTED BY IBIS OPEN FORUM:     Pending

*******************************************************************************
*******************************************************************************

STATEMENT OF THE ISSUE:

Golden Waveforms are a set of SPICE waveforms simulated using known ideal
test loads.  They are useful in verifying the accuracy of behavioral
simulation results for any given simulator.  They are not the same thing as
the traditional VT tables recommended in the "IBIS Cookbook."  The "I/O
Buffer
Accuracy Handbook" recommends a set of ideal test loads for classical
push-pull and open-drain drivers.

There is currently a problem with including Golden Waveforms in an IBIS
datasheet: the simulator tries to use these waveforms to construct its
stimulus waveform, and erroneous simulations result.

This BIRD proposes a new syntactical construct to tell the simulator
that a waveform is a Golden Waveform.  The simulator may then choose to
ignore the data or (better yet) run a set of simulations using the network
and circuit parameters provided and report the correlation between the
simulation results and the Golden Waveforms.  The mechanism for describing
a Golden Waveform involves a new subparameter under the [Rising Waveform]
and [Falling Waveform] keywords and a new keyword, [Test Load], whose
scope is global and whose subparameters are accessible by all models.

*******************************************************************************

STATEMENT OF THE RESOLVED SPECIFICATIONS:

|=============================================================================
|    Keywords:  [Rising Waveform], [Falling Waveform]
|    Required:  No
| Description:  Describes the shape of the rising and falling edge
waveforms
|               of a driver.
|  Sub-Params:  R_fixture, V_fixture, V_fixture_min, V_fixture_max,
C_fixture,
|*              L_fixture, R_dut, L_dut, C_dut, Golden_test_load
.
.
.
|               All tables assume that the die capacitance is included.
|               Potential numerical problems associated with processing the
|               data using the effective C_comp for effective die
capacitance
|               may be handled differently among simulators.
|
|*              A model developer may use the Golden_test_load subparameter
|*              to document Golden Waveforms whose purpose is to facilitate
|*              the correlation of SPICE and behavioral simulations. The
|*              value of Golden_test_load must be a valid [Test Load] name.
|*              Golden_test_load is mutually exclusive of all other
|*              subparameters and nullifies them if used. The process,
|*              temperature, and voltage conditions under which the
waveforms
|*              are generated must be identical to those used to generate
|*              the VI and VT tables. The Golden Waveforms must be
generated
|*              using unpackaged driver and receiver models. The simulator
|*              must not use the Golden Waveform tables in the construction
|*              of its internal stimulus function.
|
|-----------------------------------------------------------------------------
.
.
.
|
| Example Golden Waveforms:
|
[Rising Waveform]
Golden_test_load = Load1
| Time            V(typ)              V(min)              V(max)
   0.0000s       25.2100mV           15.2200mV           43.5700mV
   0.2000ns       2.3325mV           -8.5090mV           23.4150mV
   0.4000ns       0.1484V            15.9375mV            0.3944V
   0.6000ns       0.7799V             0.2673V             1.3400V
   0.8000ns       1.2960V             0.6042V             1.9490V
   1.0000ns       1.6603V             0.9256V             2.4233V
   1.2000ns       1.9460V             1.2050V             2.8130V
   1.4000ns       2.1285V             1.3725V             3.0095V
   1.6000ns       2.3415V             1.5560V             3.1265V
   1.8000ns       2.5135V             1.7015V             3.1600V
   2.0000ns       2.6460V             1.8085V             3.1695V
| ...
  10.0000ns       2.7780V             2.3600V             3.1670V
|
[Falling Waveform]
Golden_test_load = Load1
| Time            V(typ)              V(min)              V(max)
   0.0000s        5.0000V             4.5000V             5.5000V
   0.2000ns       4.7470V             4.4695V             4.8815V
   0.4000ns       3.9030V             4.0955V             3.5355V
   0.6000ns       2.7313V             3.4533V             1.7770V
   0.8000ns       1.8150V             2.8570V             0.8629V
   1.0000ns       1.1697V             2.3270V             0.5364V
   1.2000ns       0.7539V             1.8470V             0.4524V
   1.4000ns       0.5905V             1.5430V             0.4368V
   1.6000ns       0.4923V             1.2290V             0.4266V
   1.8000ns       0.4639V             0.9906V             0.4207V
   2.0000ns       0.4489V             0.8349V             0.4169V
| ...
  10.0000ns       0.3950V             0.4935V             0.3841V
|
.
.
.
|=============================================================================
|    Keywords:  [Test Load]
|    Required:  No
| Description:  Defines a generic test load network and its associated
|               electrical parameters for reference by Golden Waveforms
|               defined in [Rising Waveform] and [Falling Waveform] tables.
|               The Golden Waveform tables access a given [Test Load]
|               by the value of the Golden_test_load subparameter under the
|               [Rising Waveform] and [Falling Waveform] keywords.
|  Sub-Params:  C1_near, Rs_near, Ls_near, C2_near, Rp1_near, Rp2_near,
|               Td, Zo, Rp1_far, Rp2_far, C2_far, Ls_far, Rs_far, C1_far,
|               R_diff, V_term1, V_term2, Receiver_model_name, Test_point,
|               Tline_present
| Usage Rules:  The subparameters specify the electrical parameters
|               associated with a fixed generic test load.  The diagram
|               below describes the generic test load schematically.
|
|                                    V_term1
|                                 o-----------o
|                                 |           |
|                                 \           \
receiver_model_name
|   ______                        /           /
______
|  |      |  NEAR        Rp1_near \           \ Rp1_far          FAR  |
|
|  | |\   |                       /           /                       | |\
|
|  | | \  |   Rs_near  Ls_near    |   _____   |     Ls_far  Rs_far    | | \
|
|  | |  >-|---o--/\/\--@@@@--o----o--O_____)--o----o--@@@@--/\/\--o---|-|
> |
|  | | /  |   |              |    |   Td      |    |              |   | | /
|
|  | |/   |   | C1_near      |    \   Zo      \    | C2_far       |   | |/
|
|  |______|  ===            ===   /           /   ===            ===
|______|
|             |      C2_near |    \           \    |       C1_far |
|             |              |    /           /    |              |
|             |              |    |  V_term2  |    |              |
|             o--------------o    o-----------o    o--------------o
|             |                Rp2_near    Rp2_far                |
|            GND                                                 GND
|
|
|               R_diff is not shown in the schematic but would be connected
|               between the true and complement far end nodes in the case
|               of a differential driver.  In this case, the true and
|               complement nets will be identical as defined by the other
|               subparameters.
|
|               V_term1 defines the termination voltage for parallel
|               termination resistors Rp1_near and Rp1_far.  This voltage
|               is not related to the [voltage range] keyword.
|               V_term2 defines the termination voltage for parallel
|               termination resistors Rp2_near and Rp2_far.
|
|               Receiver_model_name is optional and indicates which, if
any,
|               receiver is connected to the far end node. If not used, the
|               network defaults to no receiver.
|
|               Test_point is required and defines the node in the above
|               schematic at which the Golden Waveform is measured.  It
must
|               have the value near or far.
|
|               Tline_present is required and indicates whether or not
|               the transmission line exists in the network. It must have
|               the value yes or no. If no, the transmission line is
|               replaced by a short circuit. This prevents the user from
|               having to specify a very small delay value when no
|               transmission is present, which would result in the
simulator
|               taking excessively small time steps.
|
|               The following parameters are optional and default to the
|               values specified in table below:
|
|               C1_near     = 1f
|               Rs_near     = 1M
|               Ls_near     = 1p
|               C2_near     = 1f
|               Rp1_near    = 1M
|               Rp2_near    = 1M
|               Td          = 1ns
|               Zo          = 50
|               Rp1_far     = 1M
|               Rp2_far     = 1M
|               C2_far      = 1f
|               Ls_far      = 1p
|               Rs_far      = 1M
|               C1_far      = 1f
|               R_diff      = 1M
|               V_term1     = 1
|               V_term2     = 0
|
|-----------------------------------------------------------------------------
|
[Test Load] Load1
C1_near     = 1p
Rs_near     = 10
Ls_near     = 1n
C2_near     = 1p
Rp1_near    = 100
Rp2_near    = 100
Td          = 1ns
Zo          = 50
Rp1_far     = 100
Rp2_far     = 100
C2_far      = 1p
Ls_far      = 1n
Rs_far      = 10
C1_far      = 1p
R_diff      = 100
Receiver_model_name Input1
Test_point far
Tline_present yes
| variable      typ             min             max
Vterm1          1.5             1.4             1.6
Vterm2          0.0             0.0             0.0
|
| Example Transmission Line and Receiver test load from "I/O Buffer
Accuracy
| Handbook," section 3.4.4.
|
[Test Load] Tline_rcv
Td          = 1n
Zo          = 50
Receiver_model_name Input1
Test_point far
|-----------------------------------------------------------------------------

