From: owner-ibis-users@eda.org (ibis-users)
To: ibis-users-digest@eda.org
Subject: ibis-users V1 #50
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ibis-users          Friday, January 14 2005          Volume 01 : Number 050




----------------------------------------------------------------------

Date: Thu, 06 Jan 2005 10:39:33 -0800
From: arnab <arnab@spikeindia.com>
Subject: [IBIS-Users] queries regarding ibis

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Hi all,

I  have some doubts regarding generation of ibis models

1.Is it possible to generate IO model  for 2 power supplies?If yes then =
how do we go about it?

2. Can we have the ibis models generated for a high drive as well as low =
drive for the i/o buffers.Presently we keep the drive low and generate =
the models.

Any help in this regard would be appreciated.Thanking in advance.

warm regards
arnab hazarika
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<DIV><FONT face=3DArial size=3D2>Hi all,</FONT></DIV>
<DIV><FONT face=3DArial size=3D2></FONT>&nbsp;</DIV>
<DIV><FONT face=3DArial size=3D2>I &nbsp;have some doubts regarding =
generation of=20
ibis models</FONT></DIV>
<DIV><FONT face=3DArial size=3D2></FONT>&nbsp;</DIV>
<DIV>1.Is it possible to generate&nbsp;IO model&nbsp; for 2 power=20
supplies?If&nbsp;yes then&nbsp;how do we go about it?</DIV>
<DIV><BR>2. Can we have the ibis models generated for a high drive as =
well as=20
low drive for the i/o buffers.Presently we keep the drive low and =
generate the=20
models.<BR><BR><FONT face=3DArial size=3D2>Any help&nbsp;in this =
regard&nbsp;would=20
be appreciated.Thanking in advance.</FONT></DIV>
<DIV><FONT face=3DArial size=3D2></FONT>&nbsp;</DIV>
<DIV><FONT face=3DArial size=3D2>warm regards</FONT></DIV>
<DIV><FONT face=3DArial size=3D2>arnab=20
hazarika</FONT></DIV></FONT></DIV></BODY></HTML>

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Date: Thu, 06 Jan 2005 10:39:33 -0800
From: arnab <arnab@spikeindia.com>
Subject: [IBIS-Users] [IBIS] queries regarding ibis

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Hi all,

I  have some doubts regarding generation of ibis models

1.Is it possible to generate IO model  for 2 power supplies?If yes then =
how do we go about it?

2. Can we have the ibis models generated for a high drive as well as low =
drive for the i/o buffers.Presently we keep the drive low and generate =
the models.

Any help in this regard would be appreciated.Thanking in advance.

warm regards
arnab hazarika
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<DIV><FONT face=3DArial size=3D2>
<DIV><FONT face=3DArial size=3D2>Hi all,</FONT></DIV>
<DIV><FONT face=3DArial size=3D2></FONT>&nbsp;</DIV>
<DIV><FONT face=3DArial size=3D2>I &nbsp;have some doubts regarding =
generation of=20
ibis models</FONT></DIV>
<DIV><FONT face=3DArial size=3D2></FONT>&nbsp;</DIV>
<DIV>1.Is it possible to generate&nbsp;IO model&nbsp; for 2 power=20
supplies?If&nbsp;yes then&nbsp;how do we go about it?</DIV>
<DIV><BR>2. Can we have the ibis models generated for a high drive as =
well as=20
low drive for the i/o buffers.Presently we keep the drive low and =
generate the=20
models.<BR><BR><FONT face=3DArial size=3D2>Any help&nbsp;in this =
regard&nbsp;would=20
be appreciated.Thanking in advance.</FONT></DIV>
<DIV><FONT face=3DArial size=3D2></FONT>&nbsp;</DIV>
<DIV><FONT face=3DArial size=3D2>warm regards</FONT></DIV>
<DIV><FONT face=3DArial size=3D2>arnab=20
hazarika</FONT></DIV></FONT></DIV></BODY></HTML>

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------------------------------

Date: Thu, 6 Jan 2005 10:02:48 -0800
From: "lgreen" <lgreen22@mindspring.com>
Subject: RE: [IBIS-Users] [IBIS] queries regarding ibis

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Hello, Arnab,

 

1)       To use two power supplies to the I/O buffer: Edit the SPICE input
file(s) to add the DC power supply, and make sure the node name matches the
appropriate pin on the buffer.  Avoid the use of ".GLOBAL" commands.

2)       The two drive conditions (high/low) are two separate models.  You
need to modify the SPICE netlist to set the I/O buffer into its high-drive
state and create a second model.  Use [Model Selector] to allow swapping of
model assignment.

 

Best regards,

Lynne

 

 

"IBIS training when you need it, where you need it."

 

Dr. Lynne Green

Green Streak Programs

http://www.greenstreakprograms.com

425-788-0412

lgreen22@mindspring.com

 

 

  _____  

From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On Behalf
Of arnab
Sent: Thursday, January 06, 2005 10:40 AM
To: ibis@eda.org
Cc: ibis-users@eda.org
Subject: [IBIS-Users] [IBIS] queries regarding ibis

 

Hi all,

 

I  have some doubts regarding generation of ibis models

 

1.Is it possible to generate IO model  for 2 power supplies?If yes then how
do we go about it?


2. Can we have the ibis models generated for a high drive as well as low
drive for the i/o buffers.Presently we keep the drive low and generate the
models.

Any help in this regard would be appreciated.Thanking in advance.

 

warm regards

arnab hazarika


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<div class=3DSection1>

<p class=3DMsoNormal><font size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:
10.0pt;font-family:Arial;color:navy'>Hello, =
Arnab,<o:p></o:p></span></font></p>

<p class=3DMsoNormal><font size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:
10.0pt;font-family:Arial;color:navy'><o:p>&nbsp;</o:p></span></font></p>

<p class=3DMsoNormal =
style=3D'margin-left:.5in;text-indent:-.25in;mso-list:l0 level1 =
lfo1'><![if !supportLists]><font
size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:10.0pt;font-family:Arial;
color:navy'><span style=3D'mso-list:Ignore'>1)<font size=3D1 =
face=3D"Times New Roman"><span
style=3D'font:7.0pt "Times New =
Roman"'>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
</span></font></span></span></font><![endif]><font
size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:10.0pt;font-family:Arial;
color:navy'>To use two power supplies to the I/O buffer: Edit the SPICE =
input
file(s) to add the DC power supply, and make sure the node name matches =
the
appropriate pin on the buffer.&nbsp; Avoid the use of =
&#8220;.GLOBAL&#8221;
commands.<o:p></o:p></span></font></p>

<p class=3DMsoNormal =
style=3D'margin-left:.5in;text-indent:-.25in;mso-list:l0 level1 =
lfo1'><![if !supportLists]><font
size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:10.0pt;font-family:Arial;
color:navy'><span style=3D'mso-list:Ignore'>2)<font size=3D1 =
face=3D"Times New Roman"><span
style=3D'font:7.0pt "Times New =
Roman"'>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
</span></font></span></span></font><![endif]><font
size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:10.0pt;font-family:Arial;
color:navy'>The two drive conditions (high/low) are two separate =
models.&nbsp; You
need to modify the SPICE netlist to set the I/O buffer into its =
high-drive
state and create a second model.&nbsp; Use [Model Selector] to allow =
swapping of
model assignment.<o:p></o:p></span></font></p>

<p class=3DMsoNormal><font size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:
10.0pt;font-family:Arial;color:navy'><o:p>&nbsp;</o:p></span></font></p>

<p class=3DMsoNormal><font size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:
10.0pt;font-family:Arial;color:navy'>Best =
regards,<o:p></o:p></span></font></p>

<p class=3DMsoNormal><font size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:
10.0pt;font-family:Arial;color:navy'>Lynne<o:p></o:p></span></font></p>

<p class=3DMsoNormal><font size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:
10.0pt;font-family:Arial;color:navy'><o:p>&nbsp;</o:p></span></font></p>

<p class=3DMsoPlainText><font size=3D2 face=3D"Courier New"><span =
style=3D'font-size:
10.0pt'><o:p>&nbsp;</o:p></span></font></p>

<p class=3DMsoPlainText><font size=3D2 face=3D"Courier New"><span =
style=3D'font-size:
10.0pt'>&quot;IBIS training when you need it, where you need =
it.&quot;<o:p></o:p></span></font></p>

<p class=3DMsoPlainText><font size=3D2 face=3D"Courier New"><span =
style=3D'font-size:
10.0pt'><o:p>&nbsp;</o:p></span></font></p>

<p class=3DMsoPlainText><font size=3D2 face=3D"Courier New"><span =
style=3D'font-size:
10.0pt'>Dr. Lynne Green<o:p></o:p></span></font></p>

<p class=3DMsoPlainText><font size=3D2 face=3D"Courier New"><span =
style=3D'font-size:
10.0pt'>Green Streak Programs<o:p></o:p></span></font></p>

<p class=3DMsoPlainText><font size=3D2 face=3D"Courier New"><span =
style=3D'font-size:
10.0pt'>http://www.greenstreakprograms.com<o:p></o:p></span></font></p>

<p class=3DMsoPlainText><font size=3D2 face=3D"Courier New"><span =
style=3D'font-size:
10.0pt'>425-788-0412<o:p></o:p></span></font></p>

<p class=3DMsoPlainText><font size=3D2 face=3D"Courier New"><span =
style=3D'font-size:
10.0pt'>lgreen22@mindspring.com<o:p></o:p></span></font></p>

<p class=3DMsoNormal><font size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:
10.0pt;font-family:Arial;color:navy'><o:p>&nbsp;</o:p></span></font></p>

<p class=3DMsoNormal><font size=3D2 color=3Dnavy face=3DArial><span =
style=3D'font-size:
10.0pt;font-family:Arial;color:navy'><o:p>&nbsp;</o:p></span></font></p>

<div>

<div class=3DMsoNormal align=3Dcenter =
style=3D'margin-left:.5in;text-align:center'><font
size=3D3 face=3D"Times New Roman"><span style=3D'font-size:12.0pt'>

<hr size=3D2 width=3D"100%" align=3Dcenter tabindex=3D-1>

</span></font></div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><b><font size=3D2 =
face=3DTahoma><span
style=3D'font-size:10.0pt;font-family:Tahoma;font-weight:bold'>From:</spa=
n></font></b><font
size=3D2 face=3DTahoma><span =
style=3D'font-size:10.0pt;font-family:Tahoma'>
owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] <b><span
style=3D'font-weight:bold'>On Behalf Of </span></b>arnab<br>
<b><span style=3D'font-weight:bold'>Sent:</span></b> Thursday, January =
06, 2005
10:40 AM<br>
<b><span style=3D'font-weight:bold'>To:</span></b> ibis@eda.org<br>
<b><span style=3D'font-weight:bold'>Cc:</span></b> =
ibis-users@eda.org<br>
<b><span style=3D'font-weight:bold'>Subject:</span></b> [IBIS-Users] =
[IBIS]
queries regarding ibis</span></font><o:p></o:p></p>

</div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><font size=3D3 =
face=3D"Times New Roman"><span
style=3D'font-size:12.0pt'><o:p>&nbsp;</o:p></span></font></p>

<div>

<div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><font size=3D2 =
face=3DArial><span
style=3D'font-size:10.0pt;font-family:Arial'>Hi =
all,<o:p></o:p></span></font></p>

</div>

<div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><font size=3D2 =
face=3DArial><span
style=3D'font-size:10.0pt;font-family:Arial'>&nbsp;<o:p></o:p></span></fo=
nt></p>

</div>

<div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><font size=3D2 =
face=3DArial><span
style=3D'font-size:10.0pt;font-family:Arial'>I &nbsp;have some doubts =
regarding
generation of ibis models<o:p></o:p></span></font></p>

</div>

<div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><font size=3D2 =
face=3DArial><span
style=3D'font-size:10.0pt;font-family:Arial'>&nbsp;<o:p></o:p></span></fo=
nt></p>

</div>

<div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><font size=3D2 =
face=3DArial><span
style=3D'font-size:10.0pt;font-family:Arial'>1.Is it possible to =
generate&nbsp;IO
model&nbsp; for 2 power supplies?If&nbsp;yes then&nbsp;how do we go =
about it?<o:p></o:p></span></font></p>

</div>

<div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><font size=3D2 =
face=3DArial><span
style=3D'font-size:10.0pt;font-family:Arial'><br>
2. Can we have the ibis models generated for a high drive as well as low =
drive
for the i/o buffers.Presently we keep the drive low and generate the =
models.<br>
<br>
Any help&nbsp;in this regard&nbsp;would be appreciated.Thanking in =
advance.<o:p></o:p></span></font></p>

</div>

<div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><font size=3D2 =
face=3DArial><span
style=3D'font-size:10.0pt;font-family:Arial'>&nbsp;<o:p></o:p></span></fo=
nt></p>

</div>

<div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><font size=3D2 =
face=3DArial><span
style=3D'font-size:10.0pt;font-family:Arial'>warm =
regards<o:p></o:p></span></font></p>

</div>

<div>

<p class=3DMsoNormal style=3D'margin-left:.5in'><font size=3D2 =
face=3DArial><span
style=3D'font-size:10.0pt;font-family:Arial'>arnab =
hazarika<o:p></o:p></span></font></p>

</div>

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------------------------------

Date: Thu, 6 Jan 2005 12:35:35 -0800
From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
Subject: [IBIS-Users] RE: [IBIS] queries regarding ibis

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Arnab,
=20
What do you mean by "for 2 power supplies"?  A single I/O
connected to 2 different voltages, or the same I/O buffer
being used once at one voltage and another time at another
supply voltage?
=20
If it is the latter, you can use the [Model Selector] keyword
with multiple [Model]s each of which are made with a different
voltage.
=20
If it is the former, than I wonder how that buffer works,
because I can't see how, for example, a pullup could pull
to two different voltages...
=20
However, please note that each IV table has their own reference
voltage keywords, which allows you to connect them to different
voltages.  An example for this would be a 5 volt safe 3.3 volt PCI
buffer where the pullup uses 3.3 V and the power clam uses 5 v.
=20
I hope this helps.
=20
Arpad Muranyi
Intel Corporation
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D

________________________________

From: owner-ibis@eda.org [mailto:owner-ibis@eda.org] On Behalf Of arnab
Sent: Thursday, January 06, 2005 10:40 AM
To: ibis@eda.org
Cc: ibis-users@eda.org
Subject: [IBIS] queries regarding ibis


Hi all,
=20
I  have some doubts regarding generation of ibis models
=20
1.Is it possible to generate IO model  for 2 power supplies?If yes then =
how do we go about it?

