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Subject: IBIS MINUTES, FEB. 26, 1998 SUMMIT

 DATE: 3/3/98

 SUBJECT: 2/26/98 EUROPEAN IBIS SUMMIT Minutes
   
 VOTING MEMBERS AND 1998 PARTICIPANTS LIST:
 AMP                            (Martin Freedman) 
 Applied Simulation Technology  Norio Matsui, Raj Raghuram
 Cadence Design (& UniCAD)      C. Kumar*, Don Telian, Patrick Riffault, 
				Craig Lewis, Greg Fitzgerald, Paul Galloway*,
				Patrick Dos Santos*, Catherine Weiss*, 
				Alain Tribaudot*, 
 Cypress                        (Bruce Wenniger)
 Digital Equipment Corp.        Jeff Chu, Greg Edlund, Bob Haller
 Hewlett Packard (EEsof, etc.)  Karl Kachigan, Henry Wu, Paul Gregory
 High Design Technology         Razvan Ene*
 HyperLynx                      Kellee Crisafulli, Matthew Flora
 Incases                        Olaf Rethmeier, Scott Jacobson,
				Werner Rissiek*
 Intel Corporation              Stephen Peters, Arpad Muranyi, Frank Kern,
				Will Hobbs*, Prakash Radhakrishnan*
   Columbia, SC (formerly NCR)  Dave Moxley
 Mentor Graphics (Zeelan,       Bob Ross*, George Opshal, Mark Noneman,
   Interconnectix, etc.)        Tom Dagostino*, Karine Loudet*, Jean Oudinot*,
				Manuel De Almeida*, Stephane Rousseau* 
 Mitsubishi                     (Hoang Nguyen), Tam Cao
 Motorola                       (Ron Werner)
 National Semiconductor         Syed Huq*, Cheng-Yang Kao, John Goldie,
				Ikchang Song
 North East Systems Associates  Edward Sayre, Kathy Breda
   (NESA)
 NEC                            (Hiroshi Matsumoto)
 Quantic EMC                    (Mike Ventham)
 Texas Instruments              Thomas Fisher, Harvey Stiegler,
				Vincent Chang, Jean-Claude Perrin*,
				Peter Forstner*
 Thomson-CSF                    Jean-Marc Claveau*, Laurent Duzaic*,
                                Saverio Lerose*, Benoit Meyniel*,
				Jean Lefebvre*  
 Viewlogic                      Jon Powell, Chris Rokusek, Guy de Burgh*, 
				Gary Mandel*
 VeriBest                       Ian Dodd, David Weins*, Ian Gabbitas*
 VLSI Technology                D.C. Sessions
 Zuken-Redac                    (John Berrie) 

 OTHER PARTICIPANTS IN 1998:
 Actel                          Eric Tardif*, Emmonvelle Gaudin* 
 Aerospatiale                   Lionel Dreux*, Claude Huet*
 Alcatel (Bell, Espace, etc.)   John Fitzpatrick*, W. Temmerman*, 
				Laure Bessettes*, Jean-Claude Pourtau*,
				Daniel Peron*
 ALS Design                     Yves Mouquet*
 Ansoft                         Eric Bogatin
 Apple                          Fred Floresca, Danny Itani
 Apteq Design Systems           Dan FitzPatrick 
 CERN                           Olivier Clere*, Jean-Michel Sainson*, 
				Rudi Zurbroken*
 Compaq                         Shariq Rahma
 EIA                            Patti Rusher
 EMC                            Fawn Engelmann
 ENST, Paris                    Jean-Jacques Charlot*
 European CAD Standardization   Adam Morawiec*
   Intitiative (ECSI)
 Fairchild Semiconductor        Peter LaFlamme
 H.A.S Electronics              Haruny Said*
 Intracon Design Ltd.           Derek Laidlaw*
 Philips Semiconductor          Todd Andersen
 Scottish Electronics           Robert Easson*
   Manufacturing Center (SEMC)
 Seagate                        Vanessa Howard
 SGS-Thomson                    Philippe Lefevre*
 Siemens                        Gerald Bannert*, Bernhard Unger*, 
				Christian Marot*, Miguel Hernandez*
 Symmetry                       Andy Hughes
 Tektronix                      Nassrin Ghahyasi
 Ultratest International        Chris O'Connor
 Xilinx                         Susan Wu

 In the list above, attendees at the meeting are indicated by *.  Principal
 members or other active members who have not attended are in parentheses.
 Participants who no longer are in the organization are in square brackets.

 Upcoming Meetings:  The bridge numbers for future IBIS teleconferences are as
 follows:
   
   Date               Bridge Number     Reservation #    Passcode
   March 13, 1998     (916) 356-9200    5-23353          2913463


 All meetings are 8:00 AM to 9:55 AM Pacific Time.  We try to have agendas out 
 7 days before each Open Forum and meeting minutes out within 7 days after.  
 When you call into the meeting, ask for the IBIS Open Forum hosted by Will 
 Hobbs and give the reservation number and passcode.
 
 NOTE: "AR" = Action Required.

 -------------------------------- MINUTES -------------------------------------

 INTRODUCTIONS AND MEETING QUORUM
 The European IBIS Summit was held in Paris, France at the Hotel Concorde
 La Fayette.

 Bob Ross welcomed the group and introduced the officers.  All the attendees
 introduced themselves.  During the meeting Bob thanked Mentor Graphics for 
 sponsoring the excellent facilities and equipment, Cadence Design for the 
 outstanding buffet lunch, and High Design Technology (HDT) for providing
 the refreshments.  Bob also thanked Razvan Ene of HDT for initially
 suggesting an IBIS meeting associated with the Design Automation and Testing 
 in Europe Conference (DATE98).  This suggestion was developed into this
 European IBIS Summit Meeting.  About 50 people from 20 organizations were 
 recorded as attending.  Please submit any corrections to organizations or
 names to Bob.  
 
 (Also Bob thanks Karine Loudet for handling the local arrangements, signup, 
 and providing copies of the presentations.)

 Some brief notes taken during the presentations from the presentation
 material are given below.  The presentations themselves will be available 
 on eda.org under /pub/ibis/summits/feb98.
 

 WELCOME, IBIS ACTIVITIES
 -  Bob Ross, Interconnectix/Mentor Graphics, USA 
 Bob gave a brief overview of the EIA IBIS Open Forum.  The subgroup has
 open, public participation to all interested parties.  He described the
 the technical evolution of the IBIS versions.  The Open Forum monitors
 external, international activities such as the EMC and IBIS activities in
 France.  The Open Forum also has several projects related to ratification
 of Version 3.1 including BIRD42.3 and the ibischk3 parser development (the
 first evaluation version has been distributed to those funding the project).  
 It also cooperates with the IBIS Users Group (IBIS East).
       
 
 REPORT ON IBIS USERS FORUM
 -  Paul Galloway, Cadence, USA
 Paul showed the mission and history of the IBIS Users Group headed by Ed 
 Sayre.  The Group has two committees, one concerned with Accuracy and 
 Validation of IBIS, and the other concerned with Software Aspects.  Paul
 emphasized that the participation is open and has members from all over the 
 USA.  However, the four face-to-face meetings to date have been held in the
 Northeast USA, with the last three hosted on site at companies. Paul
 concluded by stating that the group is focusing on the users needs, has
 strong East Coast EDA tool vendor participation, and is coordinating its
 activities with the EIA IBIS Open Forum.
 

 USE OF IBIS MODELS IN ALCATEL
 -  John Fitzpatrick, Alcatel, France
 John has written a simplified IBIS parser in PERL and showed pages of his
 Netscape browser interface for his IBIS Management Suite.  It was developed
 last year.  John uses the IBIS Management Suite to manage buffer models.  He
 would like to have the model verification process to be robust enough to not 
 require simulation or measurement of the buffer.  A graphical datasheet 
 shows the added curves to get the real response, and it can be used to 
 filter out superfluous data.  John also illustrated a simplified model 
 creation process when exact information is missing, but he stressed that 
 this is not for novices.  Then entered information can be used for design
 rules, and he illustrated this for crosstalk for several technologies.

 For ASICs, John relies on the short circuit current rather than the Iol
 current for driver strength classification.  By contract Alcatel requires
 IBIS models for ASICs, but in reality models are not provided.  The IBIS
 format does not support independent [Model]s for buffers, although EDA tools
 do provide such support.  John sees the need for IBIS package models for 
 ASICs which are not readily provided.  

 John stated that ASIC timing is based on Cload, but the actual load is not
 capacitive.  He would like an exact threshold value (Vt) instead of Vinl
 and Vinh.  He also claimed that the IBIS Model was not suitable for ground
 bounce simulation.  John showed some examples for buffer strength and 
 timing.

 While stating that IBIS support is better, John concluded with several
 recommendations: component and buffers may need to be managed separately,
 better ASIC library support - at least in the Cookbook, more emphasis on 
 timing analysis and less on SI, good graphical tool is needed, and more 
 package only models.
 

 IBIS MODEL DEVELOPMENT AT NATIONAL SEMICONDUCTOR CORPORATION
 -  Syed Huq, National Semiconductor, USA
 Syed introduced himself as Vice Chair. and also the Web Master of the EIA
 IBIS Open Forum.  He has been active since 1994, and National has provided
 the largest number of IBIS models.  In the last three years National has 
 also hosted the IBIS Summit Meetings associated with DesignCon.  Syed 
 discussed the IBIS Intranet, an internal National web page used for 
 information, tools, training and an internal users group.  National develops 
 IBIS models from Spice using the public s2ibis2 and also an internally 
 developed ns2spice for NaSpice.  Also National develops measurement based 
 IBIS models.
 
 Syed listed the steps he uses to validate models: visual inspection, s2iplt
 verification, ibischk2 parser test, simulation with two simulators under a
 know load, and comparison of simulation data to bench or Spice simulation.
 
 IBIS model development is a milestone step in the National digital device
 release process.  National currently develops IBIS Version 2.1 level models
 and will develop IBIS Version 3.1 models when the ibischk3 parser is made
 available.  Syed noted that Logic, Memory, and Discrete models are now
 handled by Fairchild Semiconductor, which spun off from National.


 IBIS, MEASUREMENTS VS SPICE
 - Tom Dagostino, Zeelan/Mentor Graphics, USA
 Tom compared the plots of several IBIS Model V_low tables from some publicly
 available components extracted form s2ibis tools with actual measured data.  
 While the components were selected randomly, Tom's general observation was 
 that the measurements tended to correlate with the max columns.  The plots
 also showed some s2ibis artifacts of double counting the power clamp and
 some known numerical current foldback on the ground clamp side.
 
 
 REQUIRED IBIS ENHANCEMENTS
 - Gerald Bannert, Siemens, Germany
 Gerald shared his experiences.  Along with correct logical functioning under               
 normal operating conditions (signal integrity, crosstalk, propagation
 delay), he was concerned with incorrect function and failure conditions
 (on/off of multiple power supplies, voltage over/undershoots at inputs and
 outputs, and maximum operating frequencies under load condition), and long
 term reliability (junction temperature, breakdown voltage, and maximum
 currents).

 Gerald listed the important parameters.  The group not covered by IBIS 
 included: monotony of rising and falling edges at inputs, minimum and
 maximum rise and fall times at inputs, ground bounce effects, bus hold
 circuitry at inputs, and switching on/off conditions of multiple power
 supplies.  Input capacitance and clamping diodes are covered by IBIS.  The
 load normalization of data sheet delay times is an interface problem between
 different libraries.

 Gerald illustrated several of these parameters.  He also concluded that the
 most critical parameters are difficult to define, measure and model;
 modeling parameters should take into account future practical needs; and
 the vendor interface is very important.  The vendor interface includes these
 considerations: valid IBIS revisions, optional parameters, interpretation
 of IBIS parameters, feedback of simulation results to I/O (re)designs, model
 and/or silicon changes, and model validity and guarantee.


 CHALLENGES IN USING IBIS IN HIGH FREQUENCY APPLICATIONS
 - Prakash Radhakrishnan, Intel, USA                  
 Prakash discussed the need for an improved IBIS package model to simulate
 simultaneous switching noises and associated delay interactions.  He showed
 results using the existing discrete LRC package model and using the coupled
 matrix model in IBIS Version 2.1.  Prakash's enhanced model used a "hybrid
 modeling technique" developed to capture lumped and transmission line 
 effects.  It involves modeling a plane as a two-dimensional inductance array
 with discrete capacitive coupling between planes.  This process gives more
 detail for ground and power planes and helps to improve the correlation 
 between simulated and measured results.


 EUROPEAN CAD STANDARDIZATION INITIATIVE (ECSI)
 - Adam Moraweic, ECSI, France
 Adam began the afternoon presentations by briefly describing the ECSI as
 an EDA vendor funded organization to promote educational workshops and 
 information about standards affecting the European community.  IBIS could  
 be a candidate for such a workshop.  


 IBIS MODELS AND EMC SIMULATION STANDARDIZATION STATUS
 Jean-Claude Perrin, Texas Instruments, France
 Jean-Claude, President of the working group gave the presentation in place 
 of Christian Marot who arrived later.  The working group is affiliated with 
 Union Technique de L'Electricite (UTE) of France and is UTE/CEF93/GT5 EMC.  
 It is affiliated IEC TC93 WG5 to work on electromagnetic compatibility of 
 ICs.  Its objective is to create a standard for EMC integrated circuit 
 models.  Jean-Claude defined aspects of the EMC problems: signal integrity,
 emissions (radiated fields by PCB conducted noises on lines) and immunity
 (to radiated fields to conducted noises on lines).
 
 From a questionnaire issued by the group, Jean-Claude listed the conclusions
 and directions.  Immunity was not in any software,  IBIS was well adapted
 to the general EMC problem, but needed some improvements.  For emissions,
 IBIS would need the following elements: coupling between I/O and power 
 supply, coupling with the logic core, coupling between I/O, and feedback 
 coupling between I/O.  For immunity, IBIS would need these elements:   
 equivalent decoupling impedance, impedance of supply lines, internal noise
 generator, internal loops, and coupling between internal logic and I/O.

 Measurement methodologies would have to be defined for model validation and
 control.  The plan is to create a task force at the IEC level to present a
 New Working Item Proposal for September, 1998.  An international experts
 meeting is scheduled on February 27, 1998 to disucss details.