*******************************************************************************

ANALYSIS PATH/DATA THAT LED TO SPECIFICATION:

Please refer to BIRD 69.1 for history.  BIRD 70 came about a result of an
attempt to make BIRD 69.1 upwardly compatible with IBIS-X.  BIRD 70 is
actually more compact and efficient because it allows multiple models to
access the same [Test Load].  Recommendations came from Bob Ross, Al Davis,
and the IBIS Open Forum, 3/2/01.

Changes between BIRD 69.1 and BIRD 70:

1. Scope of the "generic test load" is now global rather than being
   local to a particular model.  This is a big improvement.

2. Added one subparameter, Golden_test_load, to [Rising Waveform],
   [Falling Waveform] keywords.  Added text to describe new the
subparameter.
   The Golden_test_load subparameter calls a [Test Load].

3. Exported all the other code to the new [Test Load] keyword.

4. Removed T_ref subparameter. To do timing correlation, the simulator can
   pick a point on the 50 Ohm VT waveform as its "SPICE reference point"
and
   then simulate both the 50 Ohm load and the Golden_test_load to calculate
   a time difference.

5. Removed Pkg_pin parameter. It is too complicated. The user can model a
   simple single-pin lumped circuit using the parameters supplied.

6. Added Tline_present subparameter. If not used, the Tline should be
   removed from the simulation rather than assigned a very small delay
value.
   This prevents the simulator from taking ridiculously small time steps.

7. Replaced V_termxxx with tables similar to the dV/dt_x subparameters.
   This makes the BIRD more economical.

8. Got rid of the paragraph that read, "Using the Golden Waveform
tables..."
   This seemed to be redundant.

9. Specified which parameters are optional and which are required.

NOTE:

BIRD70 adds approximately 130 extra lines to IBIS. Of this, 25 line are
actual code and the remaining 105 are comments.

*******************************************************************************

ANY OTHER BACKGROUND INFORMATION:


See BIRD 69.1.

*******************************************************************************


 
From owner-ibis Wed Mar 21 08:52:16 2001
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To: ibis@eda.org
Subject: EIA IBIS European IBIS Summit Meeting Minutes


Date: 3/22/01

SUBJECT: 3/16/01 EIA IBIS European IBIS Summit Meeting Minutes

VOTING MEMBERS AND 2001 PARTICIPANTS LIST:
3Com (& CommWorks)             Roy Leventhal
Agilent                        (Mark Chang)
Ansoft Corporation             (Eric Bracken)
Apple Computer                 John Figueroa
Applied Simulation Technology  Raj Raghuram, Norio Matsui, Fred Balistreri
Avanti                         (Chen Hongyu)
Brocade Communications         Robert Badal
Cadence Design                 Ian Dodd, Patrick Dos Santos*, Heiko Dudek*
Cisco Systems                  Syed Huq, Lungfu Chen
Compaq                         Peter LaFlamme, Ron Bellomio, Quang Dam
Cypress                        (Rajesh Manapat)
EMC Corporation                Brian Arsenault, Jinhua Chen
Fairchild Semiconductor        Adam Tambone
IBM                            Michael Cohen, Greg Edlund, Wes Martin,
                               Yeon-Chang Hahm, Bill DeVey, Pravin Patel
Innoveda (& HyperLynx)         Guy de Burgh, John Angulo, Cary Mandel*
Intel Corporation              Stephen Peters, Arpad Muranyi*, Dave Lorang,
                               Michael Mirmak, Qinglun Chen, Will Hobbs
LSI Logic                      Larry Barnes
Mentor Graphics                Bob Ross*, Tom Dagostino*, Chris Reid,
                               Mike Donnelly, Hazem Hegazy, Tony Dunbar,
                               Griff Derryberry, Dan Lake, Sherif Hammad*,
                               Mohammed Korany*, Weston Beal, Chris Swaim*,
                               Ali Samii*, Eric Ronger*, Karine Loudet*
Micron Technology              Randy Wolff, Yong Phan
Mitsubishi                     (Tam (Tom) Cao)
Molex Incorporated             Gus Panella, Brian O'Malley
Motorola                       (Ron Werner)
National Semiconductor         Milt Schwartz
Nortel Networks                Calvin Trowell
North East Systems Associates  Edward Sayre
Philips Semiconductor          Zack Ciccone, Rob Mataheroe*
Quantic EMC                    (Mike Ventham)
Robinson-Nugent, Inc.          (Alexander Barr)
Siemens (& Automotive) AG      Bernhard Unger*, Helmut Katzier, Katja Koller*, 
                               Wolfram Meyer*, Eckhard Lenski*,
                               Gerald Bannert*, Burkhard Muller*, 
                               Christian Marot*, Manfred Maurer*,
                               Amir Motamedi*, Hans Pichlmaier*
Signal Integrity Software      Douglas Burns, Barry Katz, Walter Katz
SiQual                         Scott McMorrow, Rob Hinz, Bernard Voss,
                               Chris Brewster
Texas Instruments              Thomas Fisher, Stephen Nolan, Ramzi Ammar,
                               Jean Claude Perrin*
Time Domain Analysis Systems   Dima Smolyansky, Steve Corey
Tyco Electronics               (Russell Moser)
Via Technologies               (Weber Chuang)
Zuken (& Incases)              John Berrie*