2. Can we have the ibis models generated for a high drive as well as low =
drive for the i/o buffers.Presently we keep the drive low and generate =
the models.

Any help in this regard would be appreciated.Thanking in advance.
=20
warm regards
arnab hazarika

- ------_=_NextPart_001_01C4F42F.46B73EC8
Content-Type: text/html;
	charset="iso-8859-1"
Content-Transfer-Encoding: quoted-printable

<!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN">
<HTML><HEAD>
<META http-equiv=3DContent-Type content=3D"text/html; =
charset=3Diso-8859-1">
<META content=3D"MSHTML 6.00.2800.1480" name=3DGENERATOR>
<STYLE></STYLE>
</HEAD>
<BODY bgColor=3D#ffffff>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>Arnab,</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2></FONT></SPAN>&nbsp;</DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>What do you mean by "for 2 power supplies"?&nbsp; A single=20
I/O</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>connected to 2 different voltages, or the same I/O=20
buffer</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>being used once at one voltage and another time at=20
another</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>supply voltage?</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2></FONT></SPAN>&nbsp;</DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>If it is the latter, you can use the [Model Selector]=20
keyword</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>with multiple [Model]s each of which are made with a=20
different</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>voltage.</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2></FONT></SPAN>&nbsp;</DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>If it is the former, than I wonder how that buffer=20
works,</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>because </FONT></SPAN><SPAN class=3D348563020-06012005><FONT=20
face=3D"Courier New" size=3D2>I can't see how, for example, a pullup =
could=20
pull</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>to two </FONT></SPAN><SPAN class=3D348563020-06012005><FONT=20
face=3D"Courier New" size=3D2>different voltages...</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2></FONT></SPAN>&nbsp;</DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>However, please note that each IV table has their own=20
reference</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>voltage keywords, which allows you to connect them to=20
different</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>voltages.&nbsp; An example for this would be a 5 volt safe 3.3 =
volt=20
PCI</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>buffer where the pullup uses 3.3 V and the power clam uses 5=20
v.</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2></FONT></SPAN>&nbsp;</DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>I hope this helps.</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2></FONT></SPAN>&nbsp;</DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>Arpad Muranyi</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>Intel Corporation</FONT></SPAN></DIV>
<DIV dir=3Dltr align=3Dleft><SPAN class=3D348563020-06012005><FONT =
face=3D"Courier New"=20
size=3D2>=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D</FONT></SPAN></DIV><BR>
<DIV class=3DOutlookMessageHeader lang=3Den-us dir=3Dltr align=3Dleft>
<HR tabIndex=3D-1>
<FONT face=3DTahoma size=3D2><B>From:</B> owner-ibis@eda.org=20
[mailto:owner-ibis@eda.org] <B>On Behalf Of </B>arnab<BR><B>Sent:</B> =
Thursday,=20
January 06, 2005 10:40 AM<BR><B>To:</B> ibis@eda.org<BR><B>Cc:</B>=20
ibis-users@eda.org<BR><B>Subject:</B> [IBIS] queries regarding=20
ibis<BR></FONT><BR></DIV>
<DIV></DIV>
<DIV><FONT face=3DArial size=3D2>
<DIV><FONT face=3DArial size=3D2>Hi all,</FONT></DIV>
<DIV><FONT face=3D"Courier New" size=3D2></FONT>&nbsp;</DIV>
<DIV><FONT face=3DArial size=3D2>I &nbsp;have some doubts regarding =
generation of=20
ibis models</FONT></DIV>
<DIV><FONT face=3D"Courier New" size=3D2></FONT>&nbsp;</DIV>
<DIV>1.Is it possible to generate&nbsp;IO model&nbsp; for 2 power=20
supplies?If&nbsp;yes then&nbsp;how do we go about it?</DIV>
<DIV><FONT face=3D"Courier New"></FONT><BR>2. Can we have the ibis =
models=20
generated for a high drive as well as low drive for the i/o =
buffers.Presently we=20
keep the drive low and generate the models.<BR><BR><FONT face=3DArial =
size=3D2>Any=20
help&nbsp;in this regard&nbsp;would be appreciated.Thanking in=20
advance.</FONT></DIV>
<DIV><FONT face=3D"Courier New" size=3D2></FONT>&nbsp;</DIV>
<DIV><FONT face=3DArial size=3D2>warm regards</FONT></DIV>
<DIV><FONT face=3DArial size=3D2>arnab=20
hazarika</FONT></DIV></FONT></DIV></BODY></HTML>

- ------_=_NextPart_001_01C4F42F.46B73EC8--
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------------------------------

Date: Fri, 07 Jan 2005 12:50:36 -0800
From: Ray Anderson <ray.anderson@xilinx.com>
Subject: [IBIS-Users] General question on IBIS and SSO simulations

After working on Power Distribution issues at the PCB level for quite a 
number of years I'm now tasked with upgrading our company's IBIS models 
with respect to package parasitic modeling. As an aid in coming up to 
speed on some of the issues involved I have a general question in 
regards to utilizing IBIS models to simulate SSO noise issues.

I've reviewed a number of the presentations and papers on the IBIS 
website from past Summits and other sources and have come away with a 
mixed message regarding the usefulness of IBIS in modeling SSO. I am 
trying to determine if it will be useful to our customers if we provide 
full parasitic information for the power and ground nets in our parts. 
Can that RLC information effectively be utilized in IBIS simulations to 
produce useful results? From what I've read, some authors contend that 
IBIS  models are adequate to model SSO problems if proper package 
parasitic data and on chip capacitance data is provided while it seems 
that some others tend to question whether it can be done today with the 
present  state of IBIS.

Any comments and/or advice on the topic will be most welcome.

Raymond Anderson
Senior Signal Integrity Staff Engineer
Xilinx Inc.
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------------------------------

Date: Fri, 07 Jan 2005 13:03:55 -0800
From: Ray Anderson <ray.anderson@xilinx.com>
Subject: Re: [IBIS-Users] General question on IBIS and SSO simulations

I just wanted to add that I am aware of the modifications and issues 
raised during the BIRD95 discussions. As any enhancements based on that 
BIRD are at this time unknown and in any case won't be implemented into 
simulators until some time in the not-so-near future, my question was 
framed with the present IBIS capabilities and limitations in mind.

- -Ray

Ray Anderson wrote:

>
> After working on Power Distribution issues at the PCB level for quite 
> a number of years I'm now tasked with upgrading our company's IBIS 
> models with respect to package parasitic modeling. As an aid in coming 
> up to speed on some of the issues involved I have a general question 
> in regards to utilizing IBIS models to simulate SSO noise issues.
>
> I've reviewed a number of the presentations and papers on the IBIS 
> website from past Summits and other sources and have come away with a 
> mixed message regarding the usefulness of IBIS in modeling SSO. I am 
> trying to determine if it will be useful to our customers if we 
> provide full parasitic information for the power and ground nets in 
> our parts. Can that RLC information effectively be utilized in IBIS 
> simulations to produce useful results? From what I've read, some 
> authors contend that IBIS  models are adequate to model SSO problems 
> if proper package parasitic data and on chip capacitance data is 
> provided while it seems that some others tend to question whether it 
> can be done today with the present  state of IBIS.
>
> Any comments and/or advice on the topic will be most welcome.


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------------------------------

Date: Sat, 08 Jan 2005 23:37:39 +0200
From: Peleg Itzik <itzikpe@il.marvell.com>
Subject: [IBIS-Users] BIRD 95 Comments.

Hello All

I sure think that BIRD 95 is very important and will enhance IBIS 
modeling a step foreword.
Power Integrity Analysis is very important part when evaluation the 
performance of an interface.

My notes to SSO/ SSN analysis using IBIS based on my experience.

I have tried to connect an IBIS model with inductive supply and compare 
it to its SPICE source pad with the same conditions.
(when comparing the IBIS to the SPICE using ideal supply the results are 
the same).
The results I got were:
1. The power drop in the IBIS power terminal was bigger then the spice.
2. The signal degradation (rise time) was bigger in the spice (the spice 
has a significant degradation of the rise time while the IBIS looked 
almost the same as ideal supply case).

This results mismatch since I would expect that in the system with the 
bigger drop in the power rail the bigger degradation of the signal would be.

I have to mention that I have tried it in one simulation tool and I am 
relaying on the tool implementation of IBIS (I didn't try to implement 
myself the IBIS using primitive parts).

And now for the question: Assuming that the currents I_bypass, I_pre, 
I_term  in BIRD 95 diagram are totally zero. This is the case for the 
current IBIS modeling that we have without BIRD 95. I will expect lower 
current consumption then the real SPICE and as a results lower power 
drop in the IBIS.
Also I would expect degradation of the rise time like the spice. This is 
contrary to what I have seen and describe above.

Because of that I have tried to ask in the teleconference (7/jan) if 
there's an algorithm that IBIS can mimic Spice when the power supply drop.
I think that BIRD 95 can led us to the ability to get more accurate 
current consumption of the IBIS Buffer and then we get the response of 
the power system to this currents and get the power supply voltage drop. 
In this point if IBIS cant translate this voltage drop to a correct 
behavior in the IO pin then all the effort is useless.

I would like also to know if some one has tried to compare IBIS to SPICE 
on non ideal power supply and got good correlation.
I can implement the IBIS myself in the simulation tool, If theoretically 
IBIS can give the right results in the IO pin due to the voltage drop 
(Can someone back this up
and provide some feedback on that).

And back to BIRD 95:

The current is measured with the resistance and inductance of the power 
supply rail of the pad. While the rising and falling v(t) table are 
measured with ideal supply.
Isn't it better to measure the current on an ideal supply so the current 
is correlated to the voltage response that was capture in the rising or 
falling wave form.
Please elaborate why the current is measured with the inductance and 
resistance.

- -- 
Regards

Itzik Peleg 
Board Technology Group

Marvell Semiconductor Israel Ltd
6 Ha'mada St. Industrial Area
P.O.Box 692 Yokneam  20692  ISRAEL
Email - itzik.peleg@il.marvell.com
Tel   - +972 4  9091192  
Cell  - +972 54 4452482
Fax   - +972 4  9091501
WWW Page: http://www.marvell.com
========================================================================
This message may contain confidential, proprietary or legally privileged
information. The information is intended only for the use of the
individual or entity named above. If the reader of this message is not 
the intended recipient, you are hereby notified that any dissemination,
distribution or copying of this communication is strictly prohibited. 
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------------------------------

Date: Sat, 08 Jan 2005 14:01:11 -0800
From: Syed Huq <shuq@cisco.com>
Subject: Re: [IBIS-Users] BIRD 95 Comments.

Hi Peleg, 

Thanks for your comments on the 7th teleconf. Some responses in-line -
Syed


On Sat, 2005-01-08 at 13:37, Peleg Itzik wrote:

> And back to BIRD 95:
> 
> The current is measured with the resistance and inductance of the power 
> supply rail of the pad. While the rising and falling v(t) table are 
> measured with ideal supply.
> Isn't it better to measure the current on an ideal supply so the current 
> is correlated to the voltage response that was capture in the rising or 
> falling wave form.
> Please elaborate why the current is measured with the inductance and 
> resistance.

The L_xxx and R_xxx in the diagram are on-die parasitics. These are part
of the encrypted SPICE you may have. We wanted to show that these
components are present in your netlist as you make your measurements.

These user is *not* placing any specific L_xxx or R_xxx to make these
measurements.

We do want time coreelated V/T and I/T. Ideal supply maynot give you the
kind of SSN you wish to simulate.

Regards,
Syed
- -- 
IBIS Vice-Chair & Webmaster
Cisco Systems, Inc
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------------------------------

Date: Sat, 8 Jan 2005 16:12:12 -0800
From: "Zhiping Yang" <zhiping@cisco.com>
Subject: Re: [IBIS-Users] BIRD 95 Comments.

Hi Peleg,

Thanks for your comments on our proposal.

Very good questions about the IBIS model capability in SSO simulation.
Since Syed has replied your questions on the BIRD95, I will try to answer
your questions on the IBIS itself.

Current version of IBIS could over-estimate or under-estimate the SSO noise
in the simulation when it is compared with HSPICE model.  I will explain in
what conditions it will over-estimate and in what conditions it will
under-estimate.

Current IBIS model neglects the pre-driver current. If the predriver current
is relatively large (which is typical for very complicated I/O buffer at
0.13um process and below), the IBIS model will underestimate the SSO noise.

If the HSPICE model only include the last stage of the I/O buffer and there
are relatively large amount of on-die decaps are embedded in the HSPICE
model itself, the SSO simulation with IBIS model will overestimate the SSO
noise.  This is the case that you already saw in your simulation.  The first
reason for over-estimate is that IBIS simulator is very hard (I don't know
whether I should say impossible) to adjust the buffer driver strength due to
the voltage drop.  A lot of IBIS simulators on the market will not adjust,
so the current is the same as the ideal power supply which is bigger than
nonideal power supply.   The second reason is that on-die decap in the
HSPICE model could provide the high-speed current which is needed for
high-speed I/O switching.  For current IBIS, it is not able to model the
on-die decap, so all the high-speed current has to come from the outside of
the I/O buffer, which could overestimate the I/O current when it is compared
to the HSPICE model.

If you have any questions on my explanations, please let me know.  Thanks.

Best regards,

Zhiping






- ----- Original Message -----
From: "Peleg Itzik" <itzikpe@il.marvell.com>
To: "IBIS Users" <ibis-users@eda.org>
Sent: Saturday, January 08, 2005 1:37 PM
Subject: [IBIS-Users] BIRD 95 Comments.


