From owner-ibis  Wed Feb  5 16:50:17 1997
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Date: Wed, 5 Feb 97 16:31 PST
From: bob@icx.com ( Bob Ross)
To: ibis@vhdl.org
Subject: IBIS Summit Minutes January 20, 1997
Cc: fukuda@hitachi-mc.co.jp

 DATE: February 5, 1997

 SUBJECT: 1/20/97 EIA IBIS Summit Minutes, Santa Clara, California.
  
 VOTING MEMBERS AND 1997 PARTICIPANTS LIST:
 AMP                            (Ray Ziesse), Jeff Walden*
 Applied Simulation Technology  Dileep Divekar*, Norio Matsui*
 Cadence Design                 C. Kumar*, Don Telian*
 Cypress                        Bruce Wenniger*
 Hewlett Packard, EEsof         Karl Kachigan*, Henry Wu*
 HyperLynx                      Kellee Crisafulli*
 INCASES                        (Olaf Rethmeier)
 Intel Corporation              Stephen Peters*, Arpad Muranyi*,
 Interconnectix                 (Bob Ross)
 Meta-Software                  (Sanjay Gangal)
 Mitsubushi                     Tam Cao*
 Motorola                       Ahmed Omer
 National Semiconductor         Syed Huq*, Cheng-Yang Kao*, Mike Brisbi*
				Peter Laflamme*, Kevin Smith*, 
 NCR                            (Dave Moxley), Richard Mellitz*
 NEC                            (Hiroshi Matsumoto)
 Quad Design                    Jon Powell*, Chris Rokusek*
 Quantic Laboratories           (Mike Ventham)
 Texas Instruments              (Sri Jandhyala), Thomas Fisher*
 Thomson-CSF/SCTF               (Jean LeBrun)
 UniCAD Canada Ltd.             (Celso Faia)
 Veribest                       Ian Dodd*
 VLSI Technology                (Dick Ulmer), Hrish Patel*, D.C. Sessions*,
 Zuken-Redac                    (John Berrie)
 
 OTHER PARTICIPANTS IN 1997:
 3M                             Fran Hart*
 Actel                          Scott Schlachter*
 Acuson & Free Model Foundation Richard Munden*
 Alcatel                        John Fitzpatrick*
 Ansoft                         Eric Bogatin*
 Apteq Design Systems           Dan FitzPatrick* 
 Compaq                         Weston Beal*
 Digital Equipment Corp.        Jeff Chu
 EIA                            Patti Rusher*
 EMC                            Fabrizio Zanella*
 Micron Technology              Brian Johnson*                      
 Molex                          Gus Panella*
 North Carolina State U.        (Michael Steer)
 S3, Inc.                       Porsh Shih*, Jarathy Jribhashyam*
 Ultratest International        Charles Im* 

 In the list above, attendees at the meeting are indicated by *.  Principal
 members or other active members who have not attended are in parentheses.
 Participants who no longer are in the organization are in square brackets.
 Note, refer to the January 10, 1997 minutes for the last listing of the
 1996 IBIS Open Forum participants.

 Upcoming Meetings:  The bridge numbers for future IBIS teleconferences are as
 follows:
     
      Date       Bridge Number    Reservation #    Passcode  
      2/14/97    (916) 356-9200   3-81822          3973256

 All meetings are 8:00 AM to 9:55 AM Pacific Time.  We try to have agendas out 
 7 days before each open forum and meeting minutes out within 7 days after.  
 When you call into the meeting, ask for the IBIS Open Forum hosted by Will 
 Hobbs and give the reservation number and passcode.
 
 NOTE: "AR" = Action Required.
 
 -------------------------------- MINUTES -------------------------------------

 MINUTES NOTES:
 These minutes are constructed from raw/unedited notes taken and distributed 
 by Jon Powell.  The minutes capture some highlights of an all day face-to-face 
 meeting where much of the technical content is in the presentation material
 itself.  The presenter's are welcome to submit corrections and clarifications 
 to these minutes, as needed.  Syed Huq and Jon Powell will be working on
 making the presentations available in computer readable formats on vhdl.org
 for FTP or Browser access.  These minutes contain some corrections received
 after Jon's notes were distributed.

 Jon noted that this was a well attended meeting with representatives from all
 of the various areas of IBIS interest including IC manufacturers, connector
 manufacturers, EDA vendors, and end users.  The presentations were informative
 and covered a variety of topics. 
 
 Finally, we give special thanks to Syed Huq and National Semiconductor for
 hosting the IBIS face-to-face meeting.  National provided an excellent room
 and superior refreshments.


 INTRODUCTIONS - Syed Huq, National Semiconductor
 Syed Huq, National Semiconductor: Presiding
 Jon Powell, Quad Design: Acting Secretary
 Patti Rusher, EIA: EIA Representative


 REVIEW OF SUMMIT AGENDA, OPENS FOR NEW ISSUES - Syed Huq
 A question was raised regarding who is providing models.  Jon Powell, who is
 serving as Librarian, commented that he will run QA checks on any model that
 is e-mailed to him at jonp@qdt.com.  He also is soliciting models to be added
 to the IBIS reflector.  Jon has not received any new models for release during
 the last eight months (except from Arpad Muranyi).
 

 ANSI/EIA-656 (IBIS) OVERVIEW - Syed Huq
 Syed Huq presented an overview and IBIS roadmap and discussed the usage of
 the IBIS reflectors for communication.

 Jon Powell indicated that IBIS Open Forum Member companies can add or update
 your company logo on the IBIS Poster page of the EIA/IBIS home page.  Send the
 logo to jonp@qdt.com.  It should be in bmp or tiff format and have a size of
 about 800x200 pixels.  Bigger is better since Jon can size it down.


 EIA MEMBERSHIP AND IEC UPDATE - Patti Rusher, Electrical Industries Association
 Patti Rusher reported that there are 23 Official EIA/IBIS Members to date.
 Committee Membership is $500.00 per year.  Membership applications are
 available from Patti and will soon be available on EIA/IBIS Web site.  Bills
 for 1997 were also distributed at the meeting.

 IBIS will be represented at the Design Automation Conference (DAC) in June,
 1997 in the EIA booth.

 Regarding EIA Web page usage, IBIS is number two in the EIA on hits and has
 over 7000 hits since page inception.

 IEC Update: Patti reported that IBIS is going through the international
 technical committee.  IBIS will be assigned to Hilary Kahn.  The goal is
 to have out as a full standard in the next two years.

 [Update from Patti:  IBIS did not pass international standardization at the
 last IEC TC93 US TAG meeting because only three countries agreed to work on it
 (USA, Japan and UK with Denmark abstaining) and five are required.  Several
 other countries will be approached.]


 IBIS MODELING AT ALCATEL - John Fitzpatrick - Alcatel CIT
 John Fitzpatrick indicated that Alcatel makes telephone switches.  Alcatel has
 committed to building a large library of IBIS models.  They have done signal
 integrity analysis in the past by hand using Bergeron diagrams.  The goal
 with IBIS is to use models for simulation and extracting information to 
 create design rules.

 John has found that the IBIS he uses that are not from the vhdl.org 
 directory contain errors in all cases (100%).  Therefore Alcatel is 
 generating and checking the IBIS models themselves in a signal integrity 
 laboratory.  
 
 They want to use IBIS models to do constraint driven routing and also to use
 the IBIS files in a data base to extract information for design rules.  An
 example of a question is: Do 3 volt devices need protection?  Another use
 is to help with crosstalk control and route constraint generation for 
 correct-by-design routing.  IBIS models would provide the component series
 resistance to be used in conjunction with the proper series termination.

 John's wish list for IBIS extensions are:
   1)  Series components. (Very important)
   2)  Non-monotonic IV curve models.
   3)  R,L,C description capability.
   4)  BUS Switch Models (This is a very important issue)

 Alcatel wants to keep all models in IBIS format, but right now they are being 
 forced to keep models in multiple formats because IBIS does not support the 
 above extensions.

 John's less important wishes are:
   1)  Easier to understand IV curves: John suggests the need for new keywords 
       that support pure measurement derived values and formatting and let the
       simulator do the necessary subtractions, etc.  (A comment from the 
       audience suggests the development of a better editor on input method.)
   2)  More background information in the model: Contact information, Brief 
       description of the component, or URL to the component description.
   3)  Unique buffer names: Guidelines on buffer naming - each supplier should 
       use a unique meaningful name.
   4)  Model Verification.
   5)  Long term goal: Full Electrical Specification (don't need data-sheets).
   6)  Recommended paper data-sheet format for representing IBIS models.
   7)  Better specification of minimum data to have in IBIS models.
   8)  IBIS as a specification tool.
 
 Other suggestions include:
   ASICs (to allow for a choice of output buffers)
   Second sourcing (give us a part that matches this model)
   Industry-standard I/O (Golden IBIS models representative of industry 
      standard technologies (LCT, LVC, AC, FAST, Memories etc.)


 VISUAL IBIS EDITOR - Kellee Chrisafulli
 Kellee Chrisafulli offers the HyperLynx Visual IBIS Editor free from several
 websites.  He is seeking user inputs on how to improve the Editor.  It 
 works with Windows 3.1, 95 and NT, but runs best on 95 and NT.  It has
 a built in IBIS Version 2.1 and 1.1 syntax checker and an IBIS Skeleton
 generator.  Built in viewers allow displaying the various tables graphically
 to assist in debugging the data.  However, these tables cannot be edited
 using the viewers.  The Editor is available on http://www.hyperlynx.com.

 Sheets were passed out to the audience for inputs concerning feature updates
 and suggestions.

 Suggestions given by audience include:
   1) Show loading conditions on waveforms.
   2) Overlay multiple curves for comparison of different models.
   3) Don't show clamp of data beyond data range.  Just show the end of the 
      data.
   4) Veribest might provide a spice2ibis converter in Windows NT executable 
      format.
   5) Remove the Control-M characters from files because they are not allowed
      in IBIS.  (Is this true?) - [Answer - DOS formatted data is permitted
      and most parsers will ignore the Control-M character.]
   6) Allow graphically editing of the tables.
   7) Provide a pop-up menu with blanks for all input values.

 Comments to Kellee can be sent directly to kellee@hyperlynx.com.

 One comment is that IBIS standard needs to define how to interpret data that 
 is beyond the end of the IBIS data range.  Another comment is to contact Ian 
 Dodd regarding putting his version of spice2ibis for Windows NT on an IBIS 
 Web Site.


 SIGNAL INTEGRITY AND IBIS - Don Telian, Cadence
 [Note, this presentation was also given at Design SuperCon97 as "Signal
 Integrity Engineering in High-Speed Digital Systems" and was voted the
 best presentation.  Don's background includes authoring both the initial
 IBIS and initial RAIL specifications and chairing the initial public forum
 committees for both devepment activities.]
 
 Don Telian, a Signal Integrity Engineering in High-speed Digital Systems
 Surveyed 5 managers of SI groups and put their feedback in this presentation.
 (See Don's slides and/or the Design SuperCon97 High-Performance System Design
 Conference proceedings, pp. HF213-1 - HP213-17 for the actual presentation.)
 
 The goal of this presentation is to define the SI engineer.  Electrical 
 description is moving from a static form to a dynamic form.  Don presented 
 seven roles of SI engineer:
   1)  Pioneering and Defining
   2)  Partitioning and Approximating
   3)  Modeling and Measuring
   4)  Design and Optimizing
   5)  Quantifying and Verifying
   6)  Reducing and Simplifying
   7)  Correlating and Debugging

 In conclusion one must resolve to use good judgment rather than to whine.


 PROBLEMS REPRESENTING ABT MODELS USING IBIS - Jon Powell, Quad Design
 Jon Powell shared that the TI Spice models for the ABT series demonstrates
 a charge pumping and load dependent IV phenomena beyond what can be
 represented in the current IBIS format.  Jon showed a simplified circuit
 and gave some simulation examples to illustrate the effect.  Jon plans to
 post a full report to the IBIS reflector for further discussion.


 AN IBIS SURVEY - Karl Kachigan, Hewlett Packard - EEsof
 Karl Kachigan reported the results of a survey questionnaire he had issued 
 earlier on the IBIS reflector.  The survey asked how people develop models, 
 and the results show:
   1) Most use Spice to develop models (based on 100% of responders derived 
      IBIS models from Spice).
   2) There is opportunity for commercialization of SPICE to IBIS converter
      (but people are not willing to pay a high price for such a converter).
   3) Four out of seven responders said they did use some measurement 
      techniques to validate the simulation.
   4) The generation of models is usually not part of the budget. 


 MODELING EARLY CLAMPS IN IBIS - Arpad Muranyi, Intel
 Arpad Muranyi reported on Intel work on "Integrated Termination for Low Power, 
 Low Cost, High Speed Signaling" to put into chips.

 To be competitive in the personal computer market, Intel needed to develop a
 a low cost desktop chip set solution for the P6. 

 Currently the GTL bus needs two terminators.  This cost too much money and 
 uses to much current.  Intel has found a good technique that works in both GTL
 and CMOS.  It lets you get rid of the resistors.

 Arpad showed a worst case circuit: A Tee topology circuit with termination 
 in the middle.  Terminating it at both ends causes problems.  What is needed
 is a termination with a special IV curves with no currents at VOH and VOL.  A
 solution is to use Early clamps to match diodes to the desired curve.
 In GTL systems, VOL drifts because it varies on buffer strength (and the 
 strength of the pullup device).

 Static Early clamps are easy to model by inserting IV curves into the clamps.

 Dynamic curves are harder. Perhaps shift a IV curve as controlled by a VT 
 curve. But the shifted IV curve might not be the same as the original IV 
 curve. The timing is completely dependent on the implementation of the 
 method, which is not defined.  Arpad wants to come up with a IBIS 
 description method that encompasses all possible implementation techniques.

 A suggestion was made to try and fit this into the Multi-staged Outputs
 BIRD35.3.  BIRD35.3 would have to be modified to add a multi-receiver
 technology with a threshold test.  Arpad will open this discussion on the IBIS
 reflector.


 BIRD36.D - Stephen Peters, Intel
 Steven Peters introduced BIRD36.d (which is work in progress by an off-line
 Package Committee to develop BIRD36.1 for IBIS Open Forum) by stating its 
 intended scope:
    
    Simple board descriptions (SIMMs)
    Connectors (coupled and uncoupled)
  
 Complex (coupled) board descriptions are best left to physical/layout
 extraction descriptions (EDIF 4 0 0 calls out IBIS models).

 Some highlights of Stephen's presentation are given.  Bird 36.d defines 
 interconnect boundaries.  In general [Application Info] is used for
 connectors.  The keyword arguments provide critical information that the
 connector vendors feel is needed such as the rise time (bandwidth?) for which
 the model valid.  [Number of Pins] used for boards, unmated connectors and
 such.  [Number of Pairs] supports connectors that may eventually use a matrix
 description.  The BIRD is ambiguous about general named nodes and available
 interconnections, but this is being fixed.  It does make clear that if the
 length is specified as greater than zero, then the element is to be assumed to
 be distributed.

 The coupling description and formatting issue will apply for connectors only,
 not for general boards.  The basic approach considered is to use cascaded,
 named matrices in some format to be determined.  One problem and question
 is data reduction:  Do you really want to describe fully a 200 pin, 4 row
 connector?  Another problem is accuracy.  The challenge is to agree on what
 the data represents and how to process it.

 The mated model includes both male and female pins connected to form one
 model.  The unmated model represents only one of the connector components
 when it is disconnected.

 Discussion and debate followed concerning what is an acceptable way to
 specify a coupling matrix for connectors.  One consensus (?) was that such a
 matrix formulation does exist, and the syntax needs to be agreed upon.
 D.C. Sessions was concerned that there is no definition for the local 
 ground on a SIMM for local ground bounce analysis.


 OTHER ITEMS AND GENERAL DISCUSSION - Syed Huq
 Next meeting will be on Friday, February 14.  The topic of what needs
 to be done for Version 3.0 needs to be discussed.

 Model verification signatures in IBIS models to document passing certain
 validation tests was suggested.  One response is that it is the responsibility
 of the EDA companies to service their customers.

 Actel asked to make the "[SOURCE]" keyword required so that all models can
 be traced.  However, there was opposition since there is no way to enforce
 such a requirement.


 NEXT MEETING:
 The next meeting is on Friday, February 14, 1996, 8:00 A.M. to 9:55 A.M.
 BIRD40 is scheduled for a vote along with a discussion on what needs to
 be done for Version 3.0.

 ==============================================================================
				       NOTES
 
 IBIS CHAIR: Bob Ross (503) 603-2523, Fax (503) 639-3469
	     bob@icx.com
	     Modeling Engineer, Interconnectix
	     10220 SW Nimbus Ave, K4, Portland, OR 97223

 VICE CHAIR: Syed Huq (408) 721-4874, Fax: (408) 721-4785
	     huq@rockie.nsc.com
	     Staff Applications Engineer, National Semiconductor, M/S A-2595
	     2900 Semiconductor Drive, Santa Clara, CA 95052
 
 LIBRARIAN:  Jon Powell (805) 988-8250, Fax: (805) 988-8259
	     jonp@qdt.com
	     Transmission-Line Products Manager, Quad Design
	     1385 Del Norte Rd., Camarillo, CA 93010
 
 SECRETARY:  Vacant
 

 This meeting was conducted in accordance with the EIA Legal Guides and EIA
 Manual of Organization and Procedure.
 
 The following e-mail addresses are used:

   ibis-request@vhdl.org
       To join, change, or drop from either the IBIS Open Forum Reflector
       (ibis@vhdl.org), the IBIS Users' Group Reflector (ibis-users@vhdl.org)
       or both.  State your request.

   ibis-info@vhdl.org
       To obtain general information about IBIS, to ask specific questions
       for individual response, and to inquire about joining the EIA-IBIS
       Open Forum as a full Member.

   ibis@vhdl.org
       To send a message to the general IBIS Open Forum Reflector.  This
       is used mostly for IBIS Standardization business and future IBIS
       technical enhancements.

   ibis-users@vhdl.org
       To send a message to the IBIS Users' Group Reflector.  This is 
       used mostly for IBIS clarification, current modeling issues, and
       general user concerns.

   ibischk-bug@vhdl.org
       To report ibischk2 parser bugs.  The Bug Report Form Resides on
       vhdl.org in /pub/ibis/bugs/bugform.txt along with reported bugs.

 Information on IBIS technical contents, IBIS participants, and actual
 IBIS models are available on the IBIS Home page found by selecting the
 Electronic Information Group under:

   http://www.eia.org

 Check the pub/ibis directory on vhdl.org for more information on previous 
 discussions and results.  You can get on via ftp anonymous, "guest" login from 
 telnet or dial-in (415-335-0110), or send an e-mail request to the automatic 
 archive server, archive@vhdl.org.
 
 "IBIS Spoken Here" placards are available from Jon Powell (jonp@qdt.com) for 
 use at trade shows.
 ==============================================================================

From owner-ibis  Wed Feb  5 16:50:11 1997
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Message-Id: <m0vsHfF-000GjSC@icx.com>
Date: Wed, 5 Feb 97 16:26 PST
From: bob@icx.com ( Bob Ross)
To: fukuda@cc-smtp.hitachi-mc.co.jp
Subject: Re:  EIAJ I/O Interface Model
Cc: bob@icx.com, huq@rockie.nsc.com, ibis@vhdl.org, jonp@qdt.com,
        pattir@eia.org, will_hobbs@ccm2.jf.intel.com

Fukuda-san

Thank you very much for your update.  I am looking forward to seeing your
proposal.

You ask how we should proceed toward productive cooperation between the
IBIS Open Formum and EIAJ. 