 FUTURE COMPONENT CHARACTERIZATION FOR EMI ANALYSIS
 - Werner Rissiek, Incases, Germany
 Werner indicated that Incases and Viewlogic are working with the University
 of Missouri-Rolla on EMC component characterization.  Werner described the
 EMC problem as an additional consideration beyond signal integrity and
 thermal radiation.  The EMC problem involves strong magnetic fields in the
 area of ICs, and packages act as antennas.  There exist differential and
 common mode effects.  The general 3-dimensional solution is too large for
 accurate numerical analysis and for solving in a timely manner.  So the 
 proposed approach is to partition the problem and apply an expert approach 
 with simplifying assumptions.

 Werner listed some geometrical and electrical parameters of interest.  He
 further tabulated a number of electrical parameters for voltage, currents,
 time and clock frequencies and classified them as analysis (as an input 
 parameter) or evaluation (of results).  Tables for buffer specific parameters
 and derived quantities for components and buffer classification were shown.
 Werner concluded that the EMI analysis required behavioral models like IBIS,
 additional classification parameters for an expert approach, and specific
 geometrical package information.  This information could be put into an
 extended IBIS.  Werner stated that he is willing to help in the IEC task
 group.


 IBIS MODELS FOR EMC AND HIGH-FREQUENCY DEVICES
 - Razvan Ene, High Design Technology, Italy
 Razvan presented an architecture and Spice-like syntax sample for handling 
 SI problems.  It has time-switching functions, pullup and pulldown functions 
 and clamping functions.  Spice polynomial functions are used.  Razvan showed
 the definition of the functions and an extension for time-varying clamping.
 Its data is extracted using a TDR setup.  Razvan showed the results for the
 AC74 from two manufacturers and presented a distributed diode-inductor model
 for the slow clamping effect.  Razvan showed some measurement versus 
 simulation correlations.
 
 Regarding EMC, Razvan showed a measurement setup at the semi-anechoical
 room at Lille University and showed a test case.  Even for low frequency
 simulations the model needs to be valid at very high frequencies.  With 
 "dft" extraction (replacing the slope given in the IBIS model), he showed
 EMC modeling and measurement correlation up to 400 MHz.  
 
 For IBIS, Razvan recommends a number of practices and additions: use all
 fields (min, typ, max), introduce a field for Cout spread, use waveform
 tables, and introduce supplementary fields for TDR measurement and dynamic
 output impedance and clamping. 
 
 Razvan also supports forming a European IBIS group to disseminate IBIS and
 IBIS know-how and to provide a forum where producers and users can express
 their needs.
 

 SI-ANALYSIS WITH HSPICE BASED ON IBIS BEHAVIORAL MODELS
 - Bernhard Unger, Siemens, Germany
 Bernhard showed an IBIS model architecture for analysis that uses time-
 varying multipliers for the pulldown and pullup tables to describe the
 switching from one state to another.  He conducted a number of tests to
 generate the multipliers based on one-waveform and two-waveform test loads.
 These loads were based on waveforms generated with R_fixture = 50 ohms and
 V_fixture terminated to GND or Vcc.  Bernhard's results showed good
 correlation with the two-waveform case or when the test loads matched the
 simulation loads in the one-waveform case.

 Bernhard presented some results of actual signal integrity simulations and
 comparisons with measurement of a circuit involving an IBIS based HSPICE
 model including package, transmission line model using the HSPICE U-model
 from parameters extracted using a 2-D field solver, and a vendor supplied
 connector model.  He showed excellent agreement with measurement when he
 adjusted the pullup table using scaling factor of 1.3.  Bernhard concludes  
 that IBIS models with two-waveform tables extracted under two different 
 loading conditions give results valid for a wider range of loading
 conditions.  IBIS Version 1.1 models are not sufficient.


 PROBLEMS IN V-T CURVE MODELING AND SIMULATION
 - C. Kumar, Cadence, USA
 Kumar indicated that the waveform algorithm processing algorithms were still
 ambiguous.  One waveform analysis can be handled in a arbitrary number of
 ways.  If multiple waveforms are given, then any of the sets of choices can
 give different simulation results.  The waveform algorithms do not address
 the power and ground current distributions correctly.
 
 Kumar proposed according to BIRD42.3 that V/T and I/T tables given for the
 same V_fixture and R_fixture load could be used unambiguously to solve for
 the time varying multipliers for the pulldown and pullup tables.  He 
 proposed R_fixture = 50 and V_fixture = Vcc/2 to capture the independent
 pulldown and pullup switching characteristics.
 
 
 BIRD42.3 ALGORITHM CONSIDERATIONS 
 - Bob Ross, Interconnectix/Mentor Graphics, USA
 Bob indicated that he and C. Kumar were co-authors of BIRD42.3 that is still
 pending.  An IBIS Version 2.1 reference model was presented, consistent with 
 the prior models for waveform table processing.  The BIRD42.3 additions
 include corresponding an optional [Pullup Reference Current] table and/or an 
 optional [Pulldown Reference Current] table.

 Bob showed a possible and general enhanced structure for adding the current
 information to the IBIS Version 2.1 model using Idelta and Vdelta sources.
 With the addition current tables, there are algorithm issues.  The added
 information can be used to revise the fundamental coefficient extraction,
 as Kumar proposes, or it could be also for corrections to the IBIS model.
 Also if both the [Pullup Reference Current] and [Pulldown Reference Curent]
 tables are given, they contain redundant data which needs to be resolved by
 the simulator.  Because both the one and two voltage waveform methodology is
 used by simulators, the algorithms for the proposed current extensions need 
 to be considered in detail for any of the optional extension combinations. 
 Bob presented a table showing possible algorithm approaches for coefficient
 calculation and possible correction source calculatons for the allowable
 one and two voltage waveform cases with and without currents.  In some
 cases either the V1,V2 information or the V,I information could be used
 for calculating coefficients, and the additional data used to calculate the
 correction sources.

 Bob listed several other issues associated with BIRD42.3.  The added current 
 information most likely would be available only from Spice extraction. 
 Numerical issues may exist concerning this data.  Other Model_types related 
 to Open_* and ECL_* configurations had to be considered.  The optimal set of
 Fixture voltages could be contradictory (Vcc and 0 for V1 and V2 tables,
 Vcc/2 for V1, I1 tables).  Finally internal components such as internal
 clocks could introduce current spikes that are not included in BIRD42.3
 extensions.
 

 GROUP DISCUSSION
 Jean-Jacques Charlot introduced himself as a Professor at ENST, Paris and
 he is concerned about the need for IBIS education.  Bob Ross indicated that
 this was a general concern.

 Bob asked if people felt that the meeting was worthwhile, and the general
 consensus was very positive.  The meeting was adjourned so that people could
 engage in individual discussions and make contacts.


 NEXT MEETING:
 The next teleconference meeting is on Friday, March 13, 1998, 8:00 A.M. to 
 9:55 A.M.  BIRD46.1 may be scheduled for a vote.
 ==============================================================================
				       NOTES
 
 IBIS CHAIR: Bob Ross (503) 685-0732, Fax (503) 685-4897
	     bob_ross@mentorg.com
	     Modeling Engineer, Interconnectix BU of Mentor Graphics
	     8005 S.W. Boeckman Road, Wilsonville, OR 97070

 VICE CHAIR: Syed Huq (408) 721-4874, Fax: (408) 721-4785
	     huq@rockie.nsc.com
	     Staff Applications Engineer, National Semiconductor, M/S A-2595
	     2900 Semiconductor Drive, Santa Clara, CA 95052
 
 SECRETARY:  Stephen Peters (503) 264-4108, Fax: (503) 264-4515
	     sjpeters@ichips.intel.com
	     Senior Hardware Engineer, Intel Corporation
	     M/S JF1-56
	     2111 NE 25th Ave. 
	     Hillsboro, Oregon 97124-5961

 LIBRARIAN:  Jon Powell (805) 988-8250, Fax: (805) 988-8259
	     jonp@qdt.com
	     Senior Scientist, Viewlogic (formerly Quad Design)
	     1385 Del Norte Rd., Camarillo, CA 93010
  
 This meeting was conducted in accordance with the EIA Legal Guides and EIA
 Manual of Organization and Procedure.
 
 The following e-mail addresses are used:

   ibis-request@eda.org
       To join, change, or drop from either the IBIS Open Forum Reflector
       (ibis@eda.org), the IBIS Users' Group Reflector (ibis-users@eda.org)
       or both.  State your request.

   ibis-info@eda.org
       To obtain general information about IBIS, to ask specific questions
       for individual response, and to inquire about joining the EIA-IBIS
       Open Forum as a full Member.

   ibis@eda.org
       To send a message to the general IBIS Open Forum Reflector.  This
       is used mostly for IBIS Standardization business and future IBIS
       technical enhancements.  Job posting information is not permitted.

   ibis-users@eda.org
       To send a message to the IBIS Users' Group Reflector.  This is 
       used mostly for IBIS clarification, current modeling issues, and
       general user concerns.  Job posting information is not permitted.

   ibischk-bug@eda.org
       To report ibischk2 parser bugs.  The Bug Report Form Resides on
       eda.org in /pub/ibis/bugs/ibischk/bugform.txt along with reported bugs.

       To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms
       which reside under eda.org in /pub/ibis/bugs/s2ibis/bugs2i.txt, 
       /pub/ibis/bugs/s2ibis2/bugs2i2.txt, & /pub/ibis/bugs/s2iplt/bugsplt.txt
       respectively.

 Information on IBIS technical contents, IBIS participants, and actual
 IBIS models are available on the IBIS Home page found by selecting the
 Electronic Information Group under:

   http://www.eia.org

 Check the pub/ibis directory on eda.org for more information on previous 
 discussions and results.  You can get on via FTP anonymous.
 
 "IBIS Spoken Here" placards are available from Jon Powell (jonp@qdt.com) for 
 use at trade shows.
 ==============================================================================

 
From owner-ibis  Wed Mar  4 08:34:23 1998
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Date: Wed, 04 Mar 1998 08:30:50 -0800
From: Jon Powell <jonp@pacbell.net>
Reply-To: jonp@qdt.com
Organization: Viewlogic Consulting Services
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Notification:

There has been some problems at the site that hosts the IBIS models
page. The ibis directory was accidently deleted. I am in the process of
repairing it. Sorry for any problems.

regards,
jon powell
ibis librarian


 
From owner-ibis  Wed Mar  4 14:46:19 1998
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From: bobr@emicx.mentorg.com (Bob Ross)
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	id AA27428; Wed, 4 Mar 98 14:43:30 PST
Date: Wed, 4 Mar 98 14:43:30 PST
Message-Id: <9803042243.AA27428@bob>
To: ibis@eda.org
Subject: European IBIS Presentations

To All:

The European IBIS Summit Presentations are now all uploaded
to eda.org/pub/ibis/summits/feb98.

Bob Ross
Interconnectix B.U


                    INDEX - EUROPEAN IBIS SUMMIT
                     HOTEL CONCORDE LA FAFYETTE
                           PARIS, FRANCE
                         FEBRUARY 26, 1998


Index.txt      This file
a022698.txt    Preliminary Agenda
m022698.txt    Minutes of the Meeting

The Program is zipped files in HTML, Word, Power Point Formats and Acrobat
formats and are listed in the order of the presentations:

ross1.zip     (.ppt)
              Welcome, IBIS Activities
              Bob Ross, Interconnectix/Mentor Graphics, USA

galloway.ppt
              Report on IBIS Users Group
              Paul Galloway, Cadence, USA

fitzpatrick.zip  (.ppt)
fitzpatrick.pdf
              Use of IBIS Models in Alcatel
              John Fitzpatrick, Alcatel, France

huq.zip       (.ppt)
              IBIS Model Development at National Semiconductor Corporation
              Syed Huq, National Semiconductor, USA

dagostino.zip (.ppt)
              IBIS, Measurements vs. Spice
              Tom Dagostino, Zeelan/Mentor Graphics, USA

bannert.doc
bannert.ppt   
              Required IBIS Enhancements   
              Gerald Bannert, Siemens, Germany

radhakrishnan.zip  (.doc) 
radhakrishnan.ppt 
              Challenges in Using IBIS in High Frequency Applications
              Prakash Radhakrishnan, Intel, USA

perrin.ppt    
              IBIS Models and EMC Simulation Standardization Status
              Jean-Claude Perrin, Texas Instruments, USA

rissiek.ppt   
              Future Component Characterization for EMI Analysis
              Werner Rissiek, Incases, Germany

ene.zip       (.ppt)
              IBIS Models fo EMC and High-Frequency Devices
              Razvan Ene, High Design Technology, Italy

unger.zip     (.ppt)  (with notes)
              SI-Analysis with HSPICE Based on Behavioral Models
              Bernhard Unger, Siemens, Germany

kumar.tar     (.html)
              Problems in V-T Curve Modeling and Simulation
              C. Kumar, Cadence, USA

ross2.zip     (.ppt)
              BIRD42.3 Algorithm Considerations
              bob Ross, Interconnectix/Mentor Graphics, USA       

 
From owner-ibis  Wed Mar  4 14:54:57 1998
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CC: Gil Russell <gilbert.russell@sci.siemens.com>
Subject: JEDEC meets IBIS
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Thumbnail meeting report:

Yesterday I attended the quarterly JEDEC JC-16 meeting.
JC-16 is the group responsible for JEDEC signalling
standards such as SSTL, HSTL, etc.  Among other things
announced was the establishment of JC-16B, a working
group chartered with modelling and testing issues.

Some smartmouth in the back of the room pointed out
that the JC-16 membership was rich in semiconductor
manufacturers and system houses but totally lacking
in EDA companies, which might be a slight handicap
when addressing modelling and test issues.  To the
surprise of no one, said impulsive individual got
the appropriate reward: assignment as liason to the
EIA IBIS committee, which apparently has a complementary
membership and is posessed of much-needed expertise.

Note that the CC: on this message is to one Gil Russell,
whose misfortune is to chair JC-16B.  This could be
the start of a VERY profitable collaboration.

Item on the table: JC-16 meets quarterly along with a
slew of other JEDEC committees.  We (IBIS) should
consider moving our winter face-to-face meeting to
colocate with their December meeting.  Some mightily
interesting results could come of that.

-- 
D. C. Sessions
dc.sessions@tempe.vlsi.com
 
From owner-ibis  Wed Mar  4 16:35:43 1998
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From: bobr@emicx.mentorg.com (Bob Ross)
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To: dc.sessions@tempe.vlsi.com, ibis@eda.org
Subject: Re:  JEDEC meets IBIS

D. C.:

Can we discuss this at the next IBIS meeting on March 13?
I think we can do IBIS Models for these technologies.