> Hello All
>
> I sure think that BIRD 95 is very important and will enhance IBIS
> modeling a step foreword.
> Power Integrity Analysis is very important part when evaluation the
> performance of an interface.
>
> My notes to SSO/ SSN analysis using IBIS based on my experience.
>
> I have tried to connect an IBIS model with inductive supply and compare
> it to its SPICE source pad with the same conditions.
> (when comparing the IBIS to the SPICE using ideal supply the results are
> the same).
> The results I got were:
> 1. The power drop in the IBIS power terminal was bigger then the spice.
> 2. The signal degradation (rise time) was bigger in the spice (the spice
> has a significant degradation of the rise time while the IBIS looked
> almost the same as ideal supply case).
>
> This results mismatch since I would expect that in the system with the
> bigger drop in the power rail the bigger degradation of the signal would
be.
>
> I have to mention that I have tried it in one simulation tool and I am
> relaying on the tool implementation of IBIS (I didn't try to implement
> myself the IBIS using primitive parts).
>
> And now for the question: Assuming that the currents I_bypass, I_pre,
> I_term  in BIRD 95 diagram are totally zero. This is the case for the
> current IBIS modeling that we have without BIRD 95. I will expect lower
> current consumption then the real SPICE and as a results lower power
> drop in the IBIS.
> Also I would expect degradation of the rise time like the spice. This is
> contrary to what I have seen and describe above.
>
> Because of that I have tried to ask in the teleconference (7/jan) if
> there's an algorithm that IBIS can mimic Spice when the power supply drop.
> I think that BIRD 95 can led us to the ability to get more accurate
> current consumption of the IBIS Buffer and then we get the response of
> the power system to this currents and get the power supply voltage drop.
> In this point if IBIS cant translate this voltage drop to a correct
> behavior in the IO pin then all the effort is useless.
>
> I would like also to know if some one has tried to compare IBIS to SPICE
> on non ideal power supply and got good correlation.
> I can implement the IBIS myself in the simulation tool, If theoretically
> IBIS can give the right results in the IO pin due to the voltage drop
> (Can someone back this up
> and provide some feedback on that).
>
> And back to BIRD 95:
>
> The current is measured with the resistance and inductance of the power
> supply rail of the pad. While the rising and falling v(t) table are
> measured with ideal supply.
> Isn't it better to measure the current on an ideal supply so the current
> is correlated to the voltage response that was capture in the rising or
> falling wave form.
> Please elaborate why the current is measured with the inductance and
> resistance.
>
> --
> Regards
>
> Itzik Peleg
> Board Technology Group
>
> Marvell Semiconductor Israel Ltd
> 6 Ha'mada St. Industrial Area
> P.O.Box 692 Yokneam  20692  ISRAEL
> Email - itzik.peleg@il.marvell.com
> Tel   - +972 4  9091192
> Cell  - +972 54 4452482
> Fax   - +972 4  9091501
> WWW Page: http://www.marvell.com
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> This message may contain confidential, proprietary or legally privileged
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------------------------------

Date: Mon, 10 Jan 2005 01:58:13 +0000
From: "lee yang" <changly_80@hotmail.com>
Subject: [IBIS-Users] IV Curves

Hi IBIS experts:

I have a few questions regarding IBIS data:
1) What is the reason of ground clamp and pulldown data is ground relative 
while power clamp and pullup data is vcc relative?
2) The IV curves data is covered from -vcc to 2vcc, in what condition the 
voltage would become -vcc? (eg1: output is driving vcc and the receiver end 
is being shorted, the reflection coefficient is -1, then the maximum 
negative voltage is 0V (vcc + (-1*vcc)=0); eg2: output is driving 0v and the 
reciever end is being shorted, the reflection coefficient is -1 as well, 
would it be any reflection if the output is driving 0V with reciever end 
being shorted to ground?)
Hope you all could shed some light here.
Thanks.

Yours Faithfully,
LY

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------------------------------

Date: Sun, 9 Jan 2005 20:41:50 -0800
From: "Tom Dagostino" <tom@teraspeed.com>
Subject: RE: [IBIS-Users] IV Curves

Think about reflections off an open transmission line for your answer.

Tom Dagostino
Teraspeed Consulting Group LLC
503-430-1065
tom@teraspeed.com
www.teraspeed.com

- -----Original Message-----
From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org]On
Behalf Of lee yang
Sent: Sunday, January 09, 2005 5:58 PM
To: ibis-users@eda.org
Subject: [IBIS-Users] IV Curves


Hi IBIS experts:

I have a few questions regarding IBIS data:
1) What is the reason of ground clamp and pulldown data is ground relative
while power clamp and pullup data is vcc relative?
2) The IV curves data is covered from -vcc to 2vcc, in what condition the
voltage would become -vcc? (eg1: output is driving vcc and the receiver end
is being shorted, the reflection coefficient is -1, then the maximum
negative voltage is 0V (vcc + (-1*vcc)=0); eg2: output is driving 0v and the
reciever end is being shorted, the reflection coefficient is -1 as well,
would it be any reflection if the output is driving 0V with reciever end
being shorted to ground?)
Hope you all could shed some light here.
Thanks.

Yours Faithfully,
LY

_________________________________________________________________
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------------------------------

Date: Mon, 10 Jan 2005 07:10:47 +0000
From: "lee yang" <changly_80@hotmail.com>
Subject: RE: [IBIS-Users] IV Curves

Hi Tom,

Thanks for your responce...
However, i couldn't get you clearly. If the transmission line is being 
opened, the reflection coefficient is 1, how could it become -vcc? 
Appreciate if you could explain it in more details.
Could someone please help with my 2 questions below?
Thanks and much appreciated.

- -LY

>From: "Tom Dagostino" <tom@teraspeed.com>
>Reply-To: <tom@teraspeed.com>
>To: "lee yang" <changly_80@hotmail.com>, <ibis-users@eda.org>
>Subject: RE: [IBIS-Users] IV Curves
>Date: Sun, 9 Jan 2005 20:41:50 -0800
>
>Think about reflections off an open transmission line for your answer.
>
>Tom Dagostino
>Teraspeed Consulting Group LLC
>503-430-1065
>tom@teraspeed.com
>www.teraspeed.com
>
>-----Original Message-----
>From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org]On
>Behalf Of lee yang
>Sent: Sunday, January 09, 2005 5:58 PM
>To: ibis-users@eda.org
>Subject: [IBIS-Users] IV Curves
>
>
>Hi IBIS experts:
>
>I have a few questions regarding IBIS data:
>1) What is the reason of ground clamp and pulldown data is ground relative
>while power clamp and pullup data is vcc relative?
>2) The IV curves data is covered from -vcc to 2vcc, in what condition the
>voltage would become -vcc? (eg1: output is driving vcc and the receiver end
>is being shorted, the reflection coefficient is -1, then the maximum
>negative voltage is 0V (vcc + (-1*vcc)=0); eg2: output is driving 0v and 
>the
>reciever end is being shorted, the reflection coefficient is -1 as well,
>would it be any reflection if the output is driving 0V with reciever end
>being shorted to ground?)
>Hope you all could shed some light here.
>Thanks.
>
>Yours Faithfully,
>LY
>
>_________________________________________________________________
>Find answers fast with MSN Search BETA. http://beta.search.msn.com.my/ New
>look and improved results. Give it a try!
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------------------------------

Date: Mon, 10 Jan 2005 09:33:50 +0100
From: Antonio GIRARDI <antonio.girardi@st.com>
Subject: [IBIS-Users] RE: BIRD95: Power Integrity Analysis Using IBIS

Dear Muranyi,

I agree with you about the need to identify a solution for describing
the "gate modulation effect" by legacy buffer modeling techniques.
I think this solution will increase a lot the quality and accuracy of
IBIS model simulations, expecially in the design of high-speed
systems.

About this issue, we have done internally a lot of  benchmarking activities
to evaluate the accuracy of  IBIS SSO simulations vs SPICE ones, because
it is a very critical bottleneck to perform accurate IBIS signal 
integrity analysis
for system-in-packages design.

To reduce the mismatching IBISvsSPICE, we have identified two mandatory
steps:

1) to estimate the capacitances of  the IC power nodes and back-annotate
them to IBIS models. The capacitances considered are fullchip and include
the total self  and mutual capacitances between buffers (Vddq, Gndq) and
core (Vdd, Gnd) power nodes, including also the equivalent capacitances
of ESD structures and parassitic diodes connected to power nodes.
This step permits to recover the correct behaviour of  the power and ground
nodes, but it doesn't solve the error due the "gate modulation effect" lack
which impacts on the delay and ringing simulations accuracy.

2) to solve the "gate modulation effect" error. For this goal we have 
implemented
the Vgs modulation description using the VHDL-AMS language, starting 
from the
IBIS model template suggested by you. The results seem to be very 
interesting.
Our approach has been based on extrapolating some tables which describe
the current through pullup and pulldown for different values of Vgs, 
keeping  the
Vds values fixed.
I think this approach might be implemented also by legacy buffer 
modeling techniques,
but it has to be joined to a new IBIS simulation stategy in the EDA 
tools available
on the market.
I think the [Series Composite Current] keyword in the BIRD95 also 
presents this need.
Best regards,

                     Antonio Girardi


> Muranyi, Arpad wrote:
>
>> Mike (and Syed),
>>
>> Nice comments!  Your main concern raises a question in my mind
>> regarding on-die power delivery (passive) networks.  This subject
>> has popped up here and there in discussions, but so far no one
>> has raised it as an issue so clearly and as importantly as you
>> and Norio Matsui.
>>
>> Up until now we have considered a buffer having a single point
>> Power and GND connection (unless it was using different supply
>> voltages for clamps).  Except for some groupings done by the good
>> old [Pin Mapping] keyword, these supplies were all shorted together
>> with all power and GND pads.
>>
>> It seems that if these concerns you and Norio are raising are
>> driven by a common need, we would also need to consider how
>> power is distributed between the buffers and their sub-blocks.
>>
>> However, if one of the primary purpose of doing BIRD95 is
>> to make better SSN simulations possible (including the power
>> delivery networks), we would also need to consider the
>> so-called "gate modulation effect" for which I have heard
>> a lot a IBIS criticism since the mid 90's.  (This effect
>> is the one that reduces the drive strength of the output
>> stage due to the supply voltage reduction which arises with
>> power delivery noise).  If we don't account for that, no
>> matter how well we know how the currents are distributed
>> between power GND and the output, they are still going to
>> be wrong...
>>
>> Now, adding more than 4 supply nodes to a buffer is not possible
>> with [Model] or [External Model], only with [External Circuit].
>> This implies that describing predriver currents independently
>> could only be done with models using the new language extensions.
>> To me it seems that Syed's proposal is an attempt to provide an
>> interim solution using the legacy buffer modeling techniques.
>> The level of detail you and Norio brought up could only be
>> addressed by the new generation of models which will be written
>> with those languages.  I hope that by then we will also figure
>> out how to use ICM with IBIS to describe the on-die passive
>> interconnects to make it all work together.
>>
>> However, the gate modulation effect could still be described
>> relatively well within the legacy IBIS framework with a few simple
>> parameters.  For an example we could look at how HSPICE's B-element
>> does it with the "spu_scal" and "spd_scal" parameters.  These were
>> implemented on our request to do just that, but there are no IBIS
>> keywords or subparameters to transfer these coefficients in an
>> IBIS file.  I wonder whether we should include these features
>> in BIRD95?
>>
>> Regarding #4, current should be positive into the power node,
>> into the I/O node, but OUT OF the GND node.
>>
>> Regarding #6, very good point, but it all depends on whether the
>> diff pair is just two independent single ended buffers driven in the
>> opposite directions, or a true (current source + current steering
>> transistors) construction.  Legacy IBIS can't do the second one,
>> period.  So how would someone translate a measurement done on a
>> true diff buffer to a model that can only do two single ended
>> buffers driven in opposite directions?  I am not saying that this
>> is impossible, but I don't see an immediate solution, and I didn't
>> spend time on thinking about it yet.
>>
>> There is another issue that I ran into recently in connection with
>> differential buffers when they are designed with bipolar transistors.
>> It is a pain taking IV curves of these, because due to the nature of
>> the bipolar output transistors the two outputs are much less
>> independent as in the case with MOSFET outputs.  (The nature of
>> bipolar transistors is such that the output voltage will have
>> a great effect of the bias levels of the predrivers, and thereby
>> other half of the output).  I don't know what we can or should do
>> with these animals in an IBIS I-V curve sense.  This is not 
>> necessarily a BIRD95 problem, but since you brought up your
>> question, I had to mention it.
>>
>> Regarding #7, I feel these tables should be under subparameters
>> inside the [xxx Waveform] keywords.  That way there would be
>> no confusions.  (I hope).
>>
>> Arpad
>> ==================================================================
>>
>> -----Original Message-----
>> From: owner-ibis@eda.org [mailto:owner-ibis@eda.org] On Behalf Of 
>> Mike LaBonte
>> Sent: Wednesday, December 29, 2004 8:34 AM
>> To: ibis@eda.org; 'ibis-users'
>> Subject: RE: [IBIS] Re: [IBIS-Users] BIRD95: Power Integrity Analysis 
>> Using IBIS
>>
>> BIRD95 reminds us of the difficulties associated with the current 
>> profile
>> issue, but hopefully this time we can work it through to a 
>> conclusion. My
>> comments:
>>
>> 1) Norio Matsui may have raised the most important issue, the fact that
>> there may not be exactly one bypass capacitor and one pre-driver section
>> associated with one buffer, all sharing current from one supply. In fact
>> this case seems quite unlikely. Scaling the total bypass capacitance,
>> pre-driver current and output current for an arbitrary slice of a 
>> component
>> down to one of it's buffers should a model that is likely not very 
>> accurate
>> for any single buffer, or for any collection of buffers unless the
>> collection happens to be equal to those in the slice. And a single 
>> current
>> profile still doesn't solve the correct apportionment of current to 
>> paths
>> from distinct power supply voltages.
>>
>> 2) Accepting for the moment that we are attempting to represent multiple
>> current paths with a single table here, why not specify ground current
>> instead of power current? Isn't it more likely that all of these 
>> currents
>> flow through a single ground plane than through a single power plane?
>>
>> 3) Although the IBIS specification limits itself with regard to 
>> explaining
>> how a simulator might use the data, I feel that some effort might be
>> warranted here to advance the cause of consistency among simulators. For
>> starters, should we have some words of wisdom explaining that the 
>> current
>> out of the pad can be determined, and represents the difference 
>> between the
>> current into the power supply (if there is only one) and out through 
>> ground
>> (if there is only one). Digging deeper, how will the simulator decide 
>> how
>> much of the current passing through ground is "crowbarred" through the
>> pullup and pulldown, versus passing through the other current path 
>> formed by
>> the bypass capacitors and pre-drivers? This has a bearing on the 
>> turn-on/off
>> rates chosen for the pullup/pulldown. Mainly I would like to see some
>> discussion of this from simulator people, to validate that the 
>> simulation
>> outcome is deterministic. Even if there has been discussion already 
>> within
>> the IBIS committee, it would be good to make a record in the IBIS
>> specification for future implementers.
>>
>> 4) I think the text should clarify that positive values represent 
>> current
>> flowing into the buffer.
>>
>> 5) Although it may seem obvious, maybe the specification should 
>> clarify that
>> in the case of open_XXX models, where current is supplied by the test
>> fixture, that current is not to be accounted for in the [Series 
>> Composite
>> Current].
>>
>> 6) What would the [Series Composite Current] profile look like for a
>> differential output buffer? Presumably these must be taken as a pair, 
>> and
>> the total current for the pair ideally remains nearly static. Should we
>> require the measurements to be taken this way, or should we allow model
>> makers to provide separate P and N models with different current 
>> profiles?
>>
>> 7) The proposed [Series Composite Current] keyword associates itself 
>> with a
>> preceding [XXX Waveform] keyword, and is thus position dependent. Some
>> existing IBIS keywords are position dependent. For example, [Ramp] is 
>> part
>> of a second level of hierarchy under [Model]. But I think [Series 
>> Composite
>> Current] would be a third level of hierarchy, being under [XXX 
>> Waveform],
>> which is under [Model]. Is this OK, or would it be better to simply 
>> add 3
>> more columns to the [XXX Waveform] tables?
>>
>> 8) Can the [Series Composite Current] keyword follow only some [XXX
>> Waveform] tables and not others?
>>
>> 9) The text describes [Series Composite Current] as current flowing 
>> through
>> R_VDD, but the circuit diagram calls it R_VDDQ.
>>
>> 10) More nit picking: I had to modify the ASCII circuit diagram to 
>> make it
>> line up right.
>>
>> It's great to be discussing this important issue again. Overall I am 
>> left
>> wondering if the various current paths can reasonably be merged into a
>> single table.
>>
>> Mike LaBonte
>>
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------------------------------

Date: Mon, 10 Jan 2005 11:02:45 -0500
From: "Andrew Ingraham" <a.ingraham@ieee.org>
Subject: [IBIS-Users] Re: Basic questions about IBIS

Andrew,

Gee, I was hoping some others would chime in here by now.  Oh well.

