From owner-ibis  Tue Sep  2 09:25:58 1997
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Date: Tue, 02 Sep 97 09:03:00 PDT
From: Arpad Muranyi <Arpad_Muranyi@ccm.fm.intel.com>
Message-ID: <Tue, 02 Sep 97 09:24:24 PDT_7@ccm.hf.intel.com>
To: vchang@memh.ti.com_at_smtpgate@ccm.hf.intel.com, ibis@vhdl.org
Subject: Re: package.


Text item: 

Vincent,

1)  The I-V curves can be measured with the package around the die, because this
measurement is usually so slow that the effects of the package will not alter 
your data.

2)  Since you didn't say what causes you confusion about RLC_pgk and RLC_pin I 
am not sure how to answer.  The RLC_pkg are the global package numbers which are
in effect when nothing else is specified at the pin list.  If you know the RLC 
numbers for individual pins you can use the RLC_pin numbers which override the 
RLC_pkg defaults.

3)  Again you were not very specific with your question on the I/O pins.  I 
don't know what your confusion is, so I will just say something general.  Get 
I-V curves for it when it is driving (pullup and pulldown) and get I-V curves 
when it is 3-stated (Power and GND clamp).  The first will represent it when it 
is an output, the second when it is an input.

4)  Regarding your previous EMAIL, you didn't answer my question.  You stated 
that "In ibis model, the package is not be used on simulation. Why?" and I asked
where you got this idea from.  When you simulate with an IBIS model you will use
the package.  It is another story that you may need to remove the package from a
SPICE simulation when you are generating the V-t curves for an IBIS model.

In general, please be more precise and specific with your questions if you want 
to get more meaningful help.  This way we can only guess what your problems 
could be.  Also, most of my responses are described in the IBIS specification.  
It is a good thing to read the spec first (carefully) and then post questions to
the reflector if you still don't understand something.  As they say "If all else
fails, read the manual"...  Of course, the spec is not something that is very 
entertaining, but there are a lot of good things in it.

I hope this helps,

Arpad
===============================================================================

Arpad,

In the COOK book, it states,
===============================================================================
To behaviorally represent any such buffer requires the following
information:

    the I-V characteristics of the power clamp or ESD diodes
    the input or output capacitance of the buffer
    the characteristics of the package (the values of the lead
    inductance, resistance, and capacitance)

Output and I/O buffer representations also require:

    the current vs. voltage (I-V) characteristics of the buffer in both
    low and high states
    the rise and fall time of the buffer when switching
===============================================================================

Are the I-V characteristics of the buffer been measured with
package(R,L,C)?

Also, I am confused with RLC_pgk and RLC_pin. Oh, do you know how to
handle Bi-direction pin(I/O pins)? I am not very clear on how to
model this type of pins.

Please help me to clear these confusions. Call me if you want.
Thank you in advance.

--
Best Regards,

               Vincent Chang


=======================================================================
*  Vincent Chang                         TI MSG ID: hui8              *
*  Design Automation                     mailto:vchang@memh.ti.com    *
*  Memory Products Design                http://www.memh.ti.com/~mcad *
*  Texas Instruments Inc. MS 657         Phone: (281) 274-3167        *
*  PO Box 1443, Houston, TX 77251        Fax:   (281) 274-2067        *
=======================================================================

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Subject: package.
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Date: Fri, 29 Aug 1997 15:49:53 -0500
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From owner-ibis  Fri Sep  5 12:26:00 1997
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Sender: dc.sessions@tempe.vlsi.com (D.C. Sessions)
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Date: Fri, 05 Sep 1997 12:23:45 -0700
From: "D. C. Sessions" <dc.sessions@tempe.vlsi.com>
Organization: VLSI Technology Inc.
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Subject: BIRD 42.3
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As long ago promised, here's a talking case for BIRD42.3
For simplicity, I've restricted the case to a very simple
falling-edge behavioral model.  The driver in question
is a 50-ohm switched resistor, with the following
time/conductance tables.  The pulldown driver is common,
but there are two different pullup responses:  All
listed conductances are piecewise linear.

  Time  |  Pulldown   |	 Pullup #1  |  Pullup #2  |
        | Conductance |	Conductance | Conductance |
--------+-------------+-------------+-------------+
   0 ps |     0 mS    |	   20 mS    |    20 mS    |
 500 ps |     0 mS    |	   20 mS    |    20 mS    |
1000 ps |     0 mS    |	   10 mS    |    20 mS    |
1500 ps |     0 mS    |	    0 mS    |     0 mS    |
2000 ps |    10 mS    |	    0 mS    |     0 mS    |
2500 ps |    20 mS    |	    0 mS    |     0 mS    |
3000 ps |    20 mS    |	    0 mS    |     0 mS    |

As is typical for real-world drivers, these are
break-before-make.

*IF* the load had time to settle completely to zero
current before the next edge, there would be no
difference between them; however, in real high-speed
switching even unterminated lines take too long to
settle and thus the pullup is still sourcing current
when this schedule starts. Obviously, a terminated
line is even worse; either way the turnoff of the
pullup has important consequences.

IMNSHO, this effect is far more important than the
(extremely rare) case of major crowbar current,
and any solution to this will necessarily also take
care of those few instances where crowbar current
is actually significant.

-- 
D. C. Sessions
dc.sessions@tempe.vlsi.com
 
From owner-ibis  Fri Sep  5 14:42:22 1997
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From: MIKL%mimi@magic.itg.ti.com
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Date: Fri, 5 Sep 97 16:40:24 CDT
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To: ibis@vhdl.org
Subject: IBIS Representation for Branching Conductors

From: MIKE LAMSON    MIKL
 
Subj: IBIS Representation for Branching Conductors
 
 
An IBIS question:
I have a package that has a power distribution bus over the chip that is
connected to two external pins.  The bus also has many points where it is
wire bonded to the chip.  There is also a similar ground bus in the same
package.  This is a common lead frame design used in DRAM memories.  Can
this be readily represented by an IBIS format?  A SPICE file can be easily
generated for this.  Can this be converted to IBIS?
 
Thanks and regards,
 
Mike Lamson
m-lamson@ti.com
 
 
From owner-ibis  Mon Sep  8 08:46:15 1997
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To: MIKL%mimi@magic.itg.ti.com
Cc: ibis@vhdl.org
Subject: IBIS Representation for Branching Conductors
Date: Mon, 08 Sep 1997 08:44:46 -0700
From: Stephen Peters <sjpeters@ichips.intel.com>


Hello Mike:

     The short answer to your question is yes -- but in not a 
great amount of detail.  The [Pin Mapping] keyword allows one
to specify which buffers are connected to which power and ground
pin(s) on a package, thereby allowing the user to "create" common 
power or ground bus in a package.  The power and ground pins 
themselves can be given a lumped L/R/C value via the [Pin] keyword.  
However, the IBIS description does not allow one to describe the 
distributed L/R/C of the power distribution grid itself.  For a 
detailed network type description of the package one would need to 
use a SPICE representation.

              Regards,
              Stephen Peters
              Intel Corp.


>On Fri, 5 Sep 97 16:40:24 CDT  Mike Lamson wrote:

From: MIKE LAMSON    MIKL
 
Subj: IBIS Representation for Branching Conductors
 
 
An IBIS question:
I have a package that has a power distribution bus over the chip that is
connected to two external pins.  The bus also has many points where it is
wire bonded to the chip.  There is also a similar ground bus in the same
package.  This is a common lead frame design used in DRAM memories.  Can
this be readily represented by an IBIS format?  A SPICE file can be easily
generated for this.  Can this be converted to IBIS?
 