Bob Ross
Interconnectix/Mentor Graphics


> Date: Wed, 04 Mar 1998 15:51:11 -0700
> From: "D. C. Sessions" <dc.sessions@tempe.vlsi.com>
> Organization: VLSI Technology Inc.
> To: IBIS Mailing list <ibis@vhdl.org>
> CC: Gil Russell <gilbert.russell@sci.siemens.com>


> Thumbnail meeting report:

> Yesterday I attended the quarterly JEDEC JC-16 meeting.
> JC-16 is the group responsible for JEDEC signalling
> standards such as SSTL, HSTL, etc.  Among other things
> announced was the establishment of JC-16B, a working
> group chartered with modelling and testing issues.

> Some smartmouth in the back of the room pointed out
> that the JC-16 membership was rich in semiconductor
> manufacturers and system houses but totally lacking
> in EDA companies, which might be a slight handicap
> when addressing modelling and test issues.  To the
> surprise of no one, said impulsive individual got
> the appropriate reward: assignment as liason to the
> EIA IBIS committee, which apparently has a complementary
> membership and is posessed of much-needed expertise.

> Note that the CC: on this message is to one Gil Russell,
> whose misfortune is to chair JC-16B.  This could be
> the start of a VERY profitable collaboration.

> Item on the table: JC-16 meets quarterly along with a
> slew of other JEDEC committees.  We (IBIS) should
> consider moving our winter face-to-face meeting to
> colocate with their December meeting.  Some mightily
> interesting results could come of that.

> -- 
> D. C. Sessions
> dc.sessions@tempe.vlsi.com


 
From owner-ibis  Wed Mar  4 16:45:57 1998
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From: "D. C. Sessions" <dc.sessions@tempe.vlsi.com>
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Bob Ross wrote:
> 
> D. C.:
> 
> Can we discuss this at the next IBIS meeting on March 13?

Yup.

> I think we can do IBIS Models for these technologies.

No doubt about it, we can do MODELS for the technologies.

The interesting thing is that we can influence the process
of GENERATING the standards in the first place.  One of the
reasons that JC-16B was formed is that some standards in
the past were created with built-into-the-foundations
signal integrity flaws.  Part of the JC-16B charter is to
improve the process and characterization of signalling
standards.

Personally, I'd hope to have IBIS become the syntax for
characterizing signalling standards in the first place.
We wouldn't HAVE to model SSTL-1.8, for instance, since
the standard itself would contain an IBIS model envelope
for compliant devices.

> > Date: Wed, 04 Mar 1998 15:51:11 -0700
> > From: "D. C. Sessions" <dc.sessions@tempe.vlsi.com>
> > Organization: VLSI Technology Inc.
> > To: IBIS Mailing list <ibis@vhdl.org>
> > CC: Gil Russell <gilbert.russell@sci.siemens.com>
> 
> > Thumbnail meeting report:
> 
> > Yesterday I attended the quarterly JEDEC JC-16 meeting.
> > JC-16 is the group responsible for JEDEC signalling
> > standards such as SSTL, HSTL, etc.  Among other things
> > announced was the establishment of JC-16B, a working
> > group chartered with modelling and testing issues.
> 
> > Some smartmouth in the back of the room pointed out
> > that the JC-16 membership was rich in semiconductor
> > manufacturers and system houses but totally lacking
> > in EDA companies, which might be a slight handicap
> > when addressing modelling and test issues.  To the
> > surprise of no one, said impulsive individual got
> > the appropriate reward: assignment as liason to the
> > EIA IBIS committee, which apparently has a complementary
> > membership and is posessed of much-needed expertise.
> 
> > Note that the CC: on this message is to one Gil Russell,
> > whose misfortune is to chair JC-16B.  This could be
> > the start of a VERY profitable collaboration.
> 
> > Item on the table: JC-16 meets quarterly along with a
> > slew of other JEDEC committees.  We (IBIS) should
> > consider moving our winter face-to-face meeting to
> > colocate with their December meeting.  Some mightily
> > interesting results could come of that.
> 
> > --
> > D. C. Sessions
> > dc.sessions@tempe.vlsi.com

-- 
D. C. Sessions
dc.sessions@tempe.vlsi.com
 
From owner-ibis  Thu Mar  5 16:09:11 1998
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Date: Thu, 05 Mar 1998 16:06:26 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>



Hello All:

    The parser developer raised the following issue with the [Pin List]
keyword syntax ([Pin List] is found in the Electrical Board Description
section of IBIS ver3.0).  Because it is a syntax issue, a bird is required
to fix it.  After confering with Bob Ross, here is the proposed change.

          Regards,
          Stephen Peters
          Intel Corp.




                 Buffer Issue Resolution Document  (BIRD)


BIRD ID#:    Bird 47
ISSUE TITLE: Remove pin name as a sub-param of the [Pin List] keyword 
REQUESTOR:   Stephen Peters  Intel Corp.

DATE SUBMITTED:  March 5, 1998
DATE ACCEPTED BY IBIS OPEN FORUM:

*******************************************************************************
*******************************************************************************

STATEMENT OF THE ISSUE: The current [Pin List] keyword in the Electrical
Board Description of the specification list two subprameters -- pin_name
and signal_name.  However, this syntax/format is not consistent with the
[Pin] or [Pin Number] keywords in the rest of the specification.
Specificaly, the 'pin name' should be what the keyword is listing, not
a sub-param to the keyword.  Therefore, 'pin_name' should be removed as
a subparameter from the [Pin List] keyword, and the example changed.
 

*******************************************************************************

STATEMENT OF THE RESOLVED SPECIFICATIONS:  Replace the current [Pin List] 
keyword description and example in the Electrical Board Description section
of the specification with the following.

|=============================================================================
|     Keyword:  [Pin List]
|    Required:  Yes
| Description:  Tells the parser the pin names of the user accessible pins.
|               It also informs the parser which pins are connected to power
|               and ground. 
|  Sub-Params:  signal_name
| Usage Rules:  Following the [Pin List] keyword are two columns.  The first
|               column lists the pin name while the second lists the data book 
|               name of the signal connected to that pin. There must be as 
|               many pin_name/signal_name rows as there are pins given by the 
|               preceding [Number Of Pins] keyword.  Pin names must be the 
|               alphanumeric external pin names of the part.  The pin names
|               cannot exceed eight characters in length.  Any pin associated
|               with a signal name that begins with "GND" or "POWER" will be
|               interpreted as connecting to the boards ground or power plane.
|               In addition, NC is a legal signal name and indicates that the
|               Pin is a 'no connect'.  As per the IBIS standard "GND",
|               "POWER" and "NC" are case insensitive.
|-----------------------------------------------------------------------------
|  A SIMM Board Example
|
[Pin List]  signal_name
 A1          GND
 A2          data1
 A3          data2
 A4          POWER5    | this pin connects to 5v
 A5          NC        | a no connect pin
| .
| .
 A22         POWER3.3  | this pin connects to 3.3v
 B1          casa
| .
| .
|etc.
|
|=============================================================================



*******************************************************************************

ANALYSIS PATH/DATA THAT LED TO SPECIFICATION:  This problem was found while
the parser for IBIS ver3.0 was being developed.  Bob Ross (unofficial
keeper of the ibis syntax and syle) concures with the change.


*******************************************************************************

ANY OTHER BACKGROUND INFORMATION:



*******************************************************************************



 
From owner-ibis  Fri Mar  6 08:07:05 1998
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Date: Fri, 06 Mar 1998 11:03:27 -0500
To: dc.sessions@tempe.vlsi.com
From: "Dr. Edward P. Sayre" <esayre@nesa.com>
Subject: IBIS/JEDEC-16
Cc: breda@nesa.com, ibis@eda.org
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D. C.:

I concur that IBIS and JEDEC-16 should meet periodically.  You chip guys
have a definite interest in device qualitative descriptions, threshold
definitions and some application information is assembled and published,
but interoperability, modeling (SPICE and IBIS) and other user oriented
stuff is often left to the lab motorheads to complete.  The result is that
it often doesn't get done soon enough for our purposes.

By the way does JEDEC-16 have a web site with current drafts and standards?

ed sayre



+~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~+
|       NORTH EAST SYSTEMS ASSOCIATES, INC.       |
|      -------------------------------------      |
|     "High Performance Engineering & Design"     |
+~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~+
| Dr. Ed Sayre            e-mail: esayre@nesa.com |
| NESA, Inc.              http://www.nesa.com/    |
| 636 Great Road          Tel +1.508.897-8787     |
| Stow, MA 01775 USA      Fax +1.508.897-5359     |
+~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~+


 
From owner-ibis  Fri Mar  6 10:52:28 1998
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From: bobr@emicx.mentorg.com (Bob Ross)
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Date: Fri, 6 Mar 98 10:49:31 PST
Message-Id: <9803061849.AA28843@bob>
To: ibis@eda.org
Subject: AGENDA IBIS MEETING 3/13/98

                       IBIS Open Forum Meeting Agenda 
                                for 3/13/98

                  Bridge Number    Reservation #   Passcode
                  (916) 356-9200   5-23353         2913463

    
 All meetings are 8:00 AM to 9:55 AM Pacific Time.  When you call into the 
 meeting, ask for the IBIS Open Forum hosted by Will Hobbs and give the
 Reservation Number and Passcode.
 
 8:00 Check-In, Intros, Announcements                         Ross

      - Intros of New IBIS Participants, Meeting Quorum       Ross
      - Membership Update and Treasurers Report               Rusher
      - Review of Previous Meeting's Minutes (and ARs)        Peters
      - Miscellany/Announcements                              All
      - Press & Web Page Updates                              Huq, All
      - New Models Available, Library Update                  Powell, All
      - Opens for New Issues                                  All

 8:25 Administrative and Project Discussions

      International Progress                                  Rusher/Ross
      - IEC 62014-1 (IBIS Version 2.1)
      - EIAJ III (I/O Interface Model for ICs)
      - 93/67/NP IBIS and EMC Simulation - Meeting report     Ross/Perrin

      IBIS (East) Users Group Meeting                         Ross

      European IBIS Summit Meeting Review                     Ross

      DATE98 & PCB Symposium Review                           Ross

      Editing Committee                                       Ross/Peters
      BIRD44 - Interpretation of Min/Max/Weak/Strong Data     Ross

      IBISCHK2+ (Ver 2.115) PROGRESS                          Flora/Rokusek

      Version 3.1 Parser Development                          Ross/Peters
      - Billing
      - Tests
      - Samples

      BUG19 - Warning for "typ" Data Outside "min and "max"   Ross

      Cookbook Status                                         Peters
      - Examples

      IBIS Model Review Committee                             Flora

      JC-16B - SSTL, HSTL Modeling                            Sessions/Rusher

      New Administrative Issues                               All

 9:15 Technical Discussion

      BIRD42.3 - Modeling Current Waveforms                   Kumar/Ross

      BIRD45.1 - Dynamic Clamps                               Orhanovic/Muranyi

      BIRD46.1 - Relaxation of Some IBIS Model File Name      Flora
                 Restrictions

      BIRD47 - Remove Pin Name as a Sub-Param of the          Peters
               [Pin List] Keyword

      New Technical Issues                                    All

 9:50 Wrap Up and Next Meetings Plans                         Ross

 9:55 Sign Off
 







 
From owner-ibis  Fri Mar  6 12:28:17 1998
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Date: Fri, 6 Mar 1998 12:16:13 -0800
From: nikolai@avanticorp.com (Nikolai Bannov)
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To: ibis@eda.org, ibis-info@eda.org
Subject: what is Vmeas
X-Sun-Charset: US-ASCII



Hi Ibis Gurus,

Could anybody expalain me what is Vmeas.

What standard says about Vmeas:

|     Keyword:  [Model]
|  Sub-Params:  Vmeas, Cref, Rref, Vref

|               The Vmeas, Cref, Rref, and Vref
|               subparameters are optional. 

|               The Cref and Rref subparameters correspond to the test load
|               that the manufacturer uses when specifying the propagation
|               delay and/or output switching time of the device.  The Vmeas
|               subparameter is the reference voltage level that the
|               manufacturer uses for the component.  Include Cref, Rref, and
|               Vmeas information to facilitate board-level timing simulation.
|               The assumed connections for Cref, Rref, and Vref are shown in
|               the following diagram:
|
|                            _________
|                           |         |
|                           |      |\ |            Rref
|                           |Driver| \|------o----/\/\/\----o Vref
|                           |      | /|      |
|                           |      |/ |     === Cref
|                           |_________|      |
|                                            |
|                                           GND

| Other Notes:  A complete [Model] description normally contains the following
|               keywords:  [Voltage Range], [Pullup], [Pulldown], [GND Clamp],
|               [POWER Clamp], and [Ramp].

Does anybody know what is Vmeas? Does it have any relation to
[Voltage Range] ?

<< The Vmeas subparameter is the reference voltage level that the
   manufacturer uses for the component. >> this definition doesn't seem to
me specific enough .

Thank you very much

Nik

nikolai@avanticorp.com
 
From owner-ibis  Fri Mar  6 14:54:53 1998
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Dr. Edward P. Sayre wrote:

> I concur that IBIS and JEDEC-16 should meet periodically.  You chip guys
> have a definite interest in device qualitative descriptions, threshold
> definitions and some application information is assembled and published,
> but interoperability, modeling (SPICE and IBIS) and other user oriented
> stuff is often left to the lab motorheads to complete.  The result is that
> it often doesn't get done soon enough for our purposes.

The result is that is often doesn't get done soon enough for ANY
purposes.  Keep in mind that the ICs that I design have to talk
over transmission media to chips that others design, and it's
not much help if their models aren't ready when I'm designing.

Worse yet (and part of the reason for JC-16B) is that some of
the *standards* were introduced without any upfront analysis
(read modelling) and are crippled thereby.  If I were feeling
nasty I'd mention GTL at this point.

> By the way does JEDEC-16 have a web site with current drafts and standards?

Would you believe http://www.eia.org/jedec/download/freestd/jesd8-xx/
The domain should be familiar.

