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Date: Thu, 09 Jan 1997 12:01:32 +0100
From: John V Fitzpatrick <John.Fitzpatrick@ln.cit.alcatel.fr>
Organization: Alcatel Telecom, Lannion, France
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Happy New Year,

IBIS cannot correctly model series devices. This isn't
much of a problem for simple passive devices (R,L,C) or diodes.
However, it's a major handicap for bus-switches (e.g. 74CBT range
from Texas Inst). 

I've seen seen this feature on the wish-list, but am not aware
of any proposals to handle it.

So here's my suggestion for extending IBIS to model series switches. 
It requires 3 new keywords and one new modeltype.


1) Define a new keyword [Series Pin]
   This keyword is at the same level as, say, [Diff Pin]

   [Series Pin]
   |Pin1      Pin2    Buffer   
       3         4    switchA     |switchA is buffer from 3 to 4
       4         3    switchAneg  |Buffer from 3 to 4 is non-symmetric
      12        13    switchA
      12        14    switchB     |12 can be routed to 13 or 14
         

   The two pins of the series element are identified, along with
   the the associated series buffer. This buffer corresponds
   to measurements made at Pin1.

   If the buffer is not symmetric, a different buffer may be
   specified with the pin order swapped.

   In the case of a crossbar switch, all possible series
   connections must be listed. IBIS contains no information
   concerning how or when one of the connections is selected.  

   The buffer name given here supersedes that given under the
   [Pin] keyword. 

2) Define new model type SERIES-SWITCH
   Define new keywords [Series] and [Series OFF]

   Four curves are obligatory: [Pulldown]
                               [GND Clamp]
                               [Series]
                               [Series OFF]

   [GND Clamp] and [Series OFF] are measured for switch OFF.
   [Pulldown] and [Series] are measured for switch ON.

   [GND Clamp] + [Pulldown] are standard measurements, made at one pin.
   The other pin, identified under the [Series Pin] keyword, 
   is assumed connected to ground.        
 
   [Series] and [Series OFF] are through measurements ie between
   the two pins.

   The [Ramp] keyword is also required. The test load must
   include a voltage source.

   This gives enough information to model a switchable non-linear
   resistor.

   We could also define a model type SERIES which would not
   be switchable: only [Pulldown] and [Series] needed in this case.

   To allow for series frequency-dependent devices, additional
   R,L,C paths might be defined.


Looking forward to your feedback,
Regards,
John
-- 
John Fitzpatrick   <John.Fitzpatrick@ln.cit.alcatel.fr>    
Alcatel Telecom, 4 rue de Broglie, 22304 Lannion, France
Tel: +33(0)2.96.04.79.33  Fax: +33(0)2.96.04.85.09

From owner-ibis  Tue Jan 14 05:09:32 1997
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From: "Brian C. Wadell" <bcwadell@guidedwave.com>
To: "'ibis@vhdl.org'" <ibis@vhdl.org>
Subject: IBIS to SPICE
Date: Tue, 14 Jan 1997 08:03:15 -0500
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I have been writing a script to convert IBIS files into SPICE files.  So far it looks doable.  I've converted the clamp and the package and Ccomp.

I'm not quite certain what the meaning of the pullup and pulldown should be with respect to the edge rate specified in the IBIS file.  My thought was to create a PWL edge out of the edge rates and drive a voltage-controlled resistance having the pulldown characteristics with that voltage.  However, the voltage in the IBIS pulldown table seems to be the voltage across the pulldown resistance/conductance?  

I've read the cookbook and it doesn't answer my question.

Has anyone got any experience or advice on this or can you refer me to an IBIS document?  I'm pretty sure my question is just a matter of understanding the definitions better.  

Regards,

Brian C. Wadell
Guided Wave Solutions

From owner-ibis  Tue Jan 14 08:34:55 1997
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To: owner-ibis@vhdl.vhdl.org, ibis@vhdl.org
Subject: Re: IBIS to SPICE


Text item: 

Brian,

I would like to send you something, but I don't want to send it to the 
reflector.  Could you please give me your direct EMAIL address?

Arpad Muranyi
Intel Corporation
arpad_muranyi@ccm.fm.intel.com
(916) 356-2558
=========================================================================

I have been writing a script to convert IBIS files into SPICE files.  So =
far it looks doable.  I've converted the clamp and the package and =
Ccomp.

I'm not quite certain what the meaning of the pullup and pulldown should =
be with respect to the edge rate specified in the IBIS file.  My thought =
was to create a PWL edge out of the edge rates and drive a =
voltage-controlled resistance having the pulldown characteristics with =
that voltage.  However, the voltage in the IBIS pulldown table seems to =
be the voltage across the pulldown resistance/conductance? =20

I've read the cookbook and it doesn't answer my question.

Has anyone got any experience or advice on this or can you refer me to =
an IBIS document?  I'm pretty sure my question is just a matter of =
understanding the definitions better. =20

Regards,

Brian C. Wadell
Guided Wave Solutions

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From owner-ibis  Tue Jan 14 09:19:45 1997
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Date: Tue, 14 Jan 97 09:21 PST
From: chris@icx.com ( Chris Reid)
To: ibis@vhdl.org
Subject: Modelling bus switches and other series elements

Hello and happy new year everyone.
I'm glad to have the reflector finally working again.

John Fitzpatrick wrote about modeling series elements in IBIS.
I believe there is a need that IBIS should address on this
issue.  However, thinking about it from a simulation vendor's
point of view I think the proposal needs some additional
features.

When the simulation tool builds an electrical model for
a particular network it must include all connections through
series elements.  Thus if a large switch is encountered
with many branches then a lot of extra information must be
included in the electrical model.  If most of that information
is wasted because, say, only one path through the switch
is actually connected at any one time, then our users will
not be pleased waiting a long time for a simulation result
that should have taken only seconds.

I think John's proposal is good for connections that always
exist, but not, actually, for switches.  It needs a bit
more for that.

Chris Reid


From owner-ibis  Tue Jan 14 09:43:22 1997
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To: ibis@vhdl.org
Subject: Modelling bus switches and other series elements
Date: Tue, 14 Jan 1997 09:42:07 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>



Hello John:

   Happy new year to you also!  I read your proposal, and I was wondering
why you felt the [Pulldown] keyword was needed, and why only the
[GND Clamp] keyword was required (and not both [GND Clamp and [PWR Clamp] 
keywords).  If you are trying to describe a "series pass transistor" 
type of switch, then I think one waveform describing the switch when
"on, along with the [GND clamp] and [PWR clamp] keywords for when the switch
is off would suffice.  Could you explain more why you chose the keywords
you did?

               Regards,
               Stephen Peters
               Intel Corp.



Happy New Year,

IBIS cannot correctly model series devices. This isn't
much of a problem for simple passive devices (R,L,C) or diodes.
However, it's a major handicap for bus-switches (e.g. 74CBT range
from Texas Inst). 

I've seen seen this feature on the wish-list, but am not aware
of any proposals to handle it.

So here's my suggestion for extending IBIS to model series switches. 
It requires 3 new keywords and one new modeltype.


1) Define a new keyword [Series Pin]
   This keyword is at the same level as, say, [Diff Pin]

   [Series Pin]
   |Pin1      Pin2    Buffer   
       3         4    switchA     |switchA is buffer from 3 to 4
       4         3    switchAneg  |Buffer from 3 to 4 is non-symmetric
      12        13    switchA
      12        14    switchB     |12 can be routed to 13 or 14
         

   The two pins of the series element are identified, along with
   the the associated series buffer. This buffer corresponds
   to measurements made at Pin1.

   If the buffer is not symmetric, a different buffer may be
   specified with the pin order swapped.

   In the case of a crossbar switch, all possible series
   connections must be listed. IBIS contains no information
   concerning how or when one of the connections is selected.  

   The buffer name given here supersedes that given under the
   [Pin] keyword. 

2) Define new model type SERIES-SWITCH
   Define new keywords [Series] and [Series OFF]

   Four curves are obligatory: [Pulldown]
                               [GND Clamp]
                               [Series]
                               [Series OFF]

   [GND Clamp] and [Series OFF] are measured for switch OFF.
   [Pulldown] and [Series] are measured for switch ON.

   [GND Clamp] + [Pulldown] are standard measurements, made at one pin.
   The other pin, identified under the [Series Pin] keyword, 
   is assumed connected to ground.        
 
   [Series] and [Series OFF] are through measurements ie between
   the two pins.

   The [Ramp] keyword is also required. The test load must
   include a voltage source.

   This gives enough information to model a switchable non-linear
   resistor.

   We could also define a model type SERIES which would not
   be switchable: only [Pulldown] and [Series] needed in this case.

   To allow for series frequency-dependent devices, additional
   R,L,C paths might be defined.