OTHER PARTICIPANTS IN 2001:
Actel Corporation              Silvia Montoya
Acuson                         Kim Helliwell
AMCC                           Jeff Smith
ASIS Ltd                       David Wright
BMW                            Friedrich Hasinger*
Cereva Networks                Bob Haller
EADS Airbus Industry           Claude Huet*
  (Aerospatiale)
EFM                            Ekkehard Miersch*, Horle Raines*
EIA                            Cecilia Fleming
FCI                            Sercu Stefaan
Foundary Networks              Bertram Chan
Framatom Conectors             Danny Morlion
Fraunhofer Institute           Mariusz Faferko*, Peter Kralicek*
  Reliability and
  Integration
Fujitsu Ltd                    Tadashi Arai, Takeshi Murakami
Heidelberger Druchmaschinen AG Wolfgang Kleinfeldt*
Huawei Technologies            Rachild Chen
Hyundai Electronics            Jongho Kang
Infineon Technologies          Christian Sporrer*
Intrinsix Corporation          Steven Chin
National Institute of Applied  Etienne Sicard*
  Science (INSA)
Nokia                          Tapani von Ravner, Mika Castren*,
                               Janne Uusitalo*
Oak Technology                 Darmin Jin
Plexus Technology Group        Joseph Socha
Sintecs                        Hans Klos*
STMicroelectronics             Peter Hirt, Fabrice Boissieres*
Sun                            Adrian Udenze*
Xilinx                         Susan Wu
Independent, Consultant        Al Davis

In the list above, attendees at the meeting are indicated by *. Principal
members or other active members who have not attended are in parentheses.
Participants who no longer are in the organization are in square brackets.

Upcoming Meetings:  The bridge numbers for future IBIS teleconferences are as
follows:

  Date                Bridge Number    Reservation #    Passcode
  March 30, 2001       (916) 356-9200   2-524673         6244264
  April 20, 2001       (916) 356-9200   2-524674         3881934

All meetings are 8:00 AM to 9:55 AM Pacific Time.  We try to have agendas out
7 days before each Open Forum and meeting minutes out within 7 days after.
When you call into the meeting, ask for the IBIS Open Forum hosted by Will
Hobbs and give the reservation number and passcode.

NOTE: "AR" = Action Required.

-------------------------------- MINUTES -------------------------------------
INTRODUCTIONS AND MEETING QUORUM
The European IBIS Summit Meeting held all day at the Astron Hotel/Neue Messe, 
Munich Germany.  About 39 people from 19 companies and institutes attended.
The notes below capture some of the meeting content and discussions.  The
meeting presentations and other material will be uploaded at: 

  http://www.eda.org/pub/ibis/summits/mar01/

Bob Ross opened the meeting by having everyone introduce themselves.  The EDA,
user and semiconductor were well represented.  Bob thanked the co-sponsors for 
the meeting, Cadence, Innoveda, Mentor Graphics, and Zuken for sharing the 
meeting expenses.  Bob also thanked Karine Loudet of Mentor Graphics for 
helping in the meeting logistics, collecting registrations, copying 
presentations, creating badges, and producing the beautiful European IBIS 
Summit Meeting poster.

As a business item, Bob stated that Apple Computer is now a full EIA IBIS
Open Forum member and is now listed in the Voting Members portion of the
Participants list.

Bob gave a brief overview of the meeting agenda:

  Current IBIS Model Development and Validation 
  Specific Bus Technology Problems and Experiences
  EMI/EMC Modeling Issues
  High-Speed Issues
  Future IBIS-X Progress and Discussion
  Closing Issues and Discussions


EXPERIENCES WITH AND TIPS FOR IBIS MODELS
Eckhard Lenski, Siemens AG, Germany
Eckhard Lenski shared his experiences regarding the problems that he has seen
with IBIS models.  He currently supports about 1500 IBIS I/O models for 
internal Siemens usage world-wide.  Models come from all sources including
measurement, Spice extraction, IBIS Web sites, and data books.  Newer
technologies (LVDS, CAN, PCML, PECL etc.) provide additional challenges.
Complete and consistent information is needed.

Eckhard showed some typical concerns in models and some details that should be
considered.  The topics included the gap between ground and power clamps,
unreasonable ramp voltage values, inconsistent ramp values, I-V and V-T data
load line mismatch, double counting of clamps, incorrect V_fixture voltage
information.

Because Siemens provides models for different simulators, Eckhard shared some
tips and experiences on model details.  He showed how models referenced by the 
[Driver Schedule] keyword has pullup, pulldown and clamp table keywords that
are located differently in non-IBIS formats (or visa versa).  These details
must be understood to provide correct translations.  Eckhard also commented
that differential buffers need the Vdiff parameter.  When different Vmeas 
values exist for rising and falling edges (a situation that cannot be handled 
by the existing IBIS syntax), Eckhard suggests using the average value.  He 
also showed how the timing test loads given by parallel resistors could be 
converted into the equivalent load required by the IBIS syntax.

Eckhard spoke about package model details.  He showed simulations differences
between a model with cascaded lumped sections and with a single lumped stage.
Eckhard also showed that different sized packages may actually use the same  
die and have different lengths to the pins.  Semiconductor vendors often
shrink the die in later versions of the chip.  These details should be modeled
correctly, with different package models for different component packages.

Additional details were presented.  Differential inputs can have termination
resistors connected to a common voltage such as 1.2 V.  Clamp tables can model
this effect and also include any clamp diodes.  Eckhard needs to create three
separate models for timing test load variations for typ/min/max cases.  Also,
Eckhard commented on LVDS ramp model difficulties with 50 Ohms to Ground and
to Vcc.  A waveform model is required.