> About 3,
>                A. So, chips are usually not made according to SPICE file;
> On the contrary, SPICE files are extracted from chip and guess.

Essentially yes, but early SPICE files can also be created before a chip is
designed, based on the schematic for the chip, and on the designer's
expectations.  You can make SPICE files from either a schematic design, or
an actual chip layout.

When someone is designing a chip, they can make SPICE files that represent
how they hope the chip will behave, before there is any silicon or even a
layout.  If it is a new IC process too, then you could say the entire SPICE
model including its .MODEL parameters includes some guess, since even the
process has not been proven yet.

After the chip is made, they can also make SPICE files that represent the
final, actual chip layout.  Not everyone goes through both steps.

In any event, a good IC designer *should* always adjust their final SPICE
models (whether they came from schematics or from the layout) according to
how the chip actually behaves.  Usually not the other way around.  It is
easier to make a SPICE model fit actual silicon behavior, than the other way
around.

If the chip doesn't behave the way he wanted it to, he may go back and tweak
the chip design somewhat, but in the end, he ought to adjust the SPICE model
according to how the chip truly behaves.

>                     Thus, SPICE-derived IBIS model and encrypted SPICE
> model are not as accurate as measurement-based IBIS model. (except some
> situation)

SPICE models, whether encrypted or not, could be just as accurate as any
IBIS model.  (Encryption has nothing to do with it.)

On basic principles, a SPICE-derived IBIS model could be less accurate than
a measurement-based IBIS model, because it is one more level removed from
reality.  Each level, or translation from one form to another, incurs
additional errors.

Reality is the chip itself.  A SPICE model that has been correlated to agree
with measurements, is one level away from reality.  An IBIS model from
measurements, is also one level away from reality.  An IBIS model created
from the SPICE model, is two levels away from reality, so there CAN be a
greater chance of it not agreeing with reality.  But it's not a guarantee.

A SPICE model that has never been correlated with measurements, should be
treated with suspicion, and an IBIS model derived from it is almost surely
less accurate than one made from measurements.

But on the other hand, anyone can create a lousy IBIS file from
measurements.

If someone hands you a chip and a SPICE model, and asks you to make an IBIS
model, you may not know who created the SPICE model and whether it is
accurate.  There are many bad SPICE models out there too.  Making a SPICE-
derived IBIS model could just perpetuate a lie that was in the SPICE model,
that the designer never bothered to correct.  Making a measurement-based
IBIS model can at least be traced to the chip's actual electrical behavior.

>                B. So, the extremes of SPICE-derived model are only
> expectations.  ...

I'm not in the IC process business so I don't "know the real scoop" here ...
but as far as process extremes is concerned, I believe that the following
are true:

(1)  IC manufacturers set statistical limits on their IC process, beyond
which there is some statistical confidence that no (defect-free) parts will
be made.  Some SPICE model extremes are based on these statistical
expectations.

IC vendors can also make test chips that are meant to represent the process
extremes, which they do by intentionally varying some key factor(s) in the
chip-making process.  Because they require special changes to the IC
process, they aren't cheap.  In theory they can use these test chips to
verify SPICE model extremes.

(2)  IC manufacturers put test limits into their automatic test equipment,
used to test and screen every part manufactured, and this tends to set the
limits on the extremes of characteristics of the parts they sell.  (Except
for black-market (reject) parts that sometimes find their way onto the
market!)  Because the ATE tests may or may not directly test the parameters
of interest, sometimes they are indirect.

>                C. If everything is optimized, how long will it usually
> take to generate a IBIS3.2 model of one I/O buffer?

Gee, I don't know ... I'm going to guess no more than a day?  (Maybe two;
one to measure, one to massage the data.)  Assuming of course that the
people doing it were really set up beforehand and didn't need to do any more
research or fixturing, and that the package modeling is simple.

> About 4,
>             A. I would like to know whether the influence from fab process
> is smaller than the influence from temperature and voltage or not.

This is probably a moving target, and it's been a while since I looked at
this, but I recall that the fab process was dominant.  Today they may have
tighter controls on process variations, which might have reversed that.

They can also design temperature and voltage compensated buffers that remove
some of those dependencies on (say) buffer speed.

>             B. For most IBIS model, the typical temperature is room
> temperature, however, for some chips (ex: CPU), the temperature is much
> higher than room temperature.
>                  Is it reasonable to ask chip vendors to change the
> typical temperature.

That's a really good thing to discuss with whoever makes your IBIS models.
It's one of the things I don't particularly like about models that include
environmental effects.  No chip runs at room temperature.

> 5. In IBIS, the "max" curves are measured / simulated under the condition
> "maximum buffer strength + lowest temperature + largest voltage"
>          and the "min" curves are measured / simulated under the condition
> "minimum buffer strength + highest temperature + smallest voltage".
>     I think it is not sufficient to simulate the ringback: as I know the
> ringing caused  by maximum buffer strength is much larger the minimum
> buffer strength, but "smallest voltage - VIH" is smaller than "largest
> voltage - VIH", we cannot make sure whether the ringback margin is
> sufficient even if the simulation results of min and max passed. (Because
> the smallest ringback margin should be under the condition "maximum buffer
> strength + lowest temperature + smallest voltage")

I think this question deals more with the particular simulation strategy
(and the simulator) you use.

You could simulate using a "max" model for the driver and a "min" model for
the receiver, if your simulator allows you to do this.  (Unless, of course,
you are talking about a bi-directional transceiver monitoring its own
output.)

Personally, I prefer to decide what input thresholds *I* want to use, so in
SPICE I look for the worst-case input thresholds, plus a small margin, and I
ignore what the IBIS model may say.

I hoped someone else would comment on that question.

> 6. Chip vendors usually set the largest and smallest voltage according to
> their maximum tolerance (for example 20%), however, the voltage error rate
> of our regulator is usually not so large.  So the worst cases in IBIS
> model are not the same with the worst cases in our PCBA.  Furthermore,
> sometimes the typical voltage we use is not the same with the original.  I
> would like to know whether there is a method to generate the IBIS model we
> need.

I don't know.  Except that you could have someone create custom IBIS models
for your particular needs.

You have cited many of the reasons why I prefer to use SPICE models rather
than IBIS models!  In recent years I have been rather disappointed to see so
many IBIS models *replace* SPICE models in terms of their availability.  To
me, nothing beats a good SPICE model.  A good SPICE model does what you want
it to.  An IBIS model doesn't.  But it keeps the lawyers happy.  :-(

Regards,
Andy


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------------------------------

Date: Mon, 10 Jan 2005 08:43:20 -0800
From: "lgreen" <lgreen22@mindspring.com>
Subject: RE: [IBIS-Users] IV Curves

Hello, Lee,
Please see answers inserted.
- - Lynne

- -----Original Message-----
From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On Behalf
Of lee yang
Sent: Sunday, January 09, 2005 5:58 PM
To: ibis-users@eda.org
Subject: [IBIS-Users] IV Curves

Hi IBIS experts:

I have a few questions regarding IBIS data:
1) What is the reason of ground clamp and pulldown data is ground relative 
while power clamp and pullup data is vcc relative?
- -- This was an arbitrary decision made in the IBIS 1.0 specification.  
Note that GND-and Pulldown tables currents shift relative to ground
(and currents usually go through 0A at GND), while Power- and Pullup tables
shift when Vcc changes (and currents usually go through 0A at Vcc).

2) The IV curves data is covered from -vcc to 2vcc, in what condition the 
voltage would become -vcc? (eg1: output is driving vcc and the receiver end 
is being shorted, the reflection coefficient is -1, then the maximum 
negative voltage is 0V (vcc + (-1*vcc)=0); eg2: output is driving 0v and the

reciever end is being shorted, the reflection coefficient is -1 as well, 
would it be any reflection if the output is driving 0V with reciever end 
being shorted to ground?)
- -- A load with a small capacitance has a reflection coefficient close to +1.
For an open circuit termination, the reflection coefficient is +1.
A rising waveform into an "open circuit" load can cause 2*Vcc at the driver,
and a falling reflection (starting at Vcc) can cause -Vcc at the driver.


Hope you all could shed some light here.
Thanks.

Yours Faithfully,
LY

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------------------------------

Date: Mon, 10 Jan 2005 08:32:45 -0800
From: "Tom Dagostino" <tom@teraspeed.com>
Subject: RE: [IBIS-Users] IV Curves

If you have a 3.3V step going from 3.3 to 0V and it hits an open
transmission line it will reflect back to -3.3V.

Tom Dagostino
Teraspeed Consulting Group LLC
503-430-1065
tom@teraspeed.com
www.teraspeed.com

- -----Original Message-----
From: lee yang [mailto:changly_80@hotmail.com]
Sent: Sunday, January 09, 2005 11:11 PM
To: tom@teraspeed.com; ibis-users@eda.org
Subject: RE: [IBIS-Users] IV Curves


Hi Tom,

Thanks for your responce...
However, i couldn't get you clearly. If the transmission line is being
opened, the reflection coefficient is 1, how could it become -vcc?
Appreciate if you could explain it in more details.
Could someone please help with my 2 questions below?
Thanks and much appreciated.

- -LY

>From: "Tom Dagostino" <tom@teraspeed.com>
>Reply-To: <tom@teraspeed.com>
>To: "lee yang" <changly_80@hotmail.com>, <ibis-users@eda.org>
>Subject: RE: [IBIS-Users] IV Curves
>Date: Sun, 9 Jan 2005 20:41:50 -0800
>
>Think about reflections off an open transmission line for your answer.
>
>Tom Dagostino
>Teraspeed Consulting Group LLC
>503-430-1065
>tom@teraspeed.com
>www.teraspeed.com
>
>-----Original Message-----
>From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org]On
>Behalf Of lee yang
>Sent: Sunday, January 09, 2005 5:58 PM
>To: ibis-users@eda.org
>Subject: [IBIS-Users] IV Curves
>
>
>Hi IBIS experts:
>
>I have a few questions regarding IBIS data:
>1) What is the reason of ground clamp and pulldown data is ground relative
>while power clamp and pullup data is vcc relative?
>2) The IV curves data is covered from -vcc to 2vcc, in what condition the
>voltage would become -vcc? (eg1: output is driving vcc and the receiver end
>is being shorted, the reflection coefficient is -1, then the maximum
>negative voltage is 0V (vcc + (-1*vcc)=0); eg2: output is driving 0v and
>the
>reciever end is being shorted, the reflection coefficient is -1 as well,
>would it be any reflection if the output is driving 0V with reciever end
>being shorted to ground?)
>Hope you all could shed some light here.
>Thanks.
>
>Yours Faithfully,
>LY
>
>_________________________________________________________________
>Find answers fast with MSN Search BETA. http://beta.search.msn.com.my/ New
>look and improved results. Give it a try!
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------------------------------

Date: Mon, 10 Jan 2005 08:58:27 -0800
From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
Subject: RE: [IBIS-Users] IV Curves

Just a couple of refinements to the answers I have seen
so far.

1)  Actually none of the IV curves are GND relative any more,
this is just a terminology that is left over from the first
version of the IBIS specification.

Note that all four IV curves now have an associated [*** Reference]
keyword, which defines the voltage for the origin of the IV curve.
Therefore a pulldown IV curve for an RS232 driver could be referenced
to -12 V, for example, which is not GND relative by any means...
It is true, in most cases we reference the pulldown and GND clamp IV
curves to 0 V, so it is easy to forget about this capability.

2) Lynne said it right, but I would like to add, that even if you
have a perfect open at the end of the T-line, the 2Vcc or -Vcc
doubling will only happen if your driver is superconductive,
i.e. very low impedance.  This is because the T-line voltage
doubling doubles the incident step, which is determined by the
voltage division based on the T-line impedance, and the driver
impedance.  So the 2Vcc and -Vcc voltages are kind of an absolute
maximum condition which will most likely never happen.

Arpad Muranyi
Intel Coproation
====================================================================
 

- -----Original Message-----
From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On Behalf Of lgreen
Sent: Monday, January 10, 2005 8:43 AM
To: 'lee yang'; ibis-users@eda.org
Subject: RE: [IBIS-Users] IV Curves

Hello, Lee,
Please see answers inserted.
- - Lynne

- -----Original Message-----
From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On Behalf
Of lee yang
Sent: Sunday, January 09, 2005 5:58 PM
To: ibis-users@eda.org
Subject: [IBIS-Users] IV Curves

Hi IBIS experts:

I have a few questions regarding IBIS data:
1) What is the reason of ground clamp and pulldown data is ground relative 
while power clamp and pullup data is vcc relative?
- -- This was an arbitrary decision made in the IBIS 1.0 specification.  
Note that GND-and Pulldown tables currents shift relative to ground
(and currents usually go through 0A at GND), while Power- and Pullup tables
shift when Vcc changes (and currents usually go through 0A at Vcc).