Thanks and regards,
 
Mike Lamson
m-lamson@ti.com
 
 
From owner-ibis  Tue Sep  9 09:22:46 1997
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To: ibis@vhdl.org
Subject: IBIS Open Forum Teleconference Minutes 9/5
Date: Tue, 09 Sep 1997 09:21:15 -0700
From: Stephen Peters <sjpeters@ichips.intel.com>



 DATE: September 9, 1997

 SUBJECT: 9/5/97 EIA IBIS Open Forum Minutes
  
 VOTING MEMBERS AND 1997 PARTICIPANTS LIST:
 AMP                            Jeff Walden
 Applied Simulation Technology  [Dileep Divekar], Norio Matsui, Raj Raghuram*,
                                Fred Balistreri
 Cadence Design & UniCAD        C. Kumar, Don Telian, Cameron Seitz
 Cypress                        Bruce Wenniger
 Digital Equipment Corp.        Jeff Chu
 High Design Technology         (Razvan Ene)
 HyperLynx                      Kellee Crisafulli, Steve Kaufer, Matthew Flora*
 INCASES                        Olaf Rethmeier*, Werner Rissiek
 Intel Corporation              Stephen Peters*, Arpad Muranyi, Henry Maramis,
				Will Hobbs, Frank Kern*
 Interconnectix                 Bob Ross*
 Mitsubushi                     Tam Cao, Hoang Nguyen
 Motorola                       [Ahmed Omer], Michael Desiderio, Paul Bolden,
                                Tom Myers, Rob Wenzel
 National Semiconductor         Syed Huq*, Cheng-Yang Kao, Mike Bristol,
				Peter Laflamme, Kevin Smith
 NCR                            Dave Moxley*, Richard Mellitz
 NEC                            (Hiroshi Matsumoto)
 Quantic EMC                    (Mike Ventham)
 Texas Instruments              Thomas Fisher
 Thomson-CSF/SCTF               (Jean LeBrun)
 Viewlogic                      Jon Powell, Chris Rokusek*, Peivand Tehrani
                                Graham Bell*
 VeriBest                       Ian Dodd*, William Bell, Dave Wien*
 VLSI Technology                Harish Patel, D.C. Sessions*
 
 OTHER PARTICIPANTS IN 1997:
 3M                             [Fran Hart]
 Actel                          Scott Schlachter
 Acuson & Free Model Foundation Richard Munden
 Alcatel                        John Fitzpatrick
 Ansoft                         Eric Bogatin
 Apteq Design Systems           Dan FitzPatrick 
 Compaq                         Weston Beal, Mark Leonard
 Dell Computer                  Dave Baranauskas, Doug Wallace
 EIA                            Patti Rusher*
 EMC                            Fabrizio Zanella
 Hewlett Packard, EEsof         Karl Kachigan, Henry Wu
 Hewlett Packard, France        Jean-Christophe Pautrat
 Hitachi                        Saburo Hojo, Yasushi Ogawa 
 IBM                            Brad Herrman
 Interface Technology           Dan Waterloo 
 Micron Technology              Brian Johnson                      
 Molex                          Gus Panella
 North Carolina State U.        (Michael Steer)
 S3, Inc.                       Porsh Shih, Sarathy Sribhashyam
 Symmetry                       Andy Hughes
 TRW                            Ray Steele
 Ultratest International        Charles Im
 Zeelan Technology              George Opsahl 

 In the list above, attendees at the meeting are indicated by *.  Principal
 members or other active members who have not attended are in parentheses.
 Participants who no longer are in the organization are in square brackets.

 Upcoming Meetings:  The bridge numbers for future IBIS teleconferences are as
 follows:
     
   Date               Bridge Number     Reservation #    Passcode
   September 9       (916) 356-9200     1-178721        5387488

 All meetings are 8:00 AM to 9:55 AM Pacific Time.  We try to have agendas out 
 7 days before each Open Forum and meeting minutes out within 7 days after.  
 When you call into the meeting, ask for the IBIS Open Forum hosted by Will 
 Hobbs and give the reservation number and passcode.
 
 NOTE: "AR" = Action Required.

 -------------------------------- MINUTES -------------------------------------

 INTRODUCTIONS AND MEETING QUORUM
 The following new participants introduced themselves:

 Raj Raghuram is taking over the Applied Simulation Technology representation.
 While most of his involvement has been at his current company, he has also
 been involved with Syed Huq at National Semiconductor doing IBIS model
 development.

 Graham Bell from Viewlogic, Fremont, CA is interested in the modeling problem
 for marketing support for some of Viewlogic's signal integrity products.

 Dave Wien of Veribest is involved in marketing their signal integrity 
 products and related IBIS issues.
 

 MEMBERSHIP UPDATE AND TREASURER'S REPORT
 Patti Rusher did not have a current membership or treasurer's report.  (The
 last report was $5,272.)  Bob Ross and Patti had carried out an off line
 discussion concerning budget and membership status, but the questions still
 need to be resolved.


 REVIEW OF MINUTES AND AR'S
 Matthew Flora's written name was corrected from Matt Flora, although he goes
 by both Matt or Matthew in conversation.  Patti Rusher's name was corrected
 from Pattie in a few locations.

 Stephen Peters reviewed the AR's.  D.C Sessions has completed his AR 
 (explaining the best way to modify a SPICE transistor model to get realistic 
 power and ground clamp curves) and Bob Ross has supplied both his text 
 examples for the cookbook.  The major outstanding A/Rs are examples for the 
 Cookbook and BIRDs and will be carried forward.


 MISCELLANY/ANNOUNCEMENTS
 Bob Ross announced that he will use one of the accepted aliases "eda.org"
 in place of "vhdl.org" as the site location for IBIS documents and mailing
 addresses.  This nomenclature is more representative of the EIA/IBIS Open
 Forum since IBIS has no technical association with VHDL.

 D.C. Sessions noted that VLSI Logic annual technical center training will
 include a session on IBIS taught by D.C.

 
 PRESS AND WEB PAGE UPDATES
 Syed Huq has made some roster updates.  Also, a member company plans to submit
 a logo for the poster page after going through the authorization steps.

 Bob Ross reported that Syed's Open tutorial on "Understanding and Using
 IBIS Models for Signal Integrity Analysis" is listed in the High-level 
 Electronic System Design Conference (HESDC '97) insert that has appeared
 in several magazines.  It is scheduled October 7-9, 1997 in San Jose, CA.

 Bob also noted that the "HyperLynx Upgrades HyperSuite" in EE Times, p. 63,
 August 25, 1997 mentions IBIS.

 Bob noted that the final column in Howard Johnson's Straight Talk for Serious
 Digital Designers titled "The Real Truth About Crosstalk" in Electronic
 Design, August 18, 1997, pg. 115, mentions IBIS at the end.

 Finally, Bob noted that two references to IBIS exist in the September, 1997
 issue of Printed Circuit Design.  The IBIS Version 3.0 press release is
 given on page 9, and Shelly Nielsen's writeup on the PCB Design Conference
 East, in Boston, September 15-19, 1997, references Bob's course on "Practical
 Issues with IBIS Models".


 NEW MODELS AVAILABLE, LIBRARY UPDATE
 D.C. Sessions states that VLSI Technology has pulled their IBIS models from
 their web page.  He had written on the reflector that they represented
 obsolete products and that they are discussing how to deal with future IBIS
 models (whether by Web site or by CD ROM).  He also indicated later that
 some new features of IBIS Version 3.0 would have been useful even for these
 models.  He will make available IBIS model with new features for testing.

 Bob Ross noted that IBM Microelectronics is offering downloadable IBIS models
 to registered users at:

   http://www.cips.ibm.com/products/memory/selguide/modelmenu.html

 Jon Powell has updated the EIA/IBIS Web page models section with the above
 changes.