My recommendation is that you provide me with an electronic copy of draft
v0.0.  I would like permission to be able to either circulate it to the
IBIS Open Forum distribution list and/or to store a copy on the 
vhdl.org/pub/ibis directory for public viewing and access.  At this time,
without seeing the proposal, I cannot predict how it will be initially
received.  My expectation is that the proposal will generate a set of 
technical questions which will need clarification, and may possibly raise
issues and challenges.  So you may need to be prepared to be responsive
and to either defend or modify your proposal.

The IBIS Open Forum has been in existence since 1993 and has operated through
public discussions.  The formal EIA/IBIS Committee membership consists of
23 companies from many of the leading EDA simulator, semiconductor, and user
companies (AMP, Applied Simulation Technology (formally Contec), Cadence,
Cypress, Hewlett Packard, Hyperlynx, Incases, Interconnectix (now with Mentor
Graphics), Meta-Software (now with Avanti), Mitsubishi, Motorola, National
Semiconductor, NCR (formally with ATT), NEC, Quad Design (a Viewlogic company),
Quantic Laboratories, Texas Instruments, Thomson-CSF/SCTF, Unicad (now with
CCT which is part of Cadence), Veribest (formerly from Integraph), VLSI
Technology, and Zuken-Redac).  The meeting participation in 1996 in IBIS
activities includes over 75 indivuals from most of the above companies
plus many more, since participation is open to anyone.  The IBIS mailing
list contains over 280 names from companies all over the world.

The IBIS Open Forum continues to meet regularly, both via telephone
conference calls and via face-to-face meetings.  Like your committee, we are
driven by EDA customer analysis needs and newer Silicon developments, and we
have enhancements to IBIS, either approved or underdevelopment.  We also have
extensive package model enhancements related to Pentium Pro hybrid chip
construction and newer ideas, proposals for SIMM modules, proposals for
some buffer complications including multi-staged switched buffers, and
mapping and coupling considerations leading to ground/power bounce analysis.
Your ideas are welcome in these areas because these all represent difficult 
and (in our committee) controversial extensions.  

While you state there is no overlap, and you stress a relationship with
a Spice style format, we continue to be interested in your ideas.  So
we need to see what you have developed before determining whether to
continue independently or to cooperate in some manner.

I would like to know which companies are contributing to your proposal.
Finally, we welcome you or any of your members to participate in the
IBIS Open Forum discussions.

Best Regards,
Bob Ross
IBIS Open Forum Chair
Phone (503) 603-2523, Fax (503) 639-3469
bob@icx.com
Interconnectix, 10220 S.W. Nimbus Ave., K4, Portland, OR 97223


> Date: Thu, 30 Jan 97 19:03:08 JST
> Message-Id: <9700308546.AA85461@htc-mc2.hitachi-mc.co.jp>
> To: bob@icx.com
> CC: FYT46205@pcvan.or.jp, fukawa@eiaj.or.jp
> Subject: EIAJI/O Interface Model
> Status: RO

> Dear Mr. Ross

> As I informed you, We are discussing I/O interface model in EIAJ.    We finished
> the draft v0.0 by the end of the last year, and will be ready to release in the
> coming February both in Japanese and in English.
> As I showed you the scope of our activity, we do not intend to compete with
> IBIS, but to propose improvements for extending application and in reducing
> inconvenience in model supply from IC companies.    The points of the
> improvement are :
> (1) Ground / power bounce
> (2) Complicated circuits buffers
> (3) Complicated shaped packages and modules.
> Recently IC companies are required to supply both IBIS and SPICE data.  This
> inconvenience might be solved by the unified model adopted in our proposal.
> I would like to have your idea about how to proceed toward productive
> cooperation between IBIS and EIAJ.

> Best regards,

> Hideki Fukuda
> Chairman
> I/O Interface Model Project Group
> Technical Standardization Committee on Semiconductor Devices
> EIAJ

> Hitachi Microcomputer System
> Tel  +81-423-25-1711
> Fax  +81-423-28-1462
> E-mail   fukuda@hitachi-mc.co.jp


From owner-ibis  Wed Feb  5 16:57:03 1997
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From: apanella@molex.com
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Message-ID: <@m400gw.molex.com>
Subject: Hello is there anybody out there??

     I haven't seen anything on the reflector since SuperCon....
     
     Have I missed anything.....
     
     _gus panella
     apanella@molex.com
From owner-ibis  Thu Feb  6 10:09:41 1997
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From: "Dodd, Ian" <idodd@ingr.com>
To: "'ibis@vhdl.org'" <ibis@vhdl.org>,
        "'awglaser@eos.ncsu.edu'"
	 <awglaser@eos.ncsu.edu>
Subject: Spice to IBIS translator for NT (Comment on IBIS Summit Minutes)
Date: Thu, 6 Feb 1997 12:06:11 -0600
X-Mailer:  Microsoft Exchange Server Internet Mail Connector Version 4.0.994.63
Encoding: 22 TEXT

Hi all,
	Veribest has ported the version 1 SPICE to IBIS converter to Windows
NT. We will provide it as an executable and as source to interested
parties on a "as is" basis. Our source has been modified to fix a few
critical bugs and to work around file access (locking) problems that
occur on NT but not on UNIX. We also added an option to use our
proprietary analog simulator. The executable should also work under
windows 95 (to be verified!)

	We are actively working on porting the latest version of the program
and will make it available as soon as we have done some unit testing.

	If someone wants the  version 1 converter for NT, please contact me.
In addition, do we want to put this port on vhdl.org?

	Obviously we are very grateful to the team at North Carolina State
University that wrote this program, and hope that providing the NT port
assists the IBIS cause.
				
						Ian C Dodd
						Veribest Inc
						idodd@veribest.com
From owner-ibis  Thu Feb  6 16:03:11 1997
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Date: Thu, 6 Feb 97 16:03 PST
From: bob@icx.com ( Bob Ross)
To: ibis@vhdl.org
Subject: Forwarded: waveform testloads

For Reflector Discussion

Bob Ross
Interconnectix, Inc.


Date: Thu, 6 Feb 97 15:52:33 +0100
From: cornelia@thesys.de (Cornelia Foss)
Message-Id: <9702061452.AA11815@s01.thesys.de>
To: ibis-info@vhdl.org
Subject: waveform testloads
Status: RO


Hello all,

I've been off the IBIS topic for a while, so please forgive if I
come up with an "old" question. After reviewing the discussion 
concerning how to provide waveform- loads that model the ac- 
behavior most correctly there are still questions.

When generating for instance  [rising waveform] information I currently
use a non-reactive load at high and low voltage - is that valid?

These waveforms are only correct at one point each, the simulator
will have to interpolate somehow. So it is quite clear that the 
results may differ from simulator to simulator, but to hold the
differences to a minimum it was helpfull if one would know how
interpolation is done, are these algorithms known?

I followed Dileep Divekar's argumentation that an expected non-linear
load dependence cannot be modeled uniquely with only one test load.
If that is still true can I provide waveforms with different loads
to give some interpolation points of load dependence of the output?
(will simulators take this into account?)

I wonder how simulators derive the output under arbitrary load con-
ditions if only one [rising/falling waveform] table is contained by the 
model. Do they perhaps use parametric output characteristics and
"scale" them with the given waveform? - If so, how to deal with 
bipolar devices that surely have a different load dependence?

In the december 12th 96 meeting minutes it is noted that Mr. Rokusek
is collecting simulator vendors's suggestions concerning test loads.
Are the results available? (I didn`t find any, sorry if I overlooked
it) 

I do not want to start the diskussion again (though is seems to be
on, anyway) but just want to get as much information as possible to
improve the models.
Thank you very much for your support, I'm hopefully looking forward
to reply

Best regards
Sascha Pawel

e-mail: cornelia@thesys.de

PS: In many examples the C_comp max table contains the largest
    C_comp values and the min table the smallest. Shouldn't it 
    be vice versa for the entries in the max column are used to
    form fast/strong models? 




-------- End of Forwarded Message
 
From owner-ibis  Thu Feb  6 16:21:42 1997
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Date: Thu, 6 Feb 97 16:21 PST
From: bob@icx.com ( Bob Ross)
To: ibis@vhdl.org, ibischk_bug@vhdl.org
Subject: IBIS_CHK BUG8

******************************************************************************
********************* IBIS GOLDEN PARSER BUG REPORT FORM *********************
******************************************************************************

INSTRUCTIONS

To report a bug in the IBIS golden parser.  Please fill out the top part
of the following form and send the complete form to ibischk-bug@vhdl.org.

A list of reported bugs will be maintained on vhdl.org.

******************************************************************************

PARSER VERSION NUMBER: IBIS_CHK V2.1.11, and IBIS_CHK V1.1.a

PLATFORM (SPARC, HP700, PC, etc.):  SUN

OS AND VERSION:  SunOS 4.1.4

REPORTED BY:  Bob Ross, Interconnectix

DATE:  February 6, 1997

DESCRIPTION OF BUG:  Reserved keywords used as pin numbers generate errors

(This bug was discovered by Arthur Wong of IDT and reported December 5, 1996.)

| When pin "number" takes on the name of any of the reserved keywords
| (gnd, power, nc, na), an error is reported.

INSERT IBIS FILE DEMONSTRATING THE BUG:

|***************************************************************
|
[IBIS Ver]        2.1
| [IBIS Ver]        1.1
[File Name]       prob8.ibs
[File Rev]        0.1
[Date]            January 22, 1997
[Source]          Bob Ross, Interconnectix
[Disclaimer]      Provided for modeling purposes only.
                  Results are not guaranteed.
|
|***************************************************************
|
[Component]      TEST
[Manufacturer]   Test File
[Package]
| variable      typ             min             max
R_pkg           0.0m            NA              NA
L_pkg           0.0nH           NA              NA
C_pkg           0.0pF           NA              NA
|
|***************************************************************
|
[Pin]           signal_name     model_name      R_pin   L_pin   C_pin
nc              One_Pin         NC
gnd             One_Pin         GND
na              One_Pin         NC
power           One_Pin         POWER
|
[End]

******************************************************************************
******************** BELOW FOR ADMINISTRATION AND TRACKING *******************
******************************************************************************

BUG NUMBER: 8

SEVERITY: [FATAL, SEVERE, MODERATE, ANNOYING, ENHANCEMENT]   ANNOYING

PRIORITY: [HIGH, MEDIUM, LOW]                                LOW

STATUS: [OPEN, CLOSED, WILL NOT FIX, NOT A BUG]              OPEN

FIXED VERSION:  

FIXED DATE:

NOTES ON BUG FIX:


******************************************************************************
******************************************************************************

 
From owner-ibis  Fri Feb  7 06:26:27 1997
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Message-ID: <32FB5894.104D@realtime.net>
Date: Fri, 07 Feb 1997 08:30:12 -0800
From: Russell Rapport <russellr@bga.com>
Organization: Staktek
X-Mailer: Mozilla 2.02E-KIT  (Win16; U)
MIME-Version: 1.0
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Subject: ibis-to-spice conversion
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My question is very basic. I need to verify signal integrity starting 
with vendor-supplied Hspice and IBIS models. I work for a small company 
with a limited simulation budget, and I have access to Pspice, Hspice, 
and Viewlogic, and normally work in a Windows/NT environment, but I have 
access to UNIX workstations. We do not use a board-layout package, and I 
usually model a few worst-case situations, rather than importing some 
netlist generated by a large CAD system. I have had serious problems with 
the Pspice IBIS 1.0-to-spice translator, and I can rarely get a usable 
conversion. I would prefer to model everything in one design environment, 
but I will do whatever I need to. How do most IBIS "consumers" use the 
IBIS files? Is there a reasonable solution for small companies? Please 
send me mail directly if you want to tell me about your product, since I 
realize competing vendors use this mailing list.
 
From owner-ibis  Fri Feb  7 07:47:15 1997
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X-Note-Format: RFC822
Subject: >> IBIS to SPICE
Mime-Version: 1.0
Content-Type: text/plain; charset=us-ascii
Date: Fri, 07 Feb 1997 10:45:17 -0500
From: "Ezra D. Hall" <ehall@btv.ibm.com>

--
This is a good question.  I would also like to see a list of vendors and 
software tools available for converting IBIS models into behavioral models, 
HSpice specific or otherwise.  AVANT! (formerly Metasoft) is no longer 
supporting their METAIO tools for IBIS to HSPICE behavioral model 
conversion(It is at End Of Life).  What else is out there?  Do users now have 
to convert IBIS models by hand?  I am particularly interested since I am 
creating IBIS models, and need to perform verification in a more efficient 
manner than by hand.  Any feedback would greatly be appreciated.

Thanks!

Sincerely,
          Ezra Hall
       

------- Forwarded Message

Date:    Fri, 07 Feb 1997 08:30:12 -0800
From:    Russell Rapport <russellr@bga.com>
To:      ibis@vhdl.org
Subject: ibis-to-spice conversion

My question is very basic. I need to verify signal integrity starting 
with vendor-supplied Hspice and IBIS models. I work for a small company 
with a limited simulation budget, and I have access to Pspice, Hspice, 
and Viewlogic, and normally work in a Windows/NT environment, but I have 
access to UNIX workstations. We do not use a board-layout package, and I 
usually model a few worst-case situations, rather than importing some 
netlist generated by a large CAD system. I have had serious problems with 
the Pspice IBIS 1.0-to-spice translator, and I can rarely get a usable 
conversion. I would prefer to model everything in one design environment, 
but I will do whatever I need to. How do most IBIS "consumers" use the 
IBIS files? Is there a reasonable solution for small companies? Please 
send me mail directly if you want to tell me about your product, since I 
realize competing vendors use this mailing list.


------- End of Forwarded Message


-- 
+-------------------------------------------------------------+
|                x86 Microprocessor Development               |
|                                                             |
| Ezra D.B. Hall                | Internet: ehall@btv.ibm.com |
| IBM Microelectronics          |       VM: ehall at btvlabvm |
| D/G8G B/863-2                 |    Phone: (802) 769-7329    |
| 1000 River Street             |      FAX: (802) 769-6800    |
| Essex Junction, VT 05452-4299 |                             |
+-------------------------------+-----------------------------+


 
From owner-ibis  Fri Feb  7 09:22:09 1997
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From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9702071722.AA10122@rockie.nsc.com>
To: ibis@vhdl.org, ehall@btv.ibm.com
Subject: Re: >> IBIS to SPICE

Hi,

The roster listing of the EDA vendors and IBIS members may be a good starting
point. You may want to try 

	http://www.vhdl.org/pub/ibis/roster/roster.txt

At least this will give you a contact name for the EDA vendors supporting IBIS.

Regards,
Syed
National Semiconductor Corp.


> Ezra Hall writes: (extracted)..
> .....
>  I would also like to see a list of vendors and 
> software tools available for converting IBIS models into behavioral models, 
> HSpice specific or otherwise. > Thanks!
> 
>....
 
From owner-ibis  Fri Feb  7 09:23:46 1997
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From: scotts@actel.com (Scott Schlachter)
Message-Id: <9702071723.AA09450@ricky.sun_net>
To: ibis@vhdl.org, ibis-users@vhdl.org
Subject: Lab data vs. Spice data

Hello Ibis folks,

I'd like to compare notes with those who have produced IBIS files
from *BOTH* Spice and lab measurements.  Please respond to me 
directly (not through the reflector) if you have done this, 
particularly if yours is a CMOS process.  Thanks,

-Scott Schlachter	Actel Corporation
 scotts@actel.com	Sunnyvale, CA
 
 
From owner-ibis  Fri Feb  7 09:30:13 1997
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From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9702071729.AA10295@rockie.nsc.com>
To: ibis@vhdl.org
Subject: IBIS Meeting Agenda Feb14th'97
Cc: huq@rockie.nsc.com


                       IBIS Open Forum Meeting Agenda 
                                for 2/14/96

                  Bridge Number    Reservation #   Passcode
                  (916) 356-9200   3-81822         3973256


 All meetings are 8:00 AM to 9:55 AM Pacific Time.  When you call into the 
 meeting, ask for the IBIS Open Forum hosted by Will Hobbs and give the
 Reservation Number and Passcode.
 

 8:00 Check-In, Intros, Announcements                         Ross

      - Intros of New IBIS Participants, Meeting Quorum       Ross
      - Membership Update and Treasurers Report               Rusher
      - Review of Previous Meeting's Minutes (and ARs)        Ross
      - Miscellany/Announcements                              All
      - Press & Web Page Updates                              Huq, All
      - New Models Available, Library Update                  Powell, All
      - Opens for New Issues                                  All

 8:25 Administrative and Project Discussions

      Design SuperCon97 IBIS Meeting Report                   Huq

      DAC97 IBIS Meeting Planning                             Rusher

      International Progress/Developments                     Rusher/Ross
	- EIAJ I/O Interface standard update		      Ross

      Purchase National IBIS Article Reprints                 Huq

      Roster Update                                           Ross

      vhdl.org changes                                        Ross

      Cookbook                                                Rokusek
      Model Test Load Recommendations                         Muranyi

      IBIS-to-Behavioral Model support			      Huq

      SPICE-to-IBIS translator for NT			      Dodd

      New Administrative Issues                               All

 9:00 Technical Discussion
 
      BIRD40 - OVERSHOOT NOMENCLATURE (Vote)                  Ross

      Version 3.0 Functionality                               Ross
      - Bus and Series Models                                 Fitzpatrick
      - Switched Terminators                                  Muranyi

      Package Committee Report                                Peters

      Parser Status                                           Rokusek
      Pin Name                                                Ross        

      New Technical Issues                                    All

 9:50 Wrap Up and Next Meetings Plans                         Ross

 9:55 Sign Off
 
 
From owner-ibis  Fri Feb  7 10:15:50 1997
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Sender: crokusek@qdt.com
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Date: Fri, 07 Feb 1997 10:04:33 -0800
From: Chris Rokusek <crokusek@qdt.com>
Organization: Quad Design Technology
X-Mailer: Mozilla 3.0Gold (X11; I; SunOS 4.1.4 sun4m)
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To: ibis@vhdl.org
Subject: Re: Forwarded: waveform testloads
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Hi Sacha,

Here is ONE simulator's (Quad Design/XTK) response.

> When generating for instance  [rising waveform] information I currently
> use a non-reactive load at high and low voltage - is that valid?

Yes.  See our recommendation for test waveforms below.

> These waveforms are only correct at one point each, the simulator
> will have to interpolate somehow. So it is quite clear that the
> results may differ from simulator to simulator, but to hold the
> differences to a minimum it was helpfull if one would know how
> interpolation is done, are these algorithms known?

We are not planning to provide all our internal algorithms on the
reflector at this time.  They differ among simulation vendors.
All the simulation vendor's collective customers must make the choice
that best fits their accuracy requirements.

> I followed Dileep Divekar's argumentation that an expected non-linear
> load dependence cannot be modeled uniquely with only one test load.
> If that is still true can I provide waveforms with different loads
> to give some interpolation points of load dependence of the output?
> (will simulators take this into account?)

We partially disagree with this argument.  We claim that the recommended
test loads below will provide results meeting our customer's accuracy
requirements (our customers are very picky!).

Additional waveforms could be provided as a QA test, however they
are not presently used directly in the computation.

> I wonder how simulators derive the output under arbitrary load con-
> ditions if only one [rising/falling waveform] table is contained by the
> model. Do they perhaps use parametric output characteristics and
> "scale" them with the given waveform? - If so, how to deal with
> bipolar devices that surely have a different load dependence?

By default, we would like to see 2 waveforms for a non-single-ended device 
(e.g. non- open drain) devices.  Without two, only the risetime/falltime
is used rather than any waveform(s).

Bipolar devices DO require a differnt algorithm.

> In the december 12th 96 meeting minutes it is noted that Mr. Rokusek
> is collecting simulator vendors's suggestions concerning test loads.
> Are the results available? (I didn`t find any, sorry if I overlooked
> it)

My email is crokusek@qdt.com, please send any test load recommendations
to me or the reflector for discussion, I haven't received any up to
this point.