-- 
D. C. Sessions
dc.sessions@tempe.vlsi.com
 
From owner-ibis  Tue Mar 10 13:04:34 1998
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To: nikolai@avanticorp.com (Nikolai Bannov)
cc: ibis@eda.org, ibis-info@eda.org
Subject: Re: what is Vmeas 
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Date: Tue, 10 Mar 1998 13:01:39 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>



Hello Nick:

On  Fri, 06 Mar 1998 12:16:13 PST you wrote

> Hi Ibis Gurus,
> 
> Could anybody expalain me what is Vmeas.
> 
 <snip a lot of stuff>
>
>

   Well, the best way I can explain it is thru example.  Suppose you're 
measuring
the propagation delay thru a simple gate, as shown in the example below:


                 __________________________________________
                /
   input       / 
  ____________/|
               |
               |
               |                      
   ____________|_______________________ | 
               |                       \|
  output       |                        \--  Vmes
               |                        |\_____________________________        

               |                        |
               |                        |
               |<-------  Tpd --------->|


  The propagation delay (Tpd) is measured from a specific point on the input 
waveform,
to when the output waveform crosses a specific voltage.  This voltage is 
referred
to a 'Vmes' (or measurement voltage).  For CMOS and TTL logic Vmeas is 
generally 1.5v.
Knowing Vmeas is important because CAE tools that perform system timing 
calculations
use this value to determine how to derate device propagation delay due to 
interconnect.  I hope this helps.

              Regards,
              Stephen Peters
              Intel Corp.


 
From owner-ibis  Wed Mar 11 17:43:29 1998
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From: nikolai@avanticorp.com (Nikolai Bannov)
Message-Id: <199803120131.RAA09356@iris.svd.avanticorp.com>
To: ibis@eda.org, ibis-info@eda.org
Subject: what is dut? a question to ibis gurus
X-Sun-Charset: US-ASCII


Hi Ibis Gurus,

Could anybody expalain me what is X_dut.

What standard says about ..._dut


|    Keywords:  [Rising Waveform], [Falling Waveform]

|  Sub-Params:  R_dut, L_dut, C_dut

|               The 'fixture' subparameters specify the loading conditions
|               under which the waveform is taken.  The R_dut, C_dut, and
|               L_dut subparameters are analogous to the package parameters
|               R_pkg, C_pkg, and L_pkg and are used if the waveform includes
|               the effects of pin inductance/capacitance.  The diagram below
|               shows the interconnection of these elements.
|
|                      PACKAGE            |   TEST FIXTURE
|       _________                         |
|      |  DUT    |   L_dut   R_dut        | L_fixture  R_fixture
|      |  die    |---@@@@@--/\/\/\--o-----|--@@@@---o---/\/\/\----- V_fixture
|      |_________|                  |     |         |
|                                   |     |         |
|                                   |     |         |
|                            C_dut ===    |        === C_fixture
|                                   |     |         |
|                                   |     |         |
|                                  GND    |        GND
|
|               NOTE:  The use of L_dut, R_dut, and C_dut is strongly
|               discouraged in developing Waveform data from simulation
|               models.  Some simulators may ignore these parameters because
|               they may introduce numerical time constant artifacts.

|               All tables assume that the die capacitance is included.
|               Potential numerical problems associated with processing the
|               data using the effective C_comp for effective die capacitance
|               may be handled differently among simulators.
|-----------------------------------------------------------------------------


So, is it correct that  

--- 1 --- if
L_dut, R_dut, and C_dut are not given, --- then
R_pkg, C_pkg, and L_pkg should be assumed included in place of 
L_dut, R_dut, and C_dut 

--- 2 --- if
L_dut, R_dut, and C_dut are given, --- then
R_pkg, C_pkg, and L_pkg should be ignored 
(and not included in DUT die) in the figuere above

--- 3 ---
C_comp should be ALWAYS added to the circuit
(it is  a part of DUT die)

--- 4 ---
finally, what "dut" stands for ? (acronim, abbreviation, ibis inventor?)

why "use of L_dut, R_dut, and C_dut is strongly discouraged" ?



Thank you very much

Nik

nikolai@avanticorp.com
 
From owner-ibis  Fri Mar 13 18:34:16 1998
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From: bobr@wv.mentorg.com (Bob Ross)
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To: ibis-users@eda.org, ibis@eda.org
Subject: New s2ibis2 executable for Win95.

To All:

This is to inform you that a Windows95 version of s2ibis2 has been
uploaded to eda.org under /pub/ibis/s2ibis/s2ibis2_nt/s2ibis2Win95.zip.
It works with HSPICE.

This is contributed by Scott McMorrow of SiQual corporation.  It contains
some fixes including using 5 decimal digits in the tables for better
resolution and also providing 251 points in the Waveform tables.  A
utility is provided to filter these points to 100 by taking the first 75
points and sampling the rest.  In this way there is high resolution 
for the first part of the response where the rapid transitions should
occur and also enough points to capture the convergence to the final
DC value.

Scott's email address and other information is contained in the .zip file
if you have comments or questions.  Thanks to Scott for contributing this.

Bob Ross
Interconnectix Business Unit/Mentor Graphics
 
From owner-ibis  Tue Mar 17 09:12:21 1998
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To: ibis@eda.org
Subject: IBIS Open Forum Minutes 3/13
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Date: Tue, 17 Mar 1998 09:09:22 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>


 DATE: 3/17/98

 SUBJECT: 3/13/98 EIA IBIS Open Forum Minutes
     
 VOTING MEMBERS AND 1998 PARTICIPANTS LIST:
 AMP                            (Martin Freedman) 
 Applied Simulation Technology  Norio Matsui, Raj Raghuram
 Cadence Design (& UniCAD)      C. Kumar, Don Telian, Patrick Riffault, 
				Craig Lewis, Greg Fitzgerald, Paul Galloway,
				Patrick Dos Santos, Catherine Weiss, 
				Alain Tribaudot, Geoffrey Ellis* 
 Cypress                        (Bruce Wenniger)
 Digital Equipment Corp.        Jeff Chu*, Greg Edlund*, Bob Haller
 Hewlett Packard (EEsof, etc.)  Karl Kachigan, Henry Wu, Paul Gregory
 High Design Technology         Razvan Ene
 HyperLynx                      Kellee Crisafulli, Matthew Flora*
 Incases                        Olaf Rethmeier*, Scott Jacobson,
				Werner Rissiek
 Intel Corporation              Stephen Peters*, Arpad Muranyi*, Frank Kern*,
				Will Hobbs, Prakash Radhakrishnan
   Columbia, SC (formerly NCR)  Dave Moxley*
 Mentor Graphics (Zeelan,       Bob Ross*, George Opsahl, Mark Noneman,
   Interconnectix, etc.)        Tom Dagostino, Karine Loudet, Jean Oudinot,
				Manuel De Almeida, Stephane Rousseau, 
				Nevin Orhanovic*
 Mitsubishi                     Hoang Nguyen*, Tam Cao
 Motorola                       (Ron Werner)
 National Semiconductor         Syed Huq*, Cheng-Yang Kao, John Goldie,
				Ikchang Song
 North East Systems Associates  Edward Sayre, Kathy Breda
   (NESA)
 NEC                            (Hiroshi Matsumoto)
 Quantic EMC                    (Mike Ventham)
 Texas Instruments              Thomas Fisher, Harvey Stiegler,
				Vincent Chang, Jean-Claude Perrin*,
				Peter Forstner
 Thomson-CSF                    Jean-Marc Claveau, Laurent Duzaic,
				Saverio Lerose, Benoit Meyniel,
				Jean Lefebvre  
 Viewlogic                      Jon Powell, Chris Rokusek, Guy de Burgh, 
				Gary Mandel
 VeriBest                       Ian Dodd, David Weins, Ian Gabbitas
 VLSI Technology                D.C. Sessions*
 Zuken-Redac                    (John Berrie) 

 OTHER PARTICIPANTS IN 1998:
 Actel                          Eric Tardif, Emmonvelle Gaudin 
 Aerospatiale                   Lionel Dreux, Claude Huet
 Alcatel (Bell, Espace, etc.)   John Fitzpatrick, W. Temmerman, 
				Laure Bessettes, Jean-Claude Pourtau,
				Daniel Peron
 ALS Design                     Yves Mouquet
 Ansoft                         Eric Bogatin
 Apple                          Fred Floresca, Danny Itani
 Apteq Design Systems           Dan FitzPatrick 
 Avanti                         Nik Bannov*
 CERN                           Olivier Clere, Jean-Michel Sainson, 
				Rudi Zurbroken
 Compaq                         Shariq Rahma
 EIA                            Patti Rusher*
 EMC                            Fawn Engelmann
 ENST, Paris                    Jean-Jacques Charlot
 European CAD Standardization   Adam Morawiec
   Intitiative (ECSI)
 Fairchild Semiconductor        Peter LaFlamme
 H.A.S Electronics              Haruny Said
 Intracon Design Ltd.           Derek Laidlaw
 Philips Semiconductor          Todd Andersen
 Scottish Electronics           Robert Easson
   Manufacturing Center (SEMC)
 Seagate                        Vanessa Howard
 SGS-Thomson                    Philippe Lefevre
 Siemens                        Gerald Bannert, Bernhard Unger, 
				Christian Marot, Miguel Hernandez,
				Gil Russell*
 Symmetry                       Andy Hughes
 Tektronix                      Nassrin Ghahyasi
 Ultratest International        Chris O'Connor
 Xilinx                         Susan Wu

 In the list above, attendees at the meeting are indicated by *.  Principal
 members or other active members who have not attended are in parentheses.
 Participants who no longer are in the organization are in square brackets.

 Upcoming Meetings:  The bridge numbers for future IBIS teleconferences are as
 follows:
   
   Date               Bridge Number     Reservation #    Passcode
   April 3, 1998      (916) 356-9200    5-28516          6935733


 All meetings are 8:00 AM to 9:55 AM Pacific Time.  We try to have agendas out 
 7 days before each Open Forum and meeting minutes out within 7 days after.  
 When you call into the meeting, ask for the IBIS Open Forum hosted by Will 
 Hobbs and give the reservation number and passcode.
 
 NOTE: "AR" = Action Required.

 -------------------------------- MINUTES -------------------------------------

 INTRODUCTIONS AND MEETING QUORUM
 Geoffrey Ellis from Cadence stated that he is involved with IBIS Version 2.1
 and IBIS Version 3.0 utilities development
 
 Nik Bannov of Avanti is working on resurrecting the Meta I/O product and on 
 Version 2.1 and Version 3.0 translations.

 D.C. Sessions invited and introduced Gil Russell of Siemens who is Chair of 
 the JEDEC 16B committee.  Gil's interest is in developing simulation models 
 for the components and methods considered by the subcommittee.  Patti Rusher
 affirmed that JEDEC now has full divisional status under EIA.

 Jean-Claude Perrin of Texas Instruments in France participated in the 
 European IBIS Summit and is Chair of the IEC working group on IBIS 
 Simulation and EMC Modeling.


 MEMBERSHIP UPDATE AND TREASURER'S REPORT
 Patti Rusher had issued invoices.  She reports that North East Systems 
 Associates (NESA) is a new member and has received payment from Mitsubishi.  
 She has gotten other payments, but the accounting system is still not 
 functioning properly for a detailed ledger report.  Bob Ross and Patti will 
 discuss off-line some invoice duplication issues.

 Patti also noted that the invoices for $2084 for ibischk3 parser source
 code have been generated and mailed.


 REVIEW OF MINUTES AND AR'S
 The AR's will be discussed at the meeting.  No corrections were noted on
 the previous two sets of meeting Minutes.


 MISCELLANY/ANNOUNCEMENTS
 Bob Ross indicated that he still plans the Majordomo conversion when he has
 time.

 Later, Bob stated that Syed Huq will ask on the IBIS reflector for Roster 
 Updates for 1998.


 PRESS AND WEB PAGE UPDATES
 Bob Ross reported that the March 2, 1998 issue of EDN, pp. 14-16, has the 
 article "EDA Companies Tackle PCB-Board Design" which discusses several 
 companies with IBIS capability. 


 NEW MODELS AVAILABLE, LIBRARY UPDATE
 Bob noted that Jon Powell had inadvertently deleted the IBIS models page
 that was linked from the EIA IBIS home page.  Jon expects to restore it, and 
 Syed Huq will ask Jon on how it is progressing.

 Matthew Flora reported that he found a new Motorola link for IBIS models.
 It has columns for several technologies, but currently IBIS models exist 
 for the LCX technology.  He submitted the link later as 

   http://mot2.indirect.com/models/bin/logic_ic.html

 He cautioned that while the tables look good, there exists some binary data
 encoding or corruption in the uploaded files.  Matthew has contacted Motorola
 regarding this.


 OPENS FOR NEW ISSUES
 Bob Ross on BUG24 - Errors not issued under first of several [Define Package
   Model] keywords.
 Bob Ross on s2ibis2 for Win95.


 INTERNATIONAL PROGRESS
 - IEC 62014-1 (IBIS Version 2.1) - Patti Rusher still has not heard on the
   status.

 - EIAJ III (I/O Interface Model for ICs) - Bob reported that the EIAJ
   subcommittee plans to have a web site in March 1998 with access to 
   an English translation of the Version 1.0 document. 

 - IEC 93/67/NP IBIS and EMC Simulation - Bob reported on the meeting of 
   national experts held in Paris on Friday, February 27, 1998.  Bob is the 
   US representative.  Other national representatives from several countries
   participated along with the French committee within an official French
   standardization body: UTE.  The purpose of the meeting was to review the 
   committee activities and to provide input to the pending IEC 93/67/NP new 
   work item proposal.  This meeting was conducted as a working group meeting
   under IEC TC93/WG5 which was formed after IEC pushed back on the original
   IEC 93/60/NP proposal.  The group's charter is to produce a new work item
   proposal with international concurrence for a project to standardize on 
   models for simulating EMI emissions and also for simulating susceptibility 
   to emissions.  The presentation and draft document show some standardized 
   measurement setups and some results.  The proposal is for creating 
   equivalent models of internal noise sources within components along with
   describing some coupling to pins and supplies.  The proposal also provides
   for coupling from internal EMI noise sources to the device itself.  The
   committee had chosen the IBIS format as the basis for doing these
   additions because of the usage of the IBIS format in the simulators of
   interest.
   
   The group intends to work on the proposal to consider submitting it to 
   IEC consideration as a new work item.  Bob suggested that EDA tool vendors 
   would need to be involved with this activity for the committee to produce
   and acceptable simulation model.  Note, this committee is chaired by
   Jean-Claude Perrin who called in after this report was given.
   