Looking forward to your feedback,
Regards,
John
-- 
John Fitzpatrick   <John.Fitzpatrick@ln.cit.alcatel.fr>    
Alcatel Telecom, 4 rue de Broglie, 22304 Lannion, France
Tel: +33(0)2.96.04.79.33  Fax: +33(0)2.96.04.85.09

From owner-ibis  Tue Jan 14 17:02:53 1997
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From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9701150103.AA27664@rockie.nsc.com>
To: ibis@vhdl.org
Subject: Agenda for Jan20th IBIS Summit Meeting
Cc: huq@rockie.nsc.com


		Agenda for Jan20th 1997 IBIS Summit
	
		Place:  Westin Hotel
       		(Santa Cruz conference Room - 1st floor)
       		5101 Great America Parkway
       		Santa Clara, California
       		(408)986-0700	
	
		Date:  Jan 20th Monday(one day)
		Time:  8am - 5pm


Time		Topic				Presentor
---------------------------------------------------------------------
8:00		Continental Breakfast		All

8:30		- Sign-In			All
		- Intros of Attendees	 	Huq
		- Miscellany/Announcements	Huq
		- Open for New Issues		All

8:50		Review of summit Agenda		Huq	

9:00		ANSI/EIA-656(IBIS)overview	Huq
		- Web site at EIA
		- ftp site at vhdl.org
		- Currect activities
		- EIA Membership 
		
9:30		Problems representing ABT	Powell
		Models using IBIS		
						
10:00		IBIS modeling at Alcatel	Fitzpatrick

10:30		Overview of Visiual IBIS 	Crisafulli
		Editor for Windows, and 
		Solicitation of Ideas for 
		Version 2.0"

11:00		BIRD 36: Elec. Descrp 		Peters

12:00		Lunch

1:00		BIRD 36: Elec. Descrp Contd.....
		
		Other items
		  -DAC 97 IBIS meeting plans
		  -IBISv3.0 ratification
		  -s2ibis2
		  -cookbook for v2.1
		Next Teleconference schedule	Huq

5:00		Meeting adjourned



From owner-ibis  Tue Jan 14 18:56:53 1997
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From: "Brian C. Wadell" <bcwadell@guidedwave.com>
To: "'John V Fitzpatrick'" <John.Fitzpatrick@ln.cit.alcatel.fr>
Cc: "'ibis@vhdl.org'" <ibis@vhdl.org>
Subject: RE: IBIS to SPICE
Date: Tue, 14 Jan 1997 22:00:19 -0500
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John,

Thank you for replying.  I have defined the voltage controlled resistors AOK in the manner you have described.  Maybe it is a simple point I am stuck on.  What voltage should I drive the voltage controlled resistor control line with?  

My first thought was to drive it with a ramp having the rise time specified in the IBIS file.  But then when I think about it a bit more I think that the voltage controlled resistor is also controlled by the voltage from VCC (or ground for the pulldown R) to the output voltage (Ccomp node).  The table of (V, I) leads me to this question because of the range of voltages shown (2*Vcc, I think) which doesn't seem relevant for an internally generated ramp.  

I'm certain this is just a matter of my own lack of understanding of the IBIS model.  Thank you for taking the time to reply.

Regards,

BCW
Guided Wave Solutions

----------
From: 	John V Fitzpatrick[SMTP:John.Fitzpatrick@ln.cit.alcatel.fr]
Sent: 	Tuesday, January 14, 1997 9:46 AM
To: 	Brian C. Wadell
Subject: 	Re: IBIS to SPICE

Brian,
 
This is a good approach. I don't understand your problem. The
V-controlled resistances can be defined directly by the IBIS tables. 

For the pulldown case, your PWL will
be at 0V, so the V-controlled resistance will correspond
to the IBIS table directly. Similarly for pullup, your PWL
will be at Vcc, do you can use the Vcc-referenced IBIS table directly.

During the transition time of the PWL, you just hope for the best -
it's usually good enough. This is what I've seen from models I've
built (manually) in PSpice using IBIS data.

Regards,
John

> I'm not quite certain what the meaning of the pullup and pulldown should be with respect to the edge rate specified in the IBIS file.  My thought was to create a PWL edge out of the edge rates and drive a voltage-controlled resistance having the pulldown characteristics with that voltage.  However, the voltage in the IBIS pulldown table seems to be the voltage across the pulldown resistance/conductance?
 
-- 
John Fitzpatrick   <John.Fitzpatrick@ln.cit.alcatel.fr>    
Alcatel Telecom, 4 rue de Broglie, 22304 Lannion, France
Tel: +33(0)2.96.04.79.33  Fax: +33(0)2.96.04.85.09




From owner-ibis  Wed Jan 15 01:22:07 1997
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To: ibis@vhdl.org
Cc: "Stephen Peters chris@icx.com ( Chris Reid)" <sjpeters@ichips.intel.com>
Subject: Re: Modelling bus switches and other series elements
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Thanks to Chris and Stephen for your comments,

Hopefully we'll be able to discuss this topic on Monday.

Below is a clarification of some points:


1) Path info

I agree with Chris when he says that extra information is needed
within IBIS to reduce the number of potential simulations. But this
means giving more than an electrical description of the component;
a functional description would be necessary, something IBIS doesn't
do (yet!).

The proposal I sent would require all possible series paths to be 
listed. This, in my opinion, is a minimum requirement. (With this,
a simulator could ask the user to select the paths to simulate).
A further  optimisation might be to group series paths together to 
indicate to the simulator that if one path is selected, then all 
paths are selected.

What do simulator companies do today to model series devices
such as bus-switches?


2) Keywords

Regarding the choice of keywords, my original idea was to use
only the keywords [GND Clamp] and [Pulldown]. [GND Clamp] would
be for switch that is OFF, [Pulldown] for a switch that is ON.
To measure [Pulldown], one side of the series device would be 
connected to GND. 

Optionally, a [PWR Clamp] keyword could be used, but I don't like
this keyword !! In my opinion, it is redundant, but that's 
another debate.

Instead, the proposal I make is more general, based somewhat
on network-analysis approach:
      - one input impedance measurement per operating state
      - one through (thru) impedance measurement per op. state

So for a switch, which can be ON or OFF, there are two
operating states => 4 measurement curves.

I think this is enough to describe fully the device. What is the
opinion of simultor companies?

Aside:
      For a standard buffer (one-port), only input impedances
      are measured. There are, at most, three operating states:
      HI-Z, LO and HI => 3 measurement curves.
      IBIS defines 4 curves, hence my view that one curve is 
      redundant.


Regards,
John

-- 
John Fitzpatrick   <John.Fitzpatrick@ln.cit.alcatel.fr>    
Alcatel Telecom, 4 rue de Broglie, 22304 Lannion, France
Tel: +33(0)2.96.04.79.33  Fax: +33(0)2.96.04.85.09


Original proposal:

IBIS cannot correctly model series devices. This isn't
much of a problem for simple passive devices (R,L,C) or diodes.
However, it's a major handicap for bus-switches (e.g. 74CBT range
from Texas Inst). 

I've seen seen this feature on the wish-list, but am not aware
of any proposals to handle it.

So here's my suggestion for extending IBIS to model series switches. 
It requires 3 new keywords and one new modeltype.


1) Define a new keyword [Series Pin]
   This keyword is at the same level as, say, [Diff Pin]

   [Series Pin]
   |Pin1      Pin2    Buffer   
       3         4    switchA     |switchA is buffer from 3 to 4
       4         3    switchAneg  |Buffer from 3 to 4 is non-symmetric
      12        13    switchA
      12        14    switchB     |12 can be routed to 13 or 14
         

   The two pins of the series element are identified, along with
   the the associated series buffer. This buffer corresponds
   to measurements made at Pin1.

   If the buffer is not symmetric, a different buffer may be
   specified with the pin order swapped.

   In the case of a crossbar switch, all possible series
   connections must be listed. IBIS contains no information
   concerning how or when one of the connections is selected.  

   The buffer name given here supersedes that given under the
   [Pin] keyword. 

2) Define new model type SERIES-SWITCH
   Define new keywords [Series] and [Series OFF]

   Four curves are obligatory: [Pulldown]
                               [GND Clamp]
                               [Series]
                               [Series OFF]

   [GND Clamp] and [Series OFF] are measured for switch OFF.
   [Pulldown] and [Series] are measured for switch ON.

   [GND Clamp] + [Pulldown] are standard measurements, made at one pin.
   The other pin, identified under the [Series Pin] keyword, 
   is assumed connected to ground.        
 
   [Series] and [Series OFF] are through measurements ie between
   the two pins.

   The [Ramp] keyword is also required. The test load must
   include a voltage source.

   This gives enough information to model a switchable non-linear
   resistor.

   We could also define a model type SERIES which would not
   be switchable: only [Pulldown] and [Series] needed in this case.

   To allow for series frequency-dependent devices, additional
   R,L,C paths might be defined.


Looking forward to your feedback,
Regards,
John
-- 
John Fitzpatrick   <John.Fitzpatrick@ln.cit.alcatel.fr>    
Alcatel Telecom, 4 rue de Broglie, 22304 Lannion, France
Tel: +33(0)2.96.04.79.33  Fax: +33(0)2.96.04.85.09

From owner-ibis  Wed Jan 15 05:39:44 1997
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From: mellitz@eagle.ColumbiaSC.NCR.COM
>From: mellitz@eagle (Richard.Mellitz)
Content-Type: text
Message-Id: <9701150842.ZM22206@eagle>
Date: Wed, 15 Jan 1997 08:42:20 -0500
In-Reply-To: John V Fitzpatrick <John.Fitzpatrick@ln.cit.alcatel.fr>
        "Re: Modelling bus switches and other series elements" (Jan 15,  9:53am)
References: <199701141741.JAA20173@ichips.intel.com> 
	<32DC9AFE.52BFA1D7@ln.cit.alcatel.fr>
X-Mailer: Z-Mail (2.1.4 02apr93)
To: ibis@vhdl.org
Subject: Re: Modelling bus switches and other series elements
Cc: "Stephen Peters chris@icx.com ( Chris Reid)" <sjpeters@ichips.intel.com>

On Jan 15,  9:53am, John V Fitzpatrick wrote:
> Subject: Re: Modelling bus switches and other series elements
> Thanks to Chris and Stephen for your comments,
> 
> Hopefully we'll be able to discuss this topic on Monday.
> 
> Below is a clarification of some points:
> 
> 
> 1) Path info
> 
> I agree with Chris when he says that extra information is needed
> within IBIS to reduce the number of potential simulations. But this
> means giving more than an electrical description of the component;
> a functional description would be necessary, something IBIS doesn't
> do (yet!).
> 
> The proposal I sent would require all possible series paths to be 
> listed. This, in my opinion, is a minimum requirement. (With this,
> a simulator could ask the user to select the paths to simulate).
> A further  optimisation might be to group series paths together to 
> indicate to the simulator that if one path is selected, then all 
> paths are selected.
> 
> What do simulator companies do today to model series devices
> such as bus-switches?
> 
As a user I don't find this to be a big problem.  We use CBTs all the time.
IBIS is only a starting point to the simulation process.  In the simulation 
language I hard code in the switch instances I need and selectively 
iterate runs. Our application uses the CBTs as mostly crossbars with logically
a limited number of configs.