> I do not want to start the diskussion again (though is seems to be
> on, anyway) but just want to get as much information as possible to
> improve the models.
> Thank you very much for your support, I'm hopefully looking forward
> to reply

The "improvement of models" should be the ultimate goal, it should be
possible to make/keep everyone happy:  model makers, simulation vendors,
and most importantly our mutual customers.

------------------------------------------------------------------------
Recommended waveforms:

     o Single-ended Devices: 1 rising, 1 falling

           If the driver requires a pull-up or pull-down device to function,
           the termination resistor and supply used for the design should
           be used to terminate the driver for this test.

     o CMOS: 2 rising, 2 falling
     
           50 ohms to a terminating voltage equal to the drivers negative
           supply voltage.

           50 ohms to a terminating voltage equal to the drivers positive
           supply voltage.

     o TTL:  2 rising, 2 falling

           500 ohms to a terminating voltage equal to the drivers negative
           supply voltage.

           7 ohms to a terminating voltage equal to the drivers positive
           supply voltage.
           

In terms of IBIS we are currently accepting the following...

       - C_fixture == 0.0pF
       - L_fixture == 0.0nH
       - V_fixture - (VCC or GND) <= 0.7V
       - 3.0   < R_fixture < 30.0    (TTL to VCC)
       - 200.0 < R_fixture < 1000.0  (TTL to GND)
       - 25.0  < R_fixture < 200.0   (CMOS)
      
     Of all waveforms meeting the above criteria, the two (VCC and GND)
     waveforms with R_fixture values closest to the recommended R_fixture 
     values are chosen.  For open-ended devices, only one (VCC or GND or
     Vterm) waveform is needed.

     If the waveforms are unusable, ramp data (edge rate only) is used.

     As stated in the IBIS V2.1 specification, if more than one rising
     or falling edge waveform table is present, then the data in each
     of the respective tables must be time correlated.  In other
     words, the rising (falling) edge data in each of the rising
     (falling) edge waveform tables must be entered with respect to a
     common reference point on the input stimulus waveform.

---------------------------------------------------------------------------

The above is not GOLDEN or set in stone--only ONE simulator's present
opinion.

Another specific simulation vendor may want e.g. reactively loaded 
waveforms, if so then the ibis forum can agree to a compilation of all 
waveform requirements.

Just trying to get the ball rolling...

Best Regards,

Chris Rokusek
Quad Design/Viewlogic

(P.S. I don't know the answer to your Ccomp question.)
 
From owner-ibis  Fri Feb  7 10:24:57 1997
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From: fred@contec.contec.COM (Fred)
Message-Id: <9702071747.AA02620@contec12.contec.COM>
To: ibis@vhdl.org
Subject: IBIS to Spice
X-Sun-Charset: US-ASCII

There are indeed other solutions. I am with Applied Simulation Technology. 
We just announced an ibis translator at HP Design SuperCon held in Santa Clara
a couple of weeks ago. This is an automated tool which converts the model with
a mouse click. It also supports IBIS 2.x (lost count) specification which has
rise and fall times information in the form of V/T information. The software
automactically produces a simulation ready model and testing of the model can
be preformed within the software. If you specifically (Russel and Ezra) need 
more information you can contact me at fred@apsimtech.com or 408-434-0967 ext.
102.

Best Regards,

Fred Balistreri
 
From owner-ibis  Fri Feb  7 10:37:51 1997
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Date: Fri, 07 Feb 1997 10:34:23 -0800
To: ibis@vhdl.org
From: Kellee Crisafulli <kellee@hyperlynx.com>
Subject: Re:How to verify IBIS models
Cc: bhargin@hyperlynx.com
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At 10:45 AM 2/7/97 -0500, Ezra D. Hall wrote:
>conversion(It is at End Of Life).  What else is out there?  Do users now
have 
>to convert IBIS models by hand?  I am particularly interested since I am 
>creating IBIS models, and need to perform verification in a more efficient 
>manner than by hand.  Any feedback would greatly be appreciated.

A better solution might be to use a simulator that runs IBIS models directly.
Our LineSim package is ideal for testing IBIS models and is very low cost.
See our web site at:  www.hyperlynx.com

 
From owner-ibis  Fri Feb  7 10:44:03 1997
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Date: Fri, 07 Feb 1997 10:40:35 -0800
To: ibis@vhdl.org
From: Kellee Crisafulli <kellee@hyperlynx.com>
Subject: Re: IBIS_CHK BUG8
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Hi all,

  It is not obvious that to me that this is really a bug.  It seems that
this user has the usage of
Pin and signal_name reversed.  Please consider removing this from the bug
list.
"pin" should be 1,2,3,4  or AA1, BC1   etc.  There really should never be a
conflict with the
reserved words.

>DESCRIPTION OF BUG:  Reserved keywords used as pin numbers generate errors
>
>(This bug was discovered by Arthur Wong of IDT and reported December 5,
1996.)
>
>| When pin "number" takes on the name of any of the reserved keywords
>| (gnd, power, nc, na), an error is reported.
>
>[Pin]           signal_name     model_name      R_pin   L_pin   C_pin
>nc              One_Pin         NC
>gnd             One_Pin         GND
>na              One_Pin         NC
>power           One_Pin         POWER
>|

 
From owner-ibis  Fri Feb  7 11:27:05 1997
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Received: by fishbowl02.emc.com; Fri, 7 Feb 97 14:26:47 -0500
Date: Fri, 7 Feb 97 14:20:37 EST
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X-Priority: 3 (Normal)
To: <russellr@bga.com>
Cc: <ibis@vhdl.org>
From: "fabrizio zanella" <fabrizio=zanella%Eng%EMCHOP1@fishbowl02.lss.emc.com>
Subject: re: ibis-to-spice conversion

Russell, Applied Simulation Technology, in San Jose, CA, makes an IBIS to 
SPICE converter.  At my last job I had purchased it and used it (it worked 
well), and cost considerably less than other IBIS to SPICE translators 
available.  (It is still supported).
For information contact
Fred Balistreri  408-434-0967, X102.
Regards,
Fabrizio Zanella
			                          _/ _/  email: 
zanella_fabrizio@emc.com
       _/_/_/_/  _/     _/   _/_/_/     _/    voice: (508) 435-1000 Ext. 
4645
      _/        _/_/ _/_/  _/        _/          Fax: (508) 435-8949
     _/_/_/_/  _/  _/ _/  _/      _/_/_/
    _/        _/     _/  _/                       EMC Corporation
   _/_/_/_/  _/     _/    _/_/_/                  171 South Street
                                                Hopkinton, MA 01748-9103
-------------
Original Text
From: Russell Rapport <russellr@bga.com>, on 2/7/97 8:30 AM:
To: <ibis@vhdl.org>

My question is very basic. I need to verify signal integrity starting 
with vendor-supplied Hspice and IBIS models. I work for a small company 
with a limited simulation budget, and I have access to Pspice, Hspice, 
and Viewlogic, and normally work in a Windows/NT environment, but I have 
access to UNIX workstations. We do not use a board-layout package, and I 
usually model a few worst-case situations, rather than importing some 
netlist generated by a large CAD system. I have had serious problems with 
the Pspice IBIS 1.0-to-spice translator, and I can rarely get a usable 
conversion. I would prefer to model everything in one design environment, 
but I will do whatever I need to. How do most IBIS "consumers" use the 
IBIS files? Is there a reasonable solution for small companies? Please 
send me mail directly if you want to tell me about your product, since I 
realize competing vendors use this mailing list.


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`
end
 
From owner-ibis  Fri Feb  7 13:56:08 1997
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	(1.38.193.4/16.2) id AA09894; Fri, 7 Feb 1997 14:53:02 -0700
From: Brian Hoffer <brianho@chinook>
Subject: IBIS packaging
To: ibis@vhdl.org
Date: Fri, 07 Feb 1997 14:53:02 MST
X-Mailer: Elm [revision: 109.18]

Hello,

	I am not sure whether this is where questions should be sent but
will try anyway.  I am a co-op student from Cincinnati working on IBIS with
Symbios Logic, Inc.  We are all kinda new with it so I have some pretty basic
questions.  My current problem is with the package models.  I understand that 
the RLC matrices are representing properties of and between the pins, but 
do the pins have any correlation with the [Pin] list within the IBIS file.
I guess my question is, how do you know what the pins within the package model
are representing.  I know this question is pretty vague, but I am very new at
this so any feedback would be helpful.

	Thanks, 
	
	Brian Hoffer
	
if my return address is brianho@chinook, your reply will not get to me.  It
must be sent to brian.hoffer@symbios.com.  Thanks again.       
 
From owner-ibis  Sun Feb  9 12:21:16 1997
Received: from wile.nesa.com (8@[204.240.29.34]) by vhdl.vhdl.org (8.8.5/8.8.3) with SMTP id MAA07055 for <ibis@vhdl.org>; Sun, 9 Feb 1997 12:21:12 -0800 (PST)
Date: Sun, 9 Feb 1997 15:18:53 -0500
Message-Id: <199702092018.PAA11696@wile.nesa.com>
Received: from petunia.nesa.com(204.240.29.131) by wile.nesa.com via smap (V1.3)
	id sma011694; Sun Feb  9 15:18:31 1997
X-Sender: esayre@mail.nesa.com
X-Mailer: Windows Eudora Light Version 1.5.2
Mime-Version: 1.0
Content-Type: text/plain; charset="us-ascii"
To: ibis@vhdl.org
From: "Dr. Edward P. Sayre" <esayre@nesa.com>
Subject: Seling on IBIS Internet e-mail conference

I have specific problems with the following "helpful message".  Please can
we confine our discussions to technical subjects and leave the marketing to
the marketeers!!!

        At 10:45 AM 2/7/97 -0500, Ezra D. Hall wrote:
        >conversion(It is at End Of Life).  What else is out there?  Do
users now
        have 
        >to convert IBIS models by hand?  I am particularly interested since
I am 
        >creating IBIS models, and need to perform verification in a more
efficient 
        >manner than by hand.  Any feedback would greatly be appreciated.

        A better solution might be to use a simulator that runs IBIS models
directly.
        Our LineSim package is ideal for testing IBIS models and is very low
cost.
        See our web site at:  www.hyperlynx.com

Thanks

Ed Sayre




+~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~+
|       NORTH EAST SYSTEMS ASSOCIATES, INC.       |
|      -------------------------------------      |
|     "High Performance Engineering & Design"     |
+~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~+
| Dr. Ed Sayre            e-mail: esayre@nesa.com |
| NESA, Inc.              http://www.nesa.com/    |
| 636 Great Road          Tel +1.508.897-8787     |
| Stow, MA 01775 USA      Fax +1.508.897-5359     |
+~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~+


 
From owner-ibis  Mon Feb 10 07:02:13 1997
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Date: Mon, 10 Feb 1997 15:57:45 +0100
From: John V Fitzpatrick <John.Fitzpatrick@ln.cit.alcatel.fr>
Organization: Alcatel Telecom, Lannion, France
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Hello all,

Below is a proposal for a BIRD dealing with series non-linear devices
and bus switches. It is based on reflector discussions. Only one
additional keyword is defined.

Please note 3 features that can be criticised independently:

    * definition of series model between 2 pins
    * the addition of state information for crossbar switches
    * the reuse of [Pullup] and [Pulldown] curves by
      forcing one pin of the device to be either OPEN, GND or POWER.

What's missing is information to model series L's and C's.

This BIRD does not attempt to model the behavior of a bus-switch 
as a function of the control voltage applied to the transistor gate,
a feature used in 5V-to-3.3V protection schemes.
 
I'd appreciate your feedback before oficially submitting this BIRD.

Regards,
John

-- 
John Fitzpatrick   <John.Fitzpatrick@ln.cit.alcatel.fr>    
Alcatel Telecom, 4 rue de Broglie, 22304 Lannion, France
Tel: +33(0)2.96.04.79.33  Fax: +33(0)2.96.04.85.09



************************************************************************
************************************************************************

BIRD ID#:      N/A
ISSUE TITLE:   Modelling Series switchable devices
REQUESTER:     John Fitzpatrick, Alcatel
DATE SUBMITTED:                       Pending
DATE ACCEPTED BY IBIS OPEN FORUM:     Pending

************************************************************************
************************************************************************

STATEMENT OF THE ISSUE:

IBIS cannot model series devices. 
IBIS cannot model switches.

************************************************************************

STATEMENT OF THE RESOLVED SPECIFICATIONS:


One new keyword is  defined under [Component]:
       [Series_Pin]
       
Two additional Model_type values are allowed under the [Model] keyword:
       Series, 
       Series_Switch.
     
New measurement methods are defined for impedance tables.
 

New text:

|======================================================================
|    Keyword:  [Series_Pin]
|   Required:  Optional
|Description:  Used to associate two pins joined by a series device.
| Sub-Params:  Pin1, Pin2, Model_Name, State
|Usage Rules:  Entries follow these rules: Only series pin pairs
|              are entered.  The Pin1 column contains the pin number for 
|              which input impedances are measured. The Pin2 column
|              contains the pin name of the other end of the series 
|              device. The Model_Name colum contains the name of the 
|              model corresponding to the series device.
|              The State column contains the optional name of the state
|              in which the series device, if it is a switch, can be ON. 
|              In all other states, the device is OFF
|
|               Column length limits are:
|                  Pin1          5 characters max
|                  Pin2          5 characters max
|                  Model_Name   20 characters max
|                  State        20 characters max
| 
|Other Notes: 
|              The order of the pins are important. The model  
|              corresponds to measurements made at Pin1.
|              If the device is not symmetric, a different model may be
|              specified with the pin order swapped.
|
|              In the case of a crossbar switch, all possible series
|              connections must be listed.  Switching information is
|              contained under the State column. 
|              If the device is not a switch, no State shall be 
|              specified.
|
|              The model name given here supersedes that given 
|              under the the [Pin] keyword
|
[Series_Pin]
|Pin1      Pin2    Buffer       State
    3         4    switchA       AB-CD      |switchA is buffer from 3 to
                                            |4
    4         3    switchAneg    AB-CD      |Buffer from 3 to 4 is
                                            |non-symmetric
   12        13    switchA       AB-CD
   12        14    switchB       AC-BD      |12 can be routed to 13 or
                                            |14
 

Change existing text from:
|               Model_type must be one of the following:
|               Input, Output, I/O, 3-state, Open_drain, I/O_open_drain,
|               Open_sink, I/O_open_sink, Open_source, I/O_open_source,
|               Input_ECL, Output_ECL, I/O_ECL, and Terminator.
|
to:
|               Model_type must be one of the following:
|               Input, Output, I/O, 3-state, Open_drain, I/O_open_drain,
|               Open_sink, I/O_open_sink, Open_source, I/O_open_source,
|               Input_ECL, Output_ECL, I/O_ECL, Terminator, Series or
|               Series_switch.
|

Add text to the special usage rules:
|
|               Series             This models a series device i.e.
two     
|                                  pins
|                                  The following impedance keywords can
|                                  be used:
|                                  [Pulldown] for through Z
|                                  [GND_clamp] for input Z
|                                  [POWER_clamp] for input Z (optional)
|                                 
|               Series_switch      This models a series device that can
|                                  can be either ON or OFF.
|                                  The following impedance keywords can
|                                  used:  
|                                  [Pulldown] for through Z when OFF
|                                  [Pullup] for through Z when ON
|                                  [GND_clamp] for input Z
|                                  [POWER_clamp] for input Z (optional)
|

Add the following text somewhere:

|  The definition of I/V tables are different for series devices.
|  **All measurements shall be made at Pin1.** 
|  For [GND_Clamp], Pin2 shall be open. If the series device is a 
|  switch, the switch shall be OFF.
|  A [POWER_clamp] curve may be included if a POWER clamp structure
|  is present.
|  To measure [Pulldown], Pin2 shall be shorted to ground. If the series 
|  device is a switch, the switch shall  be OFF.
|  If the device is a switch, [Pullup] is also needed: Pin2 shall be
|  shorted to POWER, the switch shall be ON.
|  
|  Note: POWER is the control voltage for the switch.  If the switch
|  can be used for different POWER values, the different [Model]s
|  shall be included in the IBIS file.

 ***********************************************************************

ANALYSIS PATH/DATA THAT LED TO SPECIFICATION:

Bus-switches (ex: 74LVX3L383 from NS or 74CBT3383 from TI) are
increasingly being used on high-speed boards. They cannot be
modelled by IBIS 2.1. 

This BIRD allows the definition of a series device which is
connected between any two pins. If this device is a non-linear
resistor (e.g. a diode), then it can be described by an I/V
table. This BIRD proposes to use the [Pulldown] table. To obtain
this table, one of the pins of the series device is grounded.

If the device is a switch, then it can be ON or OFF. This means
that there needs to be an extra I/V table. This BIRD proposes to use
the [Pullup] table. To avoid changing the definition of the
[Pullup] table, one of the pins is connected to POWER.

As suggested by Chris Reid, a state entry is added to allow
crossbar switches be modelled. It is expected that the simulator
detect these states, then ask the user to choose one of them.

                             
***********************************************************************

ANY OTHER BACKGROUND INFORMATION:

This BIRD is designed to reuse as much as possible existing keywords.
This will surely confuse model suppliers and users, but should
facilitate acceptance of the BIRD by the simulator companies.
(What does Pullup mean in the context of a diode???)

The definition of the [Series Pin] keyword may need to be changed
in order to take into account connectors, which are also series
devices.

This BIRD might be extendable to include linear amplifiers
e.g.the 74ALB series announced by TI.

Additional keywords might be defined to allow series inductors
and capacitors be defined.
 
From owner-ibis  Tue Feb 11 12:34:32 1997
Received: from c11167-343dan.ece.ncsu.edu (c11167-343dan.ece.ncsu.edu [152.1.59.242]) by vhdl.vhdl.org (8.8.5/8.8.3) with ESMTP id MAA00900; Tue, 11 Feb 1997 12:34:31 -0800 (PST)
From: awglaser@eos.ncsu.edu
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Message-Id: <199702112033.PAA06562@c11167-343dan.ece.ncsu.edu>
Subject: New s2ibis2 update
To: ibis-users@vhdl.org, ibis@vhdl.org
Date: Tue, 11 Feb 1997 15:33:01 -0500 (EST)
In-Reply-To: <m0vuOQc-000GjTC@icx.com> from "Bob Ross" at Feb 11, 97 12:03:00 pm
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S2ibis2 has now been updated to v1.1

This update is a bug-fix only, and does not provide any new
functionality. It fixes the following bug:

    - When using Spectre for simulations, VI curves had the sign of the
      current value reversed (e.g. -1.2A should have been 1.2A)

NOTE THAT THIS BUG ONLY APPEARED WHEN USING SPECTRE FOR SIMULATIONS.
(Thanks to Ganesh Balamitran for the bug report.)

The new distribution (which includes updated sources, new executables,
and corrected example files) can be found at

ftp://vhdl.org/pub/ibis/s2ibis/s2ibis2_v1.1/s2ibis2.tar.Z

and

ftp://ftp.eos.ncsu.edu/pub/vlsi/techreports/s2ibis2.tar.Z

Also, please note that the new distribution does not include an AIX
executable, as I no longer have access to an AIX machine.

Regards,

-- 
Alan Glaser                         "It's not a competition,
ECE Dept.                            it's just a mint..." - K
North Carolina State University
 
From owner-ibis  Wed Feb 12 12:25:08 1997
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Date: Wed, 12 Feb 97 12:25 PST
From: bob@icx.com ( Bob Ross)
To: ibis@vhdl.org
Subject: BIRD41 Modelling Series Switchable Devices

To All:

The BIRD sent out by John Fitzpatrick on February 10, 1997 is formally
BIRD41.  This is sent out again for the Open Forum Meeting Introduction
and Discussion.