2) The IV curves data is covered from -vcc to 2vcc, in what condition the 
voltage would become -vcc? (eg1: output is driving vcc and the receiver end 
is being shorted, the reflection coefficient is -1, then the maximum 
negative voltage is 0V (vcc + (-1*vcc)=0); eg2: output is driving 0v and the

reciever end is being shorted, the reflection coefficient is -1 as well, 
would it be any reflection if the output is driving 0V with reciever end 
being shorted to ground?)
- -- A load with a small capacitance has a reflection coefficient close to +1.
For an open circuit termination, the reflection coefficient is +1.
A rising waveform into an "open circuit" load can cause 2*Vcc at the driver,
and a falling reflection (starting at Vcc) can cause -Vcc at the driver.


Hope you all could shed some light here.
Thanks.

Yours Faithfully,
LY

_________________________________________________________________
Find answers fast with MSN Search BETA. http://beta.search.msn.com.my/ New 
look and improved results. Give it a try!

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------------------------------

Date: Mon, 10 Jan 2005 12:50:17 -0500
From: "Zanella, Fabrizio" <fzanella@enterasys.com>
Subject: RE: [IBIS-Users] General question on IBIS and SSO simulations

Good question, Ray.  I hope we can begin a good discussion on utilizing
today's IBIS models to model SSO noise.  My answer is yes, it will be
very useful if I can get full parasitic information of power and ground
nets in packages.

Regards,

Fabrizio Zanella
Signal Integrity
Enterasys Networks
Andover, MA
Phone:  978-684-1340
fzanella@enterasys.com

- -----Original Message-----
From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On
Behalf Of Ray Anderson
Sent: Friday, January 07, 2005 3:51 PM
To: ibis-users@eda.org
Subject: [IBIS-Users] General question on IBIS and SSO simulations


After working on Power Distribution issues at the PCB level for quite a 
number of years I'm now tasked with upgrading our company's IBIS models 
with respect to package parasitic modeling. As an aid in coming up to 
speed on some of the issues involved I have a general question in 
regards to utilizing IBIS models to simulate SSO noise issues.

I've reviewed a number of the presentations and papers on the IBIS 
website from past Summits and other sources and have come away with a 
mixed message regarding the usefulness of IBIS in modeling SSO. I am 
trying to determine if it will be useful to our customers if we provide 
full parasitic information for the power and ground nets in our parts. 
Can that RLC information effectively be utilized in IBIS simulations to 
produce useful results? From what I've read, some authors contend that 
IBIS  models are adequate to model SSO problems if proper package 
parasitic data and on chip capacitance data is provided while it seems 
that some others tend to question whether it can be done today with the 
present  state of IBIS.

Any comments and/or advice on the topic will be most welcome.

Raymond Anderson
Senior Signal Integrity Staff Engineer
Xilinx Inc.
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------------------------------

Date: Mon, 10 Jan 2005 10:04:37 -0800
From: "Sam Chitwood" <samchitwood@sigrity.com>
Subject: [IBIS-Users] BIRD95 modeling suggestion

This is a multi-part message in MIME format.

- ------=_NextPart_000_0169_01C4F6FB.CB0BF840
Content-Type: text/plain;
	charset="US-ASCII"
Content-Transfer-Encoding: quoted-printable

Hi everyone,

=20

From Friday's conf call, it seems that there will be a number of issues
surrounding BIRD95.  I would like to draw attention to one issue with =
the
suggested model.  The schematic includes resistances and partial =
inductances
for power and ground.  There are a few issues with this methodology.  =
First,
there is no mutual inductance between the two - this is required for the
partials to be meaningful.  Then, what physical location is selected for =
the
measurement of VDDQ's current such that the inductances and resistance =
are
accurately modeled in the extraction? =20

=20

Do we expect the IBIS model builders to include a distributed PDS =
network in
their extractions?  The schematic shows L and R going into the devices =
as a
whole, but there is no PDS model shown between the on-die cap, the
pre-driver, nor the final driver.  I suspect this will be the typical
simulation setup, where all components are directly connected to the =
same
power and ground nodes, without a distributed on-die PDS model.

=20

I recommend that we remove the resistances and partial inductances from =
the
schematic.  This will further enforce the concept that the IBIS device =
is a
"black box" - the actual, physical location of the power and ground
connections are then clearly defined.  Their connections to the rest of =
the
system are then unambiguous, and interconnect modeling remains in the =
final
simulator's domain.

=20

I've included the schematic below for reference.  Best regards,

=20

Sam

=20

=20

|------------------------------------------------------------------------=
- --
(**)
|                                                                        =
 |
<---
|
___________________________________________________________|___VDDQ
|             |                   |         |     |       |              =
 |

|             |                   |         |     |       |              =
 |

|           -----                 |         |     |       |              =
 |

|           | E |                 |         /     |       |              =
 |

|           | S |        ----------------   \   P_|      --- PowerClamp  =
 |

|           | R |        |  Pre-Driver  |   / ||         / \             =
 |

|           -----        |   Circuit    |   \ ||__       ---             =
 |

|             |          |  powered by  |   |     |       |              =
 |

|             |          |     VDDQ     |   |     |  |    |   I_sig      =
 |

|           -----        ----------------   |     |  |    |   ------->   =
 |

|           | E |                 |
o-----o--|----o------------------- I/O
|           | S |                 |         |     |  |    |              =
 |

|        |  | L |            |    |      |  /     |  |    |              =
 |

|I_bypass|  -----       I_pre|    |I_term|  \   N_|  v   --- GNDClamp    =
 |

|        |    |              |    |      |  /  ||   I_cb / \             =
 |

|        v    |              v    |      v  \  ||_       ---             =
 |

|           -----                 |         |     |       |              =
 |

|           ----- C_p+b           |         |     |       |              =
 |

|
|___________________|_________|_____|_______|_______________|____GND
|                                                                        =
 |

|                                                                        =
 |

|------------------------------------------------------------------------=
- -|
=20

=20

=20

=20


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<div class=3DSection1>

<p class=3DMsoNormal><font size=3D2 face=3DArial><span =
style=3D'font-size:10.0pt;
font-family:Arial'>Hi everyone,</span></font></p>

<p class=3DMsoNormal><font size=3D3 face=3D"Times New Roman"><span =
style=3D'font-size:
12.0pt'>&nbsp;</span></font></p>

<p class=3DMsoNormal><font size=3D2 face=3DArial><span =
style=3D'font-size:10.0pt;
font-family:Arial'>From <font color=3Dblack><span =
style=3D'color:black'>Friday&#8217;</span></font>s
conf call, it seems that there will be a number of issues surrounding
BIRD95.&nbsp; I would like to draw attention to one issue with the =
suggested
model. &nbsp;The schematic includes resistances and partial inductances =
for
power and ground.&nbsp; There are a few issues with this =
methodology.&nbsp;
First, there is no mutual inductance between the two &#8211; this is =
required
for the partials to be meaningful.&nbsp; Then, what physical location is =
selected
for the measurement of VDDQ&#8217;s current such that the inductances =
and
resistance are accurately modeled in the extraction?&nbsp; =
</span></font></p>

<p class=3DMsoNormal><font size=3D3 face=3D"Times New Roman"><span =
style=3D'font-size:
12.0pt'>&nbsp;</span></font></p>

<p class=3DMsoNormal><font size=3D2 face=3DArial><span =
style=3D'font-size:10.0pt;
font-family:Arial'>Do we expect the IBIS model builders to include a
distributed PDS network in their extractions? &nbsp;The schematic shows =
L and R
going into the devices as a whole, but there is no PDS model shown =
between the
on-die cap, the pre-driver, nor the final driver.&nbsp; I suspect this =
will be
the typical simulation setup, where all components are directly =
connected to
the same power and ground nod<font color=3Dblack><span =
style=3D'color:black'>es,
without a distributed on-die PDS model.</span></font></span></font></p>

<p class=3DMsoNormal><font size=3D3 face=3D"Times New Roman"><span =
style=3D'font-size:
12.0pt'>&nbsp;</span></font></p>

<p class=3DMsoNormal><font size=3D2 face=3DArial><span =
style=3D'font-size:10.0pt;
font-family:Arial'>I recommend that we remove the resistances and =
partial
inductances from the schematic. &nbsp;This will further enforce the =
concept
that the IBIS device is a &#8220;black box&#8221; &#8211; the actual, =
physical
location of the power and ground connections are then clearly =
defined.&nbsp;
Their connections to the rest of the system are then unambiguous, and
interconnect modeling remains in the final simulator&#8217;s =
domain.</span></font></p>

<p class=3DMsoNormal><font size=3D3 face=3D"Times New Roman"><span =
style=3D'font-size:
12.0pt'>&nbsp;</span></font></p>

<p class=3DMsoNormal><font size=3D2 face=3DArial><span =
style=3D'font-size:10.0pt;
font-family:Arial'>I&#8217;ve included the schematic below for =
reference.
&nbsp;Best regards,</span></font></p>

<p class=3DMsoNormal><font size=3D3 face=3D"Times New Roman"><span =
style=3D'font-size:
12.0pt'>&nbsp;</span></font></p>

<p class=3DMsoNormal><font size=3D2 face=3DArial><span =
style=3D'font-size:10.0pt;
font-family:Arial'>Sam</span></font></p>

<p class=3DMsoNormal><font size=3D3 face=3D"Times New Roman"><span =
style=3D'font-size:
12.0pt'>&nbsp;</span></font></p>

<p class=3DMsoNormal><font size=3D3 face=3D"Times New Roman"><span =
style=3D'font-size:
12.0pt'>&nbsp;</span></font></p>

<pre><font size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|<font
color=3Dblack><span =
style=3D'color:black'>---------------------------------------------------=
- ----------------------- =
&nbsp;&nbsp;</span></font>(**)</span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbs=
p;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp=
;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;=
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;| &nbsp;&nbsp;</span></font>&lt;---</span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp; =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;_______=
______________________________________<font
color=3Dblack><span =
style=3D'color:black'>______________|</span></font>__<font
color=3Dblack><span =
style=3D'color:black'>_V</span></font>DDQ</span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;=
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; | <font
color=3Dblack><span =
style=3D'color:black'>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;</span></font>&nbsp;&nbsp;</span></font></pre><pre><fon=
t
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;=
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; | <font
color=3Dblack><span =
style=3D'color:black'>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp; -----&nbsp;&nbsp;&nbsp; =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp; <font
color=3Dblack><span =
style=3D'color:black'>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span style=3D'font-size:10.0pt'>| =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;| E =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;=
&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
/&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; |<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;| S =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; ----------------&nbsp;&nbsp; =
\&nbsp;&nbsp; P_|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; --- PowerClamp<font
color=3Dblack><span style=3D'color:black'> &nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp; | R |&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp; =
Pre-Driver&nbsp; |&nbsp;&nbsp; / =
||&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; / \<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp; -----&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; | =
&nbsp;&nbsp;Circuit&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp; \ =
||__&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; ---<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp; powered =
by&nbsp; |&nbsp;&nbsp; |&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; |<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp; VDDQ&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp; |&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp; =
I_sig<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp; -----&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
- ----------------&nbsp;&nbsp; |&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp; =
|&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp; -------&gt;<font
color=3Dblack><span style=3D'color:black'> &nbsp;&nbsp;&nbsp;| =
&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp; | E |&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;|&nbsp;=
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
o-----o--|----o----------<font
color=3Dblack><span style=3D'color:black'>--------- =
I/O</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp; | S =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;=
&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp; |&nbsp;&nbsp;&nbsp; |<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span style=3D'font-size:10.0pt'>| =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;|&nbsp; | L =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp; =
/&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp; |&nbsp;&nbsp;&nbsp; |<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|I_bypass|&nbsp; =
- -----&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; I_pre|&nbsp;&nbsp;&nbsp; =
|I_term|&nbsp; \&nbsp;&nbsp; N_|&nbsp; v&nbsp;&nbsp; --- GNDClamp<font
color=3Dblack><span style=3D'color:black'> &nbsp;&nbsp;&nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;=
&nbsp; | &nbsp;&nbsp;&nbsp;|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp; =
/&nbsp; ||&nbsp;&nbsp; I_cb / \<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
&nbsp;v&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;=
&nbsp; v&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; v&nbsp; =
\&nbsp; ||_&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; ---<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
&nbsp;&nbsp;&nbsp;&nbsp;-----&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&n=
bsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp; <font
color=3Dblack><span =
style=3D'color:black'>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;| =
&nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
&nbsp;&nbsp;&nbsp;&nbsp;----- =
C_p+b&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;&nbsp;&nbsp; |&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
|&nbsp;&nbsp;<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;|=
 &nbsp;&nbsp;&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;|___________________|_________|_____|=
_______|__<font
color=3Dblack><span =
style=3D'color:black'>_____________|__</span></font>__GND</span></font></=
pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbs=
p;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp=
;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;=
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;&nbsp;&nbsp;&nbsp;<font
color=3Dblack><span style=3D'color:black'> =
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;|=
 &nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>|&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbs=
p;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp=
;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;=
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&=
nbsp;&nbsp;&nbsp;&nbsp; <font
color=3Dblack><span =
style=3D'color:black'>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nb=
sp;&nbsp;&nbsp;&nbsp;| =
&nbsp;&nbsp;</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span style=3D'font-size:10.0pt'>|<font =
color=3Dblack><span
style=3D'color:black'>---------------------------------------------------=
- ----------------------|</span></font></span></font></pre><pre><font
size=3D2 face=3D"Courier New"><span =
style=3D'font-size:10.0pt'>&nbsp;</span></font></pre>

<p class=3DMsoNormal><font size=3D3 face=3D"Times New Roman"><span =
style=3D'font-size:
12.0pt'>&nbsp;</span></font></p>

<p class=3DMsoNormal><font size=3D3 face=3D"Times New Roman"><span =
style=3D'font-size:
12.0pt'>&nbsp;</span></font></p>

<p class=3DMsoNormal><font size=3D3 face=3D"Times New Roman"><span =
style=3D'font-size:
12.0pt'>&nbsp;</span></font></p>

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------------------------------

Date: Mon, 10 Jan 2005 12:01:39 -0800
From: "Zhiping Yang" <zhiping@cisco.com>
Subject: Re: [IBIS-Users] Re: [IBIS] RE: BIRD95: Power Integrity Analysis Using IBIS

Hi Arpad,

Thanks for your comments.  Please see my replies in your e-mail.  Thanks.