The datasheet may give guidance regarding the number of model variations that
the IBIS model needs.  Different output strengths may be documented for
output buffers, and different leakage currents may be documented for inputs.
The IBIS model should be consistent with this information.  The correct C_comp
value is critical for DIMM models where a number of inputs are in parallel.
Also input capacitance can have different values at different frequencies.
A bad value can introduce delay errors.

Often when the die is shrunk (for manufacturing yield improvement), the
electrical characteristics change.  A new model should be requested.  Fabrice
Boissieres commented that clamps also change with die shrinkage.

Eckhard presented some future needs.  He really wants different component
keywords for different devices for the same family instead of a generic part.
Finally, he listed quick (one-week) responses to questions to vendors, an 
electrical model checker, and EMI model parameters.

He summarized that both IBIS-X and the new approved BIRDs are good.  Complete
IBIS Version 3.2 models are currently needed that have the relevant optional
parameters, have two rising and two falling waveforms, have the over and
undershoot parameters and better package model files (not just R_pkg, L_pkg,
and C_pkg).  When you see a pyramid top in a rain forest, you do not see the
larger base underneath that is needed.

Fabrice added that typ/min/max values for Vref are needed.

 
EXTRACTION OF KEY IBIS PARAMETERS FOR EASIER MODEL SELECTION
John Berrie, Zuken, England and Michael Schaeder, Zuken Germany
John Berrie described some common problems he has seen when getting IBIS
models from Web sites.  Problems (observed more often in older models) include
pins not even modeled or modeled incorrectly.  Unique model names are
needed for different types of buffers.

The ibischk3 parser provides one level of testing and specific EDA tools can
provide additional tests.  However, a method to provide just basic file
information is needed.
                      
John stated that Michael Schaeder is developing such a tool for giving basic
information about the contents of the file containing IBIS models.  This tool
(still being improved) lists the number of pins (modeled and supply pins),
model names and model types, and package model references, and model details.  
These details include the additional keywords and subparameters such as
thresholds, timing test loads, voltage range, and static characteristics (such
as inclusion of power and ground clamps).  Also, output parameters include
documenting the [Ramp] values and the [Rising Waveform] and [Falling Waveform]
fixture resistance and voltage values.

John showed samples of the output.  Such a utility would provide a quick check
of the contents of the file for the user to see that the information is
complete and consistent.  Normally such information is scattered throughout
the file and is difficult to detect.

Zuken is planning to donate this utility to the IBIS Open Forum for public
use.  This will assist in visual inspection and could be the basis for some
additional automatic reality checking in the future.  The utility, designated
"ibsinf" (IBIS Information), is expected to be ready in several months.

Bob Ross asked, and John responded that it will be supplied in Windows and
in Unix (Sun Solaris and Hewlett Packard) formats.  Gerald Bannert suggested
that more checks are possible.


DOGEN, A SIEMENS INTERNAL MODEL TOOL, EXTENSIONS 1999 - 2001
Hans Pichlmaier, Siemens AG, Germany
Hans Pichlmaier gave an overview of DOGEN, an internal modeling tool he has 
been working on for several years.  It does: 

  Quad to IBIS, IBIS to Quad and Spice to IBIS .ebd Conversions
  IBIS Scaling of typ to min/max
  Checks of Quad and IBIS models
  Works standalone or within a BIOLIB library environment
  Supports the BIOLIB structure

BIOLIB is IBIS+ with IC, passive and module data structures.  ELAN provides
layout data with the part numbers and passive components.  These are used in
as system to generate project tool libraries for Quad, ICX and Specctra based
projects.  The library generator gives local copies with EDA tool specific
features.  For example, four cases of models for signal integrity, minimum
delay, maximum delay, and worst case crosstalk analysis are generated for
Quad based projects.

The extension made in the last two years consists of:

  Passive component models
  .ebd modules inside BIOLIB
  Evidence of usage in projects
  Complex packages inside BIOLIB
  Model Viewer for I-V and V-T tables
  Conversion of Altera and Xilinx FPGA files to IBIS Pinouts
  IBIS split and IBIS expand to make BIOLIB Elements from IBIS models
  Support of IBIS Version 3.2
  Support of new Quad syntaxes for DIFFPIN and SERIESPIN

Hans illustrated the passive part generation utility where internal part
numbers, values, packages and tolerances can be input.  The appropriate IBIS
models are generated.  He also showed the command line and resulting files
for module generation within BIOLIB.  The [Reference Designator Map] is used
differently in BIOLIB than in IBIS to refer to actual part numbers instead of
file names.  

ELAN keeps track of model usage by projects.  Updates to models can be sent
automatically to any site world-wide by e-mail.

Hans stated that the data base will be extended for EMI analysis and power bus
decoupling in the future.

Arpad Muranyi asked about scaling, and Hans indicated that V-T and I-V typical
data can be scaled independently for min and max columns.  The V-T scaling is
done in a manner that the starting and ending values are consistent with the
adjusted I-V data.

Adrian Udenze asked about the monotonic check on V-T tables.  Overshoots and
undershoots are clipped if less than 10 percent to be compatible with some
EDA tools.  Over or undershoots greater than 10 percent are suspicious and
flagged as an error.  Non-monotonic ledges during the ramp section is removed
by straight line approximations.  Tom Dagostino commented that this could lead
to slower model transition times if the ledge were due to an internal package
reflection.

At the conclusion, Hans announced that he will lead the third annual Bavarian
IBIS Summit climb in the Bavarian Alps on March 17, 2001.  Everyone is 
invited.


LVDS MODELING
Hazem Hegazy and Mohammed Korany, Mentor Graphics, Egypt
Mohammed Korany provided new material from a similar presentation given at
the DesignCon 2001 IBIS Summit Meeting on January 29, 2001.  Mohammed started
by introducing some LVDS basic terminology.  The problem is how to extract
the correct I-V tables when differential outputs are connected to internal
differential termination resistors.  Sometimes such a topology is not evident
in encrypted models output models, and sometimes there is a equal current
sourcing and sinking circuitry.  Conventional techniques may cause unexpected
DC shifts if the termination resistor is changed.  Normally each pad and padn
path is terminated by a single-ended resistor (usually 50 ohms) connected to
a Vref value.  Some original methods (Methods I - III) based on some early
ideas all had DC shift mismatches for some loads.

Proposal I used equal, but opposite sign delta voltages connected to the
pad and padn pins and attached to a common Vms (mid swing voltage).  The time
response had correct DC values when the termination resistor was 50 ohms
(same as the fixture value), but significant DC shift from Spice reference
simulations when the termination resistor was 100 ohms.

Proposal II overcame the DC shift problem by doing the DC sweeps by connecting
equal resistors to pad and padn.  The resistor value was swept to obtain the
I-V tables.  This proposal had overlaying waveforms for both the single-ended
50 and 100 ohm loads, and excellent correlation with a lossy differential
transmission line interconnection.