Bob Ross
Interconnectix

-----------------------------------------------------------------------------


Hello all,

Below is a proposal for a BIRD dealing with series non-linear devices
and bus switches. It is based on reflector discussions. Only one
additional keyword is defined.

Please note 3 features that can be criticised independently:

    * definition of series model between 2 pins
    * the addition of state information for crossbar switches
    * the reuse of [Pullup] and [Pulldown] curves by
      forcing one pin of the device to be either OPEN, GND or POWER.

What's missing is information to model series L's and C's.

This BIRD does not attempt to model the behavior of a bus-switch 
as a function of the control voltage applied to the transistor gate,
a feature used in 5V-to-3.3V protection schemes.
 
I'd appreciate your feedback before oficially submitting this BIRD.

Regards,
John

-- 
John Fitzpatrick   <John.Fitzpatrick@ln.cit.alcatel.fr>    
Alcatel Telecom, 4 rue de Broglie, 22304 Lannion, France
Tel: +33(0)2.96.04.79.33  Fax: +33(0)2.96.04.85.09



************************************************************************
************************************************************************

BIRD ID#:      41
ISSUE TITLE:   Modelling Series Switchable Devices
REQUESTER:     John Fitzpatrick, Alcatel
DATE SUBMITTED:                       February 12, 1997
DATE ACCEPTED BY IBIS OPEN FORUM:     Pending

************************************************************************
************************************************************************

STATEMENT OF THE ISSUE:

IBIS cannot model series devices. 
IBIS cannot model switches.

************************************************************************

STATEMENT OF THE RESOLVED SPECIFICATIONS:


One new keyword is  defined under [Component]:
       [Series_Pin]
       
Two additional Model_type values are allowed under the [Model] keyword:
       Series, 
       Series_Switch.
     
New measurement methods are defined for impedance tables.
 

New text:

|======================================================================
|    Keyword:  [Series_Pin]
|   Required:  Optional
|Description:  Used to associate two pins joined by a series device.
| Sub-Params:  Pin1, Pin2, Model_Name, State
|Usage Rules:  Entries follow these rules: Only series pin pairs
|              are entered.  The Pin1 column contains the pin number for 
|              which input impedances are measured. The Pin2 column
|              contains the pin name of the other end of the series 
|              device. The Model_Name colum contains the name of the 
|              model corresponding to the series device.
|              The State column contains the optional name of the state
|              in which the series device, if it is a switch, can be ON. 
|              In all other states, the device is OFF
|
|               Column length limits are:
|                  Pin1          5 characters max
|                  Pin2          5 characters max
|                  Model_Name   20 characters max
|                  State        20 characters max
| 
|Other Notes: 
|              The order of the pins are important. The model  
|              corresponds to measurements made at Pin1.
|              If the device is not symmetric, a different model may be
|              specified with the pin order swapped.
|
|              In the case of a crossbar switch, all possible series
|              connections must be listed.  Switching information is
|              contained under the State column. 
|              If the device is not a switch, no State shall be 
|              specified.
|
|              The model name given here supersedes that given 
|              under the the [Pin] keyword
|
[Series_Pin]
|Pin1      Pin2    Buffer       State
    3         4    switchA       AB-CD      |switchA is buffer from 3 to
                                            |4
    4         3    switchAneg    AB-CD      |Buffer from 3 to 4 is
                                            |non-symmetric
   12        13    switchA       AB-CD
   12        14    switchB       AC-BD      |12 can be routed to 13 or
                                            |14
 

Change existing text from:
|               Model_type must be one of the following:
|               Input, Output, I/O, 3-state, Open_drain, I/O_open_drain,
|               Open_sink, I/O_open_sink, Open_source, I/O_open_source,
|               Input_ECL, Output_ECL, I/O_ECL, and Terminator.
|
to:
|               Model_type must be one of the following:
|               Input, Output, I/O, 3-state, Open_drain, I/O_open_drain,
|               Open_sink, I/O_open_sink, Open_source, I/O_open_source,
|               Input_ECL, Output_ECL, I/O_ECL, Terminator, Series or
|               Series_switch.
|

Add text to the special usage rules:
|
|               Series             This models a series device i.e.
two     
|                                  pins
|                                  The following impedance keywords can
|                                  be used:
|                                  [Pulldown] for through Z
|                                  [GND_clamp] for input Z
|                                  [POWER_clamp] for input Z (optional)
|                                 
|               Series_switch      This models a series device that can
|                                  can be either ON or OFF.
|                                  The following impedance keywords can
|                                  used:  
|                                  [Pulldown] for through Z when OFF
|                                  [Pullup] for through Z when ON
|                                  [GND_clamp] for input Z
|                                  [POWER_clamp] for input Z (optional)
|

Add the following text somewhere:

|  The definition of I/V tables are different for series devices.
|  **All measurements shall be made at Pin1.** 
|  For [GND_Clamp], Pin2 shall be open. If the series device is a 
|  switch, the switch shall be OFF.
|  A [POWER_clamp] curve may be included if a POWER clamp structure
|  is present.
|  To measure [Pulldown], Pin2 shall be shorted to ground. If the series 
|  device is a switch, the switch shall  be OFF.
|  If the device is a switch, [Pullup] is also needed: Pin2 shall be
|  shorted to POWER, the switch shall be ON.
|  
|  Note: POWER is the control voltage for the switch.  If the switch
|  can be used for different POWER values, the different [Model]s
|  shall be included in the IBIS file.

 ***********************************************************************

ANALYSIS PATH/DATA THAT LED TO SPECIFICATION:

Bus-switches (ex: 74LVX3L383 from NS or 74CBT3383 from TI) are
increasingly being used on high-speed boards. They cannot be
modelled by IBIS 2.1. 

This BIRD allows the definition of a series device which is
connected between any two pins. If this device is a non-linear
resistor (e.g. a diode), then it can be described by an I/V
table. This BIRD proposes to use the [Pulldown] table. To obtain
this table, one of the pins of the series device is grounded.

If the device is a switch, then it can be ON or OFF. This means
that there needs to be an extra I/V table. This BIRD proposes to use
the [Pullup] table. To avoid changing the definition of the
[Pullup] table, one of the pins is connected to POWER.

As suggested by Chris Reid, a state entry is added to allow
crossbar switches be modelled. It is expected that the simulator
detect these states, then ask the user to choose one of them.

                             
***********************************************************************

ANY OTHER BACKGROUND INFORMATION:

This BIRD is designed to reuse as much as possible existing keywords.
This will surely confuse model suppliers and users, but should
facilitate acceptance of the BIRD by the simulator companies.
(What does Pullup mean in the context of a diode???)

The definition of the [Series Pin] keyword may need to be changed
in order to take into account connectors, which are also series
devices.

This BIRD might be extendable to include linear amplifiers
e.g.the 74ALB series announced by TI.

Additional keywords might be defined to allow series inductors
and capacitors be defined.


 
From owner-ibis  Wed Feb 12 12:35:08 1997
Received: from icx.com (root@fw.icx.com [205.238.6.33]) by vhdl.vhdl.org (8.8.5/8.8.3) with SMTP id MAA04711 for <ibis@vhdl.org>; Wed, 12 Feb 1997 12:35:06 -0800 (PST)
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Message-Id: <m0vulOT-000GkFC@icx.com>
Date: Wed, 12 Feb 97 12:35 PST
From: bob@icx.com ( Bob Ross)
To: ibis@vhdl.org
Subject: BIRD40 Overshoot Nomenclature

Retransmission for IBIS Open Forum Meeting and Vote

Bob Ross
Interconnectix



To IBIS Committee:

BIRD40 is a subparameter nomenclature change requested by the RAIL committee
to the approved BIRD39 to deal with possible nomenclature confusion.

The only modification is to change 

   "Overshoot_high" to "S_overshoot_high", and
   "Overshoot_low" to "S_overshoot_low" 

for static overshoot.

Bob Ross
Interconnectix, Inc.

******************************************************************************
******************************************************************************

BIRD ID#:      40
ISSUE TITLE:   OVERSHOOT NOMENCLATURE
REQUESTER:     Bob Ross, Interconnectix, Inc.
DATE SUBMITTED:                       11/27/96
DATE ACCEPTED BY IBIS OPEN FORUM:     Pending

******************************************************************************
******************************************************************************

STATEMENT OF THE ISSUE:

Overshoot in approved BIRD39 of IBIS uses Overshoot_high and Overshoot_low
for static overshoots.  The same notation is used in RAIL for any overshoot
rule including maximum overshoot.  To avoid confusion, the proposal here
is to change the nomenclature to emphasize "static" overshoot.

******************************************************************************

STATEMENT OF THE RESOLVED SPECIFICATIONS:

The [Model Spec] subparameter nomenclature is changed as shown:

    BIRD39              BIRD40 

    Overshoot_high     S_overshoot_high
    Overshoot_low      S_overshoot_low

The whole [Model Spec] keyword is presented here with changes to show the
context of the revision.  (Changes are noted by "|*" lines.)

|==============================================================================
|    Keywords:  [Model Spec]
|    Required:  No
|*  Sub-params:  Vinh, Vinl, Vinh+, Vinh-, Vinl+, Vinl-, S_overshoot_high,
|*               S_overshoot_low, D_overshoot_high, D_overshoot_low,
|               D_overshoot_time, Pulse_high, Pulse_low, Pulse_time
|
|Description:   The [Model Spec] keyword defines four columns under which
|               specification subparameters are defined.  
|               
|               The following subparamters are defined:
|               Vinh               Input voltage threshold high
|               Vinl               Input voltage threshold low
|               Vinh+              Hysteresis threshold high max Vt+
|               Vinh-              Hysteresis threshold high min Vt+
|               Vinl+              Hysteresis threshold low max Vt-
|               Vinl-              Hysteresis threshold low min Vt-
|*               S_overshoot_high   Static overshoot high voltage
|*               S_overshoot_low    Static overshoot low voltage
|               D_overshoot_high   Dynamic overshoot high voltage
|               D_overshoot_low    Dynamic overshoot low voltage
|               D_overshoot_time   Dynamic overshoot time
|               Pulse_high         Pulse immunity high voltage
|               Pulse_low          Pulse immunity low voltage
|               Pulse_time         Pulse immunity time
|
| Usage Rules:  [Model Spec] must follow all other subparameters under the 
|               [Model] keyword.
|
|               For each subparameter contained in the first column, the 
|               remaining three hold its typical, minimum and maximum values.
|               The entries of typical, minimum and maximum be must be placed 
|               on a single line and must be separated by at least one white
|               space or tab or tab character.  All four columns are required
|               under the [Model Spec] keyword.  However, data is required
|               only in the typical column.  If minimum and/or maximum values
|               are not available, the reserved word "NA" must be used
|               indicating the typical value by default.
|
|               The minimum and maximum values are used for specifications
|               subparameter values that may track the min and max operation
|               conditions of the [Model].  Usually it is related to the
|               Voltage range settings.
|
|               Unless noted below, each subparameter does not require having
|               any other subparameter.
|      
|               Vinh, Vinl rules: 
|               The threshold subparameter lines
|               provide additional min and max column values, if needed.
|               The typ column values are still required and would be
|               expected to override the Vinh and Vinl subparameter values
|               specified elsewhere.  Note: the syntax rule that require
|               inserting Vinh and Vinl under models remains unchanged
|               even if the values are defined under the [Model Spec]
|               keyword.
|
|               To mimic a hysteresis effect, the values of Vinh and Vinl may
|               interchanged such that the Vinl value is larger than the Vinh
|               value.  However, simulators may process this information
|               differently or report an error.
|
|               Vinh+, Vinh-, Vinl+, Vinl- rules:
|               The four hysteresis subparmeters must all be defined before
|               the hysteresis threshold rules become effective.  Otherwise
|               the standard threshold subparameters remain in effect.  The
|               hysteresis thresholds shall be at the Vinh+ and Vinh- values
|               for a low-to-high transition, and at the Vinl+ and Vinl-
|               values for a high-to-low transition.
|
|*               S_overshoot_high, S_overshoot_low rules:
|               The static overshoot sub-parameters provide the voltage values
|               for which the component is no longer guaranteed to function
|               correctly.
|
|               D_overshoot_high, D_overshoot_low, D_overshoot_time rules:
|               The dynamic overshoot values provide a time window during
|               which the the overshoot may exceed the static overshoot limits
|               but be below the dynamic overshoot limits.  D_overshoot_time is
|               required for dynamic overshoot testing.  In addition, if
|*               D_overshoot_high is specified, then S_overshoot_high is
|               necessary for testing beyond the static limit.  Similarly, if
|*               D_overshoot_low is specified, then S_overshoot_low is necessary
|               for testing beyond the static limit.
|                
|               Pulse_high, Pulse_low, Pulse_time rules:
|               The pulse immunity values provide a time window during which
|               a rising pulse may exceed the nearest threshold value but
|               be below the pulse voltage value and still not cause the
|               input to switch.  Pulse_time is required for pulse immunity
|               testing.  A rising response is tested only if Pulse_high is
|               specified.  Similarly, a falling response is tested only if
|               Pulse_low is specified.  The rising response may exceed the
|               Vinl value, but remain below the Pulse_high value.  Similarily,
|               the falling response drop below the Vinh value, but remain
|               above the Pulse_low value.  In either case the input is
|               regarded as immune to switching if the the responses are 
|               within these extended windows.  If the hysteresis thresholds
|               are defined, then the rising response shall use Vinh- as the
|               reference voltage, and the falling response shall use Vinl+
|               as the reference voltage.
|
|------------------------------------------------------------------------------
[Model Spec]
|   Subparameter          typ        min        max
|
| Thresholds
|
Vinh                      3.5        3.15       3.85    | 70% of Vcc
Vinl                      1.5        1.35       1.65    | 30% of Vcc
|
| Vinh                    3.835       3.335     4.335   | Offset from Vcc
| Vinl                    3.525       3.025     4.025   | for PECL
|
| Hysteresis
|
Vinh+                     2.0        NA         NA      | Overrides the
Vinh-                     1.6        NA         NA      | thresholds
Vinl+                     1.1        NA         NA 
Vinl-                     0.6        NA         NA      | All 4 are required
|
| Overshoot
|
|* Next two lines are changed
S_overshoot_high          5.5        5.0        6.0     | Static overshoot
S_overshoot_low          -0.5        NA         NA
D_overshoot_high          6.0        5.5        6.5     | Dynamic overshoot
D_overshoot_low          -1.0       -1.0       -1.0     | requires
                                                        | D_overshoot_time 
D_overshoot_time          20n        20n        20n     | & static overshoot
|
| Pulse Immunity
|
Pulse_high                3V         NA         NA      | Pulse immunity
Pulse_low                 0          NA         NA      | requires
Pulse_time                3n         NA         NA      | Pulse_time
|
|==============================================================================


******************************************************************************

ANALYSIS PATH/DATA THAT LED TO SPECIFICATION:

Static overshoot defined as "S_overshoot_high" and "S_overshoot_low" is
chosen as the best subparameter name change because it is defined as
"static" overshoot in a manner parallel to "dynamic" overshoot for
"D_overshoot_high" and "D_overshoot_low".

It makes sense to let RAIL use the more generic "Overshoot_high" and 
"Overshoot_low" for absolute maximum or else for any rule setting that
may be unrelated to device characteristics.

******************************************************************************

ANY OTHER BACKGROUND INFORMATION:

BIRD40 replaces the approved BIRD39 text.  Refer to BIRD39 for [Model Spec]
Analysis.

******************************************************************************


 
From owner-ibis  Wed Feb 12 15:27:11 1997
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Message-Id: <m0vuo4r-000GkFC@icx.com>
Date: Wed, 12 Feb 97 15:27 PST
From: bob@icx.com ( Bob Ross)
To: ibis@vhdl.org, kellee@hyperlynx.com
Subject: Re: IBIS_CHK BUG8

Kelly:

What you proposed is the realistic situation.  Technically I believe
it is a bug, but one can argue from some language in the specification
that this is not a bug.  

In any case this is on the agenda for Friday's meeting.  I propose this
be documented rather than fixed.

Best Regards,
Bob Ross
Interconnectix


> Date: Fri, 07 Feb 1997 10:40:35 -0800
> To: ibis@vhdl.org
> From: Kellee Crisafulli <kellee@hyperlynx.com>
> Subject: Re: IBIS_CHK BUG8

> Hi all,

>   It is not obvious that to me that this is really a bug.  It seems that
> this user has the usage of
> Pin and signal_name reversed.  Please consider removing this from the bug
> list.
> "pin" should be 1,2,3,4  or AA1, BC1   etc.  There really should never be a
> conflict with the
> reserved words.

> >DESCRIPTION OF BUG:  Reserved keywords used as pin numbers generate errors
> >
> >(This bug was discovered by Arthur Wong of IDT and reported December 5,
> 1996.)
> >
> >| When pin "number" takes on the name of any of the reserved keywords
> >| (gnd, power, nc, na), an error is reported.
> >
> >[Pin]           signal_name     model_name      R_pin   L_pin   C_pin
> >nc              One_Pin         NC
> >gnd             One_Pin         GND
> >na              One_Pin         NC
> >power           One_Pin         POWER
> >|



 
From owner-ibis  Wed Feb 12 18:40:28 1997
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Date: Wed, 12 Feb 1997 16:41:48 +0800
From: dileep@contec.contec.COM (Dileep Divekar)
Message-Id: <9702130041.AA10962@contec13.contec.COM>
To: ibis@vhdl.org
Subject: EIAJ I/O Interface Model
Cc: dileep@contec.contec.COM
X-Sun-Charset: US-ASCII

I just wanted to follow up on Bob Ross's posting.
Our sister company Applied Simulation Technology, Ltd., Japan
is a member of the EIAJ I/O Interface Modeling Project Group.
I have received the following short summary of the specification.

EIAJ I/O Interface Model Summary
1) Model Coverage
The model is not expressed as electrical characteristics at pins of IC package,
but expressed as a network including internal circuits of package and I/O
buffers.
2) Model Description
The model is described as a circuit composed of electrical components
and interconnections in SPICE format. This allows the description of
ground/power circuits, complex structures of packages and modules.
3) Accurate Simulation
Signals are added at input nodes of internal buffer circuits. This
allows for accurate simulation by covering from internal buffer
circuits to external load circuits.
4) Device Models
Nonlinear device characteristics are described by 1- 2- or 3-dimensional
tables. However, models such as SPICE may be used if IC companies like.
5) Separation of data of IC, Package and Module
The data of IC, package and module are stored separately. It allows to
make and supply data of IC, package and module independently.
6) Application Frequency
The circuits of the model should be changed according to application
frequency. The model can accomodate multiple model circuits for
different application frequencies.
7) EMI Simulation
Package data will be extended to include material and 3-dimensional
shapes for accurate EMI simulation in the future.
8) Relation with IBIS
The model is extended from IBIS for more complicated application.
Both models might be used according to applications. Translators
between both models might be developed.

 
From owner-ibis  Thu Feb 13 09:57:34 1997
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Message-Id: <199702131751.JAA05478@ichips.intel.com>
To: ibis@vhdl.org
Subject: BIRD 36.1, Board Level Components
Date: Thu, 13 Feb 1997 09:56:00 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>


Hello fellow IBISains:

     As discussed at the face to face, bird 36 (packaging
and connectors), has been seperated into two birds; one
dealing with board level packaginge (SIMM modules, etc.) the
other dealing stricly with connector modeling.  Following
is BIRD36.1, which is the proposal for packaging modeling.
As mentioned in the text of the bird, this proposal
deals only with un-coupled transmission line descriptions of 
a PCB component.  Boards that require full blown (coupled) 
analysis should be described using the EDIF physical description.
Connector modeling will be described in a seperate, forthcomming,
bird.


             Regards,
             Stephen Peters
             Intel Corp.