Best regards,

Zhiping
- ----- Original Message -----
From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
To: <ibis@eda.org>; "ibis-users" <ibis-users@eda.org>
Sent: Wednesday, January 05, 2005 4:03 PM
Subject: RE: [IBIS-Users] Re: [IBIS] RE: BIRD95: Power Integrity Analysis
Using IBIS


> Zhiping,
>
> I would like to comment on your paragraph on the gate modulation
> effect.  I think your statement "For the current IBIS, the power
> is assumed to be perfect" is not entirely true.  Think about the
> "Vcc relative" IV curves and the package modeling, for example.
> The origin of each IV curve is associated with a corresponding
> [XYZ Reference] keyword.  Using appropriate package parasitics and
> [Pin Mapping], these reference voltages are allowed to bounce as
> the buffers are switching.  So the power of the buffers do not
> have to be perfect in the IBIS world.

Yes.  I understood that some EDA tools could let IBIS to simulate the SSO,
but my concern is that their results may not be correct.  Besides the "gate
modulation effect" which we talked about, my personal understanding is that
even the SSO noice can be simulated with exisiting IBIS model, but the noise
coupling mechanism from power to signal pin may not be implemented or not
implemented correctly.  In another word, could the power noise impact on the
rising/falling edge in IBIS simulation match to the HSPICE simulation?  I
could be wrong and I am working on some simulations in HSPICE to verify it.


>
> It is a different story that the strength of the buffer is not
> modulated in most IBIS simulators based on the bouncing rail
> voltages.  But this capability would not be very difficult to
> add.  We could get started by just adding two parameters to
> the IBIS specification which would have the same meaning that
> I mentioned before in the HSPICE B-element.

I just read the HSPICE manual on these two parameters (spu_scal and
spd_scal) you mentioned.  I didn't see any detailed explainations on how to
use them.  Do you have any examples to show their impact on the IBIS
performance?  Personally I feel it may improve the IBIS performance, but it
still can not completely solve the "gate modulation effects" in IBIS.

>
> The first thing to decide is whether these should be part of
> BIRD95.  If yes, we can continue on this thread and discuss
> how it should be defined.  If not, we can start another thread
> and BIRD to do it separately.  Any takers to write it up?
>
> Arpad
> =================================================================
>
> -----Original Message-----
> From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On Behalf
Of Zhiping Yang
> Sent: Wednesday, January 05, 2005 3:30 PM
> To: Roy Leventhal; twesterh@cisco.com; ibis@eda.org; 'ibis-users'
> Subject: [IBIS-Users] Re: [IBIS] RE: BIRD95: Power Integrity Analysis
Using IBIS
>
> Hi Roy,
>
> Very well said about the IBIS model.
>
> For current BIRD95, our intention was not to completely solving the power
> integrity problem in one proposal.  As a first step to improve the IBIS
> model capability and accuracy in SSO simulation, we proposed to add IvsT
> information of the I/O power pin into existing IBIS model.  We think this
> IvsT table will provide enough info on Xbar current, Pre-driver current
from
> VDDQ, internal termination current and embedded decoupling current within
> I/O cell which are neglected in current IBIS model.   We really not expect
> IBIS model with added IvsT info could complete replace the SPICE model in
> SSO simulation, but we do think it can greatly reduce the simulation
> accuracy gap between the SPICE model and IBIS model.
>
> About the "gate modulation effect" Arpad and Todd mentioned, I think it is
> more like a problem which can be correctly addressed by EDA tool vendor.
> Certainly in order to correctly solve this problem in IBIS, the IBIS model
> should provide enough information for the EDA tool vendor to use them.
For
> the current IBIS, the power is assumed to be perfect, so there is no
correct
> way to consider this effect in the EDA tool.  With the introduction of
> BIRD95, EDA tool vendors could think how to simulate power noise due to
I/O
> switching (as a first step, the mutual impact between the I/O network and
> power network may not be able to fully considered).  I think it is
> relatively easily to implement the impact of I/O noise to the power
network,
> but it is relatively hard to implement the impact of power noise to the
I/O
> network by using IBIS model.    I may be wrong.   There are a lot of smart
> people in the EDA industry and they may be able to figure out how to
> implement it correctly (or closer to the SPICE model).
>
> Best regards,
>
> Zhiping
>
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------------------------------

Date: Mon, 10 Jan 2005 12:40:11 -0800
From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
Subject: [IBIS-Users] RE: BIRD95: Power Integrity Analysis Using IBIS

Zhiping,

I will just quote your latest response to reduce the
size of this thread.

You raise a good concern.  There is room for a lot of
improvements to get IBIS to reproduce the same PD simulation
results as an equivalent SPICE model.  However, there are a
lot of features in the existing capabilities of IBIS to
improve the accuracy of IBIS models for SSO simulations,
and many of these are still not utilized in many cases.

You mentioned power to signal coupling, and I would add
power to GND coupling.  Not too many people realize that
the primary reason for the additional C_comp parameters
in the 4.0 specification was exactly for this reason
(C_comp_pullup, C_comp_pulldown, C_comp_power_clamp,
C_comp_gnd_clamp).  The single C_comp concept didn't
allow for describing such coupling.  Another detail that
is not realized many times is that if the total C_comp
is split into two parts, one between the I/O pad and
Vcc and the other between the I/O pad and GND, these
two capacitors will automatically introduce a Vcc to
GND coupling too!

In addition, if this was not enough to model the total
decoupling between Vcc and GND, one can always add
more to it using the already existing series keywords,
which can also be connected between power and GND pins.
This solution is not the most elegant, since it uses
a separate [Model] of type Series, but either way, it
can be done.

Regarding the HSPICE manual, if you can get a hold of
manuals of earlier versions (sorry, but I can't remember
exactly which one has it), you may find a little more
on this.  The problem is that the writer of the manual
didn't seem to understand what this does and the equations
are wrong, that is probably why it was taken out...

Anyway, what it does is this:  The actual voltage between
power and GND is compared against the value which is in the
IBIS file either in [Voltage Range], or the difference
between the PU and PD reference keywords.  If the
instantaneous voltage is different from the nominal value,
the IV curve will be scaled according to the pu_scal or
pd_scal values.

If the "scal" value is 1, the IV curve is scaled by the
same proportion the supply voltage changed.  In other
words, a 10% change in the supply voltage will change the
IV curve by 10% also.  If the "scal" value is 0, there
will be no change in the IV curves.  If it was 0.5, then
a 10% change in the supply voltage will result in a 5%
change in the IV curves, etc...  (The value of "scal" is
not restricted to be between 0-1).

I hope that the Synopsys lawyers are not going to chase
after me for publishing this...  It is in their advantage
anyway if people know how to use this feature, right?

We all know that due to the second order nature of MOSFETs
this linear relationship is not exact.  However, this 
scaling is not designed to go all the way down to 0 volts.
In the range of the relatively small modulation this linear
approximation seem to be sufficient.  However, if it turns
out that it is not, we can always improve on it by changing
the equations to be more precise.

Arpad
- ----------------------------------------------------------------------------
- ----------------------------------------------------------------------------
- -----Original Message-----
From: Zhiping Yang [mailto:zhiping@cisco.com] 
Sent: Monday, January 10, 2005 12:02 PM
To: Muranyi, Arpad; ibis@eda.org; ibis-users
Subject: Re: [IBIS-Users] Re: [IBIS] RE: BIRD95: Power Integrity Analysis Using IBIS

...

Yes.  I understood that some EDA tools could let IBIS to simulate the SSO,
but my concern is that their results may not be correct.  Besides the "gate
modulation effect" which we talked about, my personal understanding is that
even the SSO noice can be simulated with exisiting IBIS model, but the noise
coupling mechanism from power to signal pin may not be implemented or not
implemented correctly.  In another word, could the power noise impact on the
rising/falling edge in IBIS simulation match to the HSPICE simulation?  I
could be wrong and I am working on some simulations in HSPICE to verify it.

...

I just read the HSPICE manual on these two parameters (spu_scal and
spd_scal) you mentioned.  I didn't see any detailed explainations on how to
use them.  Do you have any examples to show their impact on the IBIS
performance?  Personally I feel it may improve the IBIS performance, but it
still can not completely solve the "gate modulation effects" in IBIS.
- ----------------------------------------------------------------------------
- ----------------------------------------------------------------------------

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------------------------------

Date: Mon, 10 Jan 2005 16:04:32 -0800
From: Syed Huq <shuq@cisco.com>
Subject: [IBIS-Users] Final call for Presentation and participation - DesignCon2005 IBIS summit

- -----------------------------------------------------------------------
                       IBIS SUMMIT
                     FINAL CALL FOR
               PARTICIPATION & PRESENTATIONS
- -----------------------------------------------------------------------


              I B I S   S U M M I T   M E E T I N G

Time/Date:  Monday January 31st, 2005 8:00 AM to 5 PM

Location:   Santa Clara Convention Center
            Santa Clara, CA

Content:    Presentations and Discussions

Purpose:    Solicit and Exchange IBIS Model Related Information and
            Ideas.

Sponsors:   DesignCon

            If your company would be interested in sponsoring this
            event, please contact Syed Huq <shuq@cisco.com>.
            Benefits to sponsors include formal recognition at the
            meeting and acknowledgement in the Calls for Papers and
            meeting minutes.

            Your financial support strengthens the organization by
            allowing IBIS to focus resources on industry activities
            rather than raising money, and you will receive generous
            thanks for your support.

DesignCon Conference
            January 31- February 3rd, 2005
            Santa Clara Convention Center
            Santa Clara, CA

            Exhibit registration is Free if you register before
            December 15, 2004.  Come and visit IBIS Booth 940.
            
            See http://www.designcon.com/ for more information.
            
            Conference Catalog:
            http://www.eda.org/pub/ibis/summits/jan05/DC05_Catalog.pdf


BACKGROUND

DesignCon is the premier annual Silicon Valley event for the electronic
design automation (EDA) and semiconductor industry.  Topics of current
interest to the EIA IBIS Open Forum are addressed at DesignCon.

This meeting will be conducted as a formal IBIS Summit Meeting.
Presentations are expected to be available and archived in an electronic
format, and minutes of the meeting will be issued. Any pending formal
decisions (votes) will be announced at least two weeks prior to the
meeting.


CALL FOR PARTICIPANTS

People involved in IBIS Model development, EDA tool development, and
digital circuit design are invited to participate in the Summit meeting.
If you plan to participate, please register with the information below:

   Name:
   E-mail address:
   Company:
   Telephone:

Send to:
    Syed Huq <shuq@cisco.com>


CALL FOR PRESENTATIONS

We are seeking presentations from individuals who have experiences
of interest to the IBIS modeling community.  In the past, these have
included demonstrations of modeling techniques, explanations of
behavioral algorithms and descriptions of difficulties encountered
in specific applications.  Of particular interest are topics related
to model correlation, modeling building experiences and comparisons
to other modeling methods.  Presentations may be addressed to any
and all levels of IBIS experience, from beginning to advanced.

Format of Presentation:  LCD Projection with Windows laptop.
Time:          15-30 Minutes
Electronic Archival: We request electronic versions so that the
               presentations can be archived and also made
               available to non-attendees.  Formats used in
               the past have been text, Power Point, Word,
               Postscript, and Acrobat.  Electronic 
               presentations should be made available by
               January 24, 2005 for uploading and copying to
               the presentation laptop. Presentors are responsible
               for bringing 50 copies if not received by January 24.

If you plan a presentation, please supply

   Title:
   Presenter:
   E-mail address:
   Company:
   Telephone:

   Estimated Time:

Send this to:

  Syed Huq <shuq@cisco.com>


AGENDA

The agenda includes presentations, discussions, breaks, and
a luncheon (which will be provided if you are registered with
DesignCon). This will be developed as presentation proposals are
received.


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------------------------------

Date: Tue, 11 Jan 2005 12:22:03 +0800
From: "Andrew_Chien\(???\)" <Andrew_Chien@HTC.COM.TW>
Subject: RE: [IBIS-Users] Re: Basic questions about IBIS

Dear Mr. Ingraham,

      I'm deeply appreciative of your kindly help.
      Really thank you for so many detail informations about IBIS model, chip process, and measurement.
      I also expected some chip vendors could give me some comments, but it seems that they are not interested in these questions.
     
      About 4&6, since our tool can use encrypted SPICE model, I think I should do my best to convince our vendors to provide correlated encrypted SPICE model.

      About 5, it's strange that in IBIS4.1 Vinh, Vinl, Vinh+, Vinh-, Vinl+, Vinl-, Vth, Vth_min and Vth_max are all defined for 'typ' condition.
      But I can modify the model to fit min & max condition.

Thanks and Best regards
Andrew


- -----Original Message-----
From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org]On Behalf Of Andrew Ingraham
Sent: Tuesday, January 11, 2005 12:03 AM
To: ibis@eda.org; ibis-users@eda.org
Subject: [IBIS-Users] Re: Basic questions about IBIS


Andrew,

Gee, I was hoping some others would chime in here by now.  Oh well.

> About 3,
>                A. So, chips are usually not made according to SPICE file;
> On the contrary, SPICE files are extracted from chip and guess.

Essentially yes, but early SPICE files can also be created before a chip is
designed, based on the schematic for the chip, and on the designer's
expectations.  You can make SPICE files from either a schematic design, or
an actual chip layout.

When someone is designing a chip, they can make SPICE files that represent
how they hope the chip will behave, before there is any silicon or even a
layout.  If it is a new IC process too, then you could say the entire SPICE
model including its .MODEL parameters includes some guess, since even the
process has not been proven yet.

After the chip is made, they can also make SPICE files that represent the
final, actual chip layout.  Not everyone goes through both steps.

In any event, a good IC designer *should* always adjust their final SPICE
models (whether they came from schematics or from the layout) according to
how the chip actually behaves.  Usually not the other way around.  It is
easier to make a SPICE model fit actual silicon behavior, than the other way
around.

If the chip doesn't behave the way he wanted it to, he may go back and tweak
the chip design somewhat, but in the end, he ought to adjust the SPICE model
according to how the chip truly behaves.

>                     Thus, SPICE-derived IBIS model and encrypted SPICE
> model are not as accurate as measurement-based IBIS model. (except some
> situation)

SPICE models, whether encrypted or not, could be just as accurate as any
IBIS model.  (Encryption has nothing to do with it.)

On basic principles, a SPICE-derived IBIS model could be less accurate than
a measurement-based IBIS model, because it is one more level removed from
reality.  Each level, or translation from one form to another, incurs
additional errors.