 Syed reported that National has placed two new SuperI/O IBIS models on their
 Web page.


 OPENS FOR NEW ISSUES
 Matthew Flora on reporting ibischk2+ problems
 Dave Wien on s2ibis for NT status


 INTERNATIONAL PROGRESS
 - 93/46/NP (IBIS Version 2.1) - Patti Rusher reported that the US Technical
   Advisorary Group (TAG) is tracing the documentation associated with this
   effort.  Patti expects more details after the Tokyo IEC meeting in
   September, 1997 concerning the status and response to 93/46/NP.

 - 93/60/NP (IBIS Models and EMC Simulation) - Patti reported that the US TAG
   has conditionally voted yes, pending a better definition of the scope of
   this effort.  She should have more information after the Tokyo IEC meeting.

 - EIAJ III (I/O Interface Model for ICs) - Patti reports that this proposal
   has been forwarded to the WG3.  The EIAJ subcommittee has been invited to
   give at presentation at an industrial forum at the IEC meeting.
 

 EAST COAST IBIS USERS GROUP
 Bob Ross reported that Dr. Ed Sayre of North East Systems Associates (NESA)
 has set up an East Coast IBIS Users meeting in Stow, Massachusetts on
 Thursday, September 18, 1997 from 2 p.m. onward.  Ed expects about 25 people
 at the initial meeting.  Information has been posted on the ibis-users 
 reflector.  More details are expected to be posted soon.  The agenda of this
 first meeting will also cover organizational details.  In addition, Ed expects
 to have several presentations.  Bob also noted that he is having some very
 preliminary discussion separately on a possible IBIS meeting associated with
 EuroDAC in France in February, 1998.


 S2IBIS FOR NT
 Dave Wiens plans to post the improved s2ibis_ver1.3 for NT on the VeriBest
 Web site where links already exist from the EIA/IBIS Web page and other sites.
 Work still exists to create the latest s2ibis2_ver2.1 files.  Bob Ross
 did not want the earlier version posted since there have been several 
 significant changes, even though, according to Ian Dodd, the number of file
 differences are small.  So partial compliance with the AR is expected soon.

 AR - Ian Dodd put s2ibis_ver1.3 and s2ibis_ver2.1 for Windows on the VeriBest
 Web site.


 EDITING COMMITTEE 
 Stephen Peters reported that he and Bob Ross met to go over some issues.  They
 developed an outline for sectioning the document.  The outline included an
 introduction section which will give more scope and detail.  Also after review
 Stephen and Bob agreed to some of the terms proposed by Ogawa-san of the
 EIAJ subcommittee.  Some additional detail to clarify "required" keywords
 was discussed since they provide only a minimal set.  Some non-required
 keywords are really technically required if they are applicable.  Perhaps a
 table will be added for this as in the Cookbook.
 
 Bob and Stephan still plan a first pass to be put in the work in progress
 directory (wip).

 The existing ARs are still in effect.

 AR - Bob Ross generate and post a BNF for IBIS Version 3.0 (and IBIS Version
 3.0 ratification AR).

 AR - Stephen Peters and Bob Ross generate an editorial revision of Version 3.0
 and place it in the eda.org/pub/ibis/wip directory.


 BIRD44 - INTERPRETATION OF MIN/MAX/WEAK/STRONG DATA
 Per the discussion of last meeting, Bob Ross has moved BIRD44 discussion into
 the Editing Committee Area since BIRD44 relates to an editorial issue.  It
 proposes changing the min and max column headings to weak and strong, where
 applicable under the [Model] keyword.  BIRD44 will be considered more closely
 at a later time as part of the the Version 3.0 editorial activity.


 VERSION 2.1 PARSER (& S2IBIS) BUG REPORTING
 Matthew Flora opened the discussion on this new item.  He has discovered some
 bugs with the existing ibischk2+ code and wanted to know how to report them.
 One bug was that a [Pullup] or [Pulldown] table with no data was not flagged,
 and another involved a crash after a keyword was positioned after the [End]
 statement.

 Matthew is aware of the /pub/ibis/bugs directory under eda.org where ibischk
 bug information and a report form is stored and is also aware of the email 
 address ibischk-bug@eda.org.  His major concern is that the process is not
 documented on from the EIA/IBIS Web site or as a Frequently Asked Question
 (FAQ).  D.C. Sessions suggested an FTP site where bug test could be sent.
 They could be used for subsequent testing.  After some discussion, Matthew
 will work with Syed Huq concerning providing process information.

 AR - Matthew Flora work with Syed Huq regarding generating an FAQ and also
 an informative link from the EIA/IBIS Open Forum Web page on how to report
 bugs on ibischk parsers.

 Chris Rokusek asked whether a help switch could be added to the ibischk2+
 parser that would generate a bug report form.  The consensus was that this
 would be a good idea.  Chris also noted that the nomenclature should have
 been version 2.114 rather than 2.14.  Bob Ross stated that if changes are
 made, the parser should be nomenclated as 2.115.  Bob also noted that anyone
 who has purchased the source code license for ibischk2 can get the source
 code for these newer versions.

 Syed confirmed that ibischk2+ provides its version number, in response to
 a question by Matthew.

 The question arose where to report s2ibis bugs.  They are to be handled by
 the EIA/IBIS Open Forum, rather than by NCSU.  After some discussion Bob
 agreed to create a bug form and set up another directory for s2ibis bugs.

 AR - Bob Ross set up a bug directory for s2ibis bugs, and create a bug form.
 Bob will also work out a bug reporting process.


 VERSION 3.1 PARSER
 Bob Ross reported that one bid has come in and we are waiting for others.
 Bob also noted that in the past the source code licenses cost $500 each for
 ibis_chk and ibischk2.  This covered the contracted development cost with
 some margin since several purchases were made after the code had been
 developed.  Over 20 companies have paid for licenses for ibischk2.  The
 benefit for many companies is simply to help the development expense for
 the common benefit of all and also to get an early view as the code is
 being developed.  In some cases, they can perform early checks for IBIS models
 under development with the newer features before the official parser is
 considered complete and is released.

 The bids are expected to be higher than in the past.  In anticipation of this
 Bob wanted to get a sense of how much companies are willing to pay to share
 the cost of ibischk3.  Bob was probing the $2000 to $5000 range for each 
 company (with the expectation that fewer companies would join in to license
 the source code.)  If you are interested in licensing the source code, please
 respond privately to Bob Ross regarding about how much you would be willing
 pay to share the ibischk3 development expense. (Bob will also phone around to
 get a sense of commitment level.)  Based on some preliminary discussion,
 the $2,000 to @2,500 range seemed tolerable.  Bob indicated that a payment
 commitment that covers the total cost will be needed before we can accept
 any bid.

 Bob also raised the idea that individual companies such as Interconnectix
 may consider using internal staff to develop such a parser.  Other companies
 that might consider this include Hyperlynx, Viewlogic, VeriBest and Cadence,
 since they already have IBIS experience and need such a parser.  Consistent
 with the existing licensing policy, some fee would be set for licensing the
 source code.  With this arrangement, the company could get at least partial
 compensation for the internal effort.  Bob's main question was if anyone
 objected to pursuing this option.  No objections were raised.

 Chris Rokusek commented that if a company did the development, they would
 have to maintain the code indefinitely.  Bob commented that after the
 parser is released and accepted the company could expect to be compensated
 for additional work, especially if it involved a lot of effort.  We have 
 paid for additional work for ibischk2 fixes (and enhancements) in the past.