Richard Mellitz, NCR

From owner-ibis  Wed Jan 15 07:18:26 1997
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From: "Ezra D. Hall" <ehall@btv.ibm.com>

---

Please add me to the EIA IBIS Open Forum distibution list.

Thanks,
       Ezra Hall  (ehall@btv.ibm.com)
-- 
+-------------------------------+-----------------------------+
| Ezra D.B. Hall                | Internet: ehall@btv.ibm.com |
| IBM Microelectronics          |       VM: ehall at btvlabvm |
| D/G8G B/863-2                 |    Phone: (802) 769-7329    |
| 1000 River Street             |      FAX: (802) 769-6800    |
| Essex Junction, VT 05452-4299 |                             |
+-------------------------------+-----------------------------+



From owner-ibis  Wed Jan 15 08:28:18 1997
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From: Arpad Muranyi <Arpad_Muranyi@ccm.fm.intel.com>
Message-ID: <Wed, 15 Jan 97 08:22:16 PST_8@ccm.fm.intel.com>
To: John.Fitzpatrick@ln.cit.alcatel.fr
cc: ibis@vhdl.org
Subject: Re[2]: IBIS to SPICE


Text item: 

Brian,

I would suggest that you drive that VCR with the voltage between the output node
and the ramp node.  However, I would suggest not to use VCRs (as I stated to you
in my private EMAIL to you).  A Thevenin or Norton circuit with voltage 
controlled current or voltage source (and some tricks) will work better.

Arpad
================================================================================

John,

Thank you for replying.  I have defined the voltage controlled resistors =
AOK in the manner you have described.  Maybe it is a simple point I am =
stuck on.  What voltage should I drive the voltage controlled resistor =
control line with? =20

My first thought was to drive it with a ramp having the rise time =
specified in the IBIS file.  But then when I think about it a bit more I =
think that the voltage controlled resistor is also controlled by the =
voltage from VCC (or ground for the pulldown R) to the output voltage =
(Ccomp node).  The table of (V, I) leads me to this question because of =
the range of voltages shown (2*Vcc, I think) which doesn't seem relevant =
for an internally generated ramp. =20

I'm certain this is just a matter of my own lack of understanding of the =
IBIS model.  Thank you for taking the time to reply.

Regards,

BCW
Guided Wave Solutions

----------
From:      John V Fitzpatrick[SMTP:John.Fitzpatrick@ln.cit.alcatel.fr]
Sent:      Tuesday, January 14, 1997 9:46 AM
To:      Brian C. Wadell
Subject:      Re: IBIS to SPICE

Brian,
=20
This is a good approach. I don't understand your problem. The
V-controlled resistances can be defined directly by the IBIS tables.=20

For the pulldown case, your PWL will
be at 0V, so the V-controlled resistance will correspond
to the IBIS table directly. Similarly for pullup, your PWL
will be at Vcc, do you can use the Vcc-referenced IBIS table directly.

During the transition time of the PWL, you just hope for the best -
it's usually good enough. This is what I've seen from models I've
built (manually) in PSpice using IBIS data.

Regards,
John

> I'm not quite certain what the meaning of the pullup and pulldown =
should be with respect to the edge rate specified in the IBIS file.  My =
thought was to create a PWL edge out of the edge rates and drive a =
voltage-controlled resistance having the pulldown characteristics with =
that voltage.  However, the voltage in the IBIS pulldown table seems to =
be the voltage across the pulldown resistance/conductance?
=20
--=20
John Fitzpatrick   <John.Fitzpatrick@ln.cit.alcatel.fr>   =20
Alcatel Telecom, 4 rue de Broglie, 22304 Lannion, France
Tel: +33(0)2.96.04.79.33  Fax: +33(0)2.96.04.85.09

Text item: External Message Header

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From owner-ibis  Wed Jan 15 09:00:17 1997
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Date: Wed, 15 Jan 97 09:01 PST
From: chris@icx.com ( Chris Reid)
To: ibis@vhdl.org
Subject: Modelling bus switches and other series elements

Good morning,

Maybe instead of a syntax that defines all possible connections
simultaneously (making it look like there are many simultaneous
paths) we should find one that clearly calls out the different
switch states.  Something like:

[State] StateName1
| Pin   Pin   Model
   1     3    SMC

[State] StateName2
|  Pin   Pin   Model
    1     5    SMCx

I'm not suggesting this as the actual syntax, only as an example
to explain my concept.  The simulator must be told witch state of
the switch to use in any particular simulation.

Of course, if the goal is to model the transition between states
this is not helpful.  However, users of our system have not asked
for that capability, but they have done things like Richard Mellitz
suggests, swapping out one model for another, manually.

This syntax would give the user a way to specify the different
switch states.  It would be up to the simulator to allow the
user to specify whitch state to use when.

The same, or a degenerate syntax without the [State] specified
could be used for series elements that are not switchable.

Chris Reid


From owner-ibis  Wed Jan 15 18:25:24 1997
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Date: Wed, 15 Jan 97 18:25:46 PST
From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9701160225.AA00577@rockie.nsc.com>
To: ibis@vhdl.org
Subject: Meeting minutes Jan10th 1997
Cc: huq@rockie.nsc.com

 DATE: January15th, 1997

 SUBJECT: 1/10/97 EIA IBIS Open Forum Minutes
  
 VOTING MEMBERS AND 1996 PARTICIPANTS LIST:
 AMP                            Hank Herrmann, Tim Minnick, Russ Moser,
				Ray Ziesse, Jeff Walden
 Applied Simulation Technology  Dileep Divekar*, Norio Matsui, Antonis Orphanou
    (formerly Contec)
 Cadence Design                 C. Kumar
 Cypress                        Bruce Wenniger
 Hewlett Packard, EEsof         Karl Kachigan, Henry Wu
 HyperLynx                      Kellee Crisafulli
 INCASES                        Olaf Rethmeier, Ralf Bruening
 Intel Corporation              Stephen Peters, Will Hobbs, Arpad Muranyi*,
				John Keifer, Aaron Tang, Duane Quiet,
				[Donald Telian], Jim Kruchowski
 Interconnectix                 Bob Ross, Chris Reid
 Meta-Software                  (Sanjay Gangal)
 Mitsubushi                     Tam Cao, Hoang Nguyen
 Motorola                       Ahmed Omer*
 National Semiconductor         Syed Huq*,  Chune-Sin Yeh,
 NCR (formerly ATT-GIS)         Dave Moxley, Richard Mellitz
 NEC                            (Hiroshi Matsumoto),
 Quad Design                    Jon Powell*, Chris Rokusek
 Quantic Laboratories           Mike Ventham
 Texas Instruments              Roger Cline, Ben Andresen, Sri Jandhyala,
				Tareq Shahwan, Dan Phipps
 Thomson-CSF/SCTF               (Jean LeBrun)
 UniCAD Canada Ltd.             Celso Faia
 Veribest                       Ian Dodd, David Wiens
 VLSI Technology                Dick Ulmer, Sung Oh, Swami Gangadharan,
				Daniel Kim, Tom Dockery, D.C. Sessions,
				Hrish Patel
 Zuken-Redac                    (John Berrie)
 
 OTHER PARTICIPANTS IN 1996:
 3M                             Fran Hart, George Hare
 Actel                          Scott Schlachter
 Alcatel                        John Fitzpatrick
 Altera                         Vadim von Brzeski
 Apteq Design System            Dan FitzPatrick 
 Compaq                         Mark Leonard
 Digital Equipment Corp.        Jeff Chu*
 EIA                            Patti Rusher
 IC Works                       Eric Chen
 Mentor Graphics                Kim Owen
 Micron Technology              Brian Johnson                       
 MicroSim                       Ralph Perez
 Molex                          Gus Panella*
 North Carolina State U.        (Michael Steer)
 Oki Semiconductor              Tom Chao
 Philips Semiconductor          Mike Magdaluyo
 Rockwell Collins               Thomas Thurman
 S3, Inc.                       Sarathy Sribhashyam, Phap Duong    
 Seimans Nixdorf                Arnaud Lacariere
 Symmetry                       Andy Hughes
 Tektronix, Inc.                Brock Hannibal
 TRW & Free Model Foundation    Robert Harrison
 VTC, Inc.                      Bob Ward
 Zeelan Technology              George Opsahl

 In the list above, attendees at the meeting are indicated by *.  Principle
 members or other active members who have not attended are in parentheses.
 
 Upcoming Meetings:
     
      1/20/97    FACE TO FACE MEETING

 All meetings are 8:00 AM to 9:55 AM Pacific Time.  We try to have agendas out 
 7 days before each open forum and meeting minutes out within 7 days after.  
 When you call into the meeting, ask for the IBIS Open Forum hosted by Will 
 Hobbs and give the reservation number and passcode.
 