Proposal III was a new proposal that used sweeps to actually extract the value 
of the differential termination resistor.  Two equal sweeps connected to the
pad and padn sides of the internal differential resistor was used to extract
the I-V tables values for each buffer while nulling out the effect of the
differential terminator.  This setup sparked some questions which were
discussed and resolved off-line.  Mohammed showed the schematic for the
first set of sweeps for padn set to 0 V and 1 V respectively to extract the
differential resistance value.  The resulting LVDS differential model based
on single-ended models and an [R Series] differential termination correlated
very well to the same tests as Proposal II.

Mohammed added that the C_comp value is important for such simulations.  He
showed that severe mismatched single-ended terminations (such as 150 ohms for
50 ohm lines), produce reflections.  The input C_comp value impacts the shape
and amplitude of the reflections and glitches.   The correct value of C_comp
can be estimated by such a setup by providing a value that produces the
closest responses to a reference Spice simulation.

Mohammed concluded that Proposals II and III produced the best results.  The
estimation of C_comp was very important.


SSTL_2 MODELING EXPERIENCES
Bernhard Unger, Siemens AG, Germany
Bernhard Unger investigated simulations for one and two waveform based IBIS 
models for SSTL_2 (Stub Series Terminated Logic for 2.5V) Class 1
symmetrically single parallel terminated output load and series series
resistor.

The one waveform models (suggested by Bob Ross) used R_fixture = 50 ohms and 
V_fixture = 1.25 V.  The two waveform models (suggested by Eckhard Lenski) 
used R_fixture = 50 ohms and V_fixture = 0 and 2.5 V.  Spice (HSpice 
B-element) and IBIS model simulations were compared.

Three loading conditions were checked:

  Case 1: Parallel terminated tr-line (Z0 = 50, Td = 1.5 nS); Rpara = 50 ohms, 
          Vterm = 1.125 V; Cload = 2.5 pF

  Case 2: Unterminated tr-line (Z0 = 50, Td = 1.5 nS); Cload = 2.5 pF
  
  Case 3: Parallel and series terminated tr-line (Z0 = 50, Td = 1.5 nS); 
          Rseries = 25 ohms; Rpara = 50 ohms, Vterm = 1.125 V; Cload = 2.5 pF

Bernhard showed the overlaid simulations for these cases: 

                Case 1           Case 2            Case 3

  1 Waveform:   Good             Bad mismatch      More mismatch
  
  2 Waveforms:  Slight mismatch  Slight mismatch   Slight mismatch

The Case 2, 1 Waveform simulations had a strong dependence on the HSpice 
specific multiplier relationship of rwf/rfw.  The default setting of 0.1
produced poor results, and the setting of 1.0 provided improved results.

Bernhard checked the 1 Waveform results using an arbitrary multipler table
constraint:  

  Kpudr/f(t) + Kpdr/f(t) = 1

The 1 Waveform results were better, but a zoomed in view showed that the
2 Waveform simulations were still closer to the reference simulations.

Bernhard concluded that there is a strong dependency on loading conditions and
assumptions on multiplier relationships.  He said that golden waveforms may
be needed to check the tool dependent behavioral models and real world
applications.

Bob questioned why Case 2 was considered since that case SSTL-2 was typically
used with parallel terminations.  Bernhard responded that a specific customer
had requested comparisons for Case 2 in order to save power.


LUNCH
The participants were treated to a delicious hot lunch.


CAN BUS MODELING
Manfred Maurer, Bernhard Unger, Siemens, Friedrich Hasinger, BMW
Manfred Maurer described a project to develop models for automotive control 
units to support CAN (Controller Area Network) busses.  CAN is a serial 2-wire
differential bus concept introduced by BOSCH to interconnect microcontrollers,
actuators, and sensors.  Spice models were not available, so IBIS models were
produced from measurement data.

Manfred present the CAN characteristics, applications areas, and a circuit 
model.  The network has bit rates up to 1 Mbit/sec and up to 40 m length, and 
supports at least 30 bus participants.  It also can be used in other 
applications such as for medical equipment and systems.  Busses are doublely 
terminated by 120 ohms at each end, and are wired using a 120 Ohm 
differential characteristic impedance interconnections per ISO/DIS 11898.

The electrical operation for differential signals is not symmetrical.  The 
CAN_H signal swings between 2.5 V and 3.5 V.  The CAN_L signal swings between
1.5 V and 2.5 V.  The Recessive state is when both sides are at 2.5 V (0 V
differential), and the Dominant state is when the CAN_H and CAN_L differential
voltage is 2.0 V.  An internal termination provides a 2.5 V reference.

Manfred showed actual automotive routing (in a BMW) and some electrical bus
configurations.  He stated, in response to a question from Arpad Muranyi, that
twisted cable can be used.  Manfred created single-ended IBIS models
independently for the CAN_H and CAN_L drivers.  The waveforms were extracted
by measurement using a 60 ohm differential load.  It is normal to a single
cycle of significant preshoot and corresponding overshoot ring.  The initial
modeling approach based on assuming a fixed V_fixture value of 2.5 V did not 
produce satisfactory simulation results.

Manfred presented a new approach to derive the Kpu(t) and Kpd(t) coefficients.
He connected the CAN_H pad to a 60 ohm load, and terminated it with a variable
V_fixture(t) equal to the the CAN_L voltage (and visa-versa for CAN_L).  With
this approach, the resulting IBIS differential IBIS model gave overlaying 
simulations with the measurement data.  

Manfred also showed excellent simulation correlation with in an actual bus
applications.  The comparisons showed similar similar ringing on the lines,  
the simulation ringing amplitude was less damped.  This provided a more 
conservative response and indicated that some losses in the bus might not have 
been modeled.  Manfred concluded that the IBIS can be used to produce a good 
match between behavioral simulation and measurements when a a new algorithm 
to generate switching coefficients is used.

Arpad Muranyi suggested considering issuing a BIRD for adding time a varying 
V_fixture(t) table to support this new approach.


PARASITIC IC EMISSION MODELING
Etienne Sicard, National Institute of Applied Science, France
Etienne Sicard provided the overall context of the study by showing examples
of increasing EMI radiation.  Over the past 10 years the number of components
and the clock frequencies have increased significantly, voltage levels have
decreased, but transition times and scaled currents have become more of a
problem.  He showed that radiation can be generated from many sources.

The IERSET project is a cooperative effort with industry and academia by the
European Research Centre on Electronics for Transportation.  Its objectives
are to (1) study and evaluate emission and susceptibility measurement methods
for integrated circuits, and (2) to define and validate a model to be used in 
PCB CAD tools to guarantee the EMC of electronic systems.  EMC simulation
compliance should be part of the IC design flow.