 Ian Dodd commented that some of the Version 3.0 enhancements are very easy
 to add.  Others, such as series switches, are difficult to understand
 and therefore may be costly to include.  Bob stated that this is one of the
 major benefits of developing the ibischk3 parser - discover and resolve the
 ambiguous areas of IBIS Version 3.0.  This has worked well in the past
 leading to IBIS Version 1.1 and IBIS Version 2.1 documents.

 Bob asked Chris to join him, Jon Powell, Syed Huq and Stephen Peters on the
 ibischk3 proposal review committee.


 LEGAL IBIS VERSION 3.0 FILES
 Bob Ross reported that some "legal" concerns were raised at the last meeting
 regarding issuing IBIS Version 3.0 that have not been validated using the
 non-existent ibischk3 parser.  Jon Powell initiated some further discussion
 on the ibis reflector, without resolution.  Stephen Peters felt that the
 IBIS model should be corrupted in some manner (issued as a .txt file or
 have the [IBIS Ver] designation "preliminary" so that the earlier releases
 would be guaranteed to fail ibischk3) until formally checked.  Bob felt that
 some method was needed, but that the existing comments and disclaimer methods
 and [File Rev] control were sufficient without introducing corruption.  There
 is now a "chicken and egg" situation where companies are now including IBIS
 Version 3.0 features that require uncorrupted IBIS Version 3.0 models.  The
 user could introduce error while undoing the corruption.

 Bob also stated that "legal" was not a good term since it implies
 compliance to a (copyright) law, whereas he understood the intended meaning
 to be "in (legal) compliance with the documented IBIS Version 3.0 syntax.  

 Stephen suggested that the committee take a position on this, and Bob
 suggested a general statement that we can all agree to - while each company
 will decide their own IBIS model release policy with IBIS Version 3.0
 features, we strongly suggest that the models be clearly documented at the
 top with the statement that it is released without having been checked with
 the (to be developed) ibischk3 syntax checker and is therefore subject to
 error.  A subsequent release of the model when the ibischk3 checker is 
 available may contain syntactical corrections.
 

 COOKBOOK
 Stephen Peters reported that D.C. Sessions and Bob Ross have provided him
 write ups and an example per ARs.  D.C. provided the writeup on getting
 realistic clamping information, and Bob provided a section on diode transit
 time and a series switch example.  Other AR's remain in effect.

 Stephen will make some additions and work with Bob to put the cookbook into
 the work in progress directory (/pub/ibis/wip) in eda.org.  The document
 Version Number will be used to document new version.  After some discussion
 and reviewing what we agreed to at the last meeting, Syed Huq will provide
 a link from the official EIA/IBIS Web page to this document.  He will include
 the appropriate warnings that the Cookbook is just a preliminary version that
 will undergo revision.  The Version Number of any Cookbook document needs
 to be checked with the posted document to assure that the latest Cookbook
 Document is being used.

 AR - The following people have volunteered to supply examples
  Steve Kaufer/Hyperlynx -- Example 1 (Version 1.1 basic model)
  Arpad Muranyi - Example 2
  Stephen Peters - Example 3 

 AR - Syed Huq.  Review and expand (if necessary) Section 3.3. on "Obtaining
 I/V and Switching Information via Lab Measurement".

 AR - Stephen Peters with Bob Ross put a copy of the Cookbook in the
 eda.org/pub/ibis/wip directory after appropriate Version Number and 
 preliminary disclaimers are added.

 AR - Syed Huq provide a link to access the Cookbook document from the official
 EIA/IBIS Web Site after the Cookbook is uploaded.

  
 BIRD42.3 - MODELING CURRENT WAVEFORMS
 D.C. Sessions has not gotten together with C. Kumar regarding some technical
 discussion on where rising and falling waveform table do not produce the 
 correct response.  Instead, D.C. plans to put the discussion on the IBIS
 reflector.  So the AR now reflects this change.

 AR - D.C. Sessions provide an example on the IBIS reflector showing
 where the rising and falling waveform tables do not result in correct
 results [Done].


 SWITCHING TERMINATORS
 No Report.


 MISCELLANEOUS DISCUSSION
 Frank Kern asked if CAE Vendors are adding Version 3.0 features.  Bob Ross
 and Dave Wien responded that Interconnectix and VeriBest will have some
 IBIS Version 3.0 features in their next releases.

 Bob then asked what the semiconductor vendors view as the most important
 IBIS Version 3.0 features for inclusion by CAE Vendors.  A similar discussion
 occurred during the Version 2.1 development and helped CAE Vendors prioritize
 their development activities.  This discussion will be added to next
 meetings agenda.

 D.C. Sessions indicated that VLSI really requires the buffer selection
 addition [Model Selector].  Even older IBIS models needed this. Frank Kern
 suggested that this be a discussion topic at the next meeting since he needs
 to research this question.  Syed Huq wanted all of the features since he felt
 that excluding any feature gave permission for CAE Vendors never to implement
 it.  From a user's perspective, Dave Moxley did not have any specific need
 beyond Version 2.1.  However, he could use series switches if its 
 implementation is realistic and not too cumbersome.


 NEXT MEETING:
 The next meeting is on Friday, September 26, 1997, 8:00 A.M. to 9:55 A.M.
 ==============================================================================
				       NOTES
 
 IBIS CHAIR: Bob Ross (503) 603-2523, Fax (503) 639-3469
	     bob@icx.com
	     Modeling Engineer, Interconnectix
	     10220 SW Nimbus Ave, K4, Portland, OR 97223

 VICE CHAIR: Syed Huq (408) 721-4874, Fax: (408) 721-4785
	     huq@rockie.nsc.com
	     Staff Applications Engineer, National Semiconductor, M/S A-2595
	     2900 Semiconductor Drive, Santa Clara, CA 95052
 
 SECRETARY:  Stephen Peters (503) 264-4108, Fax: (503) 264-4515
	     sjpeters@ichips.intel.com
	     Senior Hardware Engineer, Intel Corporation
             M/S JF1-56
	     2111 NE 25th Ave. 
             Hillsboro, Oregon 97124-5961

 LIBRARIAN:  Jon Powell (805) 988-8250, Fax: (805) 988-8259
	     jonp@qdt.com
	     Senior Scientist, Viewlogic (formerly Quad Design)
	     1385 Del Norte Rd., Camarillo, CA 93010
  
 This meeting was conducted in accordance with the EIA Legal Guides and EIA
 Manual of Organization and Procedure.
 
 The following e-mail addresses are used:

   ibis-request@eda.org
       To join, change, or drop from either the IBIS Open Forum Reflector
       (ibis@eda.org), the IBIS Users' Group Reflector (ibis-users@eda.org)
       or both.  State your request.

   ibis-info@eda.org
       To obtain general information about IBIS, to ask specific questions
       for individual response, and to inquire about joining the EIA-IBIS
       Open Forum as a full Member.

   ibis@eda.org
       To send a message to the general IBIS Open Forum Reflector.  This
       is used mostly for IBIS Standardization business and future IBIS
       technical enhancements.  Job posting information is not permitted.

   ibis-users@eda.org
       To send a message to the IBIS Users' Group Reflector.  This is 
       used mostly for IBIS clarification, current modeling issues, and
       general user concerns.  Job posting information is not permitted.

   ibischk-bug@eda.org
       To report ibischk2 parser bugs.  The Bug Report Form Resides on
       eda.org in /pub/ibis/bugs/bugform.txt along with reported bugs.

 Information on IBIS technical contents, IBIS participants, and actual
 IBIS models are available on the IBIS Home page found by selecting the
 Electronic Information Group under:

   http://www.eia.org

 Check the pub/ibis directory on eda.org for more information on previous 
 discussions and results.  You can get on via FTP anonymous.
 