 NOTE: "AR" = Action Required.
 
 -------------------------------- MINUTES -------------------------------------

 INTRODUCTIONS
 No new introductions of participants.
 

 EIA MEMBERSHIP AND TREASURER'S REPORT
 Patti Rusher(EIA) was not present for updates.

 MINUTES REPORT, MISC.
 Could not confirm if commitment letter to Patti Rusher about DAC97
 poster was sent by Bob Ross.
 
 MISCELLANY/ANNOUNCEMENTS
 vhdl.org was compromised by hackers and was pulled off the network.
 This disrupted the IBIS reflector as well as links establised from
 the ANSI/EIA-656 web site. Randy Harr of DARPA was actively working
 on getting the server up and running.

 Jon Powell has sent out a message thru the alias list extracted out
 from the IBIS reflector

 Bob Ross(Chair)was unable to attend teleconference due to health reasons.
 Several members were concerned of his absense.

 PRESS AND WEB PAGE UPDATES
 Syed Huq reported EDN Product Edition Dec11th'96 pg24 had an article
 on 'PC Graphics System Design' that mentions IBIS for modeling.
 
 NEW MODELS
 Syed Huq reported various models from National Semiconductor being
 released from the website at http://www.national.com
 ds36c200, pc87338 & lm78

 Arpad reported various models being updated that are avialable under
 NDA from Intel

 OPENS FOR NEW ISSUES
 None
  
 DESIGN SUPERCON97 IBIS SUMMIT MEETING
 Received a lot of confirmation from over 22 companies who will be
 attending the IBIS summit. Syed Huq and Jon Powell are working on an
 Agenda to be published the week of Jan13th.

AR= Syed/Jon publish Summit agenda
 
 S2IBIS2
 The new version of s2ibis2 is available from the vhdl.org ftp site.
 Syed will compile any issues users encounter on this new version.
 All bugs should be forwared to syed (huq@rockie.nsc.com)

 DAC97 PLANNING
 None

 IEC PROGRESS
 None
 
 COOKBOOK for 2.1
 None
 
 PARSER BUG DISCUSSION 
 None
 
 PACKAGE COMMITTEE REPORT
 None. Concerns were highlighted by various participants regarding
 BIRD36. These were the use of SPICE models to describe connectors
 over the new syntax described by BIRD36. Many felt that SPICE was
 more appropriate and are readily available and IBIS syntax need 
 not be created again to model connectors.

 More disucssion regarding this will be held during the summit meeting.
 
 BIRD40 - SPECIFICATION ENHANCEMENT(vote)
 No vote was taken as qorum not established

other technical discussion:
---------------------------
 Various discussions were held regarding an upcoming BIRD from Arpad
 about Quick Switch. Modeling of series devices with FET switches was
 the concern. 

AR=Arpad to generate BIRD

 
 
NEXT MEETING:
 The next meeting is the IBIS Summit 1997:
	
		Place:  Westin Hotel
       		(Santa Cruz conference Room - 1st floor)
       		5101 Great America Parkway
       		Santa Clara, California
       		(408)986-0700	
	
		Date:  Jan 20th Monday(one day)
		Time:  8am - 5pm
  ==============================================================================
				       NOTES
 
 IBIS CHAIR: Bob Ross (503) 603-2523, Fax (503) 639-3469
	     bob@icx.com
	     Modeling Engineer, Interconnectix
	     10220 SW Nimbus Ave, K4, Portland, OR 97223

 VICE CHAIR: Syed Huq (408) 721-4874, Fax: (408) 721-4785
	     huq@rockie.nsc.com
	     Staff Applications Engineer, National Semiconductor, M/S A-2595
	     2900 Semiconductor Drive, Santa Clara, CA 95052
 
 LIBRARIAN:  Jon Powell (805) 988-8250, Fax: (805) 988-8259
	     jonp@qdt.com
	     Transmission-Line Products Manager, Quad Design
	     1385 Del Norte Rd., Camarillo, CA 93010
 
 SECRETARY:  Vacant
 

 This meeting was conducted in accordance with the EIA Legal Guides and EIA
 Manual of Organization and Procedure.
 
 The following e-mail addresses are used:

   ibis-request@vhdl.org
       To join, change, or drop from either the IBIS Open Forum Reflector
       (ibis@vhdl.org), the IBIS Users' Group Reflector (ibis-users@vhdl.org)
       or both.  State your request.

   ibis-info@vhdl.org
       To obtain general information about IBIS, to ask specific questions
       for individual response, and to inquire about joining the EIA-IBIS
       Open Forum as a full Member.

   ibis@vhdl.org
       To send a message to the general IBIS Open Forum Reflector.  This
       is used mostly for IBIS Standardization business and future IBIS
       technical enhancements.

   ibis-users@vhdl.org
       To send a message to the IBIS Users' Group Reflector.  This is 
       used mostly for IBIS clarification, current modeling issues, and
       general user concerns.

   ibischk-bug@vhdl.org
       To report ibischk2 parser bugs.  The Bug Report Form Resides on
       vhdl.org in /pub/ibis/bugs/bugform.txt along with reported bugs.

 Information on IBIS technical contents, IBIS participants, and actual
 IBIS models are available on the IBIS Home page found by selecting the
 Electronic Information Group under:

   http://www.eia.org

 Check the pub/ibis directory on vhdl.org for more information on previous 
 discussions and results.  You can get on via ftp anonymous, "guest" login from 
 telnet or dial-in (415-335-0110), or send an e-mail request to the automatic 
 archive server, archive@vhdl.org.
 
 "IBIS Spoken Here" placards are available from Jon Powell (jonp@qdt.com) for 
 use at trade shows.
 ==============================================================================



From owner-ibis  Thu Jan 16 01:56:45 1997
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From: John V Fitzpatrick <John.Fitzpatrick@ln.cit.alcatel.fr>
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To: ibis@vhdl.org
Cc: Chris Reid <chris@icx.com>
Subject: Re: Modelling bus switches and other series elements
References: <m0vkYij-0008xGC@icx.com>
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Bonjour,

I like Chris's suggestion. So we could have a keyword [Series Models]
followed by optional [State] keywords. 

Let's be careful about the word "switch". There is the case
where a switch is ON or OFF, and then there's the case where different
paths are switched in or selected.

So [State] indicates when to use the ON model of a buffer.
In all other states, the OFF model is used.
i.e.[State] is used when there are selectable paths.

Example:

 [Series Models]
 | Pin   Pin   Model
    6     7    FET         #always ON
 
 [State] StateName1
 | Pin   Pin   Model
    1     3    SMC        #ON only when state=StateName1
 
 [State] StateName2
 |  Pin   Pin   Model
     1     5    SMCx
 

Some questions:

  1) I see from the minutes of the last meeting that Arpad is
     preparing a BIRD on this subject. Is a draft of this BIRD
     available?

  2) A common application of bus switches is to protect
     components e.g. 3.3V from 5V, 2.5V from 3.3V.
     Should IBIS allow this to be modelled? Or is it
     too much an analog funcction?

Regards to all,
John Fitz

-- 
John Fitzpatrick   <John.Fitzpatrick@ln.cit.alcatel.fr>    
Alcatel Telecom, 4 rue de Broglie, 22304 Lannion, France
Tel: +33(0)2.96.04.79.33  Fax: +33(0)2.96.04.85.09



Chris Reid wrote:
> 
> Good morning,
> 
> Maybe instead of a syntax that defines all possible connections
> simultaneously (making it look like there are many simultaneous
> paths) we should find one that clearly calls out the different
> switch states.  Something like:
> 
> [State] StateName1
> | Pin   Pin   Model
>    1     3    SMC
> 
> [State] StateName2
> |  Pin   Pin   Model
>     1     5    SMCx
> 
> I'm not suggesting this as the actual syntax, only as an example
> to explain my concept.  The simulator must be told witch state of
> the switch to use in any particular simulation.
> 
> Of course, if the goal is to model the transition between states
> this is not helpful.  However, users of our system have not asked
> for that capability, but they have done things like Richard Mellitz
> suggests, swapping out one model for another, manually.
> 
> This syntax would give the user a way to specify the different
> switch states.  It would be up to the simulator to allow the
> user to specify whitch state to use when.
> 
> The same, or a degenerate syntax without the [State] specified
> could be used for series elements that are not switchable.
> 
> Chris Reid

From owner-ibis  Thu Jan 16 02:04:40 1997
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To: Stephen Peters <sjpeters@ichips.intel.com>
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Subject: Bird 36: latest draft
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Stephen,

I have not followed the progress of Bird 36, so am trying to
prepare myself for Monday's discussion.

Is the version on vhdl.org dated 24-June-96 the latest version
of this Bird? Or is there a working draft somewhere which
indicates better the current state of work in progress?
 
Regards,
John

-- 
John Fitzpatrick   <John.Fitzpatrick@ln.cit.alcatel.fr>    
Alcatel Telecom, 4 rue de Broglie, 22304 Lannion, France
Tel: +33(0)2.96.04.79.33  Fax: +33(0)2.96.04.85.09

From owner-ibis  Thu Jan 16 11:13:05 1997
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To: ibis@vhdl.org
Subject: Bird36.d
Date: Thu, 16 Jan 1997 11:11:43 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>

Hello fellow IBISans:

   Per request, here is the latest version of BIRD 36.  As yet, it
does not contain a formatt for describing coupling in a connector.
We have been concentrating on the simpler, uncoupled case.  Syed, please
feel free to make copies of this for distribution at the face to face
Monday.  I Looking forward to seeing everyone there....
      
