You=20 say that you do not get a warning for this ? I suppose you are talking of t= he=20 ibis parser not giving a warning if you specify [Test Load]
without [Test Data] ?

If it does not it probably= =20 should, but most from the point that it do= es not=20 make much sense to specify [Test Load] without [Test Data] I would not=20 expect

it to give problems if nobody is = trying to=20 validate the model using the golden waveform, Actually I have never seen a = model=20 including a Golden Waveform so far.

Which is a pity since it would he= lp the=20 user in his model validation a lot.

/Anders

From: owner-ibis-users@server.eda.org= =20 [mailto:owner-ibis-users@server.eda.org] On Behalf Of Muranyi,=20 Arpad
Sent: den 3 oktober 2007 17:34
To: Server=20 EDA
Subject: RE: [IBIS-Users] [Submodel] and [Add Submodel]=20 keywords

Timmy,

1) The submodel keywords were not "invente= d" for=20 the purpose

of reducing file size. Their purpose was t= o model=20 specific

behaviors of specific circuit types. The d= ynamic=20 clamp, for

example, is a special circuit in the buffer whic= h moves=20 the

origin of the I-V curve in to clamp stronger whe= n there=20 is a

transition in the waveform to "catch" overshooti= ng and=20 clamp

them better. The bus hold is a similar spe= cial=20 circuitry to

implement some sort of a dynamic termination whi= le=20 reducing

DC current consumption during long series of one= s or=20 zeroes

on the line.

While there may be other legitimate uses, be car= eful=20 about

all of the details to "get it right". Also= beware=20 that not

all EDA vendors may support all variants of thes= e=20 keywords...

2) I am not sure how to answer this questi= on at=20 this point,

and I don't have the time to research it, so I w= ill let=20 someone

else answer it...

Arpad

=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D

From: owner-ibis-users@server.eda.org= =20 [mailto:owner-ibis-users@server.eda.org] On Behalf Of Ibis=20 Model
Sent: Wednesday, October 03, 2007 2:19 AM
To: Ser= ver=20 EDA
Subject: [IBIS-Users] [Submodel] and [Add Submodel]=20 keywords

Hi forum posters,

I tried to find the previous threads on [Submodel] and [Add Submodel]= =20 keywords to no avail, so here I'm posting yet another question.=20 I understand that I have been posting questions a lot lately, so bear = with=20 me if anyone is getting bored with me spamming the forum. I have another tw= o=20 questions:

1. I find the [Submodel] and [Add Submodel] keywords very useful in=20 shrinking the IBIS models file size. Assuming an IBIS models file containin= g 100=20 models and all sharing the same [Ground Clamp] and [Power Clamp] data. In t= his=20 case, I can reduce the file size by using the keyword [Add Submodel] to ref= er to=20 a [Submodel] that contains these [GND Clamp] and [POWER Clamp] data, thus= =20 avoiding to repeat the [GND Clamp] and [Power Clamp] data for each model fo= r 100=20 times.

While I manage to reduce the file size of the IBIS models by ~20%, is = this=20 technically the correct usage of the keywords? What does it exactly mean by= a=20 "Dynamic_clamp Submodel"?

2. I understand from the IBIS spec that the keywo= rd [Test=20 Load] was used to derive the golden waveform. Will there be a problem= =20 if define the [Test Load] keyword with the respective electrical= =20 parameters such as Rs_near, Vterm, Rp1_near on my dri= ver=20 without defining the [Test Data] keyword as well as not having a golden wav= eform=20 for that IBIS model.

This doesn’t prompt me any warning when = I perform the=20 syntax check but I’m worried that this could be technically wrong as = well.=20 Please advice.