 "IBIS Spoken Here" placards are available from Jon Powell (jonp@qdt.com) for 
 use at trade shows.
 ==============================================================================








 
From owner-ibis  Tue Sep  9 16:41:53 1997
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Date: Tue, 09 Sep 1997 16:40:38 -0700
To: ibis@vhdl.org
From: Kellee Crisafulli <kellee@hyperlynx.com>
Subject: Testing the V3.0 IBIS golden parser.
Mime-Version: 1.0
Content-Type: text/plain; charset="us-ascii"

Hi All,

  It has occurred to me that we should make a priority out of
releasing golden parser test models.  Whom ever develops the golden
parser will need test models to verify it is working.

For example:
  - The new IC package format (Intel)
  - The new R,C package information (Interconnectix)
  - The new connector information (Interconnectix)
etc....

  It seems to me that it is a waste of effort to launch a development effort if we
don't have a few beta models for the parser developer to test with.

Is anyone willing to give a some of the more unusual 3.0 models to the parser
development team to test with.  I believe we should start a sub-directory
for some beta models to test with.



  

-------------------------------------------------------------------------
Have a great day...
Kellee Crisafulli at HyperLynx
kellee@hyperlynx.com	http://www.hyperlynx.com
-------------------------------------------------------------------------
 
From owner-ibis  Wed Sep 10 15:29:12 1997
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Date: Wed, 10 Sep 1997 05:51:35 -0700 (PDT)
From: bob@icx.com ( Bob Ross)
To: ibis@eda.org, kellee@hyperlynx.com
Subject: Re:  Testing the V3.0 IBIS golden parser.

Kellee and IBIS Committee:

Thank you for your suggestion.  Any test case with Version 3.0
extensions are welcome.  Stephen Peters is collecting some samples as
part of the Cookbook update project.  So I would suggest sending
them to Stephen.

Also in response to your suggestion and to elaborate regarding
ibischk issues in general, I have these points:

(1)  I have created a new eda.org/pub/samples subdirectory with
areas for ver1.1, ver2.1, and ver3.1 samples.  I seeded the ver3.0
directory with a cbt.ibs sample for a Series Switch part.  It 
contains a disclaimer that it has not been checked with the
ibischk3 parser (which is to be developed.)

(2)  Matthew Flora of Hyperlynx has submitted through the ibischk-bug@eda.org
reflector BUGS 9 through 13 on ibischk2, etc.  They will be discussed
at the next meeting.  They are located at eda.org/pub/ibis/bugs.

(3)  Matthew also compiled a 32 bit version of ibischk2+ for DOS systems.
The executable is located under eda.org/pub/ibis/ibschk2+/dos32.

(4)  Finally, Stephen and I plan to extend the Version 2.1 Test Matrix
used to define the functional elements of the standard to Version 3.0
functionality.  This will also be used to define the tested features of
ibischk3.

Bob Ross
Interconnectix


> Date: Tue, 09 Sep 1997 16:40:38 -0700
> To: ibis@vhdl.org
> From: Kellee Crisafulli <kellee@hyperlynx.com>
> Subject: Testing the V3.0 IBIS golden parser.

> Hi All,

>   It has occurred to me that we should make a priority out of
> releasing golden parser test models.  Whom ever develops the golden
> parser will need test models to verify it is working.

> For example:
>   - The new IC package format (Intel)
>   - The new R,C package information (Interconnectix)
>   - The new connector information (Interconnectix)
> etc....

>   It seems to me that it is a waste of effort to launch a development effort if we
> don't have a few beta models for the parser developer to test with.

> Is anyone willing to give a some of the more unusual 3.0 models to the parser
> development team to test with.  I believe we should start a sub-directory
> for some beta models to test with.

>   

> -------------------------------------------------------------------------
> Have a great day...
> Kellee Crisafulli at HyperLynx
> kellee@hyperlynx.com	http://www.hyperlynx.com
> -------------------------------------------------------------------------


 
From owner-ibis  Fri Sep 12 13:49:20 1997
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From: mohali@usr.com
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Date: Thu, 11 Sep 1997 15:29:42 -0500
Message-ID: <419ACFD0.3000@usr.com>
Subject: SPICE simulator
To: ibis@vhdl.org
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Content-Description: cc:Mail note part

     I am looking for an inexpensive unix-based SPICE simulator that I can 
     use as the back-end engine of my s2ibis converter. The only tool I 
     know is HSPICE from Meta Software. But it is very expensive.
     
     Does anybody has any info on this?
     
     
     Mohammad Ali, Ph.D.
     3Com Corpration
     Email: mohali@usr.com
 
From owner-ibis  Fri Sep 12 17:13:03 1997
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From: Lynne Green <lgreen@cdac.com>
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Date: Fri, 12 Sep 1997 17:10:38 -0700 (PDT)
Message-Id: <199709130010.RAA17753@quark.cdac.com>
To: mohali@usr.com
Subject: Re: SPICE simulator
Cc: ibis@vhdl.org

Dr. Ali -

Try SPICE 2G6 - it is in the public domain.  It does lack a few features,
like a decent postprocessor.  But you can buy separate postprocessors that
work off the spice output files.

Since it is in FORTRAN, you can compile it on any machine, including UNIX.

- Lynne Green
 
From owner-ibis  Wed Sep 17 01:23:34 1997
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Date: Wed, 17 Sep 1997 16:25:32 +0800
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Organization: VIA TECH
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Dear Sir:

    I wanna subscribe as a member. My email address is
justine_yu@via.com.tw.

Sincerely,

Justine

 
From owner-ibis  Wed Sep 17 12:18:11 1997
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From: Chris Rokusek <crokusek@qdt.com>
To: ibis@vhdl.org
Subject: length

Hi All,

I have a Question on the [Path Description] section in Ver 3.x of .ibs...

How do we convert the "Len"'s to physical lengths--what are the
"units" (meters?).