------------------ cut here ---------------------------------


Buffer Issue Resolution Document  (BIRD)
BIRD ID#:        36.1
ISSUE TITLE:     Electric Descriptions of Boards
REQUESTER:       Stephen Peters, Hank Herrmann
DATE SUBMITTED:  Feb 13, 1997
DATE ACCEPTED BY IBIS OPEN FORUM:  Pending

******************************************************************************
******************************************************************************
STATEMENT OF THE ISSUE:  There is a need to describe SIMM modules and related
type components that consist of one or more ICs mounted on a PCB board that
connects them to a system thru a set of pins.  The following BIRD proposes a
new type of file called .ebd (Electrical Board Description) that
addresses this need.  This proposal does not encompass an electrical 
description of connectors and other interconnect devices. 

******************************************************************************
STATEMENT OF THE RESOLVED SPECIFICATIONS:  The following text is placed
in the specification after the .pkg file description and before the
[End] keyword description.

==================== ELECTRICAL BOARD  DESCRIPTION ====================

     An Board Level Component is defined as a part that connects one or more 
IC packages to another part or board thru a set of user visible pins.  For 
example, a SIMM module is an board level component in that it connects 
several DRAM packages to a PCB thru an edge connector.  To provide a 
simple electrical description of the connection between the pins of the
board level component and the IC packages, an electrical board description 
file (a .ebd file) is defined.  A fundamental assumption regarding the
electrical board description is that the inductance and capacitance 
parameters listed in the file are derived with respect to well defined 
reference plane(s) within the board.  Also, this current description does 
not allow one to describe electrical (inductive or capacitive) coupling
between paths.  It is recommended that if coupling is an issue than an
electrical description be extracted from the boards physical parameters.

    What is, and is not, included in an Electrical Board Description
is defined by its boundaries.  For the definition of the boundaries, see the
Description section under the [Path Description] Keyword.

Usage Rules:
     A .ebd file is intended to be a stand alone file, not associated with any
.ibs file.  Board level component descriptions are stored in a file
whose name looks like <filename>.ebd, where <filename> must conform to the
naming rules given in the general syntax section of this specification.  The
.ebd extension is mandatory.

Contents:
    A .ebd file is structured similar to a standard IBIS file.  It must
contain the following keywords, as defined in the IBIS specification:
[IBIS Ver], [File name], [File rev], and [End].  It may also contain the
following optional keywords: [Comment char], [Date], [Source], [Notes],
[Disclaimer] and [Copyright].  The actual board level component
description is contained between the keywords [Begin Board Description]
and [End Board Description], and includes the keywords listed below.

[Begin Board Description]
[Manufacturer]
[Number of Pins]                 
[Pin List]                       
[Path Description]
[Reference Designator Map]
[End Board Description]

  More than one [Begin Board Description]/[End Board Description] 
keyword pair is allowed in a .ebd file.

|=============================================================================
|    Keyword: [Begin Board Description]
|   Required: Yes
|Description: Marks the beginning of an Electrical Board Description.
|Usage Rules: The keyword is followed by the name of the board level
|             component.  If the .ebd file contains more than one [Begin
|             Board Description] keyword, then each name must be unique.
|             The length of the component name must not exceed 40 characters
|             in length, and blank characters are allowed.  For every
|             [Begin Board Description] keyword there must be a
|             matching [End Board Description] keyword.
|-----------------------------------------------------------------------------
[Begin Board Description]  16Meg X 8 Simm Module
|
|=============================================================================
|    Keyword: [Manufacturer]
|   Required: Yes
|Description: Declares the manufacturer of the part(s) that use this .ebd
|             file.
|Usage Rules: Following the keyword is the manufacturers name.  It must not
|             exceed 40 characters, and can include blank characters.  Each
|             manufacturer must use a consistent name in all .ebd files.
|-----------------------------------------------------------------------------
[Manufacturer] Quality SIMM Corp.
|
|=============================================================================
|    Keyword: [Number of Pins]
|   Required: Yes
|Description: Tells the parser the number of pins to expect.  Pins are any
|             externally accessible electrical connection to the part.
|Usage Rules: The field must be a positive decimal integer.
|             Note: The simulator must not limit the Number of Pins to any
|             value less than 1,000.
|-----------------------------------------------------------------------------
[Number of Pins] 128
|
|=============================================================================
|    Keyword: [Pin List]
|   Required: Yes
|Description: Tells the parser the pin names of the parts user accessible 
|             pins.  It also informs the parser which pins are connected to
|             power and ground. 
|Sub-params:  pin_name signal_name
|Usage Rules: Following the [Pin List] keyword are two columns.  The first
|             column lists the pin name, the second lists the data book 
|             name of the signal connected to that pin. There must be as many 
|             pin_name/signal_name rows as there are pins given by the 
|             preceding [Number of Pins] keyword.  Pin names must be the 
|             alphanumeric external pin names of the part.  The pin
|             names cannot exceed eight characters in length.  Any pin
|             associated with a signal name that begins with "GND" or
|             "POWER" will be interpreted as connecting to the boards ground
|             or power plane.  In addition, NC is a legal signal name and
|             indicates that the Pin is a 'no connect'.
|             
|-----------------------------------------------------------------------------
|  A SIMM BOARD EXAMPLE
|
[Pin List]
pin_name  signal_name
A1        GND
A2        data1
A3        data2
A4        POWER5    | this pin connects to 5v
A5        NC        | a no connect pin
| .
| .
A22       POWER3.3  | this pin connects to 3.3v
B1        casa
| .
| .
|etc.
|
|============================================================================
|    Keyword: [Path Description]
|   Required: Yes
|Description: This keyword allows the user to describe the connection
|             between the user accessible pins of a part and the pins of
|             the ICs mounted on that part.  Each pin to node connection is
|             divided into one or more cascaded "sections", where each
|             section is described in terms of it's L/R/C per unit length.
|             The Fork and Endfork subparameters allow the path to branch
|             to multiple nodes, or another pin.  A path description is
|             required for each pin who's signal name is not "GND", "POWER"
|             or "NC".
|
|             BOARD DESCRIPTION AND IC BOUNDARIES:
|             In any system, each part interfaces with another part at some 
|             boundary.  Every part model must contain the components 
|             necessary to represent the behavior of the part being modeled 
|             within its boundaries. The boundary definition depends upon 
|             the parts being represented by the model.
|
|             For CARD EDGE CONNECTIONS such as a SIMM or a PC Daughter 
|             Card plugged into a SIMM Socket or Edge Connector, the 
|             boundary should be at the end of the board card edge pads as 
|             they emerge from the connector.
|
|             For any THROUGH-HOLE MOUNTED PART, the boundary will be at 
|             the surface of the board on which the part is mounted.
|
|             SURFACE MOUNTED PART models end at the outboard end of their
|             recommended surface mount pads.
|
|             If the board level component contains an UNMATED CONNECTOR,
|             the unmated connector will be described in a separate file,
|             with it's boundaries being as described above for the
|             through-hole or surface mounted part.
|
| Sub-params: Len, L, R, C, Fork, Endfork, Pin, Node
|Usage Rules: Each individual connection path (user pin to node(s))
|             description begins with the
|             [Path Description] keyword and a path name, followed by the
|             subparameters used to describe the path topology and the
|             electrical characteristics of each section of the path.  The
|             path name must not exceed 40 characters, blanks are not allowed,
|             and each occurrence of the [Path Description] keyword must be
|             followed by a unique path name.  The individual subparameters
|             are broken up into those that describe a sections electrical
|             properties, and those that describe the topology of a path.
|
|             SECTION DESCRIPTION SUBPARAMETERS:
|             The Len, L, R, and C subparameters specify the length, the
|             series inductance and resistance and the capacitance to ground
|             of each section in a path description.
|             Len     The physical length of a section.  Lengths are given
|                     in terms of arbitrary 'units'.  Any non-zero length
|                     requires that the parameters that follow must be
|                     treated as distributed elements by the simulator.
|             L       The series inductance of a section, in terms of
|                     'inductance/unit length'.  For example, if the total
|                     inductance of a section is 3.0nH and the length of the
|                     section is 2 'units', the inductance would be listed
|                     as L = 1.5nH  (i.e. 3.0 / 2). 
|             C       The capacitance to ground of a section, in terms of
|                     capacitance per unit length.
|             R       The series DC (ohmic) resistance of a section, in
|                     terms of ohms per unit length.
|
|             TOPOLOGY DESCRIPTION SUBPARAMETERS:
|             The Fork and Endfork subparameters denote branches from the 
|             main pin-to-node or pin-to-pin connection path.  The Node 
|             subparameter is used to reference an external component 
|             description file.  The Pin subparameter is used to indicate 
|             the point at which a path connects to a user visible pin. 
|             Fork    This subparameter indicates that the sections
|                     following (up to the Endfork subparameter) are part
|                     of a branch off of the main connection path.  This
|                     subparameter has no arguments.
|             Endfork This subparameter indicates the end point of a
|                     branch.  For every Fork subparameter there must be a
|                     corresponding Endfork subparameter.  As with the Fork
|                     subparameter, the Endfork subparameter has no arguments.
|             Node    reference_designator.pin
|                     This subparameter is used when the connection path
|                     connects to a pin of another, externally defined part.
|                     The arguments of the Node subparameter indicate the pin
|                     and reference designator of the external component.  The
|                     pin and reference designator portions of the argument are
|                     separated by a period (".").  The reference designator is
|                     mapped to an external component description (another .ebd
|                     file or .ibs file) by the [Reference Designator Map]
|                     Keyword.  Note that a Node MUST reference a model of
|                     a passive or active component.  A Node is not an
|                     arbitrary connection point between two elements or 
|                     paths.
|             Pin     This subparameter is used to mark the point at which
|                     a path description connects to a user accessible pin.
|                     Every path description must contain at least one 
|                     occurrence of the Pin subparameter.  It may also contain
|                     the reserved word NC.  The value of the Pin subparameter
|                     must be one of the pin names listed in the [Pin List]
|                     section.
|
|             Using The Subparameters to Describe Paths:
|             A section description begins with the Len subparameter and
|             ends with the slash (/) character.  The value of the Len, L,
|             R and C subparameters and the subparameter itself are separated
|             by an equals sign (=); whitespace around the equals sign is
|             optional.  The Fork, Endfork, Node and Pin subparameters are
|             placed between section descriptions (i.e. between the concluding
|             slash of one section and the 'Len' parameters that starts
|             another).  The arguments of the Pin and Node subparameter are
|             separated by white space; no equal sign nor slash (/)
|             character is used.  
|
|             Specifying a Len or L/R/C value of zero is allowed.  If
|             Len = 0 is specified, then the L/R/C values are the total
|             for that section.  If a non-zero length is specified, then
|             the total L/R/C for a section is calculated by multiplying 
|             the value of the Len subparameter by the value of the L,
|             R or C subparameter.  However, as noted below, if a non-
|             zero length is specified, that section MUST be treated as
|             distributed elements.
|
|             Legal Subparameter Combinations for Section Descriptions:
|
|             A)  Len, and one or more of the L, R and C subparameters.  If
|             the Len subparameter is given as zero, then the L/R/C sub-
|             parameters represent lumped elements.  If the Len subparameter
|             is non-zero, then the L/R/C subparameters represent distributed
|             elements and both L and C must be specified, R is optional.
|
|             B) The first subparameter following the [Path Description]
|             keyword must be 'Pin', followed by one or more section
|             descriptions.  The path description can terminate in a node,
|             another pin or the reserved word, NC.
|
|---------------------------------------------------------------------------
|
|
|  AN EXAMPLE PATH FOR A SIMM MODULE
|
[Path Description] CAS_2
Pin J25
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u21.15
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u22.15
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u23.15
|
|  A DESCRIPTION USING THE FORK AND ENDFORK SUBPARAMETERS
|
[Path Description] PassThru1
Pin B5
Len = 0   L=2.0n /
Len = 2.1 L=6.0n C=2.0p /
 Fork
 Len = 1.0 L= 1.0 C= 2p
 Node u23.15
 Endfork
Len = 1.0 l = 6.0n C=2.0p /
Pin A5
|
|=============================================================================
|    Keyword: [Reference Designator Map]
|   Required: Yes, if any of the path descriptions use the Node subparameter.
|Description: Indicates the linkage between a reference designator and the
|             external part it represents.
|Usage Rules: The [Reference Designator Map] keyword must be followed by a
|             list of all of the reference designators defined in the Node
|             subparameter under the [Path Description] keyword.  Each
|             reference designator is followed by the Name of the part to which
|             it is linked and the terms are separated by whitespace.  The part
|             Name may be another .ebd or .ibs model.  A referenced .ebd model
|             may be internal to the calling .ebd file or it may be an external
|             file with an appropriately given pathname.
|-----------------------------------------------------------------------------
[Reference Designator Map]
|
|  EXTERNAL PART REFERENCES
|
u23   80286.ibs
u24   SIMM.ebd
u25   C:\LIBS\LS244.ibs
|
|  AN INTERNALLY DEFINED .ebd MODEL OF A 10K RESISTOR
|
u26   R10K
| 
|=============================================================================
|    Keyword: [End Electrical Description]
|   Required: Yes
|Description: Marks the end of an Electrical Interconnect Description.
|Usage Rules: This keyword must come at the end of each complete electrical
|             interconnect model description.
|
|             Optionally, a comment may be added after the [End Electrical
|             Description] keyword to clarify which board model has
|             ended.
|-----------------------------------------------------------------------------
[End Electrical Description]        | End: 16Meg X 8 Simm Module
|
******************************************************************************
ANALYSIS PATH/DATA THAT LED TO SPECIFICATION:





 
From owner-ibis  Thu Feb 13 10:38:35 1997
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Message-ID: <Thu, 13 Feb 97 10:32:19 PST_16@ccm.fm.intel.com>
To: scotts%actel.com_at_internet_gateway@ccm.fm.intel.com, ibis@vhdl.org
Subject: Re: Lab data vs. Spice data


Text item: 

Scott,

On a few occasions I have made IBIS models from lab measurements.

Arpad Muranyi
Intel Corporation
============================================================================

Hello Ibis folks,

I'd like to compare notes with those who have produced IBIS files
from *BOTH* Spice and lab measurements.  Please respond to me
directly (not through the reflector) if you have done this,
particularly if yours is a CMOS process.  Thanks,

-Scott Schlachter     Actel Corporation
 scotts@actel.com     Sunnyvale, CA

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Subject: Lab data vs. Spice data
To: ibis@vhdl.org, ibis-users@vhdl.org
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Date: Fri, 14 Feb 97 15:50:14 PST
From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9702142350.AA01022@rockie.nsc.com>
To: ibis@vhdl.org
Subject: IBIS Roster update for 1997

IBIS fans:

Every year we need to take a look at the IBIS roster and update all the fields.
This helps the customer, user and anyone interested in IBIS to talk to all
of you.

Pls take a moment to review your company information and make changes if
required. You may E-mail the changes back to me and I will make the necessary
updates.

At least, I need a response from you so I know your information is valid.
If no response is received, we make take you off the roster.

Best Regards,
Syed
Vice-Chair ANSI/EIA-656
National Semiconductor

============================================================================
                1996 EIA IBIS Committee Participation Roster
                    As of 2/14/97 (updated periodically)

          Previous participation under old95 and old96 directories
                       Submit changes/updates to:
                          huq@rockie.nsc.com
                   (408) 721-4874, Fax (408) 721-4785
============================================================================
NOTE: This roster lists companies and organizations that have either
participated in creating the IBIS spec or are creating/distributing/using
IBIS models.  Other than the specific statements of support under each
organization's name, no support nor endorsement of the specification is
implied.  Companies designated by * are members of the EIA IBIS Open Forum.
============================================================================

Alcatel
Contact:   John Fitzpatrick
Email:     John.Fitzpatrick@ln.cit.alcatel.fr
Phone:     + 33 96 04 79 33
Fax:       + 33 96 04 85 09
Address:   4 rue Louis de Broglie
           22304 Lannion
           France
Support:   IBIS models used in CAD tool chain.
Tag-line:  Telecommunication equipment manufacturer.

* AMP Incorporated
Contact:   Martin G. Freedman
Email:     mgfreedm@amp.com
Phone:     (717) 592-6270 
Fax:       (717) 592-6179
Address:   M.S. 210-20
           P.O. Box 3608
           Harrisburg, PA 17105-3608      Harrisburg, PA 17105-3608
Support:   AMP Global Technology group is investigating the IBIS format
           for modeling connector electrical performance.  We are actively
           supporting the work of the IBIS Open Form in this area.
Tag-line:  AMP is the world's largest supplier of electrical connectors. 
           Electrical performance models, in SPICE format, are currently 
           available for high speed interconnects.

Anacad EES
Contact:  Steffen Rochel
Email:    steffen_rochel@mentorg.com
Phone:    (408) 451 5820 Fax: (408) 451-5554 
Address:  Anacad EES
          Mentor Graphics
          1001 Ridder Park
          San Jose, CA 95131-2314
Support:  Anacad can translate IBIS descriptions into models using their
          analog behavioral modeling language HDL-A.  Together with Eldo
          and a VHDL simulator, highly accurate investigations of mixed
          signal designs are possible.
Tag-line: 

* Applied Simulation Technology, Inc (formerly Contec CAE, Ltd.)
Contact:  Dileep Divekar
Email:    dileep@apsimtech.com
Phone:    (408) 434-0967, ext. 100, Fax: (408) 434-1003
Address:  2188 Bering Drive
          San Jose, CA 95131
Support:  Applied Simulation Technology tools support IBIS models.  
Tag-line: Applied Simulation Technology offers accurate, state of the art
          signal integrity, EMI / EMC and circuit simulation tools.

* Cadence Design Systems, Inc.
Contact:  C. Kumar
Email:    cpk@cadence.com
Phone:    (508) 262-6488, Fax: 508-262-6600 
Address:  270 Billerica Rd,
          Chelmsford,  MA 01824
Support:  Cadence fully supports IBIS models.  Cadence's DF/SigNoise
          product family offers a vendor-specific, IBIS compatible signal 
          integrity library of over 7000 components.  Cadence also 
          provides a translator program enabling the conversion of IBIS 
          1.1 and 2.1 files to Cadence library format.
Tag-line: Cadence, the worldwide leader in electronic design automation,
          combines leading-edge technology and a complementary set of
          services to accelerate and advance the overall performance 
          engineering of high-speed electronic systems.

* Cypress Semiconductor
Contact:  Bruce Wenniger
Email:    bw@cypress.com
Phone:    (408) 943-2688, Fax: (408) 943-2843
Address:  3901 N. First Street , MS2.2-3
          San Jose, CA 95134
Support:  Cypress will generate IBIS models for the integrated circuits
          it designs and manufactures.
Tag-line: Cypress is a leader in the development and production of high-
          performance CMOS and BiCMOS digital integrated circuits.

Digital Equipment Corp.
Contact:  Jeff L. Chu
Email:    chu@rock.enet.dec.com
Phone:    (508) 568-4197, Fax: (508) 568-4367
Address:  77 Reed Road, HLO2-3/K13
          Hudson, MA 01749
Support:  Digital will generate IBIS models for its own chip products, 
          including the line of ALPHA AXP microprocessors, peripheral and   	
	  communication chips, as needed, and support IBIS models in 		
	  in-house simulation tools.
Tag-line: Digital, maker of the world's fastest microprocessor, is also a 
          leading developer of computer systems, and networking and 
          communication products, including PCI.

EIA/Electronic Information Group
Contact:  Patti Rusher
Email:    pattir@eia.org
Phone:    (703) 907-7545. Fax: (703) 907-7501
Address:  2500 Wilson Blvd.
          Arlington, VA 22201
Support:
Tag-line:

* Hewlett-Packard/HP EEsof Division
Contact:  Karl Kachigan
Email:    karlk@sr.hp.com
Phone:    (707) 577-3949,  Fax: (707) 577-5260 
Address:  1400 Fountaingrove Parkway
          Santa Rosa, CA 94503
Support:  Support IBIS models in HP 85240 Picosecond Interconnect
          Modeling Suite for interconnect model development and
          analysis.
Tag-line: HP EEsof is a leading supplier of high frequency analog
          (RF/Microwave) design and modeling tools.