                   Best regards,
                   Stephen Peters
                   Intel Corp.



Buffer Issue Resolution Document  (BIRD)
BIRD ID#:        36.d
ISSUE TITLE:     Electric Descriptions of Boards and Connectors
REQUESTER:       Stephen Peters, Hank Herrmann
DATE SUBMITTED:  June 23, 1996, 11/4/96
DATE ACCEPTED BY IBIS OPEN FORUM:  Pending

******************************************************************************
******************************************************************************
STATEMENT OF THE ISSUE:  There is a need to describe SIMM modules and related
type components that consist of one or more ICs mounted on a PCB board that
connects them to a system thru a set of pins.  The following BIRD proposes a
new type of file called .eid (Electrical Interconnect Description) that
addresses this need.  A .eid file can also be used to describe connectors and
sockets.

******************************************************************************
STATEMENT OF THE RESOLVED SPECIFICATIONS:  The following text is placed
in the specification after the .pkg file description and before the
[End] keyword description.

==================== ELECTRICAL INTERCONNECT DESCRIPTION ====================

     An Interconnect Level Component is defined as a part that connects
one or more IC packages to another part or board thru a set of user visible
pins.  For example, a SIMM module is an interconnect level component in that
it connects several DRAM packages to a PCB thru an edge connector.  To provide
a simple electrical description of the connection between the pins of the
interconnect level component and the IC packages, an electrical interconnect
description file (a .eid file) is defined. The .eid file is also used to
describe the electrical characteristics of connectors and sockets.

    What is, and is not, included in an Electrical Interconnect Description
is defined by its boundaries.  For the definition of the boundaries, see the
Description section under the [Path Description] Keyword.

Usage Rules:
     A .eid file is intended to be a stand alone file, not associated with any
.ibs file.  Interconnect level component descriptions are stored in a file
whose name looks like <filename>.eid, where <filename> must conform to the
naming rules given in the general syntax section of this specification.  The
.eid extension is mandatory.

Contents:
    A .eid file is structured similar to a standard IBIS file.  It must
contain the following keywords, as defined in the IBIS specification:
[IBIS Ver], [File name], [File rev], and [End].  It may also contain the
following optional keywords: [Comment char], [Date], [Source], [Notes],
[Disclaimer] and [Copyright].  The actual interconnect level component
description is contained between the keywords [Begin Electrical Description]
and [End Electrical Description], and includes the keywords listed below.

[Begin Electrical Description]
[Manufacturer]
[Application Info]
[Number of Pins]                 note 1
[Number of Pairs]                note 1
[Pin List]                       note 2
[Pair List]                      note 2
[Path Description]
[Coupled Path Model]             note 3
[Reference Designator Map]
[Model Data]                     note 3
[Resistance Matrix]              note 3
[Inductance Matrix]              note 3
[Capacitance Matrix]             note 3
[Bandwidth]                      note 3
[Row]                            note 3
[End Model Data]                 note 3
[End Electrical Description]

(Note 1) Either the [Number of Pins] or [Number of Pairs] keyword must be
         used but not both.
(Note 2) Either the [Pin List] or [Pair List] keyword must be used but not
         both.  [Pin List] is used only when the [Number of Pins] keyword
         has been used and [Pair List] is used only when the [Number of Pairs]
         keyword has been used.
(Note 3) The indicated keywords are reserved for future use in coupled models.

  More than one [Begin Electrical Description]/[End Electrical Description] 
keyword pair is allowed in a .eid file.