-Chris Rokusek
Viewlogic/MTS



|=============================================================================
|     Keyword:  [Path Description]
|    Required:  Yes
| Description:  This keyword allows the user to describe the connection
|               between the user accessible pins of a part and the pins of the
|               ICs mounted on that part.  Each pin to node connection is
|               divided into one or more cascaded "sections", where each
|               section is described in terms of it's L/R/C per unit length.
|               The Fork and Endfork subparameters allow the path to branch to
|               multiple nodes, or another pin.  A path description is
|               required for each pin whose signal name is not "GND", "POWER"
|               or "NC".
|
|               Board Description and IC Boundaries:
|
|               In any system, each part interfaces with another part at some 
|               boundary.  Every part model must contain the components 
|               necessary to represent the behavior of the part being modeled 
|               within its boundaries. The boundary definition depends upon 
|               the parts being represented by the model.
|
|               For CARD EDGE CONNECTIONS such as a SIMM or a PC Daughter 
|               Card plugged into a SIMM Socket or Edge Connector, the 
|               boundary should be at the end of the board card edge pads as 
|               they emerge from the connector.
|
|               For any THROUGH-HOLE MOUNTED PART, the boundary will be at the
|               surface of the board on which the part is mounted.
|
|               SURFACE MOUNTED PART models end at the outboard end of their
|               recommended surface mount pads.
|
|               If the board level component contains an UNMATED CONNECTOR,
|               the unmated connector will be described in a separate file,
|               with its boundaries being as described above for the
|               through-hole or surface mounted part.
|
|  Sub-Params:  Len, L, R, C, Fork, Endfork, Pin, Node
| Usage Rules:  Each individual connection path (user pin to node(s))
|               description begins with the [Path Description] keyword and a
|               path name, followed by the subparameters used to describe the
|               path topology and the electrical characteristics of each
|               section of the path.  The path name must not exceed 40
|               characters, blanks are not allowed, and each occurrence of the
|               [Path Description] keyword must be followed by a unique path
|               name.  Every signal pin (pins other than POWER, GND or NC)
|               must appear in one and only one path description per [Begin
|               Board Description]/[End Board Description] pair.  Pin names do
|               not have to appear in the same order as listed in the [Pin
|               List] table.  The individual subparameters are broken up into
|               those that describe the electrical properties of a section,
|               and those that describe the topology of a path.
|
|               Section Description Subparameters:
|
|               The Len, L, R, and C subparameters specify the length, the
|               series inductance and resistance and the capacitance to ground
|               of each section in a path description.
|
|               Len     The physical length of a section.  Lengths are given
|                       in terms of arbitrary 'units'.  Any non-zero length
|                       requires that the parameters that follow must be
|                       interpreted as distributed elements by the simulator.
|               L       The series inductance of a section, in terms of
|                       'inductance/unit length'.  For example, if the total
|                       inductance of a section is 3.0 nH and the length of
|                       the section is 2 'units', the inductance would be
|                       listed as L = 1.5 nH  (i.e. 3.0 / 2). 
|               C       The capacitance to ground of a section, in terms of
|                       capacitance per unit length.
|               R       The series DC (ohmic) resistance of a section, in
|                       terms of ohms per unit length.
|
|               Topology Description Subparameters:
|
|               The Fork and Endfork subparameters denote branches from the 
|               main pin-to-node or pin-to-pin connection path.  The Node 
|               subparameter is used to reference the pin of a component or
|               board as defined in a .ibs or .ebd file.  The Pin subparameter
|               is used to indicate the point at which a path connects to a
|               user visible pin.
| 
|               Fork    This subparameter indicates that the sections
|                       following (up to the Endfork subparameter) are part
|                       of a branch off of the main connection path.  This
|                       subparameter has no arguments.
|               Endfork This subparameter indicates the end point of a branch.
|                       For every Fork subparameter there must be a
|                       corresponding Endfork subparameter.  As with the Fork
|                       subparameter, the Endfork subparameter has no
|                       arguments.
|               Node    reference_designator.pin
|                       This subparameter is used when the connection path
|                       connects to a pin of another, externally defined part.
|                       The arguments of the Node subparameter indicate the
|                       pin and reference designator of the external
|                       component.  The pin and reference designator portions
|                       of the argument are separated by a period (".").  The
|                       reference designator is mapped to an external
|                       component description (another .ebd file or .ibs file)
|                       by the [Reference Designator Map] Keyword.  Note that
|                       a Node MUST reference a model of a passive or active
|                       component.  A Node is not an arbitrary connection
|                       point between two elements or paths.
|               Pin     This subparameter is used to mark the point at which
|                       a path description connects to a user accessible pin.
|                       Every path description must contain at least one 
|                       occurrence of the Pin subparameter.  It may also
|                       contain the reserved word NC.  The value of the Pin
|                       subparameter must be one of the pin names listed in
|                       the [Pin List] section.
|
|               Using The Subparameters to Describe Paths:
|
|               A section description begins with the Len subparameter and
|               ends with the slash (/) character.  The value of the Len, L,
|               R, and C subparameters and the subparameter itself are
|               separated by an equals sign (=); whitespace around the equals
|               sign is optional.  The Fork, Endfork, Node and Pin
|               subparameters are placed between section descriptions (i.e.,
|               between the concluding slash of one section and the 'Len'
|               parameters that starts another).  The arguments of the Pin and
|               Node subparameter are separated by white space. 
|
|               Specifying a Len or L/R/C value of zero is allowed.  If
|               Len = 0 is specified, then the L/R/C values are the total for
|               that section.  If a non-zero length is specified, then the
|               total L/R/C for a section is calculated by multiplying the
|               value of the Len subparameter by the value of the L, R, or C
|               subparameter.  However, as noted below, if a non-zero length
|               is specified, that section MUST be interpreted as distributed
|               elements.
|
|               Legal Subparameter Combinations for Section Descriptions:
|
|               A)  Len, and one or more of the L, R and C subparameters.  If
|               the Len subparameter is given as zero, then the L/R/C
|               subparameters represent lumped elements.  If the Len
|               subparameter is non-zero, then the L/R/C subparameters
|               represent distributed elements and both L and C must be
|               specified, R is optional.
|
|               B) The first subparameter following the [Path Description]
|               keyword must be 'Pin', followed by one or more section
|               descriptions.  The path description can terminate in a Node,
|               another pin or the reserved word, NC.
|
|               Dealing With Series Elements:
|
|               A discrete series R or L component can be included in a path
|               description by defining a section with L=0 and the proper R or
|               L value.  A discrete series component can also be included in
|               a path description by writing two back to back node statements
|               that reference the same component (see the example below).
|               Note that both ends of a discrete, two terminal component MUST
|               be contained in a single [Path Description].  Connecting two
|               separate [Path Description] with a series component is not
|               allowed.
|-----------------------------------------------------------------------------
|
|  An Example Path For a SIMM Module:
|
[Path Description] CAS_2
Pin J25
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u21.15
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u22.15
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u23.15
|
|  A Description Using The Fork and Endfork Subparameters:
|
[Path Description] PassThru1
Pin B5
Len = 0   L=2.0n /
Len = 2.1 L=6.0n C=2.0p /
 Fork
 Len = 1.0 L = 1.0n C= 2.0p /
 Node u23.15
 Endfork
Len = 1.0 L = 6.0n C=2.0p /
Pin A5
|
|  A Description Including a Discrete Series Element:
|
[Path Description] sig1
Pin B27
Len = 0  L=1.6n /
Len = 1.5 L=6.0n C=2.0p /
Node R2.1
Node R2.2
Len = 0.25 L=6.0n C=2.0p /
Node U25.6
|
|=============================================================================
 
From owner-ibis  Thu Sep 18 04:12:02 1997
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From owner-ibis  Fri Sep 19 16:14:01 1997
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Date: Fri, 19 Sep 1997 16:12:22 -0700 (PDT)
From: bob@icx.com ( Bob Ross)
To: ibis@eda.org
Subject: IBIS MEETING 9/26/97

                       IBIS Open Forum Meeting Agenda 
                                for 9/26/97

                  Bridge Number    Reservation #   Passcode
                 (916) 356-9200    1-178721        5387488

 All meetings are 8:00 AM to 9:55 AM Pacific Time.  When you call into the 
 meeting, ask for the IBIS Open Forum hosted by Will Hobbs and give the
 Reservation Number and Passcode.
 