Etienne introduced the core emission model.  It consists of a current source
Ib, and the following parameters connected to the external Vdd and Vss: Rvdd,
Lvdd, Rvss, Lvss, Cb and Cd.  Existing approaches are too detailed and become
impractical for large sized chips or else are too simple and not accurate.  
With the new approach, Ib is an equivalent current generator.  Etienne showed
reasonable simulation and measurement correlation.  This model can be attached
to the IBIS I/O cell through a Zsub resistance and Cio decoupling capacitor.
This added detail gives better validation.  Etienne also added inductive and
capacitive coupling for better correlation with measurement in a TEM cell.

Etienne concluded by noting that a simple model has been proposed and has
produced satisfactory predictions of emission.  The model proposal is being
standardized by the French standards body UTE as ICEM.  The next step is to
produce an ICEM cookbook.

Bernhard Unger asked about the physical meaning of the inductance, and 
Etienne stated that it is related to length of the supply paths within a
chip.  Arpad Muranyi was concerned about lumping all pins into one model.
Etienne stated that there was a 15 dB error in simulations in non-critical
regions.  The simple model was a good start.  Gerald Bannert commented that
he expected a 5 dB mismatch.  Tom Dagostino stated that shielding within
shielding could affect the actual measurement.  Patrick dos Santos commented
that a plane close to the die also could change the results.


INTEGRATED CIRCUITS MODELING, ELECTROMAGNETIC COMPATIBILITY SIMULATION ON
PRINTED CIRCUIT BOARD
Christian Marot, Siemens, France
Christian Marot continued the ICEM presentation by showing actual testing
environments for systems and boards.  All electronic systems have to fulfill
Electromagnetic compatibility tests.  It is too late in the design cycle and
very expensive if the unit fails EMC testing in an anechoic chamber.

Christian showed how IC noise sources based on clock resonances cause the PCB
to act as an antenna through supply lines and signal lines.  Simulations are
needed early in the design process to reduce EMC test stage costs.  Currently
Spice and IBIS are used for models, and IMIC and ICEM are new proposals to
be used along with board RLGC matrices.  Increase IC model accuracy is to be
linked to the IC internal activity through supply lines, signal lines and
direct radiations.  

Christian advocated an IC data flow linking models and simulation tools.  The
objective is to use EMC simulation tools to tune virtual test boards and to
reduce the amount of expensive actual measurement validation testing.


INTEGRATED CIRCUITS MODELING, ICEM INTEGRATED CIRCUITS ELECTROMAGNETIC MODEL
PROPOSAL: IEC 62014-3
Jean Claude Perrin, Texas Instruments, France and Christian Huet, EADS Airbus,
France
Jean Claude Perrin concluded the presentation of ICEM by noting that this is
the fourth year that he has participated in the European IBIS Summit.  

Jean Claude summarized simulation needs for EMC/EMI for integrated circuit
manufacturers and printed circuit board designers.  Simulation is now needed
to comply with EMC directives and standards.  Jean Claude listed the members
of the UTE EMC Task Force and also traced the history starting with a Working
Group in 1994 and continuing through the current CDV proposal that is sent 
to IEC for standards approval in March 2001 as IEC 62014-3.  This is intended 
to be technical document.

The details of the proposed model were again presented.  The first schematic 
showed the power line contribution.  The second schematic added the I/O
contribution to a single supply structure.  The third schematic showed how
the I/O contribution can be modeled in a multiple supply structure.

Then Jean Claude showed how ICEM can be implemented in an IBIS data base.
He showed some related keywords for package modeling and then presented
some new keyword possibilities to describe the current generator and to
document the intercoupling between supplies.  Direct IC electromagnetic
emission is mainly due to the package.  The variables of interest are pin
length, frequency and RLC resonances.

Jean Claude concluded that ICEM data can be added to files such as IBIS for
simulations for EMC due to internal activity and I/O noise coupling.  He
listed some planned actions:

  Issue a cookbook to explain how ICEM model parameters are obtained (a first
    draft is written)
  Evaluate the model through the IBIS Open Forum
  Integrate ICEM in model data bases such as IBIS
  Integrate EMC simulation capability with ICEM
  Validate the software

There was some discussion on how to obtain the internal currents.  Jean Claude 
commented that IC manufactures must know this information in order to prevent 
metal migration problems in package designs.  Other comments related to
getting information from measurements and field solvers.  Patrick dos Santos 
commented that the package model may need to be more detailed.


MODELING OF GROUND-NOISE FOR CIRCUITS WITH SHORT-CHANNEL TRANSISTORS
Mariusz Faferko, Fraunhofer Institute Reliability and Microintegration,
Germany
Mariusz Faferko defined ground-noise in terms of a voltage drop across an
effective inductance.  The test circuit consists of N buffers that switch
simultaneously from high to low.  Each buffer is simplified to just a CMOS 
inverter.

His solution to model the resulting ground noise is to split the ground noise
signal into three phases:

  Slew Rate linear increase
  Time response RL circuit
  Oscillation Circuit

The presentation shows the equivalent circuits and mathematical derivations
for each phase.  Mariusz summarized the resulting equations.  These equations
were in terms of some physical parameters taken from transistor models,
circuit parameters from the schematic some simulation parameters that could
be available from IBIS models.

Mariusz showed excellent correlation between simulations based on the new
model and full circuit Spice simulations, both in the time and frequency
domains.  He also showed excellent correlation in a second example between
simulation and actual measurement.  Mariusz added later that this approach 
has been implemented in a commercial EDA tool.  The resulting noise could
be added as a source to the signal.

Tom Dagostino asked what is covered by Leff, and Mariusz clarified that it 
does include the package inductance.  Tom commented that the formulation 
ignores common mode (crossbar) currents through the driver.  This could be
added.  Ekkehard Miersch questioned whether this approach could scale linearly
for a very large number of drivers (100 or so), as implied in the formulation.  
There may be other interactions such as supply current limits and voltage 
drops.  Mariusz stated that he thought that it would, and he has had excellent 
correlation with about 30 drivers.


AN ELECTROMAGNETIC EMISSION MODEL FOR INTEGRATED CIRCUITS
Peter Kralicek, Fraunhofer Institute Reliability and Microintegration, 
Germany
Peter Kralicek noted that ICs typically are modeled by equivalent circuits
that do not contribute to emitted field analysis.  This is not sufficient for 
today's speeds and complex packages.  He proposes a another new macromodel. 