|=============================================================================
|    Keyword: [Begin Electrical Description]
|   Required: Yes
|Description: Marks the beginning of an Electrical Interconnect description.
|Usage Rules: The keyword is followed by the name of the interconnect level
|             component.  If the .eid file contains more than one [Begin
|             Electrical Description] keyword, then each name must be unique.
|             The length of the component name must not exceed 40 characters
|             in length, and blank characters are allowed.  For every
|             [Begin Electrical Description] keyword there must be a
|             matching [End Electrical Description] keyword.
|-----------------------------------------------------------------------------
[Begin Electrical Description]  16Meg X 8 Simm Module
|
|=============================================================================
|    Keyword: [Manufacturer]
|   Required: Yes
|Description: Declares the manufacturer of the part(s) that use this .eid
|             file.
|Usage Rules: Following the keyword is the manufacturers name.  It must not
|             exceed 40 characters, and can include blank characters.  Each
|             manufacturer must use a consistent name in all .eid files.
|-----------------------------------------------------------------------------
[Manufacturer] Quality SIMM Corp.
|
|=============================================================================
|    Keyword: [Application Info]
|   Required: Yes, if any subparameters need to be specified.
|Description: This keyword provides general model application information.
|Sub-params:  Min_edge_time, Cpad1, Cpad2
|Usage Rules: This keyword is followed by one to three listed subparameters.
|             All three subparameters are optional.  Subparameters are
|             followed by an equals sign (=); whitespace around the equals
|             sign is optional.
|
|             The Min_edge_time subparameter is used to specify the minimum
|             edge time of a signal for which an interconnect model is
|             considered accurate.  This value is based on the smallest
|             physical feature that is modeled in the electrical description.
|             Note that a simulator may choose to produce a warning message
|             if a signal with a faster edge enters the model.  Simulators
|             should also use this subparameter in determining how to
|             model a section with non-zero length.
| 
|             The Min_edge_time subparameter is a single numeric argument
|             specifying the 20% to 80% edge time of the fastest pulse the
|             model will accurately pass.  This value will be the minimum
|             value at which the measured signal line impedance is within 10%
|             of the simulated impedance.  The point at which impedance
|             deviations exceed 10% is the point at which the model needs 
|             more structural detail.  This is not the same as dividing a long
|             section into stages as is required when using lumped values in 
|             SPICE.  Long uniform sections should be specified as distributed 
|             sections.  (Len <> 0 under [Path Description])  Measured line 
|             impedance is the impedance plot of the part's connection path 
|             taken by a Time Domain Reflectometer (TDR) with the edge time 
|             indicated by the Min_edge_time subparameter.  The simulated 
|             impedance is the ratio of the dynamic model input voltage to input 
|             current with the same source waveform and the same configuration 
|             as the test.  The usual configuration is to ground all appropriate 
|             lines and use source and load impedances of 50 ohms.
|
|             The Cpad1 subparameter defines the default pad capacitances
|             for all circuit board edge pads or all pins on the first side
|             of a connector model.  Cpad2 is the default pad capacitance on
|             the second side of a connector.  The first and second sides
|             refer to the order as used in the pin-pairs of the [Pin List]
|             keyword.  If either is omitted, the default value is zero pF.
|             Do not omit Cpad1 (set it equal to zero) if Cpad2 is needed.
|             In all cases the simulator may override the listed or default
|             value with values extracted from the actual pad dimensions
|             provided in a physical board description.
|
|---------------------------------------------------------------------------
|
|  AN EXAMPLE CONNECTOR DESCRIPTION
|
Min_edge_time = 1.5n
Cpad1 = 0.5p
Cpad2 = 1.0p
|
|  AN EXAMPLE PATH ON A SIMM MODULE
|
Min_edge_time = 1.0n
Cpad1 = 1.5p
|
|  ANOTHER EXAMPLE PATH ON A SIMM MODULE
|
Min_edge_time = 1.5n
|
|=============================================================================
|    Keyword: [Number of Pins]
|   Required: Yes, if the .eid file describes a circuit board, an unmated
|             connector or similar structure.  This keyword must not be
|             used if the [Number of Pairs] keyword is used.
|Description: Tells the parser the number of pins to expect.  Pins are any
|             externally accessible electrical connection to the part.
|Usage Rules: The field must be a positive decimal integer.
|             Note: The simulator must not limit the Number of Pins to any
|             value less than 1,000.
|-----------------------------------------------------------------------------
[Number of Pins] 128
|
|=============================================================================
|    Keyword: [Number of Pairs]
|   Required: Yes, if the .eid file describes a mated connector, socket or
|             other similar interconnection structure.  This keyword must not
|             be used if the [Number of Pins] keyword is used.
|Description: Tells the parser the number of pairs to expect.  Pairs are 
|             simply the number of conductive paths in an interconnection.
|             Pairs are necessary since each path has at least two external
|             pins; one on each side of the interconnection device.
|Usage Rules: The field must be a positive decimal integer.
|             Note: The simulator must not limit the Number of pin-pairs to
|             any value less than 1,000.
|-----------------------------------------------------------------------------
[Number of Pairs] 240
|
|=============================================================================
|    Keyword: [Pin List]
|   Required: Yes, if the [Number of Pins] keyword has been used.
|             Either the [Pin List] or [Pair List] keyword must be used but
|             not both.  [Pin List] is used only when the [Number of Pins]
|             keyword has been used and [Pair List] is used only when the
|             [Number of Pairs] keyword has been used.
|Description: Tells the parser the set of names that are used for the part's
|             external pins and also defines pin ordering.  The first pin name
|             given is the "lowest" pin, and the last pin given is the
|             "highest".
|Usage Rules: Following the [Pin List] keyword, the names for the pins are
|             listed.  There must be as many entries listed as there are pins
|             given by the preceding [Number of Pins] keyword.  Pin names must
|             be the alphanumeric external pin names of the part.  The pin
|             names cannot exceed eight characters in length.  
|             PWR, GND and NC are not legal pin names.
|-----------------------------------------------------------------------------
|
|  A SIMM CIRCUIT BOARD OR UNMATED CONNECTOR EXAMPLE
|
[Pin List]
A1
A2
A3
| .
| .
A22
B1
| .
| .
|etc.
|
|=============================================================================
|    Keyword: [Pair List]
|   Required: Yes, if the [Number of Pairs] keyword has been used.
|             Either the [Pair List] or [Pin List] keyword must be used but
|             not both.  [Pair List] is used only when the [Number of Pairs]
|             keyword has been used and [Pin List] is used only when the
|             [Number of Pins] keyword has been used.
|Description: Tells the parser the set of names that are used for the part's
|             external pins, matches the names that are at opposite sides of
|             each conductive path and also defines pin ordering.  The first
|             pin name given is the "lowest" pin, and the last pin name given
|             is the "highest".  Pin names are assigned in column order.  That
|             is, first all pin names on one side are assigned in the order
|             given, then the other side is assigned in the order given.
|Usage Rules: Following the [Pair List] keyword, the paired pin names for the
|             pairs are listed.  There must be as many pair entries listed as
|             there are pairs given by the preceding [Number of Pairs] keyword.
|             Pin names must be alphanumeric.  They provide the internal names
|             that are used in the [Path Description] keyword.  They are
|             matched to the external pin names of the part.  The pin names
|             cannot exceed eight characters in length.  The special pin name,
|             NC, is reserved to represent no-connection if a pin name is not
|             used on one side or the other of the interconnection.
|             PWR and GND are not legal pin names.
|-----------------------------------------------------------------------------
|
|  A MATED CONNECTOR EXAMPLE
|
[Pair List]
RA1     PA1
RA2     PA2
RA3     PA3
| .     .
| .     .
RA22    PA22
RB1     PB1
| .     .
| .     .
|etc.   etc.
|
|============================================================================
|    Keyword: [Path Description]
|   Required: Yes, unless the [Coupled Path Model] Keyword is used.
|Description: This keyword allows the user to describe the connection
|             between the user accessible pins of a part and the pins of
|             the ICs mounted on that part.  If describing a connector,
|             this keyword is used to describe the path from one pin of a
|             connector pin-pair to the other pin of the same pair.  The
|             Fork and Endfork subparameters allow branching to other
|             pin-pair paths.  NOTE that this means that pin names can appear
|             more than once.
|
|             BOUNDARIES OF MODEL PATHS:
|             In any system, each part interfaces with another part at some 
|             boundary.  Every part model must contain the components 
|             necessary to represent the behavior of the part being modeled 
|             within its boundaries. The boundary definition depends upon 
|             the parts being represented by the model.
|
|             For CARD EDGE CONNECTIONS such as a SIMM or a PC Daughter 
|             Card plugged into a SIMM Socket or Edge Connector, the 
|             boundary should be at the end of the board card edge pads as 
|             they emerge from the connector. The pads need to be included 
|             in the connector model.
|
|             For any THROUGH-HOLE MOUNTED PART, the boundary should be at 
|             the surface of the board on which the part is mounted.  This
|             also applies to an IC plugged into a socket.  The portion of
|             the IC pins that project into the socket must be included in
|             the socket model.
|
|             SURFACE MOUNTED PART models end at the outboard end of their
|             recommended surface mount pads.
|
|             CONNECTOR models must be mated connections unless the 
|             connector is commonly used in an unmated condition such as in 
|             a digital bus where all slots are not filled.  Unmated 
|             connector models would have only one boundary; the board-
|             connector boundary.
|
|             Combination models can be made when two parts are always used 
|             together, such as with a chip that is always intended to be
|             socketed.  In that case, the socket-to-board boundary is the only
|             one used.
|
| Sub-params: Len, L, R, C, Fork, Endfork, Pin, Node
|Usage Rules: Each individual connection path (user pin to node(s)
|             description or connector pin-to-pin description) begins with the
|             [Path Description] keyword and a path name, followed by the
|             subparameters used to describe the path topology and the
|             electrical characteristics of each section of the path.  The
|             path name must not exceed 40 characters, blanks are not allowed,
|             and each occurrence of the [Path Description] keyword must be
|             followed by a unique path name.  The individual subparameters
|             are broken up into those that describe a section's electrical
|             properties, and those that describe the topology of a path.
|
|             SECTION DESCRIPTION SUBPARAMETERS:
|             The Len, L, R, and C subparameters specify the length, the
|             series inductance and resistance and the capacitance to ground
|             of each section in a path description.
|             Len     The physical length of a section.  Lengths are given
|                     in terms of arbitrary 'units'.  Any non-zero length
|                     requires that the parameters that follow must be
|                     treated as distributed elements by the simulator.
|             L       The series inductance of a section, in terms of
|                     'inductance/unit length'.  For example, if the total
|                     inductance of a section is 3.0nH and the length of the
|                     section is 2 'units', the inductance would be listed
|                     as L = 1.5nH  (i.e. 3.0 / 2). 
|             C       The capacitance to ground of a section, in terms of
|                     capacitance per unit length.
|             R       The series DC (ohmic) resistance of a section, in
|                     terms of ohms per unit length.
|
|             TOPOLOGY DESCRIPTION SUBPARAMETERS:
|             The Fork and Endfork subparameters denote branches from the 
|             main pin-to-node or pin-to-pin connection path.  The Node 
|             subparameter is used to reference an external component 
|             description file.  The Pin subparameter is used to indicate 
|             the point at which a path connects to a user visible pin. 
|             Fork    This subparameter indicates that the sections
|                     following (up to the Endfork subparameter) are part
|                     of a branch off of the main connection path.  This
|                     subparameter has no arguments.
|             Endfork This subparameter indicates the end point of a
|                     branch.  For every Fork subparameter there must be a
|                     corresponding Endfork subparameter.  As with the Fork
|                     subparameter, the Endfork subparameter has no arguments.
|             Node    reference_designator.pin
|                     This subparameter is used when the connection path
|                     connects to a pin of another, externally defined part.
|                     The arguments of the Node subparameter indicate the pin
|                     and reference designator of the external component.  The
|                     pin and reference designator portions of the argument are
|                     separated by a period (".").  The reference designator is
|                     mapped to an external component description (another .eid
|                     file or a .ibs file) by the [Reference Designator Map]
|                     Keyword.
|             Pin     This subparameter is used to mark the point at which
|                     a path description connects to a user accessible pin.
|                     Every path description must contain at least one 
|                     occurrence of the Pin subparameter.  It may also contain
|                     the reserved word NC.  The value of the Pin subparameter
|                     must be one of the pin names listed in the [Pin List] or
|                     [Pair List] section.
|
|             Using The Subparameters to Describe Paths:
|             A section description begins with the Len subparameter and
|             ends with the slash (/) character.  The value of the Len, L,
|             R and C subparameters and the subparameter itself are separated
|             by an equals sign (=); whitespace around the equals sign is
|             optional.  The Fork, Endfork, Node and Pin subparameters are
|             placed between section descriptions (i.e. between the concluding
|             slash of one section and the 'Len' parameters that starts
|             another).  The arguments of the Pin and Node subparameter are
|             separated by white space; no equal sign nor slash (/)
|             character is used.  
|
|             Specifying a Len or L/R/C value of zero is allowed.  If
|             Len = 0 is specified, then the L/R/C values are the total
|             for that section.  If a non-zero length is specified, then
|             the total L/R/C for a section is calculated by multiplying 
|             the value of the Len subparameter by the value of the L,
|             R or C subparameter.  However, as noted below, if a non-
|             zero length is specified, that section MUST be treated as
|             distributed elements.
|
|             Legal Subparameter Combinations for Section Descriptions:
|
|             A)  Len, and one or more of the L, R and C subparameters.  If
|             the Len subparameter is given as zero, then the L/R/C sub-
|             parameters represent lumped elements.  If the Len subparameter
|             is non-zero, then the L/R/C subparameters represent distributed
|             elements and both L and C must be specified, R is optional.
|
|             B) The first subparameter following the [Path Description]
|             keyword must be 'Pin', followed by one or more section
|             descriptions.  The path description can terminate in a node,
|             another pin or the reserved word, NC.
|
|---------------------------------------------------------------------------
|
|  A TYPICAL CONNECTOR DESCRIPTION EXAMPLE
|
[Path Description]  J1-P1
Pin J1
Len = 2.0 L=8.35n C=3.34p R=0.01 /
Len = 0.5 L=1.0n  C=2.7p  /
Pin P1
|
|  AN EXAMPLE PATH FOR A SIMM MODULE
|
[Path Description] CAS_2
Pin J25
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u21.15
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u22.15
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u23.15
|
|  A DESCRIPTION USING THE FORK AND ENDFORK SUBPARAMETERS
|
[Path Description] PassThru1
Pin B5
Len = 0   L=2.0n /
Len = 2.1 L=6.0n C=2.0p /
 Fork
 Len = 1.0 L= 1.0 C= 2p
 Node u23.15
 Endfork
Len = 1.0 l = 6.0n C=2.0p /
Pin A5
|
|  A MORE COMPLEX CONNECTOR or BOARD DESCRIPTION EXAMPLE
|
|  A metal part or trace with 2 connections on one side and one
|    connection on the other side.
|                                     +--------------+
|                                     |              |
|                           RG1  +====+\             |       NC
|                                     | L1           |
|                                     | R1           |
|                           RG2  +====+/____L2__R2___+====+  PG2
|                                     |              |
|                                     +--------------+
[Path Description]  RG1-NC
Pin RG1
 Fork
 Len = 1.0 L=0.3n R=0.01 /
 Pin RG2
 Endfork
Pin NC
|
[Path Description]  RG2-PG2
Pin RG2
Len = 1.0 L=1.3n R=0.04 /
Pin PG2
|
|=============================================================================
|    Keyword: [Coupled Path Model]
|   Required: Not at the present time.  This keyword is reserved for future use.
|Description: This keyword will introduce a coupled model path description in
|             some format yet to be determined.
| Sub-params: TBD
|Usage Rules: TBD
|             
|-----------------------------------------------------------------------------
|  [Coupled Path Model] Example TBD
|
|=============================================================================
|    Keyword: [Reference Designator Map]
|   Required: Yes, if any of the path descriptions use the Node subparameter.
|Description: Indicates the linkage between a reference designator and the
|             external part it represents.
|Usage Rules: The [Reference Designator Map] keyword must be followed by a
|             list of all of the reference designators defined in the Node
|             subparameter under the [Path Description] keyword.  Each
|             reference designator is followed by the Name of the part to which
|             it is linked and the terms are separated by whitespace.  The part
|             Name may be another .eid or .ibs model.  A referenced .eid model
|             may be internal to the calling .eid file or it may be an external
|             file with an appropriately given pathname.
|-----------------------------------------------------------------------------
[Reference Designator Map]
|
|  EXTERNAL PART REFERENCES
|
u23   80286.ibs
u24   SIMM.eid
u25   C:\LIBS\LS244.ibs
|
|  AN INTERNALLY DEFINED .eid MODEL OF A 10K RESISTOR
|
u26   R10K
| 
|=============================================================================
|    Keyword: [Model Data], [End Model Data], [Resistance Matrix],
|             [Inductance Matrix], [Capacitance Matrix], [Bandwidth], [Row]
|   Required: Not at the present time.  These keywords are reserved for future
|             use for coupled models.
|=============================================================================
|    Keyword: [End Electrical Description]
|   Required: Yes
|Description: Marks the end of an Electrical Interconnect Description.
|Usage Rules: This keyword must come at the end of each complete electrical
|             interconnect model description.
|
|             Optionally, a comment may be added after the [End Electrical
|             Description] keyword to clarify which interconnect model has
|             ended.
|-----------------------------------------------------------------------------
[End Electrical Description]        | End: 16Meg X 8 Simm Module
|
******************************************************************************
ANALYSIS PATH/DATA THAT LED TO SPECIFICATION:




------ =_NextPart_000_01BC0388.0B121020--

From owner-ibis  Fri Jan 17 17:50:05 1997
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From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9701180150.AA29801@rockie.nsc.com>
To: ibis@vhdl.org
Subject: Final Agenda of IBIS Summit (Jan20th 1997)
Cc: huq@rockie.nsc.com


		Agenda for Jan20th 1997 IBIS Summit
	
		Place:  Westin Hotel
       		(Santa Cruz conference Room - 1st floor)
       		5101 Great America Parkway
       		Santa Clara, California
       		(408)986-0700	
	
		Date:  Jan 20th Monday(one day)
		Time:  8am - 5pm


Time		Topic				Presentor
---------------------------------------------------------------------
8:00		Continental Breakfast		All

8:30		- Sign-In			All
		- Intros of Officers/Attendees	Huq
		
8:50		Review of summit Agenda		Huq	
		- Open for New Issues		

9:00		ANSI/EIA-656(IBIS)overview	Huq(National Semi)
		- Web site at EIA
		- ftp site at vhdl.org
				
9:15		EIA Membership 			Rusher(EIA)
		IEC update
		
9:30		IBIS modeling at Alcatel	Fitzpatrick(Alcatel)

10:00		Overview of Visiual IBIS 	Crisafulli(Hyperlynx)
		Editor for Windows, and 
		Solicitation of Ideas for 
		Version 2.0

10:30		Signal Integrity & IBIS		Telian(Cadence)

11:20		Problems representing ABT	Powell(Quad Design)
		Models using IBIS	

12:00			Lunch

1:00		An IBIS survey - HPEEsof	Wilson(HPEEsof)

1:20		Modeling Early Clamps in IBIS   Muranyi(Intel)

2:00		BIRD 36d: Electric descriptions Peters(Intel)
		of boards and connectors

		Other items
		  -DAC 97 IBIS meeting plans
		  -IBISv3.0 ratification
		  -s2ibis2
		  -cookbook for v2.1
		Next Teleconference schedule	Huq

5:00		Meeting adjourned



From owner-ibis  Wed Jan 22 23:24:58 1997
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From: Quad Design Technology <jonp@pacbell.net>
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Hi ibis type persons,

I am still at Design Supercon but I thought you might like to get the minutes from the 
meeting such as they are. I will be working with Syed to make available some computer 
readable format of any of the presentations that the presenters wish to provide.

take care,
Jon

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Minutes of the ANSI/EIA-656 Meeting IBIS 1/20/97 at SUPERCON97 at the Santa Clara Westin

Secretaries Notes:
This was an extremely well attended meeting containing representatives from all of the various areas of IBIS 
interest, including IC manufacturers, Connector manufacturers, EDA vendors, and end users. There were 
several interesting presentations on various topics. I have attempted to note some of the highlights of those 
topics and will work with Syed to make the actual presentations available to all IBIS members via the ftp 
reflector or WWW site. I apologize for the roughness of this data but it is hard to type and argue at the same 
time.

Special thanks to Syed Huq and National Semiconductor for hosting the IBIS face to face. They provided an 
excellent room, superior refreshments, and a microphone so we could hear Stephen Peters.



Introductions.
Syed Huq: Presiding
Jon Powell: acting secretary
Patti Rusher: EIA Representative

Review of schedule.

Questions about who is providing models.
Comments from the librarian on providing models to the library or seeking assistance in model development.
Jon Powell has offered to run QA checks on ANY models that emailed to him at jonp@qdt.com. He is also 
soliciting models to be added to the IBIS reflector. Jon has not received any (new) models for release during 
the last 8 months. (well, maybe from Arpad but those don’t count because he is so good at it).

Syed: IBIS Road map

Use of the reflector

IBIS Poster Page
If you wish you company logo added or updated, please send your logo to jonp@qdt.com. It should be in 
bmp or tiff format and have a size of about 800x200 pixels. Bigger is better as he can size it down.

EIA Membership Update (patty)
23 Members to date.
Committee Membership is $500.00
Membership applications are available from patty and will soon be available on the web at the IBIS site.
IBIS will be represented at DAC in EIA booth.
IBIS is number 2 in the EIA on hits on the web page.
Over 7000 hits since page inception.
IEC Update: is going through the international technical committee. Will be assigned to Hillary Con. Hope 
to have out as a full standard in the next two years.
Patti distributed membership bills at the meeting.

John Fitzpatrick: User Presentation.
Makes telephone switches. Alcaltel has committed to building a large library of IBIS models. Have 
classically solved this problem using Bergeron Diagrams.
Want to use for simulation and extracting information to create design rules.

Found %100 errors in IBIS models (but none of those were off the reflector).
They found that they had to generate many of the models themselves.
Will be building models from an SI lab and checking all Models. Want to use IBIS models to do constraint 
driven routing.
Will be using IBIS files as a database to extract information for design rules. Such things as : do 3 volts 
devices need protection?
Can also use IBIS to help with crosstalk control and route constraint generation for correct by design 
routing. Don’t know output impedance of a component to select proper series termination but you can get 
this information from IBIS.
Wish lists:
1)  Unable to model series components. (very important)
2)  Non-monotonic IV curve models.
3)  R,L,C description capability.
4)  BUS Switch Models (This is a very important issue)

They want to keep all models in IBIS format and right now they are being forced to keep things in multiple 
formats because IBIS does not support the above issues.

Less Important wishes:
1)  Easier to understand IV curves: suggests the need for new keywords that support pure measurement 
values and let the simulator do the necessary subtractions etc. (Audience suggests that development of a 
better editor or input technology).
2)  More background information in the model. Contact information, Brief description of the component, 
or URL to component description.
3)  Unique buffer names. Guidelines on buffer naming: each supplier should use a unique meaningful 
name.
4)  Model Verification: 
5)  Long term goal: Full Electrical Specification (don’t need data-sheets).
6)  Recommended paper data-sheet format for representing IBIS models
7)  Better specification of “minimum” data to have a IBIS models.
8)  IBIS as a specification tool
  ASICs (to allow for a choice of output buffers)
  Second sourcing (give us a part that matches this model)
  Industry-standard I/O (“Golden” ibis models representative of industry standard technologies 
(LCT, LVC, AC FAST, Memories etc.)


Kelle on Visual IBIS editor for Windows
Free on several websites.
Seeking inputs on how to improve the editor.
Win3.1, WIN95 or WINNT but runs better on 95 and NT
has built in 2.1 and 1.1 syntax checker.
Skeleton Generator
Has built-in viewers for seeing the various tables graphically. (cannot edit graphically). This viewing can 
greatly assist in debugging the data.
Can get this from www.hyperlynx.com

Looking to do Feature Update and looking for suggestions. Sheets were passed out which asked people for 
their inputs.

Suggestions given by Audience:
1)  show loading conditions on waveforms
2)  overlay multiple curves for comparison of different models.
3)  Don’t show clamp of data beyond data range. Just show the end of the data.
4)  Veribest might provide a SPICE2IBIS converter in WIN95 executable format.
5)  remove “CONTROL-M” for output because they aren’t allowed in standard. (is this true?)
6)  Graphically edit curve.
7)  Pop-up Menu with blanks for all input values.


email: kellee@hyperlynx.com

ASIDE: we need to define in IBIS what happens at the end of the IBIS data.
Contact Ian about putting SPICE2IBIS WINNT version on the web site.