* HyperLynx
Contact:  Kellee Crisafulli
Email:    kellee@hyperlynx.com
Phone:    (206) 869-2320, Fax: (206) 881-1008
Address:  17641 N.E. 67th. Ct.
          Redmond, WA 98052
Support:  Several signal integrity and EMC analysis tools are available:

          LineSim:  A simulator using schematic data input, reads
                    IBIS files as part of its native library support. 
                    Ships with a set of IBIS libraries.

          BoardSim: A simulator using PCB geometry data input from
                    numerous PCB layout packages, also natively supports 
                    IBIS files.  Ships with a set of IBIS libraries.

          SpectralSim:
                    An add-on tool for BoardSim and LineSim that provides
                    EMC analysis using a spectrum analyzer.

Tag line: HyperLynx, Inc. is the industry's leading supplier of 
          affordable, accurate, Windows based signal-integrity
          and EMC software.

IBM Corporation
Contact:  Joseph C. (Jay) Diepenbrock
Email:    jayd@vnet.ibm.com
Phone:    (919) 543-8804
Fax:      (919) 543-6552      
Address:  Networking Hardware. Div.          
          PDLA/656
          P.O. Box 12195
          Research Triangle Park, NC 27709
Support:  
Tag-line: 

* INCASES Engineering GmbH
Contact:  Werner Rissiek, Olaf Rethmeier
Email:    wrissiek@pad.incases.com, orethmeier@pad.incases.com
Phone:    ++49-5251-150-620, ++49-5251-150-625, Fax: ++49-5251-150-700 
Address:  INCASES Engineering GmbH
          Vattmannstrasse 3
          D-33100 Paderborn, Germany
Support:  INCASES provides the simulation packages INSIDE (INCASES Signal 
	  Integrity Diagnostic Environment) for signal integrity analysis 
	  and COMORAN (COMputation of RAdiatioN) for radiation analysis 
	  within its product family EMC-Workbench.

          INCASES provides the IBIS-to-INCASES converter that bases on the 
          IBIS Golden Parser 2.1. The converter creates INCASES macromodels, 
          corresponding reference lists, and further information for the 
          components in a fully automatic way. 

          The INCASES Library management tool EXLIN provides specific features
          to import the new models generated by the converter into respective 
          libraries. EXLIN checks for consistency, supports the defintion of 
          user specific IDs, and allows to reference the models also for other 
          components which show a similar behaviour as the original ones.

          Detailed information is available on request.

Tag-line: INCASES Engineering, GmbH, Germany, founded on November 1, 1994,
          is a supplier of design automation software and consulting 
          services to the electronic design automation (EDA) market, 
          focusing on EMC and 'Design for  Manufacturability'.  INCASES 
          develops, sells, and supports two major product lines: THEDA, 
          acquired from Computervision Corporation and EMC-Workbench, 
          acquired from Siemens Nixdorf Informationssysteme AG.

* Intel Corporation
Contact:  Will Hobbs
Email:    Will_Hobbs@ccm2.jf.intel.com
Phone:    (503) 696-4369, Fax: (503) 696-4210
Address:  5200 NE Elam Young Pkwy, JF1-57
          Hillsboro, OR 97124
Support:  Intel is a strong supporter of the IBIS standard, and provides
          IBIS models for many of its components.  For a list of supported
          components, send the following message to archive@vhdl.org:

          path <your return email path>
          send pub/ibis/models/intel readme  index /pub/ibis/models/intel

          For information on models of unannounced products, contact your
          local Intel field sales office.

Tag-line: Intel, the world's largest chip maker, is also a leading 
          manufacturer of personal computer networking and communications
          products.

* Interconnectix (A Mentor Graphics Company)
Contact:  Bob Ross
Email:    bob@icx.com
Phone:    (503) 684-6641, Fax: (503) 639-3469
Address:  10220 S.W. Nimbus Ave., K4
          Portland, Oregon 97223
Support:  The Interconnect Synthesis (IS) product supports the major 
          extensions of IBIS Version 2.1.  Interface extensions for 
          component and model selection and termination generation
          allow IBIS formatted data to be used in "what if" 
          investigations and automatic synthesis operations.
Tag-line: The leading Interconnect Synthesis Company

KAW/USA
Contact:  Dan Aleksandrowicz
Email:    dan@kaw.com
Phone:    (603) 886-8711, Fax: (603) 881-8763
Address:  39 Simon Street
          Nashua, NH 03060
Support:  
Tag-line: A total concept solution for P.C.B. by design, simulation,
          consulting, training, analysis and schematic capture; by using
          Mentor-Board Station/Design Architect, Cadence/Allegro/Concept/
          Boardquest, Unicad and CCT-Router.

Mentor Graphics Corp.
Contact:  Greg Doyle
Email:    greg_doyle@mentorg.com
Phone:    (408) 451-5753, Fax: (408) 451-5538
Address:  1001 Ridder Park Drive
          San Jose, CA 95131
Support:  Mentor supports IBIS by using Quad Design and Intel IBIS models.
Tag-line: The Integrated System Design Company 

Meta-Software
Contact:  Sanjay Gangal                 Les Spruiell
          Solutions Marketing Group     Product Line Group
Email:    sanjayg@metasw.com            less@metasw.com
Phone:    (408) 369-5244                (408) 369-5459
Address:  1300 White Oaks Rd.
          Campbell, CA 95008
Support:  
Tag-line: 

MicroSim Corp.
Contact:  Ralph Perez
Email:    
Phone:    (714) 770-3022, Fax: (714) 455-0554
Address:  20 Fairbanks
          Irvine, CA 92718
Support:  MicroSim can automatically generate PSpice models for vendors 
          who provide data in a file format conforming to the IBIS Ver 1.1
          specification.  The models can then be simulated with PSpice.
          MicroSim has made IBIS models for Intel's Pentium processor 
          82430 PCIset available to customers.
Tag-line: MicroSim Corp. - The Desktop EDA Company - provides technically 
          sophisticated software for schematic entry, simulation, 
          programmable logic synthesis, and signal integrity analysis.

* Mitsubishi Electric
Contact:  Tom Cao
Email:    tcao@msai.mea.com
Phone:    (919) 479-3362, Fax: (919) 479-3309
Address:  Three Diamond Lane
          Durham, NC 27705    
Support:  
Tag-line: 

* Motorola
Contact:  Ahmed Omer                        Ron Werner
Email:    R28450@email.sps.mot.com          p24742@email.mot.com
Phone:    (512) 794-4248                    (602) 441-8593 
Fax:      (512) 794-4250                    (602) 441-2363
Address:  5918 W. Courtyard Dr., Suite 200  8201 E. McDowell Road
          Austin, TX 78730                  Scottsdale, AZ 85252      
Support:  
Tag-line: 

* National Semiconductor Corp.
Contact:  Syed B.Huq
Email:    huq@rockie.nsc.com
Phone:    (408) 721-4874, Fax:(408)721-4785 
Address:  2900 Semiconductor Drive, M/S A-2595
          Santa Clara, CA 95052
Support:  National Semiconductor provides IBISv1.1 and IBISv2.1 models
          for selected product lines.  Refer to www.natonal.com for the
          latest available models.
Tag-line: National Semiconductor provides technologies for moving and
          shaping information.  The company focuses on communications, 
          analog, and personal systems markets, and is the fourth largest 
          U.S semiconductor merchant.

* NCR Corporation
Contact:  Dave Moxley
Email:    David.Moxley@columbiasc.ncr.com
Phone:    (803) 939-6495, Fax: (803) 939-7317
Address:  3325 Platt Springs Rd.
          W. Columbia, SC 29170
Support:  NCR supports the ANSI/EIA-656 standard and is a user of IBIS
          models.
Tag-line: 

* NEC Corporation
Contact:  Hiroshi Sakuma
Email:    sakuma@lsi.tmg.nec.co.jp
Phone:    +81 -44-435-1501(DIR), Fax: +81 -44-435-1887 
Address:  Design Sys. Dept., System ASIC Div., NEC Corp.
          1753 Shimonumabe, Nakahara-ku
          Kawasaki Japan 211
Support:  NEC is willing to write some IBIS models and a model generator
          for some of its LSI components.
Tag-line:

North Carolina State University
Contact:  Michael Steer, Paul Franzon,   Steve Lipa
Email:    mbs@ncsu.edu   paulf@ncsu.edu  slipa@eos.ncsu.edu 
Phone:    919-515-5191   919-515-7351    919-515-3947  
          FAX for all three: 919-515-5523
Address:  ECE Dept. Box 7911 
          NC State Univ. 
          Raleigh, NC  27695-7911 
Support:  (as of 2/94) A Spice to IBIS converter is being developed.  A 
          measurement based procedure is being developed for extracting 
          IBIS models.  A yacc/lex parser for IBIS models is being 
          develped.  All software and techniques will be put in the public 
          domain.
Tag-line: 

* Quad Design Technology, Inc.
Contact:  Jon Powell
Email:    jonp@qdt.com
Phone:    (805) 988-8250, Fax: (805) 988-8259
Address:  1385 Del Norte Rd.
          Camarillo, CA 93010
Support:  Quad Design has a translation program that translates from IBIS
          format to Quad Design .mod format.  This translator uses the 
          Golden Parser code with enhancements to warn of malformed (yet 
          legal) models.  The translator supports user input to be able to 
          select from the min-typ-max range of IBIS data.  This program 
          (IBIS2XTK) is available now and is distributed with XTK 
          Crosstalk and transmission line simulation tool kit.
Tag-line: Quad Design is a leading supplier of Signal Integrity and Timing 
          tools for high speed digital designs.

* Quantic Laboratories, Inc.
Contact:  Mike Ventham
Email:    ventham@quantic.mb.ca
Phone:    (204) 942-4000, Fax: (204) 957-1158 
Address:  12th Floor, 191 Lombard Ave
          Winnipeg, Manitoba, R3B 0X1
          Canada
Support:  Quantic provides an IBIS reader (based on the Golden
          Parser) that will read IBIS models and automatically generate 
          data files for Phidias (our graphical VI curve device modellor) 
          and database files that associate the component definitions with 
          the pin models.

          From Phidias, both SPICE models for PCB Greenfield (our pre
          and post layout transmission line simulator) and models for
          BoardScan, (our PC board screener for signal integrity and 
          crosstalk problems) can be created.

          This is available now for Quantic customers.
Tag-line: Quantic Laboratories Ltd has been the leading supplier of
          field solvers and signal integrity tools since 1983. This 
          expertise has now been extended to Electromagnetic Compatibility 
          (EMC) tools.

Symmetry Design Systems, Inc.
Contact:  Andy Hughes
Email:    andy@symmetry.com
Phone:    (415) 949-9600, Fax: (415)-949-0831
Address:  477 S. San Antonio Rd. #200
          Los Altos, Ca. 94022
Support:  Symmetry provides IBIS modeling tools and services. Symmetry's 
          modeling tool MODPEX can create IBIS models based on measured 
          device characteristics or data sheet information. MODPEX can 
          translate IBIS models to SPICE descriptions for testing and 
          documentation or translate SPICE models to IBIS.
Tag-line: Symmetry is a dedicated supplier of tools and services for 
          creating, testing, and documenting SPICE and IBIS component 
          models for electronic system design.

Tanner Research, Inc.
Contact:  Peter Parrish, Ed Miller, Scott Wedge
Email:    peter.parrish@tanner.com, ed.miller@tanner.com, 
          scott.wedge@tanner.com 
Phone:    (818) 792-3000
FAX:      (818) 792-0300
Address:  180 North Vinedo Avenue
          Pasadena, CA  91107
Support:  Tanner Research is currently developing IBIS model 
          support for its MCM design tools.
Tag-line: Affordable ASIC, MCM, and MEMS design tools from
          Tanner Research offer high performance and 
          easy to use CAE solutions for PCs, Macintoshes, and
          UNIX workstations. Tanner Tools provide a complete 
          design solution including schematic capture, circuit
          and gate level simulation, signal integrity analysis,
          auto place and route, layout editing and layout verification.

* Texas Instruments, Inc.
Contact:  Ben Andresen                   Roger Cline
          (ASIC)                         (ASIC)
Email:    andresen@asic.sc.ti.com        rcline@asic.sc.ti.com
Phone:    (972) 480-4028                 (972) 480-4053
Fax:      (972) 480-4400                 (972) 480-4400
Address:  8505 Forest Lane               8505 Forest Lane
          Dallas, TX. 75243              Dallas, TX. 75243
          M/S 8664                       M/S 8664

Support:  TI is working on a tool to automatically generate IBIS models
          from TI SPICE simulations (TI's proprietary SPICE dialect).
          TI is also evaluating various procedures for IBIS model
          distribution and tracking.
Tag-line:

* Thomson-CSF/SCTF
Contact:  Jean Lebrun
Email:    lebrun@sctf.thomson.fr
Phone:    1/69 33 00 99, Fax: 1/69 33 00 10
Address:  L'oree De Corberville
          BP 56
          91401 Orsay
          France
Support:  
Tag-line: 

* UniCAD Inc.
Contact:  Stephen Lum
Email:    lum@unicad.com
Phone:    (613) 596-9091 Ext. 321
Address:  2745 Iris Street
          Pinecrest Office Park
          Ottawa, Ontario K2C 3V5
Support:  UniSolve, a concurrent engineering workbench currently
          supports IBIS v1.1 model files in native mode for signal 
          integrity analysis.  Support for IBIS v2.1 is planned for early 
          1995.
Tag-line: UniCAD, INC. provides software used in the layout and
          analysis of printed circuits and multichip modules.  It provides 
          the only available concurrent Computer Aided Analysis (CAA) 
          environment used to simultaneously monitor Emissions, Digital 
          Signal Integrity, Analog Signal Integrity, Thermal, and 
          Reliability throughout the design layout process.

* VeriBest Inc.
Contact:  Mark Andres
Email:    mandres@veribest.com
Phone:    (303) 581-2409
Address:  6101 Lookout Rd.
          Boulder, CO  80301
Support:  VeriBest Inc. fully supports the activities of the IBIS 
          open forum and as such, is ensuring that all signal integrity 
          development is aligned so that our customers will be able to 
          take advantage of IBIS as the standard stabilizes. 
Tag-line: VeriBest Inc. provides electronic design automation tools for 
          designers of electronic system that include PCBs, ASICs, FPGAs, 
          and PLDs. VeriBest bridges the cost/capability gap by providing
          proven design flows that interoperate between Windows NT/95 and 
          UNIX operating systems.

* VLSI Technology
Contact:  Richard Ulmer
Email:    dick.ulmer@tempe.vlsi.com
Phone:    (602) 752-6252  Fax: (602) 752-6002
Address:  8375 South River Parkway
          Tempe, AZ 85284
Support:  
Tag-line: 

Zeelan Technology (A Mentor Graphics Company)
Contact:  George Opsahl
Email:    george@zeelan.com
Phone:    (503) 685-1000, Fax: (503) 685-1001
Address:  8005 SW Boeckman Road
          Wilsonville, OR 97070
Support:  Standard Model Libraries (including Microprocessor, Memory,
          pre-silicon ASIC, FPGA, Digital Logic models) as well as Modeling
          service to characterize and create models conforming to the IBIS
          format.  MasterModels(TM) are created from measurements of
          physical devices under a tightly controlled high frequency
          fixture and modeling system.  These accurate models closely
          represent actual device behavior when used in simulation. 
Tag-line: 

* Zuken-Redac
Contact:  John Berrie
EMail:    johnb@redac.co.uk
Phone:    +44 1684 294161, Fax +44 1684 299754
Address:  Tewkesbury,
          Gloucestershire GL20 8HE
          England
Support:  Zuken-Redac currently supports IBIS modelling through its interfaces
          to Quad Design and Quantic Labs. Further integration with IBIS
          is planned in future.
Tag-Line: Zuken-Redac is a world leader in design automation, providing
          open, leading technology, standards-based CAD-CAM solutions.

============================================================================

 
From owner-ibis  Mon Feb 17 08:30:08 1997
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To: ibis@vhdl.org
Subject: BIRD 41.1
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Hello all,

Thanks to all who commented on Bird 41 during the Open Forum
meeting on Friday.

Based on what I heard, I've made some changes to the BIRD, which
I submit as BIRD 41.1.

I'll be on holidays for 3 weeks from Thursday 20th, so I'd really
appreciate your comments as soon as possible.... 

What I'd like to know is:

  a) Is the definition of series pins OK?
     Will it be compatible with the connector pin definitions?

  b) Is the explanation of state understandable?
     Should [State] be a separate keyword?

  c) Will [Series Impedance] allow bus-switches to be correctly
     modelled? 

  d) What are your opinions on the RLC series path as defined?
     Would it be better to allow an arbitrary series path be
     defined, as per the old 36.1?

If, like me, you print out BIRD's, then scribble corrections on 
them, you can fax me your handwritten notes at 
+33 2 9604 8509 (where + stands for 011 in the USA)

Regards,
John

p.s. And for those who heard my plea for a simpler way to define
V/I curves, what about the suggestion for an [Impedance] keyword
with a Mode subparameter (see Analysis Path)?    


************************************************************************
************************************************************************

BIRD ID#:      41.1
ISSUE TITLE:   Modelling Series Switchable Devices
REQUESTER:     John Fitzpatrick, Alcatel
DATE SUBMITTED:                       February 17, 1997
DATE ACCEPTED BY IBIS OPEN FORUM:     Pending

************************************************************************
************************************************************************

STATEMENT OF THE ISSUE:

IBIS cannot model series devices. 
IBIS cannot model switches.
 
************************************************************************

STATEMENT OF THE RESOLVED SPECIFICATIONS:


One new keyword is defined under [Component]:
       [Series_Pin]
      
A new keyword is defined under [Component]:
       [Series_Impedance]
 
RLC series paths can be defined with:
       [Rseries], 
       [C_series], [R_c_series], [L_c_series],
       [L_series], [R_l_series]

Two additional Model_type values are allowed under the [Model]
keyword:
       Series, 
       Series_Switch
       
     
New measurement methods are defined for impedance tables.
 