  
 IBIS EAST USERS GROUP ACTIVITIES
 Greg Edlund reported on the IBIS User's Group meeting will hold a meeting
 on Thursday, March 19, 1998 at Digital Equipment.  It will cover the pending
 BIRD on an Accuracy and Testing Document, some tools activities, and some
 reports on the European IBIS Summit.
 
 Greg also is holding a meeting of the Accuracy subgroup on Thursday, March
 26, 1998 to work on the Accuracy document.  Greg stated that some of the 
 work by Greg and Bob Haller documented in the DesignCon98 paper will be
 applied.  Bob Ross recommended that this document be generated separate to 
 IBIS Version 3.0.  It already is self-contained, comprehensive subject. 
 There could be some controversial areas such as test loads and methodology, 
 and Bob does not want the activity to bog down the progress toward IBIS 
 Version 3.1.  So, while a BIRD proposal would be in context of issuing an 
 Appendix to IBIS Version 3.1, a BIRD would not be approved until the 
 document is completed.  The document itself must focus on the methodology
 and not make references to any commercial EDA product to remain within
 the scope of what is allowed within the EIA rules of operation.


 EUROPEAN IBIS SUMMIT REPORT
 Bob Ross asked if there was any feedback on the European IBIS Summit.  Syed
 Huq felt it was a very successful meeting and thanked Mentor Graphics, 
 Cadence, and High Design Technology for providing the support.  The meeting
 was well attended and the 13 presentations filled the day.  Syed appreciated
 that all the presentations had been uploaded.  Bob also felt that the Summit 
 was successful and stated that the people in Europe were critical for 
 handling the local logistics.  He stated that the next European IBIS Summit
 will probably be held with DATE99 in March in Munich, Germany.
 

 DATE98 AND PCB SYMPOSIUM FEEDBACK
 Bob Ross also asked if there was any feedback on the Design Automation
 and Test in Europe show.  In general Bob and others felt that these were
 good conferences.


 EDITING COMMITTEE 
 Bob Ross reported that he will upload the unofficial IBIS ver3_1b.ibs update
 in the  /pub/ibis/wip directory of eda.org.  It corrects a few editorial
 errors including the [End Electrical Description] and [End Board
 Description] nomenclature inconsistency and other issues reported by Atul
 Agarwal.

 The BNF AR remains.

 AR - Bob Ross generate and post a BNF for IBIS Version 3.0 (an IBIS Version
 3.0 ratification AR).


 BIRD44 - INTERPRETATION OF MIN/MAX/WEAK/STRONG DATA
 Bob Ross reported that he contacted Andy Ingraham regarding submitting
 BIRD44.1 to capture the agreements of the February 13, 1998 meeting.  The
 extension will use only slow/weak and fast/strong nomenclature.  Andy will
 also state the other keywords in Version 3.0 that might be affected by this
 change.  Andy indicated that he expected to do this.

 AR - Andy Ingraham to issue BIRD44.1 with the changes and extensions noted
 above.


 IBISCHK2+ (VER 2.115) PROGRESS
 As previously reported, Matthew Flora and Chris Rokusek worked together
 to produce a set of executables including a DOS32 executable for ibischk2+
 Version 2.1.15 which Bob Ross Uploaded on eda.org.
 
 Also Matthew reported that fixes to BUG22 and BUG23 were added to ibischk2+
 and sent to Atul Agarwal for inclusion in the ibischk3 development.  Bob
 asked that Matthew and Chris continue adding bug fixes to the ibischk2+
 code, but that we will not release executables until we have a stable set
 of fixes.

 As more bugs are discovered and fixed as part of the ibischk3 project, Bob
 would like Matthew, Chris, and Atul to work together to get the information
 for ibischk2+ updates incorporated in the ibischk2+ code.  As an example,
 BUG8 is fixed in ibischk3, but has not been moved to ibischk2+ because we
 did not have the resources to fix it when it was reported.


 VERSION 3.1 PARSER DEVELOPMENT
 Around February 20, 1998, the first release of ibischk3 was distributed to
 the 12 companies that supported the development.  Matthew Flora is doing
 the distribution from source code that Atul Agarwal delivers to him.  
 Matthew has been adding a DOS32 ibischk3.exe executable so people can use
 the code.  Atul reported that he has included the fixes to BUG22, BUG23,
 and also BUG8 in the first release.  The first release included
 implementations of all of the IBIS Version 3.0 features except the package
 model and electrical board descriptions.  Bob Ross reported that Atul has
 included eight comprehensive test files for testing and checking the
 ibischk3 functions that have been implemented so far.  Bob reviewed these
 in detail - line by line, and provided some feedback to Atul.  The 
 ibischk-bug@eda.org reflector contains the officers and several people
 involved in the parser development projects, and questions regarding
 ibischk3 details raised by Atul are answered on this reflector.  Atul is
 now working on the package model extensions and on the electrical board
 description.

 Atul has just reported that he has a correction release based on issues
 raised on the code so far.  Bob asked Matthew to communicate with Atul
 and get a new copy for distribution.

 AR - Matthew Flora work with Atul Agarwal to distribute a new release of
 ibischk3.

 As previously reported, the invoices have been sent out to the companies
 funding the ibischk3 parser development.


 COOKBOOK
 Stephen Peters reports that Greg Edlund and Bob Haller from the IBIS East 
 Users Group are now participating in the Cookbook update project.  They 
 will provide contributions to the Test and Validation chapter. 

 Bob Ross suggested dropping all the ARs related to supplying examples to
 the Cookbook since no one has acted on these.  Everyone agreed with this, 
 so the example ARs are removed.
 
 
 BUG19 - WARNING FOR "typ" DATA OUTSIDE "min" AND "max"
 Bob Ross had been asked by Atul Agarwal whether he wanted Atul to add this
 enhancement in ibischk3.  Atul has already implemented some value testing
 for the ibischk3 [Model Spec] subparameters.  BUG19 also deals with checking
 to see if typical parameters fall between the min and max parameters.
 
 When originally issued by Paul Gregory, BUG19 was concerned with values in 
 the I/V tables.  However per the discussion at the December 17, 1998 meeting 
 we felt that there were cases where such a test would issue warnings against 
 correct data - particularly for BiCMOS devices.  However, we felt the idea 
 was still valid for subparameters such as C_comp, L_pkg, C_pkg and R_pkg.  
 However, we did not authorize that this BUG be fixed at that time.  Bob
 now suggested that we authorize its implementation for the above 
 subparameters and also for all of the Voltage Rails.  The committee agreed.
 
 AR - Bob Ross communicate to Atul Agarwal to implement the BUG19 enhancement
 for the keywords and subparameters above.


 BUG24 - ERRORS NOT ISSUED UNDER FIRST OF SEVERAL [Define Package Model]
	 KEYWORDS
 Bob Ross added this new agenda item for discussion here because Atul Agarwal 
 issued BUG24 and also provided the solution.  BUG24 applies to ibischk2+,
 but this bug would get in the way of test case development for ibischk3.
 
 Since the provided solution was simple, Bob Ross suggested that we fix it
 and also add the fix to the ibischk2+ source code.  Bob also suggested that
 BUG24 be classified as Severe, Medium since real errors can be missed.


 IBIS MODEL REVIEW COMMITTEE DISCUSSION
 Bob Ross reported that one company is interested in getting some IBIS models
 reviewed.  Bob had asked the request be forwarded to Matthew Flora.  Matthew
 has not yet seen the request.

 D.C. Sessions indicated that the VLSI IBIS models are available for review.
 Bob has completed the permission request, and D.C. indicated that he is
 ready to upload the several Megabytes of IBIS models to Bob's site for the
 purpose of review.  Others may also receive the models if the provide D.C.
 a letter at the VLSI address on the roster.

 Bob listed the complete Model Review Committee again and the e-mail 
 addresses are given in the minutes.  The contact point is Matthew Flora.  

   Matthew Flora, HyperLynx                   mbflora@hyperlynx.com
   Bob Ross, Interconnectix/Mentor Graphics   bob_ross@mentorg.com
   Olaf Rethmeier, Incases                    orethmeier@pad.incases.com
   Chris Rokusek, Viewlogic                   crokusek@qdt.com
   Paul Galloway, Cadence                     pgjr@cadence.com
   Ian Dodd, VeriBest                         idodd@veribest.com
   Jon Powell, Viewlogic                      jonp@qdt.com

 
 JC-16B
 Gil Russell is serving as Chair of a JEDEC subgroup of JC-16 designated as
 JC-16B.  Gil describes JC-16 role as standardizing on interface modeling
 and testing of new I/O configurations such as Series Stub Terminated Logic 
 (STTL).  However what is missing are simulation models for the devices for 
 validating the new methodologies.  Gil revealed some resulting problems in 
 the SSTL-3 specification extensions that might have been discovered by
 simulation.  So SSTL-2 is still the practical level.  This problem provided  
 a motivation to form the JC-16B subgroup.  Gil presented the Scope statement
 that the committee wants to generate models related to the new technologies
 considered by JC-16 and to be used for verification and design support.

 For background, D.C. Sessions is a member of JC-16B and suggested that IBIS 
 format was an ideal candidate for fulfilling the modeling requirements. 
 Furthermore, he suggested that EDA vendors need to participate in such model 
 development activities.  D.C. (was) volunteered to serve as a liaison between 
 JC-16B and the IBIS committee, and he invited Gil to participate in the IBIS 
 Open Forum meeting.

 Since the Scope statement was quite lengthy, Bob Ross asked Gil to provide
 a text copy to be distributed to the IBIS reflector.  Furthermore, Bob
 invited Gil to continue to participate and monitor the IBIS activities
 since the Open Forum participation public and is open to all interested 
 people.
 
 D.C., Gil and Patti Rusher discussed further a suggestion that the IBIS
 Open Forum meet at the December, 1998 meeting in San Diego, California.
 D.C. proposed the IBIS Summit meeting be held with the JEDEC group to foster
 interaction.  He proposed that this replace the semi-annual IBIS Summit
 meeting associated with DesignCon in January in Santa Clara.  Bob Ross
 indicated that this would have to be considered further since the IBIS
 community has had very successful history working with the DesignCon staff 
 and holding meetings in January.  Bob asked about other quarterly meeting 
 locations to see if they happened to be at other potential IBIS Summit 
 meeting sites, but the other JEDEC quarterly meetings tended to be at 
 international locations.  Bob would also consider an additional joint 
 meeting in San Diego in December.  The possibility of a joint meeting is
 open to further discussion.
 

 S2IBIS2
 Bob Ross reported that he uploaded a copy of s2ibis2 for Windows95 that was
 contributed by Scott McMorrow of SiQual corporation.  It works with HSPICE.
 Scott extended the columns to 5 decimal points for better accuracy and
 resolution and increased the length of the waveform table to 251 points.  He
 also provides a utility to keep the first 75 points and sample the rest for
 a total of 100 points - the IBIS limit (if it is needed by the EDA tool).
 In this way he can get good resolution on the first part of the response
 where the data is changing and also converge accurately to the final DC
 value.  Bob indicated that the .zip file which includes documentation is
 located on eda.org under /pub/ibis/s2ibis/s2ibis2_nt.  (Late note, with a
 .dll file in the documentation, this executable also works with Windows NT).
 Scott's e-mail is provided for comments and questions. 
 

 BIRD42.3 - MODELING CURRENT WAVEFORMS
 Bob Ross reported that BIRD42.3 and related topics were discussed at the
 the European IBIS Summit.  However, he was not ready to discuss this at
 this meeting.


 BIRD45.1 - DYNAMIC CLAMPS
 Arpad Muranyi reported that he met with Bob Ross and Chris Reid at Mentor
 Graphics on February 11, 1998 to agree upon a proposal.  Initially the 
 investigation was to see whether the [Driver Selection] mechanism could be
 used as originally suggested by Dave Moxley.  After some discussion the 
 group reached an agreement on a comprehensive extension that includes the
 BIRD45.1 dynamic clamp mechanism and also some active latching feature. 
 
 Bob outlined the revised proposal. A new Model_type will be 
 proposed to cover both the dynamic Clamp mechanism of BIRD45.1, but with
 fewer new keywords, and will also include the latching mechanism.  Bob noted
 that the structure models is exactly the same as the Bus Hold structure that
 is currently being implemented in devices.  Threshold subparameters for
 for voltage triggering would be added to the model for typ, min, and max
 in a four column format similar to those under [Model Spec].
 
 Input and I/O models would call this new [Model] to be added to the existing
 responses.  Bob agreed to issue the revision as BIRD45.2.
 
 AR - Bob Ross issue BIRD45.2 to add the dynamic clamp and latching
 details under a new Model_type for a model which can be called by other
 models.
 
 
 BIRD46.1 - RELAXATION OF SOME IBIS FILE NAME RESTRICTIONS
 Matthew Flora still needs to issue BIRD46.1 per the AR of the last meeting
 to extend the filename from 8 characters to 20 characters.  Bob Ross raised
 the issue that BIRD46 explicitly adds the period "." character as an allowed
 character in the file name for detail such as gtl.plus.ibs.  Bob felt that
 while such generality was possible, it was still preferred to keep the
 existing restrictions for format uniformity among model providers.  Stephen
 Peters and others on the committee agreed.  So the AR is modified to just
 extend the filename size to 20 characters without adding the comment
 character.

 Bob also noted that a BIRD must be issued two weeks before we will vote on
 it so that interested parties have time to review it.
 
 AR - Matthew Flora issue BIRD46.1 to include references to the .pkg file
 and .ebd file and to change the limitation from 64 total characters to
 a <filename> limit of 20 characters and delete the references to allowing
 the period "." character.


 BIRD47 - REMOVE PIN NAME AS A SUBPARAMETER OF THE [Pin List] KEYWORD.
 Stephen Peters issued BIRD47 to deal with an inconsistency under the 
 Electrical Board Description section, [Pin List] keyword.  As it is
 currently documented, two subparameters are documented on a separate line
 in a unique format.  The typical pin subparameters such as those for [Pin],
 [Pin Mapping], etc., list subparameters on the same line as the keyword.
 BIRD47 eliminates the pin_name subparameter and moves the signal_name
 subparameter to the keyword line.  Because this was a syntax change from
 IBIS Version 3.0, BIRD47 was necessary.

 The committee generally agreeded with BIRD47.  BIRD47 will be formally voted
 upon at the next meeting to comply with the two week notification
 requirement.  However, based on the sense of the Committee, Bob Ross will
 authorize Atul to use the syntax of BIRD47 in the ibischk3 code.