Reality is the chip itself.  A SPICE model that has been correlated to agree
with measurements, is one level away from reality.  An IBIS model from
measurements, is also one level away from reality.  An IBIS model created
from the SPICE model, is two levels away from reality, so there CAN be a
greater chance of it not agreeing with reality.  But it's not a guarantee.

A SPICE model that has never been correlated with measurements, should be
treated with suspicion, and an IBIS model derived from it is almost surely
less accurate than one made from measurements.

But on the other hand, anyone can create a lousy IBIS file from
measurements.

If someone hands you a chip and a SPICE model, and asks you to make an IBIS
model, you may not know who created the SPICE model and whether it is
accurate.  There are many bad SPICE models out there too.  Making a SPICE-
derived IBIS model could just perpetuate a lie that was in the SPICE model,
that the designer never bothered to correct.  Making a measurement-based
IBIS model can at least be traced to the chip's actual electrical behavior.

>                B. So, the extremes of SPICE-derived model are only
> expectations.  ...

I'm not in the IC process business so I don't "know the real scoop" here ...
but as far as process extremes is concerned, I believe that the following
are true:

(1)  IC manufacturers set statistical limits on their IC process, beyond
which there is some statistical confidence that no (defect-free) parts will
be made.  Some SPICE model extremes are based on these statistical
expectations.

IC vendors can also make test chips that are meant to represent the process
extremes, which they do by intentionally varying some key factor(s) in the
chip-making process.  Because they require special changes to the IC
process, they aren't cheap.  In theory they can use these test chips to
verify SPICE model extremes.

(2)  IC manufacturers put test limits into their automatic test equipment,
used to test and screen every part manufactured, and this tends to set the
limits on the extremes of characteristics of the parts they sell.  (Except
for black-market (reject) parts that sometimes find their way onto the
market!)  Because the ATE tests may or may not directly test the parameters
of interest, sometimes they are indirect.

>                C. If everything is optimized, how long will it usually
> take to generate a IBIS3.2 model of one I/O buffer?

Gee, I don't know ... I'm going to guess no more than a day?  (Maybe two;
one to measure, one to massage the data.)  Assuming of course that the
people doing it were really set up beforehand and didn't need to do any more
research or fixturing, and that the package modeling is simple.

> About 4,
>             A. I would like to know whether the influence from fab process
> is smaller than the influence from temperature and voltage or not.

This is probably a moving target, and it's been a while since I looked at
this, but I recall that the fab process was dominant.  Today they may have
tighter controls on process variations, which might have reversed that.

They can also design temperature and voltage compensated buffers that remove
some of those dependencies on (say) buffer speed.

>             B. For most IBIS model, the typical temperature is room
> temperature, however, for some chips (ex: CPU), the temperature is much
> higher than room temperature.
>                  Is it reasonable to ask chip vendors to change the
> typical temperature.

That's a really good thing to discuss with whoever makes your IBIS models.
It's one of the things I don't particularly like about models that include
environmental effects.  No chip runs at room temperature.

> 5. In IBIS, the "max" curves are measured / simulated under the condition
> "maximum buffer strength + lowest temperature + largest voltage"
>          and the "min" curves are measured / simulated under the condition
> "minimum buffer strength + highest temperature + smallest voltage".
>     I think it is not sufficient to simulate the ringback: as I know the
> ringing caused  by maximum buffer strength is much larger the minimum
> buffer strength, but "smallest voltage - VIH" is smaller than "largest
> voltage - VIH", we cannot make sure whether the ringback margin is
> sufficient even if the simulation results of min and max passed. (Because
> the smallest ringback margin should be under the condition "maximum buffer
> strength + lowest temperature + smallest voltage")

I think this question deals more with the particular simulation strategy
(and the simulator) you use.

You could simulate using a "max" model for the driver and a "min" model for
the receiver, if your simulator allows you to do this.  (Unless, of course,
you are talking about a bi-directional transceiver monitoring its own
output.)

Personally, I prefer to decide what input thresholds *I* want to use, so in
SPICE I look for the worst-case input thresholds, plus a small margin, and I
ignore what the IBIS model may say.

I hoped someone else would comment on that question.

> 6. Chip vendors usually set the largest and smallest voltage according to
> their maximum tolerance (for example 20%), however, the voltage error rate
> of our regulator is usually not so large.  So the worst cases in IBIS
> model are not the same with the worst cases in our PCBA.  Furthermore,
> sometimes the typical voltage we use is not the same with the original.  I
> would like to know whether there is a method to generate the IBIS model we
> need.

I don't know.  Except that you could have someone create custom IBIS models
for your particular needs.

You have cited many of the reasons why I prefer to use SPICE models rather
than IBIS models!  In recent years I have been rather disappointed to see so
many IBIS models *replace* SPICE models in terms of their availability.  To
me, nothing beats a good SPICE model.  A good SPICE model does what you want
it to.  An IBIS model doesn't.  But it keeps the lawyers happy.  :-(

Regards,
Andy


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------------------------------

Date: Wed, 12 Jan 2005 01:08:15 +0000
From: "lee yang" <changly_80@hotmail.com>
Subject: RE: [IBIS-Users] IV Curves

Hi all,
Thanks for the answers, i appreciate them very much.
I am sorry to say that i am poor in SI, i couldn't get how the reflection 
for an open circuit transmission with coefficient=1 cause the voltage at 
driver site become -vcc (the reflection is the multiplication of voltage 
(vcc) and coefficient (+1) which end up with +vcc)? I am sorry but could 
someone shed some light to get rid of my confusion?
Much appreciated.

- -Lee

>From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
>To: <ibis-users@eda.org>
>Subject: RE: [IBIS-Users] IV Curves
>Date: Mon, 10 Jan 2005 08:58:27 -0800
>
>Just a couple of refinements to the answers I have seen
>so far.
>
>1)  Actually none of the IV curves are GND relative any more,
>this is just a terminology that is left over from the first
>version of the IBIS specification.
>
>Note that all four IV curves now have an associated [*** Reference]
>keyword, which defines the voltage for the origin of the IV curve.
>Therefore a pulldown IV curve for an RS232 driver could be referenced
>to -12 V, for example, which is not GND relative by any means...
>It is true, in most cases we reference the pulldown and GND clamp IV
>curves to 0 V, so it is easy to forget about this capability.
>
>2) Lynne said it right, but I would like to add, that even if you
>have a perfect open at the end of the T-line, the 2Vcc or -Vcc
>doubling will only happen if your driver is superconductive,
>i.e. very low impedance.  This is because the T-line voltage
>doubling doubles the incident step, which is determined by the
>voltage division based on the T-line impedance, and the driver
>impedance.  So the 2Vcc and -Vcc voltages are kind of an absolute
>maximum condition which will most likely never happen.
>
>Arpad Muranyi
>Intel Coproation
>====================================================================
>
>
>-----Original Message-----
>From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On Behalf 
>Of lgreen
>Sent: Monday, January 10, 2005 8:43 AM
>To: 'lee yang'; ibis-users@eda.org
>Subject: RE: [IBIS-Users] IV Curves
>
>Hello, Lee,
>Please see answers inserted.
>- Lynne
>
>-----Original Message-----
>From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On Behalf
>Of lee yang
>Sent: Sunday, January 09, 2005 5:58 PM
>To: ibis-users@eda.org
>Subject: [IBIS-Users] IV Curves
>
>Hi IBIS experts:
>
>I have a few questions regarding IBIS data:
>1) What is the reason of ground clamp and pulldown data is ground relative
>while power clamp and pullup data is vcc relative?
>-- This was an arbitrary decision made in the IBIS 1.0 specification.
>Note that GND-and Pulldown tables currents shift relative to ground
>(and currents usually go through 0A at GND), while Power- and Pullup tables
>shift when Vcc changes (and currents usually go through 0A at Vcc).
>
>2) The IV curves data is covered from -vcc to 2vcc, in what condition the
>voltage would become -vcc? (eg1: output is driving vcc and the receiver end
>is being shorted, the reflection coefficient is -1, then the maximum
>negative voltage is 0V (vcc + (-1*vcc)=0); eg2: output is driving 0v and 
>the
>
>reciever end is being shorted, the reflection coefficient is -1 as well,
>would it be any reflection if the output is driving 0V with reciever end
>being shorted to ground?)
>-- A load with a small capacitance has a reflection coefficient close to 
>+1.
>For an open circuit termination, the reflection coefficient is +1.
>A rising waveform into an "open circuit" load can cause 2*Vcc at the 
>driver,
>and a falling reflection (starting at Vcc) can cause -Vcc at the driver.
>
>
>Hope you all could shed some light here.
>Thanks.
>
>Yours Faithfully,
>LY
>
>_________________________________________________________________
>Find answers fast with MSN Search BETA. http://beta.search.msn.com.my/ New
>look and improved results. Give it a try!
>
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------------------------------

Date: Wed, 12 Jan 2005 08:52:17 -0700
From: rrwolff@micron.com
Subject: RE: [IBIS-Users] IV Curves

Lee,

The reflection coefficient is a measure of mismatch between the
impedance of the transmission line and the impedance of the load.  It
indicates how much energy reflects off the load back down the
transmission line and with what phase shift. The reflection coefficient
can vary from -1 to +1 and indicates a phase shift from 0 to 180
degrees.

The equation for reflection coefficient (RC) is:
RC=(Zl-Zo)/(Zl+Zo), where Zl is the impedance of the load and Zo is the
impedance of the transmission line.  Let's look at three cases where Zo
is 50 ohms in each case.

Case 1: The load is an open circuit, so Zl=infinity
RC=(infinity-50)/(infinity+50) = 1
The reflected voltage (Vr) would be forward voltage (Vf)*RC = Vcc*1 =
Vcc
The load voltage (Vload) is Vf+Vr = Vcc+Vcc = 2*Vcc

Case 2: The load is perfectly matched, so Zl=50
RC=(50-50)/(50+50) = 0
Vr = Vf*RC = Vcc*0 = 0
Vload = Vf+Vr = Vcc+0 = Vcc

Case 3: The load is a short (very, very low impedance), so Zl=0
RC=(0-50)/(0+50) = -1
Vr = Vf*RC = Vcc*-1 = -Vcc
Vload = Vf+Vr = Vcc+(-Vcc) = 0

You can see that in case 3, -Vcc is reflected towards the driver.  I
hope this helps.

Randy Wolff
Micron Technology

- -----Original Message-----
From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On
Behalf Of lee yang
Sent: Tuesday, January 11, 2005 6:08 PM
To: arpad.muranyi@intel.com; ibis-users@eda.org
Subject: RE: [IBIS-Users] IV Curves

Hi all,
Thanks for the answers, i appreciate them very much.
I am sorry to say that i am poor in SI, i couldn't get how the
reflection 
for an open circuit transmission with coefficient=1 cause the voltage at

driver site become -vcc (the reflection is the multiplication of voltage

(vcc) and coefficient (+1) which end up with +vcc)? I am sorry but could

someone shed some light to get rid of my confusion?
Much appreciated.

- -Lee

>From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
>To: <ibis-users@eda.org>
>Subject: RE: [IBIS-Users] IV Curves
>Date: Mon, 10 Jan 2005 08:58:27 -0800
>
>Just a couple of refinements to the answers I have seen
>so far.
>
>1)  Actually none of the IV curves are GND relative any more,
>this is just a terminology that is left over from the first
>version of the IBIS specification.
>
>Note that all four IV curves now have an associated [*** Reference]
>keyword, which defines the voltage for the origin of the IV curve.
>Therefore a pulldown IV curve for an RS232 driver could be referenced
>to -12 V, for example, which is not GND relative by any means...
>It is true, in most cases we reference the pulldown and GND clamp IV
>curves to 0 V, so it is easy to forget about this capability.
>
>2) Lynne said it right, but I would like to add, that even if you
>have a perfect open at the end of the T-line, the 2Vcc or -Vcc
>doubling will only happen if your driver is superconductive,
>i.e. very low impedance.  This is because the T-line voltage
>doubling doubles the incident step, which is determined by the
>voltage division based on the T-line impedance, and the driver
>impedance.  So the 2Vcc and -Vcc voltages are kind of an absolute
>maximum condition which will most likely never happen.
>
>Arpad Muranyi
>Intel Coproation
>====================================================================
>
>
>-----Original Message-----
>From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On
Behalf 
>Of lgreen
>Sent: Monday, January 10, 2005 8:43 AM
>To: 'lee yang'; ibis-users@eda.org
>Subject: RE: [IBIS-Users] IV Curves
>
>Hello, Lee,
>Please see answers inserted.
>- Lynne
>
>-----Original Message-----
>From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On
Behalf
>Of lee yang
>Sent: Sunday, January 09, 2005 5:58 PM
>To: ibis-users@eda.org
>Subject: [IBIS-Users] IV Curves
>
>Hi IBIS experts:
>
>I have a few questions regarding IBIS data:
>1) What is the reason of ground clamp and pulldown data is ground
relative
>while power clamp and pullup data is vcc relative?
>-- This was an arbitrary decision made in the IBIS 1.0 specification.
>Note that GND-and Pulldown tables currents shift relative to ground
>(and currents usually go through 0A at GND), while Power- and Pullup
tables
>shift when Vcc changes (and currents usually go through 0A at Vcc).
>
>2) The IV curves data is covered from -vcc to 2vcc, in what condition
the
>voltage would become -vcc? (eg1: output is driving vcc and the receiver
end
>is being shorted, the reflection coefficient is -1, then the maximum
>negative voltage is 0V (vcc + (-1*vcc)=0); eg2: output is driving 0v
and 
>the
>
>reciever end is being shorted, the reflection coefficient is -1 as
well,
>would it be any reflection if the output is driving 0V with reciever
end
>being shorted to ground?)
>-- A load with a small capacitance has a reflection coefficient close
to 
>+1.
>For an open circuit termination, the reflection coefficient is +1.
>A rising waveform into an "open circuit" load can cause 2*Vcc at the 
>driver,
>and a falling reflection (starting at Vcc) can cause -Vcc at the
driver.
>
>
>Hope you all could shed some light here.
>Thanks.
>
>Yours Faithfully,
>LY
>
>_________________________________________________________________
>Find answers fast with MSN Search BETA. http://beta.search.msn.com.my/
New
>look and improved results. Give it a try!
>
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------------------------------

Date: Thu, 13 Jan 2005 00:01:37 +0000
From: "lee yang" <changly_80@hotmail.com>
Subject: RE: [IBIS-Users] IV Curves

Hi Randy Wolff,
Thanks a lot for your detail and useful explaination, i appreciate it very 
much. Now, i have a much better idea about the reflection.
I have a further question:
In case 3 below, although the reflected voltage is -vcc, the total voltage 
in driver site is 0V. Do you have any example that shows the voltage at 
driver site is at -vcc? (which is cover by IBIS voltage range.)
Many thanks.