Add the following text somewhere after the [Component] keyword:

|======================================================================
|    Keyword:  [Series_Pin]
|   Required:  Optional
|Description:  Used to associate two pins joined by a series device.
| Sub-Params:  Pin1, Pin2, Model_Name, State
|Usage Rules:  Entries follow these rules: Only series pin pairs
|              are entered.  The Pin1 column contains the pin number for 
|              which input impedances are measured. The Pin2 column
|              contains the pin name of the other end of the series 
|              device. The Model_Name colum contains the name of the 
|              model corresponding to the series device.
|              The State column contains text allowing the simulator
|              tool to make intelligent path configurations in the
|              case of, say, crossbar switches.
|
|               Column length limits are:
|                  Pin1          5 characters max
|                  Pin2          5 characters max
|                  Model_Name   20 characters max
|                  State        20 characters max
| 
|Other Notes: 
|              The order of the pins is important. All V/I curves 
|              correspond to measurements made at Pin1. 
|              If the device is not symmetric, a different model may be
|              specified with the pin order swapped.
|
|              The State column shall contain text
|              which can be used by the simulator to prompt the user
|              for configuration information:
|                - for a Series_Switch, the device os ON when the
|                  corresponding state is selected, otherwise it
|                  is OFF;
|                - for other devices, the device is present only 
|                  when the corresponding state is selected, or if the
|                  state is "NA".
|
|              In the case of a crossbar switch, all possible series
|              connections must be listed:  switching information is
|              contained under the State column. 
|
|              The model name given here supersedes that given 
|              under the the [Pin] keyword
|
[Series_Pin]
|Pin1      Pin2    Buffer       State
    3         4    switchA       AB      |switchA is buffer from 3 to
                                         |4
    4         3    switchAneg    AB      |Buffer from 3 to 4 is
                                         |non-symmetric
   12        13    switchA       AB      |12 connected to 13 in state AB
   12        14    switchB       AC      |12 connected to 14 in state AB
                                        

Change existing text from:
|               Model_type must be one of the following:
|               Input, Output, I/O, 3-state, Open_drain, I/O_open_drain,
|               Open_sink, I/O_open_sink, Open_source, I/O_open_source,
|               Input_ECL, Output_ECL, I/O_ECL, and Terminator.
|
to:
|               Model_type must be one of the following:
|               Input, Output, I/O, 3-state, Open_drain, I/O_open_drain,
|               Open_sink, I/O_open_sink, Open_source, I/O_open_source,
|               Input_ECL, Output_ECL, I/O_ECL, Terminator, Series,
|               Series_switch and Series_path.
|

Add text to the special usage rules:
|
|               Series             This models a non-linear series  
|                                  device e.g. a diode
|                                  [Series_Impedance]: no modes
|                                  No mode subparameter.
|                                 
|               Series_switch      This models a series device that can
|                                  can be either ON or OFF.
|                                  Mode subparameters defined under
|                                  [Series_Impedance]: modes ON, OFF
 
Add the following text after the [Model] keyword:
 
|======================================================================
|    Keyword:  [Series_Impedance]
|   Required:  Yes, for series devices
|Description:  The data points under this keyword define the V/I curves
|              measured at Pin1 for a given load at Pin2 and for a 
|              given mode of operation of the device.
|              Pin1 and Pin2 are defined under the [Series_Pins] 
|              keyword.
| Sub-Params:  R_load, Mode
|Usage Rules:  The first column contains the voltage value, and the 
|              three remaining columns hold the typical, minimum, and 
|              maximum current values.  The four entries, Voltage, 
|              I(typ), I(min), and I(max) must be placed on
|              a single line and must be separated by at least one white
|              space or tab character.
|
|              All four columns are required under these keywords.  
|              However, data is only required in the typical column.  
|              If minimum and/or maximum current values
|              are not available, the reserved word "NA" must be used. 
|              "NA" can be used for currents in the typical column, 
|              but numeric values MUST be specified for the
|              first and last voltage points on any V/I curve. 
|              Each V/I curve must have at least 2, but not more 
|              than 100, voltage points.
|
|              The R_load sub-parameter specifies the resistive load
|              between Pin2 and ground. If not specified, it is
|              assumed that Pin2 is directly connected to ground.
|
|              The Mode subparameter is required if the 
|              characteristics of the series device can be
|              configure by internal or external control logic.
|              Accepted values for Mode are:
|                 ON   : the series device is switched on
|                 OFF  : the series device is switched off
|
| Other Notes:  All measurements are relative to ground.
|
|               There is no monotonicity requirement. However
|               the model supplier should realise that it may
|               not be possible to derive a behavioural model
|               from non-monotonic data.
|
|               More than one [Series_Impedance] may be included,
|               with different values of R_load.
|               Recommended values: 0, 50 and 1kohm.
|

Add the following text somewhere after the [Rgnd] keyword:
 
|======================================================================
|   Keywords:  [Rseries], 
|              [C_series], [R_c_series],[L_c_series],
|              [L_series], [R_l_series]
|   Required:  Yes, if they exist in the device
|Description:  The data for these keywords allow the definition
|              of series R, L or C paths.   
| Usage Rules: For each of these keywords, the three columns hold the
|              typical, minimum, and maximum resistance values.  The 
|              three entries must be placed on a single line
|              and must be separated by at least one white space or tab
|              character.  All three columns are required under these
|              keywords.  However, data is only required in the typical
|              column.  If minimum and/or maximum values are not 
|              available, the reserved word "NA" must be used.
| Other Notes: This series RLC model defined to allow IBIS to model
|              simple passive devices and/or parasitics.
|              The model is:
|
|
|                    R_series
|                     +---/\/\/\/\--------------------+
|                     |                               |
|               Pin1  |   L_series  R_l_series        |  Pin2
|                 <---+---@@@@@@@@-/\/\/\/\-----------+--->
|                     |                               |
|                     |   | |                         |
|                     +---| |--@@@@@@@@@---/\/\/\/\---+
|                         | |  L_c_series  R_c_series
|                       C_series
|
|               [R_l_series] shall be defined only
|               if [L_series] exists.
|               [R_c_series] and [L_c_series] shall be defined
|               only if [C_series] exists.
|

 ***********************************************************************

ANALYSIS PATH/DATA THAT LED TO SPECIFICATION:

Bus-switches (ex: 74LVX3L383 from NS or 74CBT3383 from TI) are
increasingly being used on high-speed boards. They cannot be
modelled by IBIS 2.1. 

This BIRD allows the definition of a series device which is
connected between any two pins. If this device is a non-linear
resistor (e.g. a diode), then it can be described by an I/V
table.  

One approach suggested was to force one of the pins to Vcc or
ground, and then reuse the [Pullup] and [Pulldown] tables.
This approach will not correctly model bus-switches.

So instead, a new keword [Series_Impedance] is defined. This
has a R_load keyword. For bus-switches, R_load should be set
to a value >> 5ohms in order to allow the Ron vs. bias voltage
(as given in application notes) curves be obtained.

The author would like to suggest an extra keyword [Impedance] to
"replace", or provide an alternative, to the pullup, pulldown,
etc. This keyword would have a mode subparameter, with
values Pullup, Pulldown and Hi-state. This would allow 3 sets of
measurements be included in the IBIS file, without any fiddly
subtaracting of curves, or confusing Vcc relativity.
 
As suggested by Chris Reid, a state entry is added to allow
crossbar switches be modelled. It is expected that the simulator
detect these states, then ask the user to choose one of them.
Is this information really in the right place??

Often a bus-switch is used to provide 3.3V to 5V translation.
If this is to be modelled in IBIS, then a second model must
be generated for Vcc=4.3V. Use the [Model selector] keyword
to allow the correct buffer be chosen.

Additional series RLC paths are defined in this BIRD.
An alternative solution would be to allow an arbitrary path be 
defined, similar to Bird 36.1 prior to the amputation of connector
support.
                             
***********************************************************************

ANY OTHER BACKGROUND INFORMATION:

41   Submitted Feb 12, 1997 

41.1 Submitted Feb 17, 1997
     - Better explanation of State column
     - Define new [Series Impedance] keyword
     - Define series RLC path (to model passive device + parasitics)
 
From owner-ibis  Mon Feb 17 13:27:25 1997
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Date: Mon, 17 Feb 97 13:25:47 PST
From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9702172125.AA20977@rockie.nsc.com>
To: ibis@vhdl.org
Subject: more on roster update

IBISfans:

I am getting a lot of information from you all about updating
the respective company roster entries.

I would like you to provide information on ALL the fields if
possible. E-mail address and Web address are very important as
this roster will eventually be turned into a HTML file with
all the hypertext links in place. 

Pls also mention your involvement with IBIS using the following

Category: End-user, EDA, Model supplier

That is if all are applicable for your company. Pick the ones that
apply.

Let me know if there is any questions,

Best Regards,
Syed.
National Semiconductor Corp.
 
From owner-ibis  Tue Feb 18 05:43:41 1997
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Date: Tue, 18 Feb 1997 19:10:08 +0531
From: R Sanjeev <presi@cadence.com>
Message-Id: <199702181339.TAA22650@nakul.cadence.com>
To: ibis@vhdl.org
Subject: IBIS model from Datasheets.
X-Sun-Charset: US-ASCII

Hi everyone,

Has anyone tried to make IBIS models from Datasheets? 

How good can we expect such a model to be?

Any reply is appreciated,
Thanx
regards
presi
 
From owner-ibis  Tue Feb 18 07:59:32 1997
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Date: Tue, 18 Feb 1997 08:57:28 -0700
From: "D.C. Sessions" <dc.sessions@tempe.vlsi.com>
Organization: VLSI Technology Inc.
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To: R Sanjeev <presi@cadence.com>
CC: ibis@vhdl.org
Subject: Re: IBIS model from Datasheets.
References: <199702181339.TAA22650@nakul.cadence.com>
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R Sanjeev wrote:
> 
> Hi everyone,
> 
> Has anyone tried to make IBIS models from Datasheets?
> 
> How good can we expect such a model to be?

Not.  The problem is that the devices in the IC
output structures are very nonlinear, but the
data sheets only provide (if you're lucky) two
points on the V/I curve for one case and two
DIFFERENT points for another case.  This is
just not enough, and that'e the reason for IBIS
in the first case.

-- 
D. C. Sessions
dc.sessions@tempe.vlsi.com
 
From owner-ibis  Tue Feb 18 11:14:05 1997
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Date: Tue, 18 Feb 97 11:13 PST
From: bob@icx.com ( Bob Ross)
To: ibis@vhdl.org
Subject: IBIS MINTUTES 2/14/97

 DATE: February 18, 1997

 SUBJECT: 2/14/97 EIA IBIS Open Forum Minutes
  
 VOTING MEMBERS AND 1997 PARTICIPANTS LIST:
 AMP                            Jeff Walden
 Applied Simulation Technology  Dileep Divekar*, Norio Matsui
 Cadence Design                 C. Kumar, Don Telian
 Cypress                        Bruce Wenniger
 Hewlett Packard, EEsof         Karl Kachigan, Henry Wu
 HyperLynx                      Kellee Crisafulli
 INCASES                        (Olaf Rethmeier)
 Intel Corporation              Stephen Peters*, Arpad Muranyi*,
 Interconnectix                 Bob Ross*
 Mitsubushi                     Tam Cao
 Motorola                       Ahmed Omer*
 National Semiconductor         Syed Huq*, Cheng-Yang Kao, Mike Brisbol,
				Peter Laflamme, Kevin Smith, 
 NCR                            Dave Moxley*, Richard Mellitz
 NEC                            (Hiroshi Matsumoto)
 Quad Design/Viewlogic          Jon Powell, Chris Rokusek*
 Quantic Laboratories           (Mike Ventham)
 Texas Instruments              Thomas Fisher
 Thomson-CSF/SCTF               (Jean LeBrun)
 UniCAD Canada Ltd.             (Celso Faia)
 Veribest                       Ian Dodd*
 VLSI Technology                Harish Patel, D.C. Sessions,
 Zuken-Redac                    (John Berrie)
 
 OTHER PARTICIPANTS IN 1997:
 3M                             Fran Hart
 Actel                          Scott Schlachter
 Acuson & Free Model Foundation Richard Munden
 Alcatel                        John Fitzpatrick*
 Ansoft                         Eric Bogatin
 Apteq Design Systems           Dan FitzPatrick 
 Compaq                         Weston Beal
 Digital Equipment Corp.        Jeff Chu*
 EIA                            Patti Rusher*
 EMC                            Fabrizio Zanella
 Micron Technology              Brian Johnson                      
 Molex                          Gus Panella
 North Carolina State U.        (Michael Steer)
 S3, Inc.                       Porsh Shih, Sarathy Sribhashyam
 Ultratest International        Charles Im*
 Zeelan Technology              George Opsahl* 

 In the list above, attendees at the meeting are indicated by *.  Principal
 members or other active members who have not attended are in parentheses.
 Participants who no longer are in the organization are in square brackets.
 Note, refer to the January 10, 1997 minutes for the last listing of the
 1996 IBIS Open Forum participants.

 Upcoming Meetings:  The bridge numbers for future IBIS teleconferences are as
 follows:
     
      Date       Bridge Number    Reservation #    Passcode  
      3/7/97     (916) 356-9200   3-87786          1568848

 All meetings are 8:00 AM to 9:55 AM Pacific Time.  We try to have agendas out 
 7 days before each open forum and meeting minutes out within 7 days after.  
 When you call into the meeting, ask for the IBIS Open Forum hosted by Will 
 Hobbs and give the reservation number and passcode.
 
 NOTE: "AR" = Action Required.
 
 -------------------------------- MINUTES -------------------------------------

 INTRODUCTIONS AND MEETING QUORUM
 George Opsahl, a long time participant from Zeelan Technology, joined the 
 discussion.


 MEMBERSHIP UPDATE AND TREASURER'S REPORT
 Patti Rusher reports that Meta-Software (now Avant!) has canceled their
 membership.  IBM will not be joining.  So the membership is currently 22,
 but most bills are still outstanding.  There will be some changes due to
 changing interests and some business purchases and mergers.

 The DAC97 participation will be deducted from the 1996 funds.  Patti will
 supply Bob Ross current treasury status, but predicts about $10,500 income
 this year from membership dues.  Dave Moxely asked clarification that the
 membership rate is $500.00 this year even if the company had purchased the 
 IBIS_CHK2 source code license in the past.  The parser/membership discount 
 of $750.00 still applies for joint membership/parser licenses for the year 
 of the purchase.

 Patti needs to supply Bob the current financial information since the last
 showed $9,285 in the IBIS account.


 REVIEW OF MINUTES AND AR'S
 Minutes corrections submitted privately include the following:
    
    Minor text corrections. 
    Harish Patel spelling correction from Hrish for VLSI.  
    Sri Jandhyala removal from Texas Instruments contacts, roster,
      participants list due to responsibility change. 
    Mike Bristol from Bristi for National Semiconductor. 
    Sarathy Sribhashyam from Jarathy Jribhashyam for S3, Inc.
 

 MISCELLANY/ANNOUNCEMENTS
 None.


 PRESS AND WEB PAGE UPDATES
 Syed Huq reports miscellaneous logo and company Web page link updates on the
 EIA/IBIS Home page Poster selection (Quantic/EMC and Applied Simulation
 Technology).

 Syed also reports that "Apsim Models IC Packages" on pg. 56 of the February
 10, 1997 issue of EE Times describes Applied Simulation Technology's ApsimIBIS 
 products for package coupled-matrix LRC extraction and IBIS to Spice 
 conversions.

 
 NEW MODELS AVAILABLE, LIBRARY UPDATE
 Bob Ross reported that the Free Model Foundation has removed their models,
 but plans to have some new ones shortly.

 
 OPENS FOR NEW ISSUES
 Bob Ross for the new North Carolina State University s2ibis2 Version 1.1.


 REVIEW OF SUPERCON97 IBIS SUMMIT MEETING
 Syed Huq reported that it was a good meeting with a lot of interesting topics,
 and with over 35 people attending.

 Syed and Jon Powell will be posting the electronic copies of the
 presentations.  Bob Ross asked that he be given copies since he will
 post them in a summit97 directory where he is owner.  The minutes of the 
 meetings are also stored in that directory.  Syed and Jon can still work on 
 any possible visible copies.

 AR - Syed Huq supply Bob Ross with electronic copies.


 DESIGN AUTOMATION CONFERENCE 1997 IBIS MEETING PLANNING
 Patti Rusher asked what day the IBIS Summit meeting will be held so she can
 reserve a room.  Bob Ross suggested Thursday, June 12, 1997 because it is the
 day after the trade show portion closes.  DAC97 will be held in Anaheim, 
 California.  Patti indicated that a Poster will be needed.  Bob hopes to 
 off-load this project.
 

 INTERNATIONAL PROGRESS
 Patti Rusher reported that IBIS did not pass international standardization at 
 the last IEC TC93 US TAG meeting because only three countries agreed to work 
 on the proposal per fast track.  She is still pursuing getting five countries
 interested and expects to be successful because of some recent organizational
 changes.
 

 EIA JAPAN I/O INTERFACE MODEL PROPOSAL
 Bob Ross reported that he had just received a FAXed copy of the Electronic 
 Industries Association of Japan (EIAJ) "Standard for I/O Interface Model", 
 Draft Version 0.0.  Committee Chair, Hideki Fukuda from Hitachi, does not
 want this draft circulated to the public at this time.  Instead, he has
 proposed meeting with Bob and/or appropriate representatives of the EIA/IBIS
 Open Forum to investigate future areas of cooperation.  Bob commented that 
 that this is a well-written, Postscript formatted document.  It is a
 copyrighted document, so Bob is seeking permission to provide copies to the 
 EIA/IBIS Open Forum officers for review.
 
 Based on a quick reading, Bob provided a brief overview and his initial 
 observations.  The document was developed by a committee with representatives
 from seventeen Japanese companies. It was designed to extend IBIS Version 2.1 
 and contains the IBIS-style keyword syntax.  It has a nice partitioning 
 of a part into IC, Package, and Module Board portions.  It also has a 
 functionality level structure:  Level 1 for Signal Integrity, Level 2 for 
 Power Integrity (ground and power bounce) and Level 3 for EMI (requiring 
 shape information).

 For comparison and positioning of the proposal, Bob feels that IBIS
 Version 2.1 is Component-centric with special application to large-sized 
 Board-Level analysis.  The Japanese proposal is more IC-centric with 
 Spice-centric extensions to handle internal details including the electrical
 representation of internal metalization within an IC.  With detailed internal 
 power/ground/buffer electrical interconnection, more accurate power integrity
 analysis is possible.  One example shows two adjacent ground pins modeled
 by splitting the electrical inductances between the two pins.  This type of
 detail goes beyond what can be provided by the existing [Pin Mapping] keyword.

 Some standard Spice syntax is included to describe passive elements.  A
 set of table-based behavioral MOS transistor and diode extensions are 
 included, which Bob believes would be extensions to most, if not all
 Spices (this needs to be checked further).  This behavioral approach gives
 additional accuracy, while at the same time, does not require revealing
 actual proprietary process information.

 Hideki Fukuda has suggested a March visit, and Bob is suggesting that an
 appropriate time and location may be centered around the PCB Design
 Conference in Santa Clara, California, March 18-20, 1997.

 Based on this discussion, the sense of the Forum is to proceed with further
 discussion.  The EIA/IBIS Open Forum officers along with several other
 individuals expressed interest and volunteered to be part of the group for
 future discussions and advice:

   Bob Ross, Interconnectix
   Syed Huq, National Semiconductor
   Jon Powell, Quad Design/Viewlogic
   Dileep Divekar, Applied Simulation Technology (USA)
   Stephen Peters, Intel

 Bob will work out scheduling with Hideki Fukuda.


 ELECTRONIC DESIGN REPRINTS
 Syed Huq has received permission to post the article he published "Ease 
 System Simulation With IBIS Device Models" in the December 2, 1996 issue of
 Electronic Design on the EIA/IBIS Home page.  He is currently converting it
 to HTML format.

 Syed also raised the issue of whether the EIA/IBIS Forum should purchase
 reprints according to the following price schedule:

     100    $2010
     500    $2215
    1000    $2715
 
 They would be used as trade show handout material (particularly for DAC97)
 along with some remaining copies of the 1995 EDN IBIS article.  Patti Rusher
 indicated that at least 500 copies would be needed.  Bob Ross questioned
 whether National Semiconductor is interested in sharing the expense by
 purchasing some copies for National distribution.  Syed will find out,
 and the purchase decision will be deferred until next meeting.


 ROSTER UPDATE
 Because of the acquisitions, mergers, and changing directions and personnel
 that is characteristic of our industry, the roster.txt document needs to be 
 updated.  Syed Huq volunteered to gather the new information by sending the
 current roster.txt out on the ibis@vhdl.org reflector.  Please review your
 entries and make any changes or corrections.  Also, we would like to know
 if the EDA vendors support IBIS as a native model input (with translation
 to another model format), and whether the vendor can read IBIS Version 2.1 
 level files (versus IBIS Version 1.1).  We would like to see which silicon
 vendors produce IBIS models, and we would like to see which users also create
 or make use of IBIS models.  Anyone who is involved with IBIS in any way is
 invited to submit roster.txt information to Syed for their organization.
 Use the existing roster.txt to provide the format for your entry.  
 