 8:00 Check-In, Intros, Announcements                         Ross

      - Intros of New IBIS Participants, Meeting Quorum       Ross
      - Membership Update and Treasurers Report               Rusher
      - Review of Previous Meeting's Minutes (and ARs)        Peters
      - Miscellany/Announcements                              All
      - Press & Web Page Updates                              Huq, All
      - New Models Available, Library Update                  Powell, All
      - Opens for New Issues                                  All

 8:25 Administrative and Project Discussions

      International Progress                                  Rusher/Ross
      - 93/46/NP (IBIS Version 2.1)
      - 93/60/NP (IBIS Models and EMC Simulation)
      - EIAJ III (I/O Interface Model for ICs)

      East Coast IBIS Users Meeting Report                    Ross

      s2ibis for NT Status                                    Dodd/Wiens

      Editing Committee                                       Ross/Peters
      BIRD44 Interpretation of Min/Max/Weak/Strong Data       Ross

      ibischk2+ Status                                        Rokusek/Ross
      - DOS32 Version

      Version 3.1 Parser                                      Ross/Peters
      - Status on Bids and Actions
      - Funding and Budget
      - Test Matrix
      - Samples

      Cookbook Status                                         Peters
      - Examples

      Version 3.0 Feature Priority Discussion                 Ross

      New Administrative Issues                               All

 9:15 Technical Discussion

      New ibischk bugs                                        Flora
        BUG9       Crash if Keyword Associated with [Model]
                   Comes First
        BUG10      Crash if Parser Encounters Empty V/I Table
        BUG11      Parser Continues after [End] Keyword
        BUG12      Lines Greater than 1024 Characters Cause
                   Wrong Line Numbers
        BUG13      Parser Crashes if Error in Line Longer
                   than 256 Characters
        BUG14      Long Illegal Keyword Prints Meaningless
                   Message   
              
      BIRD42.3 Modeling Current Waveforms                     Kumar/Ross

      Switched Terminators                                    Muranyi

      New Technical Issues                                    All

 9:50 Wrap Up and Next Meetings Plans                         Ross

 9:55 Sign Off
 
 
From owner-ibis  Fri Sep 19 17:23:42 1997
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To: ibis@vhdl.org
Subject: length
Date: Fri, 19 Sep 1997 17:22:10 -0700
From: Stephen Peters <sjpeters@ichips.intel.com>


Hello Chris:

     Mmmm....intresting question.  The "Len" parameter is really just a
pure number that
is used when calculating the delay thru a section.  It does not favor a
particular system
of measurement.

                      Regards,
                      Stephehn



>On Wed, 17 Sep 97 12:06:04 PDT Chris Rokusek wrote:

Hi All,

I have a Question on the [Path Description] section in Ver 3.x of .ibs...

How do we convert the "Len"'s to physical lengths--what are the
"units" (meters?).

-Chris Rokusek
Viewlogic/MTS



|=============================================================================
|     Keyword:  [Path Description]
|    Required:  Yes
| Description:  This keyword allows the user to describe the connection
|               between the user accessible pins of a part and the pins of the
|               ICs mounted on that part.  Each pin to node connection is
|               divided into one or more cascaded "sections", where each
|               section is described in terms of it's L/R/C per unit length.
|               The Fork and Endfork subparameters allow the path to branch to
|               multiple nodes, or another pin.  A path description is
|               required for each pin whose signal name is not "GND", "POWER"
|               or "NC".
|
|               Board Description and IC Boundaries:
|
|               In any system, each part interfaces with another part at some 
|               boundary.  Every part model must contain the components 
|               necessary to represent the behavior of the part being modeled 
|               within its boundaries. The boundary definition depends upon 
|               the parts being represented by the model.
|
|               For CARD EDGE CONNECTIONS such as a SIMM or a PC Daughter 
|               Card plugged into a SIMM Socket or Edge Connector, the 
|               boundary should be at the end of the board card edge pads as 
|               they emerge from the connector.
|
|               For any THROUGH-HOLE MOUNTED PART, the boundary will be at the
|               surface of the board on which the part is mounted.
|
|               SURFACE MOUNTED PART models end at the outboard end of their
|               recommended surface mount pads.
|
|               If the board level component contains an UNMATED CONNECTOR,
|               the unmated connector will be described in a separate file,
|               with its boundaries being as described above for the
|               through-hole or surface mounted part.
|
|  Sub-Params:  Len, L, R, C, Fork, Endfork, Pin, Node
| Usage Rules:  Each individual connection path (user pin to node(s))
|               description begins with the [Path Description] keyword and a
|               path name, followed by the subparameters used to describe the
|               path topology and the electrical characteristics of each
|               section of the path.  The path name must not exceed 40
|               characters, blanks are not allowed, and each occurrence of the
|               [Path Description] keyword must be followed by a unique path
|               name.  Every signal pin (pins other than POWER, GND or NC)
|               must appear in one and only one path description per [Begin
|               Board Description]/[End Board Description] pair.  Pin names do
|               not have to appear in the same order as listed in the [Pin
|               List] table.  The individual subparameters are broken up into
|               those that describe the electrical properties of a section,
|               and those that describe the topology of a path.
|
|               Section Description Subparameters:
|
|               The Len, L, R, and C subparameters specify the length, the
|               series inductance and resistance and the capacitance to ground
|               of each section in a path description.
|
|               Len     The physical length of a section.  Lengths are given
|                       in terms of arbitrary 'units'.  Any non-zero length
|                       requires that the parameters that follow must be
|                       interpreted as distributed elements by the simulator.
|               L       The series inductance of a section, in terms of
|                       'inductance/unit length'.  For example, if the total
|                       inductance of a section is 3.0 nH and the length of
|                       the section is 2 'units', the inductance would be
|                       listed as L = 1.5 nH  (i.e. 3.0 / 2). 
|               C       The capacitance to ground of a section, in terms of
|                       capacitance per unit length.
|               R       The series DC (ohmic) resistance of a section, in
|                       terms of ohms per unit length.
|
|               Topology Description Subparameters:
|
|               The Fork and Endfork subparameters denote branches from the 
|               main pin-to-node or pin-to-pin connection path.  The Node 
|               subparameter is used to reference the pin of a component or
|               board as defined in a .ibs or .ebd file.  The Pin subparameter
|               is used to indicate the point at which a path connects to a
|               user visible pin.
| 
|               Fork    This subparameter indicates that the sections
|                       following (up to the Endfork subparameter) are part
|                       of a branch off of the main connection path.  This
|                       subparameter has no arguments.
|               Endfork This subparameter indicates the end point of a branch.
|                       For every Fork subparameter there must be a
|                       corresponding Endfork subparameter.  As with the Fork
|                       subparameter, the Endfork subparameter has no
|                       arguments.
|               Node    reference_designator.pin
|                       This subparameter is used when the connection path
|                       connects to a pin of another, externally defined part.
|                       The arguments of the Node subparameter indicate the
|                       pin and reference designator of the external
|                       component.  The pin and reference designator portions
|                       of the argument are separated by a period (".").  The
|                       reference designator is mapped to an external
|                       component description (another .ebd file or .ibs file)
|                       by the [Reference Designator Map] Keyword.  Note that
|                       a Node MUST reference a model of a passive or active
|                       component.  A Node is not an arbitrary connection
|                       point between two elements or paths.
|               Pin     This subparameter is used to mark the point at which
|                       a path description connects to a user accessible pin.
|                       Every path description must contain at least one 
|                       occurrence of the Pin subparameter.  It may also
|                       contain the reserved word NC.  The value of the Pin
|                       subparameter must be one of the pin names listed in
|                       the [Pin List] section.
|
|               Using The Subparameters to Describe Paths:
|
|               A section description begins with the Len subparameter and
|               ends with the slash (/) character.  The value of the Len, L,
|               R, and C subparameters and the subparameter itself are
|               separated by an equals sign (=); whitespace around the equals
|               sign is optional.  The Fork, Endfork, Node and Pin
|               subparameters are placed between section descriptions (i.e.,
|               between the concluding slash of one section and the 'Len'
|               parameters that starts another).  The arguments of the Pin and
|               Node subparameter are separated by white space. 
|
|               Specifying a Len or L/R/C value of zero is allowed.  If
|               Len = 0 is specified, then the L/R/C values are the total for
|               that section.  If a non-zero length is specified, then the
|               total L/R/C for a section is calculated by multiplying the
|               value of the Len subparameter by the value of the L, R, or C
|               subparameter.  However, as noted below, if a non-zero length
|               is specified, that section MUST be interpreted as distributed
|               elements.
|
|               Legal Subparameter Combinations for Section Descriptions:
|
|               A)  Len, and one or more of the L, R and C subparameters.  If
|               the Len subparameter is given as zero, then the L/R/C
|               subparameters represent lumped elements.  If the Len
|               subparameter is non-zero, then the L/R/C subparameters
|               represent distributed elements and both L and C must be
|               specified, R is optional.
|
|               B) The first subparameter following the [Path Description]
|               keyword must be 'Pin', followed by one or more section
|               descriptions.  The path description can terminate in a Node,
|               another pin or the reserved word, NC.
|
|               Dealing With Series Elements:
|
|               A discrete series R or L component can be included in a path
|               description by defining a section with L=0 and the proper R or
|               L value.  A discrete series component can also be included in
|               a path description by writing two back to back node statements
|               that reference the same component (see the example below).
|               Note that both ends of a discrete, two terminal component MUST
|               be contained in a single [Path Description].  Connecting two
|               separate [Path Description] with a series component is not
|               allowed.
|-----------------------------------------------------------------------------
|
|  An Example Path For a SIMM Module:
|
[Path Description] CAS_2
Pin J25
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u21.15
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u22.15
Len = 0.5 L=8.35n C=3.34p R=0.01 /
Node u23.15
|
|  A Description Using The Fork and Endfork Subparameters:
|
[Path Description] PassThru1
Pin B5
Len = 0   L=2.0n /
Len = 2.1 L=6.0n C=2.0p /
 Fork
 Len = 1.0 L = 1.0n C= 2.0p /
 Node u23.15
 Endfork
Len = 1.0 L = 6.0n C=2.0p /
Pin A5
|
|  A Description Including a Discrete Series Element:
|
[Path Description] sig1
Pin B27
Len = 0  L=1.6n /
Len = 1.5 L=6.0n C=2.0p /
Node R2.1
Node R2.2
Len = 0.25 L=6.0n C=2.0p /
Node U25.6
|
|=============================================================================
 