Peter listed the modeling requirements:

  Good approximation of near and far fields
  Low number of model parameters
  Parameter determination via measurement and simulation
  Simple integration into existing commercial EDA tools
  Support different modes of operation and connected circuitry

He listed a number of possible approaches and is pursuing multipole expansion
of the electromagnetic field.  The advantage of this approach is that it is
scalable for the complexity of the analysis.  He showed plots for dipole,
quadrupole, octopole and hexapole patterns.  More modes can be added, if
needed, for more accurate analysis.

Two models are proposed: the Simple Emission Model (SEM) and the Voltage 
Controlled Emission Model (VCEM).  The SEM has these attributes:

  Valid in near and far field
  Physical model
  Parameter determination via measurement of simulation
  No consideration of external circuitry

The model parameters are multipole coefficients, and these can optionally
support different modes.  The VCEM adds these attributes:

  Voltages at IC ports control modal emissions
  External circuitry (parasitic effects) considered

Peter summarized the workflow.  The model parameters could be added to IBIS
models.  This method has been used in an EDA tool that uses a method of 
moments field solver to approximate the fields for multipole expansion.  
Linear system matrix mathematics is used to determine unknown currents.
Peter reports only a minimal increase in calculation time.

Several different coupling methods are taken into account in a diagram that
shows radiations from the PCB/MCM, coupling to/from an antenna, conductive 
coupling of wires to/from the PCB/MCM, and field coupling of the wires to the 
PCB/MCM and to/from the antenna.

Peter shared some excellent simulation correlation results with almost
overlaying comparisons in the time and frequency domains to full wave
references.  He also showed a case where multipole expansion added more 
accurate simulation detail.  This approach is computationally efficient.  


POINTS OF VIEW FOR HIGH FREQUENCY IBIS MODELS
Gerald Bannert, Siemens AG, Germany
Gerald Bannert provided a list of number of detailed points regarding high 
frequency IBIS models.  His classifications are extensive and detailed, and he 
talked about several of them during the presentation.  Some other points had 
been covered in earlier presentations.  Overall, Gerald supports including 
many of the relevant optional parameters in IBIS models including some new 
ones that are described in approved BIRDs.

He listed a number of technological changes made over the past 10 years.  The
general trend is for higher speed and complexity, greater I/O variety and 
greater influence of parasitics.

In another table Gerald provided some desired Version 3.2 improvements for
handling:

  New output technologies
  Scaling algorithm for process, temperature and voltages
  Coupled package sections
  Ground bounce
  Complex input
  EMI parameters

He needs better package detail using coupled sections, but some of the losses
are currently not so important.  These include skin effect and dielectric 
losses.

One needed improvement is to model cross bar current.  Gerald summarized his 
concerns:

  He questions if there is a big demand for IBIS-X
  Further development is needed for IBIS
  He proposes technical model classification with supporting examples
  Official IBIS statement on proper model development methods



IBIS-X AND THE IBIS MACRO LANGUAGE
Stephen Peters and Arpad Muranyi, Intel, USA
In the remaining time, Arpad Muranyi gave a brief overview of the IBIS-X
ongoing work.  He adapted some of Stephen Peters' earlier presentation
material for this presentation.  The problem is that IBIS is has some serious
limitations regarding a number of important parameters.  These include:

  Dealing with some new technologies
  Return path modeling support
  Coupled package modeling support
  Receiver model advances
  Frequency domain analysis

The IBIS-X approach is to keep the good features of IBIS, but add flexibility
including nodal interconnection support for model and die interconnect
advances, and a macro language for the flexibility of creating new model
prototypes.  The presentation gave some examples of details.  Arpad warned
that the syntax is still evolving, so some IBIS-X details are presented only
for information on what is being considered.  IBIS-X has the flexibility to
define new tables and add other formats for numerical data.  The IBIS-X
extensions also include a number of Spice compatible primitives.  

Arpad touched on a number of topics.  The syntax of elements looks like a
more formal version of Spice syntax.  Data input can take on may forms from
numerical and symbolic values to multidimensional tables.  A number of 
familiar operators are defined, such as || for OR. 

Extended blocks are defined for:

  Driver
  Reshape
  Delay
  Voltage Controlled Delay

Other likely extensions include:

  Behavioral voltage and current sources similar to the Berkeley "B" element
  Integrator block
  Differentiator block
  Behavioral integrator
  Behavioral differentiator

Other extensions being considered include:

  Model creation/functionality -
    .trigger, .local, .inherit 
    
  Debug/visibility related -
    .export, .alarm, .assert
  
  Program flow -
    .if .elseif, .endif, .select, .case, .end select, .array <name>

  General equations -
    Berkeley B element

Arpad summarized the current status:

  IBIS Version 3.2 has been implemented in the IBIS-ML (macrolanguage)
  The Working Group is meeting bi-weekly doing -
    The overall IBIS-X specification
    Library guide
    Programmers Language Reference Manual
  Much work remains on the die interconnection section

In response to Gerald Bannert's question, Arpad stated that IBIS-X goes beyond 
both Spice and IBIS and addresses things that cannot be done currently. 
Gerald added that analog simulation can be possible.  Ekkehard Miersch 
commented that lumped package approximations are not sufficient.  Bob Ross 
stated that distributed models are expected to be supported.  Etienne Sicard 
questioned how IBIS-X relates ot IBIS and IMIC, and Arpad responded that these 
formats and other formats are just levels of abstraction for model details.

Someone asked why an existing higher level language such as VHDL-AMS or
Verilog-AMS was not used.  Arpad responded that we had heard presentations
and considered a number of approaches at the June 8, 2000 IBIS Summit Meeting. 
We chose the macro language approach because in matched what we were trying 
to accomplish and we were not expert enough to deal with understanding other
approaches.  The alternatives including extending IBIS, using Spice or IMIC, 
etc. seemed to be limited in some respects.  In a sense, IBIS-X could also be
viewed as a Spice-X extension since Spice was also limited for our needs.  For 
example, IMIC table model extensions could be issued using the macro language 
to describe the table transistor format and its interconnections.  Arpad added 
that when the IBIS-X discussion is moved from the Working Group to the IBIS 
Open Forum for review, and the macro language is better defined, that topic 
could be revisited.

Bob Ross added that someone would have to help drive an alternative higher
level language approach.  A formal description of IBIS-X might be the starting
point.  However, the current plan is to continue with the macro language
development and concurrent parser implementation.


CONCLUDING REMARKS
Bob Ross thanked the participants for attending and the presentors for 
providing a fine set of presentations.  Bob also thanked the sponsors and
Karine Loudet again for the setup.  The poster she produced is available at
the Web site given above.


NEXT MEETING:
The next teleconference meeting will be on Friday, March 30, 2001, from
8:00 AM to 10:00 AM.