 Official EIA/IBIS Open Forum Member organizations will always be retained on
 the roster.  If no response is received for non-member organizations, the 
 existing entry will be deleted.  This is our way of removing obsolete
 references.

 AR - Everyone submit to Syed Huq at huq@rockie.nsc.com any roster changes
 or new roster information.
 

 VHDL.ORG CHANGES
 Bob Ross reported that a PERL script utility submitted by John Fitzpatrick
 is now being used in the /pub/ibis/birds directory (and also in the 
 /pub/rail/roads directory) to create current index.html files.  These
 index.html files allow, by default, a nicely formatted index table of 
 all of the current IBIS BIRDs (and ROADs for RAIL) using a Browser and direct 
 access to any specific BIRD.  Bob thanked John for writing this utility.
 
 Bob also reported some other changes.  The domain name "vhdl.org" will also
 accept more relevant aliases such as eda.org, verilog.org, etc. since vhdl.org
 contains directories for many different standards groups, most of which are
 not associated with the VHDL activities.

 As a result of lax security precautions associated with a wide spread need for
 many different groups to access to vhdl.org, a hacker group break-in occurred
 into vhdl.org.  No known damage was found.  However vhdl.org was immediately 
 taken off the network as a defensive measure for several weeks.  Tighter 
 security measures were taken.  Among these were the removal of guest login 
 and direct line modem access.  Anonymous FTP and Browser access is still 
 available.  These changes are now reflected in the information provided at the
 end of these Minutes.

 Finally, Bob has moved some of the information into subdirectories to clean
 up the file structure under /pub/ibis.  One example is to move all of the 
 yearly e-mail directories under one directory "email".  Bob also wishes to
 put the documents now contained under "documents" in a directory named "docs".  
 Currently both directories will exist containing identical information until 
 some links to various documents from the EIA/IBIS home page are changed.


 IBIS COOKBOOK PROGRESS
 Chris Rokusek, who is heading this project, asked whether Stephen Peters has
 done a draft, as previously planned.  Stephen reported that he recently has
 gotten a technical writer who will start working on the Cookbook shortly.


 MODEL TEST LOAD RECOMMENDATIONS
 Bob Ross reported that a long standing AR is for vendors to provide Chris 
 Rokusek the information the preferred setups for [Rising Waveform] and 
 [Falling Waveform] data that makes the simulator algorithms most effective.  
 So far Bob and Chris have provide preferred data loads.  This information 
 will be put in the Cookbook to help guide all model developers.  


 IBIS-TO-BEHAVIORAL MODEL SUPPORT
 Syed Huq raised the issue of whether there is a need for the EIA/IBIS Open 
 Forum to pursue IBIS to Spice Behavioral translation.  This has been a 
 recent IBIS reflector topic.  Syed cited several vendors who have or have 
 had such products and again noted Applied Simulation Technologies recent 
 entry.  While some of the products are only at IBIS Version 1.1 level or 
 have been discontinued, there still exists both some coverage and also some
 opportunity for providing more utilities.


 SPICE-TO-IBIS TRANSLATOR FOR WINDOWS NT
 Ian Dodd volunteered to make available the VeriBest adaptation of s2ibis 
 compiled to work under Windows NT from the VeriBest home page.  The EIA/IBIS 
 Home page will have a direct link, as it does for the HyperLynx Visual IBIS 
 Editor.  Bob Ross endorsed the notion that free utilities available from a 
 number of commercial sites reinforces the reality that there is widespread 
 acceptance of IBIS.  This is healthy for the IBIS community as a whole.
 
 
 SPICE-TO-IBIS FROM NORTH CAROLINA STATE UNIVERSITY
 As reported on the reflector, new version of s2ibis2_v1.1 now exists on vhdl.org
 under /pub/ibis/s2ibis/s2ibis2_v1.1/s2ibis2.tar.Z for FTP downloading.  Alan
 Glaser made some polarity corrections for Spectre applications.  He was not
 able to provide an AIX executable, as in the past, because he no longer has
 access to an AIX machine.


 BIRD40 OVERSHOOT NOMENCLATURE
 Bob Ross introduced BIRD40 as just a nomenclature change of Overshoot_high
 to S_overshoot_high and Overshoot_low to S_overshoot_low for static
 overshoots in the already approved BIRD39.  
 
 BIRD40 was approved by unanimous vote.


 VERSION 3.0 FUNCTIONALITY
 Per discussion at the January 20, 1997 Summit, the issue of Version 3.0
 functionality was introduced.  Bob Ross summarized the progress since
 June, 1994 where Version 2.0 of IBIS was introduced through December, 1995
 when Version 2.1 was stabilized through several letter ballot votes to
 become ANSI/EIA-656.  During this period, there have been minimal technical
 changes.  Version 2.1 continues to be the most current version.  The Open
 Forum has already introduced (and also rejected) a number of proposals using
 the BIRD process.  
 
 These BIRDs have been approved for Version 3.0 along with their associated 
 categories:

    BIRD28.3 and BIRD37.3:  Package Model Enhancements    
    BIRD30.2:               Programmable Buffers           
    BIRD34.2:               Stored Charge Effects              
    BIRD35.3:               Multi-staged Outputs (with possible revisiting)
    BIRD39 and BIRD40:      Specification Enhancements

 The following BIRDs are still pending:

    BIRD36.1:               Electrical Board Description
    BIRD41:                 Modeling Series Switchable Devices (just issued)
 
 These BIRDs have been pending, but inactive, and relate to package and  
 connector models.  Most likely, a new BIRD will be issued for this area.

    BIRD31.3:               Mated Models
    BIRD32:                 Additional Package Model Enhancement

 All of these features are needed and constitute a rich set for defining the
 Version 3.0 functionality that will exist beyond Version 2.1 ANSI/EIA-656
 functionality.

 The only addition beyond this might be some form of switchable terminators.
 that is also to be discussed later.


 BIRD41 - MODELING SERIES SWITCHABLE DEVICES
 John Fitzpatrick introduced BIRD41 to the Committee.  Bob Ross had formalized
 the proposal as BIRD41 because there had already been sufficient reflector 
 and face-to-face discussion on this functionality, and John had issued a 
 well-formatted document, even while requesting more feedback.  The BIRD 
 process itself can now be the basis for making modifications and moving
 forward.  Bob noted that the IBIS format really does not provide the
 necessary keywords to describe the series switch devices (Quick Switch,
 CBT series, etc.) that are now being used in designs.  Series elements
 themselves are not officially defined, although there may be some vendor-
 specific ways of providing barely adequate work-arounds.
  
 BIRD41 defines a new keyword [Series Pin] and two subparameters: Series and
 Series_Switch.  Under [Series Pin], John proposes reusing the existing
 keywords ([Pulldown] and [Pullup]) and incorporated State information as 
 suggested by Chris Reid of Interconnectix.  
 
 Bob thought that relying on existing keywords for the purpose of EDA vendor
 acceptance was a bad idea since the keyword definition would have differences.
 This would cause both specification confusion and model developer confusion.
 Bob prefers new keywords with names that reflect more closely what is intended. 
 The keyword [Power Clamp] and [Gnd Clamp] appear to have retained exactly 
 their original meaning and should continue to be used, as defined.

 Arpad Muranyi questioned whether the series description should contain 
 multiple VI data to model more closely the Source to Drain characteristics
 as a function of Gate to Drain voltage that exists in FET based series 
 elements.  The alternative position is that just a simple series VI
 relationship adequately describes the characteristics needed for modeling
 the switch for analysis.  After some technical details were suggested, Bob
 suggested moving this discussion on the IBIS reflector.

 In response to a question by Stephen Peters about the scope of BIRD41, John 
 answered that it was designed to model the series switch device and also 
 model series diodes.  So BIRD41 provides two useful additions.

 Stephen also asked for clarification of the State terminology in the example.
 John responded that this column information (e.g., AB-CD) was for clarity
 and was not used.

 Bob suggested that John consider the verbal inputs given here and go ahead
 and issue BIRD41.1.


 MODELING EARLY CLAMPS IN IBIS 
 Following up on recent meeting discussions, Bob Ross suggested that if Arpad 
 Muranyi really needs the functionality of switchable input terminators soon,
 he needs to issue a BIRD.  However, this may also be a case where this
 additional functionality could be a Version 3.1 addition since Arpad is
 currently very busy.
 

 PACKAGE COMMITTEE REPORT AND BIRD36.1 - ELECTRICAL DESCRIPTION OF BOARDS
 Stephen Peters summarized the February 7, 1997 Package Committee meeting
 position that it will focus on two separate proposals:

    An Electrical Board description suitable for SIMMs, but without coupling
      information (just issued as BIRD36.1)
    
    Connector Description which includes coupled and non-coupled lines and
      describes pin pairs.

 In BIRD36.1, Bob Ross has some minor some minor editorial comments which 
 can be handled off-line.  He also questioned whether the "R10K" in the example
 was really a name of a model, or whether it was an attempt to define a
 syntax for a resistor element directly.  Stephen answered that it was a
 model name for a shunt resistor.  When questioned about including series 
 resistor elements, Stephen responded that it can be modeled using a zero 
 length transmission line segment with R.

 Regarding connector model directions, the Package Committee appears to have
 achieved a consensus on using a Matrix description where the Matrix elements
 are defined as "partial" inductances and capacitances.  Jon Powell has
 solicited sample matrix information from the connector manufacturers so that
 he can run simulations using that information and comparing the results with
 corresponding Spice representations using Spice simulations.  He is also
 working on some syntax proposals to reduce the amount of data needed for the
 descriptions.

 Stephen is scheduling the next meeting for Friday, February 21, 1997.
  

 PARSER STATUS   
 Chris Rokusek has developed an IBISCHK2 extension that generates some warning
 messages for a suspicious component values and waveform endpoint mismatch
 conditions that have been previously discussed.  These situations are
 documented as BUG5, BUG6 and BUG7.  Chris needs to know how best to provide
 the executables he has developed.  Bob Ross suggested discussing this with
 Chris off-line.
 
 AR - Chris Rokusek and Bob Ross discuss how to make the extended IBISCHK2 
 executables available.
 
 
 BUG8 - RESERVED KEYWORDS USED AS PINNUMBERS GENERATE ERRORS
 In the brief time left, Bob Ross indicated that Author Wong of Integrated
 Device Technology (IDT), had discovered a bug that is now documented as BUG8.  
 Based on a close reading of the IBIS Specification, there can be several 
 interpretations.  Regardless of the interpretation, Bob feels that BUG8 would 
 not justify an ibischk2 (and ibis_chk) revision.  Easy work-arounds exits.  No 
 decision was reached, so the discussion will be continued at the next meeting.


 NEXT MEETING:
 The next meeting is on Friday, March 7, 1996, 8:00 A.M. to 9:55 A.M.
 ==============================================================================
				       NOTES
 
 IBIS CHAIR: Bob Ross (503) 603-2523, Fax (503) 639-3469
	     bob@icx.com
	     Modeling Engineer, Interconnectix
	     10220 SW Nimbus Ave, K4, Portland, OR 97223

 VICE CHAIR: Syed Huq (408) 721-4874, Fax: (408) 721-4785
	     huq@rockie.nsc.com
	     Staff Applications Engineer, National Semiconductor, M/S A-2595
	     2900 Semiconductor Drive, Santa Clara, CA 95052
 
 LIBRARIAN:  Jon Powell (805) 988-8250, Fax: (805) 988-8259
	     jonp@qdt.com
	     Transmission-Line Products Manager, Quad Design/Viewlogic
	     1385 Del Norte Rd., Camarillo, CA 93010
 
 SECRETARY:  Vacant
 

 This meeting was conducted in accordance with the EIA Legal Guides and EIA
 Manual of Organization and Procedure.
 
 The following e-mail addresses are used:

   ibis-request@vhdl.org
       To join, change, or drop from either the IBIS Open Forum Reflector
       (ibis@vhdl.org), the IBIS Users' Group Reflector (ibis-users@vhdl.org)
       or both.  State your request.

   ibis-info@vhdl.org
       To obtain general information about IBIS, to ask specific questions
       for individual response, and to inquire about joining the EIA-IBIS
       Open Forum as a full Member.

   ibis@vhdl.org
       To send a message to the general IBIS Open Forum Reflector.  This
       is used mostly for IBIS Standardization business and future IBIS
       technical enhancements.

   ibis-users@vhdl.org
       To send a message to the IBIS Users' Group Reflector.  This is 
       used mostly for IBIS clarification, current modeling issues, and
       general user concerns.

   ibischk-bug@vhdl.org
       To report ibischk2 parser bugs.  The Bug Report Form Resides on
       vhdl.org in /pub/ibis/bugs/bugform.txt along with reported bugs.

 Information on IBIS technical contents, IBIS participants, and actual
 IBIS models are available on the IBIS Home page found by selecting the
 Electronic Information Group under:

   http://www.eia.org

 Check the pub/ibis directory on vhdl.org for more information on previous 
 discussions and results.  You can get on via ftp anonymous, or send an e-mail
 request to the automatic archive server, archive@vhdl.org.
 
 "IBIS Spoken Here" placards are available from Jon Powell (jonp@qdt.com) for 
 use at trade shows.
 ==============================================================================

 
From owner-ibis  Tue Feb 18 12:30:27 1997
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Date: Tue, 18 Feb 1997 15:26:41 -0800
To: ibis@vhdl.org
From: Eric Blomberg <ericb@cadence.com>
Subject: ibis tutorials

Greeting
Has anyone come across an end-user IBIS tutorial which helps set
expectations on  measured results vs simulated. Something which
explains by examples and causes (ie fab line changed, bias currents lowered ...)
why measured results don't match predictions. Should be suitable for folks
who thought of themselves as logic/PCB designers who, after learning a tool they
might not have wanted, now have to deal with waveforms. A non-partisan source
would be nice.

Thanks
Eric Blomberg
Cadence Design

 
From owner-ibis  Tue Feb 18 17:36:40 1997
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Date: Tue, 18 Feb 97 16:56:00 PST
From: Will Hobbs <Will_Hobbs@ccm.jf.intel.com>
Message-ID: <Tue, 18 Feb 97 17:35:03 PST_9@ccm.jf.intel.com>
To: owner-ibis@vhdl.vhdl.org, ibis@vhdl.org
Subject: Re: ibis tutorials


Text item: 

Eric,

I am not aware of an article like that. There are a couple of articles that 
discuss various other IBIS, including a "Cookbook," which is a how-to guide for 
IBIS model developers, and an EDN article on IBIS V1.1 and how it works. These 
don't address your concern, but may be interesting to read anyway. They can be 
found on the ibis web page on eia.org.

However, if you have direct experience that could contribute to such an article,
I would wager you could get it published, and achieve a small degree of fame and
fortune while performing a service for the SI community. I'd also wager a number
of others on the IBIS reflector list would be interested in collaborating on 
such an article.

Will Hobbs
Intel Corp.

Greeting
Has anyone come across an end-user IBIS tutorial which helps set 
expectations on  measured results vs simulated. Something which 
explains by examples and causes (ie fab line changed, bias currents 
lowered ...)
why measured results don't match predictions. Should be suitable for folks 
who thought of themselves as logic/PCB designers who, after learning
a tool they
might not have wanted, now have to deal with waveforms. A non-partisan source 
would be nice.

Thanks
Eric Blomberg
Cadence Design

Text item: External Message Header

The following mail header is for administrative use
and may be ignored unless there are problems.

***IF THERE ARE PROBLEMS SAVE THESE HEADERS***.

Subject: ibis tutorials
From: Eric Blomberg <ericb@cadence.com>
To: ibis@vhdl.org
Date: Tue, 18 Feb 1997 15:26:41 -0800
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From owner-ibis  Wed Feb 19 09:06:20 1997
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Date: Wed, 19 Feb 1997 11:55:06 -0500
From: "Real Mongrain Jr." <mongrain@poster.cae.ca>
Organization: CAE Electronics Ltd, Montreal, Canada
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To: ibis@vhdl.org
Subject: Simulation tools
Content-Type: text/plain; charset=us-ascii
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Hi everyone,

I want to know if anybody have tried many different signal integrity
simulation tools? (IBIS compatible)
Anobody compared SigNoise with XTK? Which one is the best?
Is there other great tools and what are their big advantage?

Any comments will be very helpful.

Regards,
-- 
===============================================================
 Real Mongrain Jr.	MailTo:mongrain@cae.ca
 CAE Electronics Ltd	http://www.cae.ca
 8585 Cote de Liesse
 St-Laurent, Qc, Canada, H4T 1G6
 Tel.:(514) 341-6780 ext.3218	 fax.:(514) 734-5618
===============================================================
 
From owner-ibis  Wed Feb 19 12:41:19 1997
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Message-Id: <m0vxIos-000GkGC@icx.com>
Date: Wed, 19 Feb 97 12:40 PST
From: bob@icx.com ( Bob Ross)
To: ibis-users@vhdl.org, ibis@vhdl.org, mongrain@poster.cae.ca
Subject: Re:  Simulation tools

To everyone:

The IBIS reflectors are NOT to be used for discussing/
commenting on/comparing COMMERCIAL products of Silicon
Vendors, CAE vendors, Connector Vendors, or Users in
any manner whatsoever.

The IBIS Open Forum consists of many competing companies
working together based on common interests, while at the
same time representing the important positions of individual 
companies (most of which are commercial based).  If we start
bickering who is best, we will destroy all cooperation.

Real's questions are fair, however.  If you which to respond,
please respond in private directly to Real.

Best Regards,
Bob Ross
IBIS Open Forum Chair
Phone (503) 603-2523, Fax (503) 639-3469
bob@icx.com
Interconnectix, 10220 S.W. Nimbus Ave., K4, Portland, OR 97223



> Date: Wed, 19 Feb 1997 11:55:06 -0500
> From: "Real Mongrain Jr." <mongrain@poster.cae.ca>
> To: ibis@vhdl.org
> Subject: Simulation tools


> Hi everyone,

> I want to know if anybody have tried many different signal integrity
> simulation tools? (IBIS compatible)
> Anobody compared SigNoise with XTK? Which one is the best?
> Is there other great tools and what are their big advantage?

> Any comments will be very helpful.

> Regards,
> -- 
> ===============================================================
>  Real Mongrain Jr.	MailTo:mongrain@cae.ca
>  CAE Electronics Ltd	http://www.cae.ca
>  8585 Cote de Liesse
>  St-Laurent, Qc, Canada, H4T 1G6
>  Tel.:(514) 341-6780 ext.3218	 fax.:(514) 734-5618
> ===============================================================


 
From owner-ibis  Tue Feb 25 09:31:42 1997
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Date: Tue, 25 Feb 97 09:31 PST
From: bob@icx.com ( Bob Ross)
To: ibis-users@vhdl.org, ibis@vhdl.org
Subject: IBIS SUMMIT MEETING

To All:

The IBIS Summit meeting presentations are now stored on vhdl.org
under /pub/ibis/summits/summit97.  Compressed versions of the
presentations are contained in the z97 and zip97 subdirectories
for downloading.  Refer to 00readme.txt for more details.

Bob Ross
Interconnectix
 
From owner-ibis  Wed Feb 26 17:02:08 1997
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Date: Wed, 26 Feb 97 17:01:03 PST
From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9702270101.AA04670@rockie.nsc.com>
To: ibis@vhdl.org
Subject: New IBIS models from National - Interface products

IBIS fans,

National Semiconductor has released the following Interface
IBIS model. These are available from our web site at:

    http://www.national.com/models/ibis/interface.html

ds90lv031tm.ibs		3.3V LVDS Quad Differential Driver
ds90lv032tm.ibs		3.3V LVDS Quad Differential Receiver

National Semiconductor provides IBISv1.1 and IBISv2.1 models
from various product lines.

National Semiconductor will provide system-on-a-chip
solutions for our key data highway strategic partners, exploiting
our analog expertise as a starting point for forward integration.

Regards,
Syed
National Semiconductor Corp.
 