 KEYWORDS UNDER [NOTES] SECTION CAUSE PARSING ERRORS
 In the time remaining after all of the formal agenda items including new
 issues were discussed, Arpad Muranyi discussed a problem.  If a keyword
 is used as part of the text under the [Notes] keyword, and it is the first
 entry of the line, then ibischk2+ and ibischk3 report an incorrect error.

 Matthew Flora stated that IBIS requires the keywords to start on the first
 column.  If the [Notes] text was formated so that it was indented, but the
 line started with a bracketed keyword, then this would be a bug which could be
 detected and corrected.  Arpad noted that there was no restriction that the
 [Notes] text has to be indented.  Bob Ross noted that this would be a truly
 ambiguous case - you would not know if the notes text was intended to 
 include the keyword name or whether it was intended to be terminated by a
 new keyword that was not positioned properly.
 
 Arpad stated that he would write up the problem so we could consider it
 further based on its specific description.
 
 AR - Arpad Muranyi document the concern and send it to ibischk-bug@eda.org
 [Done].
 
 
 DISTINCT SIGNAL NAMES
 Matthew Flora asked whether it would be considered a specification violation
 or an error if the [Pin] signal_name entry was the same for different models.
 This was discussed briefly.  Bob Ross felt that while IBIS documents what
 is intended for signal_name (the pin signal name from the component databook),
 the entry is for information only.  EDA tools that use IBIS models do not
 rely on the entry, and there are cases where good IBIS models can be created
 by just stubbing in any entry to fill the column.  In the electrical board
 description, the signal_name subparameter column does have some meaning for
 documenting the POWER, GND, and NC pins since [Path Description]s are not
 required for these pins.
 
 Matthew felt that this was still an error for the [Pin] keyword.  Bob 
 suggested that Matthew either issue a BIRD to suggest a clarification in the 
 IBIS specification or a BUG to raise formally the issue that a Warning 
 should be issued if different signal_names exist for the same model.


 NEXT MEETING:
 The next teleconference meeting is on Friday, April 3, 1998, 8:00 A.M. to 
 9:55 A.M.  BIRD46.1 and BIRD47.1 are scheduled for votes.
 ==============================================================================
				       NOTES
 
 IBIS CHAIR: Bob Ross (503) 685-0732, Fax (503) 685-4897
	     bob_ross@mentorg.com
	     Modeling Engineer, Interconnectix BU of Mentor Graphics
	     8005 S.W. Boeckman Road, Wilsonville, OR 97070

 VICE CHAIR: Syed Huq (408) 721-4874, Fax: (408) 721-4785
	     huq@rockie.nsc.com
	     Staff Applications Engineer, National Semiconductor, M/S A-2595
	     2900 Semiconductor Drive, Santa Clara, CA 95052
 
 SECRETARY:  Stephen Peters (503) 264-4108, Fax: (503) 264-4515
	     sjpeters@ichips.intel.com
	     Senior Hardware Engineer, Intel Corporation
	     M/S JF1-56
	     2111 NE 25th Ave. 
	     Hillsboro, Oregon 97124-5961

 LIBRARIAN:  Jon Powell (805) 988-8250, Fax: (805) 988-8259
	     jonp@qdt.com
	     Senior Scientist, Viewlogic (formerly Quad Design)
	     1385 Del Norte Rd., Camarillo, CA 93010
  
 This meeting was conducted in accordance with the EIA Legal Guides and EIA
 Manual of Organization and Procedure.
 
 The following e-mail addresses are used:

   ibis-request@eda.org
       To join, change, or drop from either the IBIS Open Forum Reflector
       (ibis@eda.org), the IBIS Users' Group Reflector (ibis-users@eda.org)
       or both.  State your request.

   ibis-info@eda.org
       To obtain general information about IBIS, to ask specific questions
       for individual response, and to inquire about joining the EIA-IBIS
       Open Forum as a full Member.

   ibis@eda.org
       To send a message to the general IBIS Open Forum Reflector.  This
       is used mostly for IBIS Standardization business and future IBIS
       technical enhancements.  Job posting information is not permitted.

   ibis-users@eda.org
       To send a message to the IBIS Users' Group Reflector.  This is 
       used mostly for IBIS clarification, current modeling issues, and
       general user concerns.  Job posting information is not permitted.

   ibischk-bug@eda.org
       To report ibischk2 parser bugs.  The Bug Report Form Resides on
       eda.org in /pub/ibis/bugs/ibischk/bugform.txt along with reported bugs.

       To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms
       which reside under eda.org in /pub/ibis/bugs/s2ibis/bugs2i.txt, 
       /pub/ibis/bugs/s2ibis2/bugs2i2.txt, & /pub/ibis/bugs/s2iplt/bugsplt.txt
       respectively.

 Information on IBIS technical contents, IBIS participants, and actual
 IBIS models are available on the IBIS Home page found by selecting the
 Electronic Information Group under:

   http://www.eia.org

 Check the pub/ibis directory on eda.org for more information on previous 
 discussions and results.  You can get on via FTP anonymous.
 
 "IBIS Spoken Here" placards are available from Jon Powell (jonp@qdt.com) for 
 use at trade shows.
 ==============================================================================



 
From owner-ibis  Tue Mar 17 15:40:43 1998
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Date: Tue, 17 Mar 98 15:39:52 PST
From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9803172339.AA10382@rockie.nsc.com>
To: ibis@vhdl.org
Subject: IBIS Roster update
Cc: huq@rockie.nsc.com

IBISfans:

Pls take a moment to review the entries in the Roster page for your
company. This roster can be found in www.eia.org/EIG/IBIS/ibis.htm
Click on 'Roster'.

We try to keep this roster as current as possible. Some companies
roster entry is incomplete with certain fields missing. An updated
current roster allows IBIS interests and your customers to get hold
of you easily.

If you have gone thru mergers/consolidation etc, you may want to see
who would best represent your new organization for IBIS.

Pls provide me with your changes by FRI Mar27th. Simply E-mail them
to me and I will update the roster page.

Best Regards,
Syed.
Vice-Chair ANSI/EIA-656 IBIS
National Semiconductor Corp.
 
From owner-ibis  Tue Mar 17 22:46:20 1998
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Date: Wed, 18 Mar 1998 15:49:27 +0900
From: "Chun, Jung-Ryoon" <jrchun@hei.co.kr>
Reply-To: jrchun@hei.co.kr
Organization: HEI
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To: ibis@eda.org
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I want to be unsubscribed,,
 
From owner-ibis  Wed Mar 18 08:37:39 1998
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Date: Wed, 18 Mar 98 08:34:44 PST
Message-Id: <9803181634.AA07569@bob>
To: ibis@eda.org
Subject: IBIS ver3_1b.ibs

To All:

I have uploaded an unofficial interim document on eda.org
under /pub/ibis/wip/ver3_1b.ibs with minor editorial 
corrections.  Also I uploaded a revised tree3_0a.txt 
which moved the [Model Selector] keyword to the top
level.

Bob Ross
Interconnectix Business Unit
Mentor Graphics
 
From owner-ibis  Wed Mar 18 15:45:53 1998
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I want to be unsubscribed,,


 
From owner-ibis  Fri Mar 20 11:14:51 1998
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Date: Fri, 20 Mar 1998 11:10:28 -0800
From: jon powell <jonp@pacbell.net>
Organization: viewlogic
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TWIMC,

The IBIS models web page is back on-line.
please report any problems to me:
jonp@pacbell.net

ALso, if you have any new links for me to add. Please let me know.

sincerely,
Jon Powell
Ibis Librarian
 
From owner-ibis  Mon Mar 23 15:11:07 1998
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From: Elias Lozano <elias@3dfx.com>
To: "'ibis@vhdl.org'" <ibis@vhdl.org>, "'jon powell'" <jonp@pacbell.net>
Subject: RE: ibis models page
Date: Mon, 23 Mar 1998 15:06:32 -0800
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I have a problem:

I would like to down load the golden parser and there is no way for me
to do this.

I have gone into the www.eda.org/pub/ibis/ibischk2/solaris and when I
want to down load ibischk2 in my area, the only thing I get is just an
executable file that cannot be down loaded.
Can any one help me with this? or better yet, is this a good strategy to
use this ibischk2 to check syntax in your document?
any help will be appreciated.

Also,

can anyone send me any problems that they have had with Star-Hspice? 
I do get a number of problems when I try to running the tryme file under
the directory of test.

I would like to see just one easy example of a regular 3.3V 4 ma buffer.

thanks a lot

Elias

>----------
>From: 	jon powell[SMTP:jonp@pacbell.net]
>Sent: 	Friday, March 20, 1998 11:10 AM
>To: 	ibis@vhdl.org
>Subject: 	ibis models page
>
>TWIMC,
>
>The IBIS models web page is back on-line.
>please report any problems to me:
>jonp@pacbell.net
>
>ALso, if you have any new links for me to add. Please let me know.
>
>sincerely,
>Jon Powell
>Ibis Librarian
>
 
From owner-ibis  Mon Mar 23 16:48:13 1998
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Date: Mon, 23 Mar 98 16:47:14 PST
From: huq@rockie.nsc.com (Syed Huq)
Message-Id: <9803240047.AA11124@rockie.nsc.com>
To: ibis@vhdl.org, jonp@pacbell.net, elias@3dfx.com
Subject: RE: ibis models page - parser download

Hi,

You may try to ftp the executable file instead of a web download.
The ftp site would be an anonymous and cd to /pub/ibis/ibischk2+/solaris

You should select the ibischk2+ dir as that is the latest version
of the parser.

Regards,
Syed.
National Semiconductor Corp.

> From owner-ibis@server.vhdl.org Mon Mar 23 16:24:49 1998
> From: Elias Lozano <elias@3dfx.com>
> To: "'ibis@vhdl.org'" <ibis@vhdl.org>, "'jon powell'" <jonp@pacbell.net>
> Subject: RE: ibis models page
> Date: Mon, 23 Mar 1998 15:06:32 -0800
> X-Mailer:  Microsoft Exchange Server Internet Mail Connector Version 4.0.994.63
> Content-Type> : > text/plain> ; > charset="us-ascii"> 
> Content-Transfer-Encoding: 7bit
> 
> I have a problem:
> 
> I would like to down load the golden parser and there is no way for me
> to do this.
> 
> I have gone into the www.eda.org/pub/ibis/ibischk2/solaris and when I
> want to down load ibischk2 in my area, the only thing I get is just an
> executable file that cannot be down loaded.
> Can any one help me with this? or better yet, is this a good strategy to
> use this ibischk2 to check syntax in your document?
> any help will be appreciated.
> 
> Also,
> 
> can anyone send me any problems that they have had with Star-Hspice? 
> I do get a number of problems when I try to running the tryme file under
> the directory of test.
> 
> I would like to see just one easy example of a regular 3.3V 4 ma buffer.
> 
> thanks a lot
> 
> Elias
> 
> >----------
> >From: 	jon powell[SMTP:jonp@pacbell.net]
> >Sent: 	Friday, March 20, 1998 11:10 AM
> >To: 	ibis@vhdl.org
> >Subject: 	ibis models page
> >
> >TWIMC,
> >
> >The IBIS models web page is back on-line.
> >please report any problems to me:
> >jonp@pacbell.net
> >
> >ALso, if you have any new links for me to add. Please let me know.
> >
> >sincerely,
> >Jon Powell
> >Ibis Librarian
> >
> 
 
From owner-ibis  Tue Mar 24 10:26:35 1998
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From: "D. C. Sessions" <dc.sessions@tempe.vlsi.com>
Reply-To: IBIS Mailing list <ibis@vhdl.org>
Organization: VLSI Technology Inc.
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To: si-list@silab.Eng.Sun.COM
CC: skolli@smartm.com, IBIS Mailing list <ibis@eda.org>
Subject: Re: [SI-LIST] : IBIS Modeling
References: <882565D1.005BE011.00@smtphost.smartm.com>
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skolli@smartm.com wrote:
> 
> Hello there!
>      The company I work for has assigned me the duty of creating IBIS
> models for the
> memory modules(SIMMs, DIMMs, etc) that we make.
> 
>      Is there some body out there who has done this in the past? Does IBIS
> even have
> capabilities of modeling this kind of modules? How do you go about doing
> these kinds of
> models. Is there material out there that explains how to measure all the
> different I/V characteristics?
> Do I just take the device models and plug them in and say here is the model
> for the module?
> Any help would be much appreciated.

First off, this really belongs on the IBIS reflector.  I've taken the
liberty of copying it and directing followups there.

In brief, the answer is that IBIS device models are *not* good enough.
You absolutely need to model the substrate and the terminators (DIMM
series resistors) on them.  IBIS 3.1 includes the capability of
defining Electrical Board Descriptions, which are basically simplified
netlists of the PWB.  The examples given are in fact memory modules.

-- 
D. C. Sessions
dc.sessions@tempe.vlsi.com
From owner-ibis  Tue Mar 24 12:35:20 1998
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To: <ibis@eda.org>
Subject: Ray Jelesky/San Jose/IBM is out of the office.
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I am out of the office from 03-21-98, returning 03-27-98.  You will receive
only this notification of my absence prior to my return, at which time I will
respond.

 
From owner-ibis  Wed Mar 25 01:02:16 1998
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To: IBIS Mailing list <ibis@vhdl.org>, si-list@silab.Eng.Sun.COM
From: Kellee Crisafulli <kellee@hyperlynx.com>
Subject: Re: [SI-LIST] : IBIS Modeling
Cc: skolli@smartm.com, IBIS Mailing list <ibis@eda.org>
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At 11:22 AM 3/24/98 -0700, D. C. Sessions wrote:
>In brief, the answer is that IBIS device models are *not* good enough.
>You absolutely need to model the substrate and the terminators (DIMM
>series resistors) on them.  IBIS 3.1 includes the capability of
>defining Electrical Board Descriptions, which are basically simplified
>netlists of the PWB.  The examples given are in fact memory modules.
>D. C. Sessions
>dc.sessions@tempe.vlsi.com

We have built DIMM and SIMM module modules using IBIS 2.1 that do
a reasonable simulation job.  It requires a bit of playing with the
package model and it is somewhat simulator dependant.  Our simulator
interpretes
large RLC package values as transmission lines instead of lumped LC parameters
which allows us to make a reasonable DIMM or SIMM module module using
IBIS 2.1 To accomplish this we create a full circuit boad model of the
DIMM or SIMM and then tweak an IBIS package model until it looks
the same under several simulation conditions.  The die model input capacitance
must also be increased to account for the extra loading.