From owner-ibis  Tue Sep 23 15:16:02 1997
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Date: Tue, 23 Sep 1997 15:14:22 -0700 (PDT)
From: bob@icx.com ( Bob Ross)
To: ibis@eda.org
Subject: IEC Approval of IBIS

To All:

I received word from Patti Rusher, Director of the Electornic Information
Group in EIA that IBIS Version 2.1 (also known as ANSI/EIA-656 was ratified
at the IEC meeting in Tokyo as an international standard.  It will be
designated as IEC 62014-1.

Thank you Patti for promoting this for us though the IEC channels.

Bob Ross
Interconnectix

 
From owner-ibis  Tue Sep 23 16:58:45 1997
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From: jzhao@ee1-gw.ee.binghamton.edu
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Date: Tue, 23 Sep 1997 19:59:06 -0400
Message-Id: <9709232359.AA20506@ee1-gw.ee.binghamton.edu>
To: ibis@vhdl.org
Subject: Add My Name on the LIST PLEASE.


Please add my name on the list.  Thanks.

My email address are:
jzhao@emlab1.ee.binghamton.edu
jzhao@binghamton.edu

 
From owner-ibis  Wed Sep 24 12:07:54 1997
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Date: Wed, 24 Sep 1997 12:06:13 -0700 (PDT)
From: bob@icx.com ( Bob Ross)
To: ibis@eda.org
Subject: IBIS AND S2IBIS BUGS

To IBIS Committee:

ibischk bugs 9-18 have been submitted for discussion at the
Friday meeting.  The reports are located in eda.org under
/pub/ibis/bugs/ibischk/.  Please review them if you wish
to participate in this discussion.

Three new directories have been created for s2ibis, s2ibis2 and
s2iplt bug reports.  The bug report forms are stored as the .txt files.
Use the same ibischk-bug@eda.org for submitting bugs in these areas.

Bob Ross
Interconnectix


Below is the bug.dir for ibischk bugs to summarize the list of bugs.

         LIST OF BUGS (FIXED FOR FOLLOWING VERSION) FOR IBIS_CHK


YES NO             Version 2.1.10

X       BUG1       Multiple Disclaimers 
X       BUG2       Package Model Warning Message for Legal Suffixes
X       BUG3       Incorrect [Model] Sub-parameter Syntax Not Reported
X       BUG4       Printout Version No.

                   Version 2.1.11

        BUG5       Additional Value Checking
        BUG6       Output Control
        BUG7       Check of VI Curves Against Waveforms

 
                  Version 3.XXX Plan:

        BUG8       Reserved Words Used as Pin Numbers Generate Errors


                   New Bugs for Consideration:

        BUG9       Crash if Keyword Associated with [Model] Comes First
        BUG10      Crash if Parser Encounters Empty V/I Table
        BUG11      Parser Continues after [End] Keyword
        BUG12      Lines Greater than 1024 Characters Cause Wrong Line Numbers
        BUG13      Parser Crashes if Error in Line Longer than 256 Characters
        BUG14      Long Illegal Keyword Prints Meaningless Message 
        BUG15      "Program Bug" for Version 1.1 Files with more than 512 Pins
        BUG16      [Package] Argument Does Not Give Error
        BUG17      Incomplete [Pin] L_pin, C_pin, R_pin Error Message
        BUG18      Other Order R_pin, L_pin, C_pin Columns Not Correctly Read

 
From owner-ibis  Fri Sep 26 09:05:53 1997
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From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9709261605.AA27169@rockie.nsc.com>
To: ibis@vhdl.org
Subject: NEW SuperI/O IBIS model from National
Cc: huq@rockie.nsc.com

IBIS fans,

National Semiconductor's Personal Systems Group has
released the following Super I/O IBIS models on
it's web site:

pc97338.ibs

The URL is:

http://www.national.com/models

Select 'IBIS' and then 'SuperI/O'

Best Regards,
Syed
Vice-Chair ANSI/EIA-656
National Semiconductor Corp.

 
From owner-ibis  Fri Sep 26 10:18:17 1997
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Date: Fri, 26 Sep 1997 10:16:26 -0700 (PDT)
From: bob@icx.com ( Bob Ross)
To: ibis@eda.org
Subject: IBISCHK3 FUNDING

To IBIS Committee:

We are contracting the development of the ibischk3 parser for IBIS
Version 3.1.  We need to have the funds committed before we start 
the development.  Similar to the funding efforts of the previous
ibischk development projects, we are sharing the cost among many
companies.  The funding committment will be in the form of a purchase
order sent to Jeanne Warner as follows:

   EIA/Electronic Information Group
   2500 Wilson Blvd
   Arlington, VA 22201
   Attn: Jeanne Warner
   (703) 907-7539
   FAX: (703) 907-7501


   Purchase Order for IBISCHK3 Source Code and Licence

   Not to EXCEED $2,500 (Two Thousand and Five Hundred Dollars)


Once we get the level of committment in place to pay for the development,
we will start the project.  The actual invoices will be issued against
the purchase orders at a time to be decided (approximately around December,
1997) based on actual cost divided by the N companies participating.

Please inform (or send a copy of the purchase order) to Bob Ross so we can
track the participation in this shared development expense:

   Bob Ross
   Interconnectix
   10220 S.W. Nimbus Ave., K4
   Portland, OR 97223
   (503) 603-2523
   FAX: (503) 639-3469 

Thank you
Bob Ross
Interconnectix


 
From owner-ibis  Sat Sep 27 10:08:54 1997
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Date: Sat, 27 Sep 1997 10:06:15 -0700
From: jon powell <jonp@pacbell.net>
Organization: viewlogic
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Subject: Model Web Page Update
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The IBIS model web page has been update with several new links including
AMTEL and FAIRCHILD.

take a look.

as always, please refer and problems or new sites to me.


thanks
jon
 