5 minute break.

Don Telian: Signal Integrity Engineering in High-speed Digital Systems
Surveyed 5 managers of SI groups and put their feedback in this presentation
(see don’s slides for actual presentation).
The goal of this presentation is to define the SI engineer and put him on the map.

Electrical description is moving from a static form to a dynamic form.
7 roles of SI Engineer:
1)  Pioneering and Defining
2)  Partitioning and Approximating
3)  Modeling and Measuring
4)  Design and Optimizing
5)  Quantifying and verifying
6)  Reducing and Simplifying
7)  Correlating and Debugging

Resolve not to whine and use good judgment.

ABT simulation problems Jon Powell
The TI abt SPICE model demonstrates a charged pumping and load dependent IV curve phenomena that jon 
does not believe can be represented with current IBIS technology. Jon presented an encapsulation of the 
circuit and showed some example simulations. Jon will post full report to the IBIS reflector for further 
discussion.

Carl - HP EESOF IBIS survey
How do people develop models:
1)  Most use SPICE to develop models (in fact %100 of responders derived from SPICE)
2)  Opportunity for commercialization of SPICE to IBIS converter (but the price they would pay is 
probably pretty small)
3)  4 out of 7 said they did use some measurement techniques to do the simulation.
4)  No recognized budget for generating models.

Arpad: Integrated Termination for Low Power, Low Cost, High Speed Signaling
This is a new feature that Intel is working on putting in their chips.

PCB needed to develop a low cost desktop chip set solution for the P6. Had to be low cost as the PC market 
is very competitive.
GTL bus needs two terminators. This cost too much money and current.
Found a good technique that works in both GTL and CMOS. Lets you get rid or resistors.

Worst case circuit: T circuit with termination in the middle.
Terminating at both ends causes.
So they need a termination with a special IV curves with no currents at VOH and VOL.
Use “Early” clamps to match diodes to desired curve.
In GTL systems, VOL drifts because it varies on buffer strength (and the strength of the pullup device).

Static Early clamps are easy to model by inserting IV curves into the clamps.

Dynamic curves are harder. Perhaps shift a IV curve as controlled by a VT curve. But the shifted IV curve 
might not be the same as the original IV curve. The timing is completely dependent on the implementation 
of the method, which is not defined. Arpad wants to come up with a IBIS description method that 
encompasses all possible implementation techniques.
Suggestion was made to try and fit this into the Multi-Driver bird. It would have to be modified to a multi-
receiver technology with a threshold test. Arpad will get this onto the reflector

Steven Peters: Bird 36.d
Two Purposes:
  Simple board descriptions (SIMMS)
  Connectors (coupled and uncoupled)
  Complex (coupled) board descriptions best left to physical/layout extraction  (EDIF 4.0 calls out IBIS 
models).

Some Highlights:
  Bird 36.d defines interconnect boundaries.
  In general [application info] is used for connectors. Provides critical information that the connector 
vendors feel is important, like the rise time that the model is good for (bandwidth of model?)
  [Number of pins] used for boards, unmated connectors and such.
  [Number of pairs] is there to support connectors that use an eventual matrix description.
  Bird does not make clear that nodes is not a general named node for interconnection (this is being 
fixed).
  Makes clear that if length > 0, then it is a distributed element.

COUPLING:
  goal is to describe a connector, not a general board interconnect.
  Basic approach is cascaded, name matrix
  One problem is data reduction: do you really want to describe a 200 pin, 4 row connector?
  Another Problem: Accuracy (?)
  Must agree on what data represents/ how to process data.


Mated model includes both male and female pins in the same connection
Unmated is only the male or female part.

Lots of argument concentrating on what is an acceptable way to specify a coupling matrix for connectors. I 
think it was finally agreed that such a matrix formalization does exist and the syntax needs to be agreed on.
DC  Sessions was concerned that there is not a definition for the local ground on a SIMM to be able to 
model local ground bounce on the SIMM.

Next Teleconference will be Feb. 14th
Reservation number will be put on the reflector.


First Topic for the 14th: Clarification of what needs to be done for 3.0

Discussion on model verification: Putting signatures into IBIS models that prove that certain checks were 
run? 
It is the EDA companies responsibility to service their customers.

Actel asked for us to make the SOURCE keyword required such that all models can be traced.
But that suggestion was met with some opposition as we have no way to enforce.

Meeting Adjourned


--------------4F2A539D6659--



From owner-ibis  Thu Jan 23 16:05:49 1997
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Please unsubscribe me.

mthai@kaw.co.jp

From owner-ibis  Thu Jan 23 17:41:59 1997
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Please unsubscribe me.


	#################################################

$)C
		Jung-Ryoon Chun (C5 A$ 7{)
	        Technical Staff 
		Design Dep.2, Memory R&D Division
		Hyundai Electronics Industries (HEI)
		Tel : 082-0336-30-4425
	#################################################

From owner-ibis  Mon Jan 27 18:42:07 1997
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To: ibis@vhdl.org
Date: Tue, 28 Jan 1997 22:42:36 +0000
Subject: (Fwd) Re: Where can I find an IBIS file for a DIMM module
Reply-To: mhliao@sis.com.tw
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Forwarded message:
From:     Self <Single-user mode>
To: ibis@vhdl.org ibis-user@vhdl.org
Subject: Re: Where can I find an IBIS file for a DIMM module
Reply-to: mhliao@sis.com.tw
Date: Tue, 28 Jan 1997 21:19:25

Hi everyone :
	I need an IBIS file for a DIMM module. Where can I find an IBIS file 
for a DIMM module? I do have an IBIS file for one synchronous DRAM 
chip. Or is there any other way to modify the IBIS file I have to an 
IBIS file for the DIMM module? Thanks for any response.
	Best Regards

Ming-Hao Liao, SiS Taiwan

From owner-ibis  Tue Jan 28 10:07:03 1997
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IBIS does not currently support complex objects like DIMM modules. We
are working on it but it will at least a year before there is official
EIA standard approval of any complex package methodology. If you need to
model a DIMM you will have to do it in the modeling language of whatever
simulator you are using.


sorry

Jon Powell
IBIS librarian.


ps. if any other ibis people diagree with me I'm sure they will let you
know. (and let me know too, please).
From owner-ibis  Wed Jan 29 16:14:39 1997
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Subject: Clarification of Temperature Range
Date: Wed, 29 Jan 1997 16:13:12 -0800
From: leandro <leandro@hawk.dtc.hp.com>


Hi,

I just wanted a clarification on what the temperature range values should be
for the min and max columns in the IBIS models.

From the Cookbook (what I believe is correct):
 For CMOS:
   min=max temp.  <-- slowest, weakest case
   max=min temp.  <-- fastest, strongest case

The confusion comes with the IBIS spec, which has the example of:
 variable		typ	min	max
[Temperature Range]     27.0    -50     130.0

Is this example correct???  It seems to contradict what min and max stand
for.  I think that -50 should be 150 and the 130.0 should be 0.

Thanks.

-Leandro

_________________________________________________________________
Leandro Chua
Design Engineer
HP ICBD/DTC -- PALO ALTO, CA 
Library Design Group
mail-stop: 6U-I
e-mail: leandro@dtc.hp.com  phone: (415)857-7343 fax: (415) 852-8676
_________________________________________________________________
From owner-ibis  Wed Jan 29 16:58:14 1997
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From: Arpad Muranyi <Arpad_Muranyi@ccm.fm.intel.com>
Message-ID: <Wed, 29 Jan 97 16:53:18 PST_2@ccm.fm.intel.com>
To: ibis@vhdl.org
cc: pgregory@hpdmd48.boi.hp.com
Subject: Re: Clarification of Temperature Range


Text item: 

Leandro,

If you read the section "Notes on Data Derivation Method" at the end of the 
spec. you will understand.  The cookbook didn't consider the bipolar devices.
Bipolars get stronger with higher temperatures, CMOS get weaker.  The min. 
column should get the value that makes the buffer waeker, i.e. larger number for
CMOS, smaller number for Biolar.

Arpad
=============================================================================

Hi,

I just wanted a clarification on what the temperature range values should be
for the min and max columns in the IBIS models.

From the Cookbook (what I believe is correct):
 For CMOS:
   min=max temp.  <-- slowest, weakest case
   max=min temp.  <-- fastest, strongest case

The confusion comes with the IBIS spec, which has the example of:
 variable          typ     min     max
[Temperature Range]     27.0    -50     130.0

Is this example correct???  It seems to contradict what min and max stand
for.  I think that -50 should be 150 and the 130.0 should be 0.

Thanks.

-Leandro

_________________________________________________________________
Leandro Chua
Design Engineer
HP ICBD/DTC -- PALO ALTO, CA
Library Design Group
mail-stop: 6U-I
e-mail: leandro@dtc.hp.com  phone: (415)857-7343 fax: (415) 852-8676
_________________________________________________________________

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From: leandro <leandro@hawk.dtc.hp.com>
Date: Wed, 29 Jan 1997 16:13:12 -0800
Subject: Clarification of Temperature Range
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Date: Wed, 29 Jan 97 17:05:44 -0800
From: venu@cadence.com (Venugopal Paddabhiramaieyengar)
Message-Id: <9701300105.AA03870@cds10018>
To: ibis@vhdl.org


I am interested in continuing to get latest information about ibis
Please add my name to the reflectors distribution list.

my name is venugopal pattabhiramaiyengar
my e-mail is venu@cadence.com

thanks
venu