While I agree IBIS 3.x makes this relatively easy and provides a more accurate
result it is possible to get usable results with 2.1 prior to the release of
the 3.x parser.







 
From owner-ibis  Wed Mar 25 01:02:13 1998
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To: IBIS Mailing list <ibis@vhdl.org>, si-list@silab.Eng.Sun.COM
From: Kellee Crisafulli <kellee@hyperlynx.com>
Subject: Re: [SI-LIST] : IBIS Modeling
Cc: skolli@smartm.com, IBIS Mailing list <ibis@eda.org>
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At 11:22 AM 3/24/98 -0700, D. C. Sessions wrote:
>In brief, the answer is that IBIS device models are *not* good enough.
>You absolutely need to model the substrate and the terminators (DIMM
>series resistors) on them.  IBIS 3.1 includes the capability of
>defining Electrical Board Descriptions, which are basically simplified
>netlists of the PWB.  The examples given are in fact memory modules.
>D. C. Sessions
>dc.sessions@tempe.vlsi.com

We have built DIMM and SIMM module modules using IBIS 2.1 that do
a reasonable simulation job.  It requires a bit of playing with the
package model and it is somewhat simulator dependant.  Our simulator
interpretes
large RLC package values as transmission lines instead of lumped LC parameters
which allows us to make a reasonable DIMM or SIMM module module using
IBIS 2.1 To accomplish this we create a full circuit boad model of the
DIMM or SIMM and then tweak an IBIS package model until it looks
the same under several simulation conditions.  The die model input capacitance
must also be increased to account for the extra loading.

While I agree IBIS 3.x makes this relatively easy and provides a more accurate
result it is possible to get usable results with 2.1 prior to the release of
the 3.x parser.







 
From owner-ibis  Wed Mar 25 01:37:30 1998
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From: Weber Chuang <WeberChuang@via.com.tw>
To: "'Kellee Crisafulli'" <kellee@hyperlynx.com>,
        IBIS Mailing list
	 <ibis@vhdl.org>, si-list@silab.Eng.Sun.COM
Cc: skolli@smartm.com, IBIS Mailing list <ibis@eda.org>
Subject: RE : [SI-LIST] : IBIS Modeling
Date: Wed, 25 Mar 1998 17:34:58 +0800
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We are PC chipset vendors, so we need to handle kinds of I/O pads and
modules, so far I use real module database and then combine it with
mainboard to run a backplane-style simulation for AGP and PCI and
memory, though we only consider capacitance effect for connector or
socket. Using lumped RLC to substitute for the trace yields odd and
inaccurate waveforms.

  Best Regards

 Weber Chuang(ChingFu Chuang)
 SI Engineer, System Team.
 VIA Technologies, Inc.
 Taipei, Taiwan, ROC 
 http://www.via.com.tw
 Very Innovative Architecture

	********************    Re: [SI-LIST] : IBIS Modeling
********************* 

> At 11:22 AM 3/24/98 -0700, D. C. Sessions wrote:
> >In brief, the answer is that IBIS device models are *not* good
> enough.
> >You absolutely need to model the substrate and the terminators (DIMM
> >series resistors) on them.  IBIS 3.1 includes the capability of
> >defining Electrical Board Descriptions, which are basically
> simplified
> >netlists of the PWB.  The examples given are in fact memory modules.
> >D. C. Sessions
> >dc.sessions@tempe.vlsi.com
> 
> We have built DIMM and SIMM module modules using IBIS 2.1 that do
> a reasonable simulation job.  It requires a bit of playing with the
> package model and it is somewhat simulator dependant.  Our simulator
> interpretes
> large RLC package values as transmission lines instead of lumped LC
> parameters
> which allows us to make a reasonable DIMM or SIMM module module using
> IBIS 2.1 To accomplish this we create a full circuit boad model of the
> DIMM or SIMM and then tweak an IBIS package model until it looks
> the same under several simulation conditions.  The die model input
> capacitance
> must also be increased to account for the extra loading.
> 
> While I agree IBIS 3.x makes this relatively easy and provides a more
> accurate
> result it is possible to get usable results with 2.1 prior to the
> release of
> the 3.x parser.
> 
> 
> 
> 
> 
> 
> 
 
From owner-ibis  Wed Mar 25 01:37:33 1998
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From: Weber Chuang <WeberChuang@via.com.tw>
To: "'Kellee Crisafulli'" <kellee@hyperlynx.com>,
        IBIS Mailing list
	 <ibis@vhdl.org>, si-list@silab.Eng.Sun.COM
Cc: skolli@smartm.com, IBIS Mailing list <ibis@eda.org>
Subject: RE : [SI-LIST] : IBIS Modeling
Date: Wed, 25 Mar 1998 17:34:58 +0800
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We are PC chipset vendors, so we need to handle kinds of I/O pads and
modules, so far I use real module database and then combine it with
mainboard to run a backplane-style simulation for AGP and PCI and
memory, though we only consider capacitance effect for connector or
socket. Using lumped RLC to substitute for the trace yields odd and
inaccurate waveforms.

  Best Regards

 Weber Chuang(ChingFu Chuang)
 SI Engineer, System Team.
 VIA Technologies, Inc.
 Taipei, Taiwan, ROC 
 http://www.via.com.tw
 Very Innovative Architecture

	********************    Re: [SI-LIST] : IBIS Modeling
********************* 

> At 11:22 AM 3/24/98 -0700, D. C. Sessions wrote:
> >In brief, the answer is that IBIS device models are *not* good
> enough.
> >You absolutely need to model the substrate and the terminators (DIMM
> >series resistors) on them.  IBIS 3.1 includes the capability of
> >defining Electrical Board Descriptions, which are basically
> simplified
> >netlists of the PWB.  The examples given are in fact memory modules.
> >D. C. Sessions
> >dc.sessions@tempe.vlsi.com
> 
> We have built DIMM and SIMM module modules using IBIS 2.1 that do
> a reasonable simulation job.  It requires a bit of playing with the
> package model and it is somewhat simulator dependant.  Our simulator
> interpretes
> large RLC package values as transmission lines instead of lumped LC
> parameters
> which allows us to make a reasonable DIMM or SIMM module module using
> IBIS 2.1 To accomplish this we create a full circuit boad model of the
> DIMM or SIMM and then tweak an IBIS package model until it looks
> the same under several simulation conditions.  The die model input
> capacitance
> must also be increased to account for the extra loading.
> 
> While I agree IBIS 3.x makes this relatively easy and provides a more
> accurate
> result it is possible to get usable results with 2.1 prior to the
> release of
> the 3.x parser.
> 
> 
> 
> 
> 
> 
> 
 
From owner-ibis  Wed Mar 25 04:20:44 1998
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D. C. Sessions wrote:

> skolli@smartm.com wrote:
> >
> > Hello there!
> >      The company I work for has assigned me the duty of creating
> IBIS
> > models for the
> > memory modules(SIMMs, DIMMs, etc) that we make.
> >
> >      Is there some body out there who has done this in the past?
> Does IBIS
> > even have
> > capabilities of modeling this kind of modules? How do you go about
> doing
> > these kinds of
> > models. Is there material out there that explains how to measure all
> the
> > different I/V characteristics?
> > Do I just take the device models and plug them in and say here is
> the model
> > for the module?
> > Any help would be much appreciated.
>
> First off, this really belongs on the IBIS reflector.  I've taken the
> liberty of copying it and directing followups there.
>
> In brief, the answer is that IBIS device models are *not* good enough.
>
> You absolutely need to model the substrate and the terminators (DIMM
> series resistors) on them.  IBIS 3.1 includes the capability of
> defining Electrical Board Descriptions, which are basically simplified
>
> netlists of the PWB.  The examples given are in fact memory modules.
>
> --
> D. C. Sessions
> dc.sessions@tempe.vlsi.com



 
From owner-ibis  Wed Mar 25 08:31:34 1998
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From: Andrew Ingraham <Andrew.Ingraham@digital.com>
To: "'Kellee Crisafulli'" <kellee@hyperlynx.com>
Cc: IBIS Mailing list <ibis@eda.org>, si-list@silab.Eng.Sun.COM
Subject: RE: [SI-LIST] : IBIS Modeling
Date: Wed, 25 Mar 1998 11:28:44 -0500
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>We have built DIMM and SIMM module modules using IBIS 2.1 that do
>a reasonable simulation job.  It requires a bit of playing with the
>package model and it is somewhat simulator dependant.  Our simulator
>interpretes
>large RLC package values as transmission lines instead of lumped LC
>parameters
>which allows us to make a reasonable DIMM or SIMM module module
>using
>IBIS 2.1 


I don't mean to criticize your approach ... but this seems like a
dangerous way of creating a model.

In an ideal world, IBIS models *ought* to be portable such that they can
be used on different platforms and different simulators and yield
basically the same result, within the accuracy limits of those
simulators.

If there are big differences such as this (where large RLC values are
treated in a fundamentally different way on some simulators), that seems
like a risky thing to take advantage of.  It ties your IBIS model to
that simulator.  How do you prevent the model from being used on another
simulator?

In essence, you have created a proprietary *.ibs model, similar to an
Hspice model that won't work correctly on someone else's simulator.

As a side note, is it even the right thing to treat large RLC package
values as a transmission line?  What if they represent something like a
long bondwire and a big bonding pad?  How do you make that choice
between which way to model it in the simulator?

Should the IBIS spec make such loopholes possible?

Regards,
Andy Ingraham

 
From owner-ibis  Wed Mar 25 12:50:11 1998
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Date: Wed, 25 Mar 1998 12:46:12 -0800
To: Andrew Ingraham <Andrew.Ingraham@digital.com>
From: Kellee Crisafulli <kellee@hyperlynx.com>
Subject: RE: [SI-LIST] : IBIS Modeling
Cc: IBIS Mailing list <ibis@eda.org>, si-list@silab.Eng.Sun.COM
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Hi Andrew,

>In an ideal world, IBIS models *ought* to be portable such that they can
>be used on different platforms and different simulators and yield
>basically the same result, within the accuracy limits of those
>simulators.
I agree completely.

>If there are big differences such as this (where large RLC values are
>treated in a fundamentally different way on some simulators), that seems
>like a risky thing to take advantage of.  It ties your IBIS model to
>that simulator.  How do you prevent the model from being used on another
>simulator?
In this instance we made the models for our own customers only.
However the real issue is how good or bad it works using either
method.  Please try it, demonstrate the magnitude of whatever problem
you are concerned.  Based on comparative
simulations we ran we felt the result were acceptable and useful until the
version 3.x models are available and simulators are all using them.  I was
one of the most vocal advocates of getting modeling into IBIS for
DIMM and SIMM modules and made several proposals to the IBIS committee to get
this done.

>In essence, you have created a proprietary *.ibs model, similar to an
>Hspice model that won't work correctly on someone else's simulator.
You have a valid point. However unlike Hspice
it will run on all the simulators that use IBIS with slight differences in
the package effects but at least they will have a model v.s.
no model.  Do you think it is better not to do any modeling and have
users guess what the signals look like.  And yes I think this sort of
model is an order of magnitude better than guessing.

>As a side note, is it even the right thing to treat large RLC package
>values as a transmission line?  What if they represent something like a
>long bondwire and a big bonding pad?  How do you make that choice
>between which way to model it in the simulator?
IBIS has never specified that the LC pin values be used as lumped values.
As you may know some packages are modeled better as a lump and some
model better as a transmission line. Neither is perfect for all packages.
however it generally isn't possible to get devices to work if the pin is
really a large lumped L so I don't see much danger here.

>Should the IBIS spec make such loopholes possible?
I don't see this as a loop hole.  Each vendor needs to use the IBIS
data to create the best results they feel possible.

I don't believe we need to spend a great deal of time on this thread Andrew.
I only wish to point out that it is possible to create a useable model for
a DIMM or SIMM in V2.1 IBIS.  
I lobbied to get better SIMM and DIMM modeling into the spec. for over a year
so I agree it is a much better method.  I was the one that insisted that the
changes proposed by Intel for their processor models also work for DIMM and
SIMM
modules.

I understand your concerns and they are reasonable.
Best wishes..
Kellee













From owner-ibis  Fri Mar 27 16:37:58 1998
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To: ibis@eda.org
Subject: IBIS AGENDA 4/3/98

                       IBIS Open Forum Meeting Agenda 
                                for 4/3/98

                  Bridge Number    Reservation #   Passcode
                 (916) 356-9200    5-28516         6935733

 All meetings are 8:00 AM to 9:55 AM Pacific Time.  When you call into the 
 meeting, ask for the IBIS Open Forum hosted by Will Hobbs and give the
 Reservation Number and Passcode.
 
 8:00 Check-In, Intros, Announcements                         Ross

      - Intros of New IBIS Participants, Meeting Quorum       Ross
      - Membership Update and Treasurers Report               Rusher
      - Review of Previous Meeting's Minutes (and ARs)        Peters
      - Miscellany/Announcements                              All
      - Press & Web Page Updates                              Huq, All
      - New Models Available, Library Update                  Powell, All
      - Opens for New Issues                                  All

 8:25 Administrative and Project Discussions

      International/External Progress                         Rusher/Ross
      - IEC 62014-1 (IBIS Version 2.1)
      - EIAJ III (I/O Interface Model for ICs)
      - 93/67/NP IBIS and EMC Simulation                      Ross/Perrin
      - JC-16B                                                Sessions/Russell

      IBIS Logo Change                                        Rusher/Ross

      IBIS (East) Users Group Meetings                        Edlund

      Editing Committee                                       Ross/Peters
      BIRD44 - Interpretation of Min/Max/Weak/Strong Data     Ross

      IBISCHK2+ (Ver 2.115) PROGRESS                          Flora/Rokusek

      BUG25 - Keyword as First Word in [Notes] Causes Error   Muranyi

      BUG26 - Parser Crashes when Calling [Package Model]     Ross

      Version 3.1 Parser Development                          Ross/Peters
      - Billing
      - Tests & Samples

      Cookbook Status                                         Peters

      IBIS Model Review Committee                             Flora

      s2ibis2 BUG1 - HSPICE Examples Do Not Work              Ross/Unger

      New Administrative Issues                               All

 9:15 Technical Discussion

      BIRD47 - Remove Pin Name as a Sub-Param of the          Peters
               [Pin List] Keyword
               (Vote)

      BIRD42.3 - Modeling Current Waveforms                   Kumar/Ross

      BIRD46.1 - Relaxation of Some IBIS Model File Name      Flora
                 Restrictions
           
 **   BIRD48 - Add Model                            Orhanovic/Muranyi/Ross
 
 **   BIRD49 - Add Model Dynamic Clamps             Orhanovic/Muranyi/Ross

 **   BIRD50 - Add Model Bus Hold                   Orhanovic/Muranyi/Ross

 **   To Be Issued

      BIRD45.1 - Dynamic Clamps                     Orhanovic/Muranyi/Ross
               (Consider Replacement with BIRD48, BIRD49, BIRD50)

      Some Technical Issues on IBIS Reflector                 Ross

      New Technical Issues                                    All

 9:50 Wrap Up and Next Meetings Plans                         Ross

 9:55 Sign Off
 







From owner-ibis  Mon Mar 30 05:50:31 1998
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From: "Hans Werner"<hwerner@tulip.com>
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Message-ID: <412565D7.0051FF0C.00@tulip.com>
Date: Mon, 30 Mar 1998 15:57:03 +0100
Subject: IBIS
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Please Remove me from the email list.