Appreciated,
Lee

>From: rrwolff@micron.com
>To: <changly_80@hotmail.com>
>CC: <ibis-users@eda.org>
>Subject: RE: [IBIS-Users] IV Curves
>Date: Wed, 12 Jan 2005 08:52:17 -0700
>
>Lee,
>
>The reflection coefficient is a measure of mismatch between the
>impedance of the transmission line and the impedance of the load.  It
>indicates how much energy reflects off the load back down the
>transmission line and with what phase shift. The reflection coefficient
>can vary from -1 to +1 and indicates a phase shift from 0 to 180
>degrees.
>
>The equation for reflection coefficient (RC) is:
>RC=(Zl-Zo)/(Zl+Zo), where Zl is the impedance of the load and Zo is the
>impedance of the transmission line.  Let's look at three cases where Zo
>is 50 ohms in each case.
>
>Case 1: The load is an open circuit, so Zl=infinity
>RC=(infinity-50)/(infinity+50) = 1
>The reflected voltage (Vr) would be forward voltage (Vf)*RC = Vcc*1 =
>Vcc
>The load voltage (Vload) is Vf+Vr = Vcc+Vcc = 2*Vcc
>
>Case 2: The load is perfectly matched, so Zl=50
>RC=(50-50)/(50+50) = 0
>Vr = Vf*RC = Vcc*0 = 0
>Vload = Vf+Vr = Vcc+0 = Vcc
>
>Case 3: The load is a short (very, very low impedance), so Zl=0
>RC=(0-50)/(0+50) = -1
>Vr = Vf*RC = Vcc*-1 = -Vcc
>Vload = Vf+Vr = Vcc+(-Vcc) = 0
>
>You can see that in case 3, -Vcc is reflected towards the driver.  I
>hope this helps.
>
>Randy Wolff
>Micron Technology
>
>-----Original Message-----
>From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On
>Behalf Of lee yang
>Sent: Tuesday, January 11, 2005 6:08 PM
>To: arpad.muranyi@intel.com; ibis-users@eda.org
>Subject: RE: [IBIS-Users] IV Curves
>
>Hi all,
>Thanks for the answers, i appreciate them very much.
>I am sorry to say that i am poor in SI, i couldn't get how the
>reflection
>for an open circuit transmission with coefficient=1 cause the voltage at
>
>driver site become -vcc (the reflection is the multiplication of voltage
>
>(vcc) and coefficient (+1) which end up with +vcc)? I am sorry but could
>
>someone shed some light to get rid of my confusion?
>Much appreciated.
>
>-Lee
>
> >From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
> >To: <ibis-users@eda.org>
> >Subject: RE: [IBIS-Users] IV Curves
> >Date: Mon, 10 Jan 2005 08:58:27 -0800
> >
> >Just a couple of refinements to the answers I have seen
> >so far.
> >
> >1)  Actually none of the IV curves are GND relative any more,
> >this is just a terminology that is left over from the first
> >version of the IBIS specification.
> >
> >Note that all four IV curves now have an associated [*** Reference]
> >keyword, which defines the voltage for the origin of the IV curve.
> >Therefore a pulldown IV curve for an RS232 driver could be referenced
> >to -12 V, for example, which is not GND relative by any means...
> >It is true, in most cases we reference the pulldown and GND clamp IV
> >curves to 0 V, so it is easy to forget about this capability.
> >
> >2) Lynne said it right, but I would like to add, that even if you
> >have a perfect open at the end of the T-line, the 2Vcc or -Vcc
> >doubling will only happen if your driver is superconductive,
> >i.e. very low impedance.  This is because the T-line voltage
> >doubling doubles the incident step, which is determined by the
> >voltage division based on the T-line impedance, and the driver
> >impedance.  So the 2Vcc and -Vcc voltages are kind of an absolute
> >maximum condition which will most likely never happen.
> >
> >Arpad Muranyi
> >Intel Coproation
> >====================================================================
> >
> >
> >-----Original Message-----
> >From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On
>Behalf
> >Of lgreen
> >Sent: Monday, January 10, 2005 8:43 AM
> >To: 'lee yang'; ibis-users@eda.org
> >Subject: RE: [IBIS-Users] IV Curves
> >
> >Hello, Lee,
> >Please see answers inserted.
> >- Lynne
> >
> >-----Original Message-----
> >From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On
>Behalf
> >Of lee yang
> >Sent: Sunday, January 09, 2005 5:58 PM
> >To: ibis-users@eda.org
> >Subject: [IBIS-Users] IV Curves
> >
> >Hi IBIS experts:
> >
> >I have a few questions regarding IBIS data:
> >1) What is the reason of ground clamp and pulldown data is ground
>relative
> >while power clamp and pullup data is vcc relative?
> >-- This was an arbitrary decision made in the IBIS 1.0 specification.
> >Note that GND-and Pulldown tables currents shift relative to ground
> >(and currents usually go through 0A at GND), while Power- and Pullup
>tables
> >shift when Vcc changes (and currents usually go through 0A at Vcc).
> >
> >2) The IV curves data is covered from -vcc to 2vcc, in what condition
>the
> >voltage would become -vcc? (eg1: output is driving vcc and the receiver
>end
> >is being shorted, the reflection coefficient is -1, then the maximum
> >negative voltage is 0V (vcc + (-1*vcc)=0); eg2: output is driving 0v
>and
> >the
> >
> >reciever end is being shorted, the reflection coefficient is -1 as
>well,
> >would it be any reflection if the output is driving 0V with reciever
>end
> >being shorted to ground?)
> >-- A load with a small capacitance has a reflection coefficient close
>to
> >+1.
> >For an open circuit termination, the reflection coefficient is +1.
> >A rising waveform into an "open circuit" load can cause 2*Vcc at the
> >driver,
> >and a falling reflection (starting at Vcc) can cause -Vcc at the
>driver.
> >
> >
> >Hope you all could shed some light here.
> >Thanks.
> >
> >Yours Faithfully,
> >LY
> >
> >_________________________________________________________________
> >Find answers fast with MSN Search BETA. http://beta.search.msn.com.my/
>New
> >look and improved results. Give it a try!
> >
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------------------------------

Date: Wed, 12 Jan 2005 21:30:05 -0800
From: "lgreen" <lgreen22@mindspring.com>
Subject: RE: [IBIS-Users] IV Curves

Lee-

Consider Randy's case 1, except switching from Vcc to 0V:
The reflected voltage (Vr) would be forward voltage (Vf)*RC = -Vcc*1 = -Vcc
The load voltage (Vload) is Vf+Vr = -Vcc+(0) = -Vcc

You might consider checking out some of the excellent transmission line
textbooks.  The books by Dr. Johnson and by Eric Bogatin are also good.

- - Lynne

- -----Original Message-----
From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On Behalf
Of lee yang
Sent: Wednesday, January 12, 2005 4:02 PM
To: rrwolff@micron.com
Cc: ibis-users@eda.org
Subject: RE: [IBIS-Users] IV Curves

Hi Randy Wolff,
Thanks a lot for your detail and useful explaination, i appreciate it very 
much. Now, i have a much better idea about the reflection.
I have a further question:
In case 3 below, although the reflected voltage is -vcc, the total voltage 
in driver site is 0V. Do you have any example that shows the voltage at 
driver site is at -vcc? (which is cover by IBIS voltage range.)
Many thanks.

Appreciated,
Lee

>


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------------------------------

Date: Fri, 14 Jan 2005 16:12:31 +0530
From: "Vivek Kumar Sundriyal" <Vivek.Kumar.Sundriyal@nsc.com>
Subject: [IBIS-Users] Problem with POWER_CLAMP data

Hi ,

      I am using s2ibis2 to generate the IBIS Models.

      I come across the following problem with the POWER_CLAMP curves.

      In the POWERCLAMP curves, for extreme voltage conditions, I get a very
high current of about 49A( which is wrong). Now if i closely observe the
pct1.spi, i find that the sweep has been set  in the following manner :

      .DC VOUTS2I 3.3  5.1  0.1

      But in the IBIS file, the POWER CLAMP data has been generated from -1.8V
to 0.0V. And the current at -1.8V is 49A.

      What can be the problem ? Is it the behaviour of the buffer or is it a bug
with s2ibis2 ? How can i get out from this problem ?

      The SPICE engine that i use is HSPICE.

Thanks ,

Vivek




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------------------------------

Date: Fri, 14 Jan 2005 17:42:25 +0530
From: "Vivek Kumar Sundriyal" <Vivek.Kumar.Sundriyal@nsc.com>
Subject: [IBIS-Users] Query on Pullup/Pulldown

Hi ,

      Working on s2ibis2, i find put1.spi and dut1.spi for the generation of the
pullup data.

      Can anyone explain why do we need two sets of files for the pull up data ?

      How does s2ibis2 extrapolate/interpolate these values into the final .ibs
file ?

Thanks,

Vivek








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------------------------------

Date: Fri, 14 Jan 2005 10:30:43 -0500
From: "Andrew Ingraham" <a.ingraham@ieee.org>
Subject: Re: [IBIS-Users] Problem with POWER_CLAMP data

Vivek,

There is no problem, except maybe that your SPICE models are unrealistic
when stressed this far.  The real device probably can't sink 49 amps, but
your SPICE model says that it does.  This is not an uncommon problem with
SPICE models, many of which forget to include diode series resistance.  Thus
you get extremely steep curves with huge currents in forward conduction, in
the SPICE model.

There is nothing wrong with the fact that the POWER CLAMP goes from 0V
to -1.8V.  Remember, the POWER CLAMP table is VDD-relative, and if VDD is
3.3V, then 3.3V at the device pin corresponds to 0V in the IBIS table, and
5.1V at the device pin corresponds to -1.8V in the IBIS table.

Is the 49A value a problem if left alone?  Maybe, or maybe not.  If the
SPICE model was OK, then so is the IBIS model; that is, the IBIS model is no
worse than the SPICE model.  It is at the extreme far end of the clamp
curve, well away from normal operation, and it is unlikely that the
simulator will converge on a voltage near that point.  That large a current
value helps push the simulator back into the more normal operating region
where the currents are less.  This will happen with both the SPICE model and
the IBIS model.

If you don't like the 49A, you should fix the SPICE model.

Regards,
Andy


>       In the POWERCLAMP curves, for extreme voltage conditions, I get a
very
> high current of about 49A( which is wrong). Now if i closely observe the
> pct1.spi, i find that the sweep has been set  in the following manner :
>
>       .DC VOUTS2I 3.3  5.1  0.1
>
>       But in the IBIS file, the POWER CLAMP data has been generated
from -1.8V
> to 0.0V. And the current at -1.8V is 49A.
>
>       What can be the problem ? Is it the behaviour of the buffer or is it
a bug
> with s2ibis2 ? How can i get out from this problem ?


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------------------------------

Date: Fri, 14 Jan 2005 11:49:13 -0500
From: "Ambrish Varma" <akvarma@ncsu.edu>
Subject: RE: [IBIS-Users] Query on Pullup/Pulldown

Hello Vivek,
put1.spi is the setup file for the entire driver whereas dut1.spi is the
file with the driver disabled (to get the clamp current).

The pullup current you see in the model is the difference of the 2 currents
to give the performance of only the driver.

We then take only a few points from the linear part of the curve and a
majority of points from the 'interesting' part of the curve.

That's a 100 feet view of how things are done in s2ibis2.

Hope that helps,
Ambrish.


Ambrish K Varma
akvarma@ncsu.edu
North Carolina State University
ph(919)513-2015, fax(919)515-2285

- -----Original Message-----
From: owner-ibis-users@eda.org [mailto:owner-ibis-users@eda.org] On Behalf
Of Vivek Kumar Sundriyal
Sent: Friday, January 14, 2005 7:12 AM
To: ibis-users@eda.org; owner-ibis-users@eda.org
Subject: [IBIS-Users] Query on Pullup/Pulldown

Hi ,

      Working on s2ibis2, i find put1.spi and dut1.spi for the generation of
the
pullup data.

      Can anyone explain why do we need two sets of files for the pull up
data ?

      How does s2ibis2 extrapolate/interpolate these values into the final
.ibs
file ?

Thanks,

Vivek








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------------------------------

Date: Fri, 14 Jan 2005 09:07:04 -0800
From: Syed Huq <shuq@cisco.com>
Subject: Re: [IBIS-Users] Query on Pullup/Pulldown

put1 - Pull-up Typical
dut1 - Disabled Pull-up Typical

Most likely this is a 3-state Model_type so it needs to capture the V/I
tables while the output stages are "ON" and while they are
"Tri-state'ed" etc..

If your Model_type is "Output" only, you will not see the duxx files.

Syed
- -- 
IBIS Vice-Chair & Webmaster
Cisco Systems, Inc

On Fri, 2005-01-14 at 04:12, Vivek Kumar Sundriyal wrote:
> Hi ,
> 
>       Working on s2ibis2, i find put1.spi and dut1.spi for the generation of the
> pullup data.
> 
>       Can anyone explain why do we need two sets of files for the pull up data ?
> 
>       How does s2ibis2 extrapolate/interpolate these values into the final .ibs
> file ?
> 
> Thanks,
> 
> Vivek
> 
> 
> 
> 
> 
> 
> 
> 
> |------------------------------------------------------------------
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------------------------------

Date: Fri, 14 Jan 2005 15:40:33 -0800
From: "Mirmak, Michael" <michael.mirmak@intel.com>
Subject: [IBIS-Users] IIRD8.3: Distinct Model_pinmap and Model_nodemap Names

This is a multi-part message in MIME format.

- ------_=_NextPart_001_01C4FA92.711E10A0
Content-Type: text/plain;
	charset="us-ascii"
Content-Transfer-Encoding: quoted-printable


The enclosed revised IIRD, Distinct Model_pinmap and Model_nodemap
Names, is posted on behalf of Bob Ross of Teraspeed Consulting Group.
The document makes minor changes to an IIRD already scheduled for an
approval vote at the January 28, 2005 IBIS Open Forum teleconference.

- - Michael Mirmak
  Intel Corp.
  Chair, EIA IBIS Open Forum


- ------_=_NextPart_001_01C4FA92.711E10A0
Content-Type: text/plain;
	name="IIRD8.3.txt"
Content-Transfer-Encoding: base64
Content-Description: IIRD8.3.txt
Content-Disposition: attachment;
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End of ibis-users V1 #50
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