==============================================================================
                                      NOTES

IBIS CHAIR: Bob Ross (503) 685-0732, Fax (503) 685-4897
            bob_ross@mentor.com
            Modeling Engineer, Mentor Graphics
            8005 S.W. Boeckman Road, Wilsonville, OR 97070

VICE CHAIR: Stephen Peters (503) 264-4108, Fax: (503) 264-4515
            stephen.peters@intel.com
            Senior Hardware Engineer, Intel Corporation
            M/S JF1-209
            2111 NE 25th Ave.
            Hillsboro, OR 97124-5961

SECRETARY:  Guy de Burgh (805) 988-8250, Fax: (805) 988-8259
            gdeburgh@innoveda.com
            Senior Manager, Innoveda
            1369 Del Norte Rd.
            Camarillo, CA 93010-8437

LIBRARIAN:  Roy Leventhal (837) 797-2152, Fax: (847) 222-2799
            roy_leventhal@3com.com
            Senior Engineer, CommWorks Corp. (a wholly owned 3Com subsidiary)
            1800 W. Central Rd.
            Mt. Prospect, IL 60056-2293

WEBMASTER:  Syed Huq (408) 525-3399, Fax: (408) 526-5504
            shuq@cisco.com
            Manager, Hardware Engineering, Cisco Systems
            170 West Tasman Drive
            San Jose, CA 95134-1706

POSTMASTER: John Angulo (425) 869-2320, Fax: (425) 881-1008
            jangulo@innoveda.com
            Development Engineer, Innoveda
            14715 N.E. 95th Street, Suite 200
            Redmond, WA 98052

This meeting was conducted in accordance with the EIA Legal Guides and EIA
Manual of Organization and Procedure.

The following e-mail addresses are used:

  ibis-request@eda.org
      To join, change, or drop from either the IBIS Open Forum Reflector
      (ibis@eda.org), the IBIS Users' Group Reflector (ibis-users@eda.org)
      or both.  State your request.

  ibis-info@eda.org
      To obtain general information about IBIS, to ask specific questions
      for individual response, and to inquire about joining the EIA-IBIS
      Open Forum as a full Member.

  ibis@eda.org
      To send a message to the general IBIS Open Forum Reflector.  This
      is used mostly for IBIS Standardization business and future IBIS
      technical enhancements.  Job posting information is not permitted.

  ibis-users@eda.org
      To send a message to the IBIS Users' Group Reflector.  This is
      used mostly for IBIS clarification, current modeling issues, and
      general user concerns.  Job posting information is not permitted.

  ibischk-bug@eda.org
      To report ibischk2/3 parser bugs.  The Bug Report Form Resides on
      eda.org in /pub/ibis/bugs/ibischk/bugform.txt along with reported bugs.

      To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms
      which reside under eda.org in /pub/ibis/bugs/s2ibis/bugs2i.txt,
      /pub/ibis/bugs/s2ibis2/bugs2i2.txt, & /pub/ibis/bugs/s2iplt/bugsplt.txt
      respectively.

Information on IBIS technical contents, IBIS participants, and actual
IBIS models are available on the IBIS Home page found by selecting the
Electronic Information Group under:

  http://www.eigroup.org/ibis/ibis.htm

Check the pub/ibis directory on eda.org for more information on previous
discussions and results.  You can get on via FTP anonymous.
==============================================================================

 
From owner-ibis Fri Mar 23 08:40:11 2001
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From: guy@camarillo.innoveda.com (Guy de Burgh)
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To: ibis@eda.org
Subject: IBIS Open Forum Meeting Agenda


		     IBIS Open Forum Meeting Agenda
			      for 3/30/01

		 Bridge Number    Reservation #   Passcode
		 (916) 356-9200   2-524673        6244264

All meetings are 8:00 AM to 9:55 AM Pacific Time.  When you call into the 
meeting, ask for the IBIS Open Forum hosted by Will Hobbs and give the
Reservation Number and Passcode.

8:00 Check-In, Intros, Announcements                         Ross

     - Intros of New IBIS Participants, Meeting Quorum       Ross
     - Membership Update and Treasurers Report               Ross/Fleming
     - Review of Previous Meeting's Minutes (and ARs)        Ross
     - Miscellany/Announcements                              All
     - Press & Web Page Updates                              Huq, All
     - New Models Available, Library Update                  Leventhal, All
     - Opens for New Issues                                  All

8:15 Administrative and Project Discussions

     International/External Progress
     - IEC 62014-1 (IBIS Version 3.2)                        Ross/Fleming
     - pr EIAJ ED-5302 Standard for I/O Interface Model      
	  for Integrated Circuits (IMIC)                     Ross
     - IEC 62014-3 (ICEM) Integrated Circuits Electromagnetic 
       Model Proposal (IEC 93/67/NP IBIS and EMC Simulation) Perrin/Ross
     - JEDEC JC-16 Modeling and Testing                      Sessions
     - T10, Project 1414-DT - SCSI Signal Modeling           Barnes

     Date 2001 European IBIS Summit Meeting Review           Ross

     DAC 2001 IBIS Summit Meeting Planning                   Ross

     IBIS Model Review Committee                             Angulo

     New Administrative Issues                               All

8:45 Technical Discussion (some topics may be deferred)

     Connector Proposal Review                               Panella

     IBIS Futures Group Report (IBIS-X, API, BIRDxx)         Peters

     BIRD69.1 - Golden Waveforms                             Edlund

     BIRD70 - Golden Waveforms                               Edlund

     Other Pending BIRDS                                     Ross

     ibischk3 Bug Tracking                                   Ross

     - BUG54 - Corners with NA Give Bad Test Load Warnings   Mirmak

     New Technical Issues                                    All

9:50 Wrap Up and Next Meetings Plans                         Ross

9:55 Sign Off
 
 
From owner-ibis Fri Mar 30 14:34:02 2001
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Date: Fri, 30 Mar 2001 14:33:28 -0800
From: Bob Ross <bob_ross@mentorg.com>
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To: ibis@eda.org, ibis-users@eda.org
Subject: New ibischk3 Version 3.2.7
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To All:

New ibischk3 Version 3.2.7 executables have been
uploaded under

  http://www.eda.org/pub/ibis/ibischk3/

The older executables are archived under the same
directory.  The new executables correct a defect
where Warning messages are issued for correct
*Open_drain and *Open_sink or *Open_source
models.

Thanks to Matthew Flora for making the correction
and producing the Windows executable and thanks to
Guy de Burgh for producing the new Unix executables.

A Linux executable still needs to be created and
uploaded.

The new Source code has been distributed to the
companies holding the source code licence.

Bob Ross
Mentor Graphics
 