Thank you

H. Werner


From owner-ibis  Mon Mar 30 09:47:00 1998
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Date: Mon, 30 Mar 98 09:43:53 PST
From: satishp@lsil.com (Satish Pratapneni)
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To: ibis@eda.org
Subject: Re: IBIS




Please Remove me from the e-mail list for now since I am switching
companies in next two weeks.

Thanks,

-Satish Prtapneni

From owner-ibis  Tue Mar 31 09:05:50 1998
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Date: Tue, 31 Mar 1998 09:01:02 -0800
From: Jon Powell <jonp@pacbell.net>
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To: jsynesio@us-power.com, ibis@vhdl.org
Subject: Re: FW: FW: Spice Model of IBIS
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Well, I just couldn't resist.

I certainly wouldn't argue with anyone that SPICE (actually some SPICE
commercial derivative) is the premier circuit simulation technology that
is currently publically available. I also wouldn't argue with anyone who
said that IBIS has some problems that need to be addressed.

However, the market has shown that there is a need for a PCB SI
simulation technology that offers features that transcend the current
SPICE node based syntax. Think of the bigger problem. You need to
simulate the SI and Crosstalk effects of every net on a PCB. You need
MIN MAX timing from every driver to every receiver. You need SI and
Noise margin numbers for every net. And you need them quickly enough so
that you can use the data to turn the design a couple of times. I
believe these issues are difficult to solve using SPICE as it (they)
exists on the market today.

Of course, I use SPICE every day. I think it is great. I just believe in
using the right tool for the right job and I have more than one job to
do.

Here is a conceptual example:
you have a 32 wire bus. Each wire couples to it's neighbors. You need to
simulate every wire and the effects on that wire by it's immediate
neighbors. You do not want to waste simulation time by simulating
effects of the wires that are more than a couple of conductors away.

How would you solve this problem using SPICE?
Can it be solved automatically?
How would spice represent the names of the different nets? (ie. what is
the crosstalk on D13?).

As for accuracy:
Leave the argument of which approach is more accurate for the moment.
what is the accuracy of your inputs? (PCB stack-up, SPICE model data,
Dielectric constant, trace width).
If you are simulating to a higher accuracy than your data inputs then
you are wasting time and deceiving yourself. I think that a teacher told
me this in 5th grade but I never really believed it until I started
doing SI simulation.



From owner-ibis  Tue Mar 31 10:07:50 1998
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To: jonp@qdt.com
CC: jsynesio@us-power.com, ibis@vhdl.org
Subject: Re: FW: FW: Spice Model of IBIS
References: <199803310316.VAA23282@hawk.us-power.com> <3521214E.582D0FFC@pacbell.net>
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Jon,

Well said!  I agree, let's use the right tools for the job.
All are appropriate within specific contexts.  And lets not
forget the comfort factor.  Once one becomes familiar with
a specific tool that does a given job, it is hard to overcome
the inertia and change to a tool that might be different, if
not better.

You're right.  If the pcb tolerance is +/- 10% and the part process
tolerance is +/- 30%, simulator differences are generally
inconsequential.

I and my customers value my time.  For my time, I generally choose
a tool based upon ease of use, speed, and accuracy.  In that order.

Scott McMorrow
SiQual

Jon Powell wrote:

> Well, I just couldn't resist.
>
> I certainly wouldn't argue with anyone that SPICE (actually some SPICE
> commercial derivative) is the premier circuit simulation technology that
> is currently publically available. I also wouldn't argue with anyone who
> said that IBIS has some problems that need to be addressed.
>
> However, the market has shown that there is a need for a PCB SI
> simulation technology that offers features that transcend the current
> SPICE node based syntax. Think of the bigger problem. You need to
> simulate the SI and Crosstalk effects of every net on a PCB. You need
> MIN MAX timing from every driver to every receiver. You need SI and
> Noise margin numbers for every net. And you need them quickly enough so
> that you can use the data to turn the design a couple of times. I
> believe these issues are difficult to solve using SPICE as it (they)
> exists on the market today.
>
> Of course, I use SPICE every day. I think it is great. I just believe in
> using the right tool for the right job and I have more than one job to
> do.
>
> Here is a conceptual example:
> you have a 32 wire bus. Each wire couples to it's neighbors. You need to
> simulate every wire and the effects on that wire by it's immediate
> neighbors. You do not want to waste simulation time by simulating
> effects of the wires that are more than a couple of conductors away.
>
> How would you solve this problem using SPICE?
> Can it be solved automatically?
> How would spice represent the names of the different nets? (ie. what is
> the crosstalk on D13?).
>
> As for accuracy:
> Leave the argument of which approach is more accurate for the moment.
> what is the accuracy of your inputs? (PCB stack-up, SPICE model data,
> Dielectric constant, trace width).
> If you are simulating to a higher accuracy than your data inputs then
> you are wasting time and deceiving yourself. I think that a teacher told
> me this in 5th grade but I never really believed it until I started
> doing SI simulation.



From owner-ibis  Tue Mar 31 10:34:05 1998
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From: "John Synesiou" <jsynesio@us-power.com>
To: <jonp@qdt.com>, <ibis@vhdl.org>
Subject: RE: FW: FW: Spice Model of IBIS
Date: Tue, 31 Mar 1998 12:29:42 -0600
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Jon,

You raise a good point. I raised this point originally to question the need
to develop a unique syntax for IBIS, when an existing syntax would prevail.
In my opinion, IBIS should describe a template using existing SPICE syntax
(or XSPICE syntax) so that the engineering community can choose the best
tool for their simulation and analysis, i.e. IBIS simulator or SPICE
simulator.

Pre PCB layout simulation could be simulated quite effectively in SPICE,
with the added advantage that more extensive analysis could be done if
required. IBIS simulators on the other hand have a particular purpose and
hence the analysis as I understand it is limited to time domain waveforms
(rise/fall time, ringing, reflections) and a simple spectral plot. For
instance, I'm not sure how you would calculate the power in a termination
resistor, a simple example, but you get the point.

Regarding crosstalk, I'm not sure how the IBIS simulators work, but I'm sure
that they don't consider crosstalk from one trace to all other traces, but
instead consider only the closest traces (one or two traces). Considering
that some EDA vendors IBIS simulators are actually SPICE simulators with an
IBIS to SPICE translator, I would expect that this problem could also be
solved in SPICE directly. I'm not sure I need to make this point, but I put
it in for further discussion.

My point really is that I may like to use SPICE to do more extensive
analysis than is available with an IBIS simulators. I can take any IBIS
model today and translate it into a SPICE model to examine various issues,
SI, EMC and others. I just find the translation process time consuming and
error prone. In essence, why does it have to be an either or, why can't
SPICE simulators be an extension of IBIS simulators?

Regards

John Synesiou			jsynesio@us-power.com
U.S. Power, Inc			Phone (612)826-1111
6497 City West Parkway	Fax (612)826-1003
Eden Prairie			Date: 03/31/98
MN, 55344			Time: 11:45 AM




-----Original Message-----
From:	Jon Powell [mailto:jonp@pacbell.net]
Sent:	Tuesday, March 31, 1998 11:01 AM
To:	jsynesio@us-power.com; ibis@vhdl.org
Subject:	Re: FW: FW: Spice Model of IBIS

Well, I just couldn't resist.

I certainly wouldn't argue with anyone that SPICE (actually some SPICE
commercial derivative) is the premier circuit simulation technology that
is currently publically available. I also wouldn't argue with anyone who
said that IBIS has some problems that need to be addressed.

However, the market has shown that there is a need for a PCB SI
simulation technology that offers features that transcend the current
SPICE node based syntax. Think of the bigger problem. You need to
simulate the SI and Crosstalk effects of every net on a PCB. You need
MIN MAX timing from every driver to every receiver. You need SI and
Noise margin numbers for every net. And you need them quickly enough so
that you can use the data to turn the design a couple of times. I
believe these issues are difficult to solve using SPICE as it (they)
exists on the market today.

Of course, I use SPICE every day. I think it is great. I just believe in
using the right tool for the right job and I have more than one job to
do.

Here is a conceptual example:
you have a 32 wire bus. Each wire couples to it's neighbors. You need to
simulate every wire and the effects on that wire by it's immediate
neighbors. You do not want to waste simulation time by simulating
effects of the wires that are more than a couple of conductors away.

How would you solve this problem using SPICE?
Can it be solved automatically?
How would spice represent the names of the different nets? (ie. what is
the crosstalk on D13?).

As for accuracy:
Leave the argument of which approach is more accurate for the moment.
what is the accuracy of your inputs? (PCB stack-up, SPICE model data,
Dielectric constant, trace width).
If you are simulating to a higher accuracy than your data inputs then
you are wasting time and deceiving yourself. I think that a teacher told
me this in 5th grade but I never really believed it until I started
doing SI simulation.




From owner-ibis  Tue Mar 31 12:05:51 1998
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Date: Tue, 31 Mar 1998 11:07:15 -0800
From: Fred Balistreri <fred@apsimtech.com>
Organization: Apsim
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Jon Powell wrote:
> 
> Well, I just couldn't resist.
> 
> I certainly wouldn't argue with anyone that SPICE (actually some SPICE
> commercial derivative) is the premier circuit simulation technology that
> is currently publically available. I also wouldn't argue with anyone who
> said that IBIS has some problems that need to be addressed.
> 
> However, the market has shown that there is a need for a PCB SI
> simulation technology that offers features that transcend the current
> SPICE node based syntax. Think of the bigger problem. You need to
> simulate the SI and Crosstalk effects of every net on a PCB. You need
> MIN MAX timing from every driver to every receiver. You need SI and
> Noise margin numbers for every net. And you need them quickly enough so
> that you can use the data to turn the design a couple of times. I
> believe these issues are difficult to solve using SPICE as it (they)
> exists on the market today.
> 
> Of course, I use SPICE every day. I think it is great. I just believe in
> using the right tool for the right job and I have more than one job to
> do.
> 
> Here is a conceptual example:
> you have a 32 wire bus. Each wire couples to it's neighbors. You need to
> simulate every wire and the effects on that wire by it's immediate
> neighbors. You do not want to waste simulation time by simulating
> effects of the wires that are more than a couple of conductors away.
> 
> How would you solve this problem using SPICE?
> Can it be solved automatically?
> How would spice represent the names of the different nets? (ie. what is
> the crosstalk on D13?).
> 
> As for accuracy:
> Leave the argument of which approach is more accurate for the moment.
> what is the accuracy of your inputs? (PCB stack-up, SPICE model data,
> Dielectric constant, trace width).
> If you are simulating to a higher accuracy than your data inputs then
> you are wasting time and deceiving yourself. I think that a teacher told
> me this in 5th grade but I never really believed it until I started
> doing SI simulation.
Surprise! Every item you mention above has been sucessfully acomplished
by many of our customers and other Spice vendors as well. Using IBIS
or behavioral models a whole board can be done in reasonable times using
Spice. The problem of simulating wires by distance or number of
conductors
is related to the user interface control and the field solver not a 
simulator issue at all. This has been done by the way in our system
since
1992 and some other SPICE vendors a bit later. Node names are not an
issue
in modern Spice programs. Your dealing with 2.6 from Berekley circa
1968.
PCB stackups have nothing to do with Spice. It's an issue on integrating
a
good field solver with your simulation engine. Again its been done by 
several Spice vendors. You are either trying to confuse customers by
these
issues you raise or you truly don't understand modern day Spice tools.
Of course Spice is not perfect and there are plenty of problems. But
neither
is IBIS. It has its place but at the moment the capabilites are a bit
on the lite side...and there are plenty of problems as you yourself have
raised. We'll leave accuracy aside for the moment as you mentioned. How
about flexibility, capability? Can IBIS handle Analog? How about more
sophisticated output stages that dynamically change current
sourcing/sinking
capability? Where's the information about the power supply currents?
Heck
some IBIS data doesn't even contain switching information. How about
ground
bounce? Since there is no mention of the gate or base of the
transistors,
once noise is introduced via the power/gnd what's the voltage on the
base/
or gate of the I/O output transistors? Without that you don't even know 
which transistor is on or off. I'm for bringing out these issues and
solving
them using IBIS not covering them up or changing the argument. Spice is 
just a simulator. It will survive or die on its own merits. How about
improving IBIS? 
 

Best Regards, 
-- 
Fred Balistreri
fred@apsimtech.com

http://www.apsimtech.com
From owner-ibis  Tue Mar 31 17:41:00 1998
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From: "Charles Hymowitz" <charles@intusoft.com>
Organization: Intusoft
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Date: Tue, 31 Mar 1998 17:33:07 -0800
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Subject: Join reflector
Priority: normal

I would like to join  the IBIS open forum reflector and the
the IBIS users group reflector.

email address charles@intusoft.com

Charles Hymowitz - V.P. Prod. Dev.
Intusoft
email: charles@intusoft.com, CompuServe: intusoft@compuserve.com
Web: http://www.intusoft.com
Tel. (310) 833-0710, Fax (310) 833-9658
P.O. Box 710, San Pedro CA. 90733-0710

Please visit our web site @ http://www.intusoft.com for more information
and lots of SPICE goodies.