Regards,

Timmy

Be a better Heartthrob. Get=20 better relationship answers from someone who knows.
Yahoo! Answers -= =20 Check it out.
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This message has been scanned for viruses and
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believed to be clean. - ------_=_NextPart_001_01C805D5.C176F712-- - -------------------------------------------------------------------- |For help or to subscribe/unsubscribe, e-mail majordomo@eda-stds.org |with the appropriate command message(s) in the body: | | help | subscribe ibis | subscribe ibis-users | unsubscribe ibis | unsubscribe ibis-users | |or e-mail a request to ibis-request@eda-stds.org. | |IBIS reflector archives exist under: | | http://www.eda-stds.org/pub/ibis/email_archive/ Recent | http://www.eda-stds.org/pub/ibis/users_archive/ Recent | http://www.eda-stds.org/pub/ibis/email/ E-mail since 1993 ------------------------------ Date: Wed, 10 Oct 2007 22:30:05 -0700 From: "Jin Zhao" Subject: [IBIS-Users] Reminder: CIE-SF 2007 Annual Short Course, EPMC-04, Latest Development in High Performance Lead-Frame Packaging and Applications, this coming Saturday afternoon at SJSU Engineering Building Room 339 Hi All, This is a reminder that CIE-SF 2007 Annual Short Course, EPMC-04, Latest Development in High Performance Lead-Frame Packaging and Applications, will be held on this coming Saturday (10/13) afternoon 1:30 pm at San Jose State University, Engineering Building, room 339. Lead frame packaging technology Putting extraordinary technology in ever smaller packages, this simple and typically low cost packaging is still the best solution for many consumer applications. The Quad flat no-lead (QFN) package is a surface mount plastic package with lead pads located on the bottom surface of the package. With the QFN (Quad Flat No-lead) packaging technology entering into mass production several years ago, the packaging industry experienced a significant paradigm shift in the low-pin-count to medium-pin-count IC packaging arena. The same success story of performance enhancement and cost reduction through miniaturization repeated itself for another time. Not only did QFN packages revolutionized lead frame-based packaging technology, but also it entered into IC packaging areas that are traditionally considered less competitive for lead frame packaging against laminate packaging. Since then, small form factor and high density lead frame packaging became a very active research and development area. Several new approaches and technologies were developed to improve over QFN packages in terms of size, density and cost. This talk attempts to provide an overview of the current high-density lead frame packaging technologies and directions the industry that is moving to. This EPMC04 short course will be presented by Dr. Weiping (Bill) Li, who is currently GM of North America Operations, Jiangsu Changjiang Electronics Technology (JCET), a leading packaging company in China. Prior to his current work, he was a Senior Product Manager with Amkor Technology, Principal Staff Engineer with Motorola Semiconductor Product Sector and Product Engineer with Delphi Delco Electronics Systems. He has been working in the areas of System-in-Package (SiP), flip-chip BGA packaging, embedded passives and HDI. Dr. Li is a US patent holder with multiple corporate invention disclosures. He has published dozens of technical papers in the areas of high-density interconnection, flip chip, embedded passives and packaging materials, process and reliability. Dr. Li obtained his Ph.D degree from Georgia Institute of Technology in Materials Science and Engineering and MS and BS degrees from Shanghai Jiao Tong University in Materials Science. The CIE-SF 2007 Annual Short Course is co-sponsored by CIE-SF EPMC and San Jose State University. This is the last short course, the previous 3 short courses are Introduction to Electronic Packaging, presented by Mr. Andy Tseng; Electrical and Thermal issues in Electronic Packaging, presented by Dr. An-Yu Kuo; and System in Package (SIP) Design Flow and Applications, presented by Mr. Shawn Nikoukary. It is free to San Jose State University students/faculties, and Santa Clara University students; for CIE members, it will be $20; for non-CIE members, it will be $25. Pre-registration is highly recommended. Please email to cie_shortcourse2007@yahoo.com with your name and email address. Thanks. Location: San Jose State University, Engineering Building (located on San Fernando St. between 7th and 8th street) Map: http://www.sjsu.edu/about_sjsu/docs/SJSU_campus_map.pdf Free parking is available during weekends at Fourth St. Garage, 44 South Fourth St., at San Fernando St. across from Dr. Martin Luther King, Jr. Library 2007 CIE-SF Short Course Organizing Committee - -- This message has been scanned for viruses and dangerous content by MailScanner, and is believed to be clean. - -------------------------------------------------------------------- |For help or to subscribe/unsubscribe, e-mail majordomo@eda-stds.org |with the appropriate command message(s) in the body: | | help | subscribe ibis | subscribe ibis-users | unsubscribe ibis | unsubscribe ibis-users | |or e-mail a request to ibis-request@eda-stds.org. | |IBIS reflector archives exist under: | | http://www.eda-stds.org/pub/ibis/email_archive/ Recent | http://www.eda-stds.org/pub/ibis/users_archive/ Recent | http://www.eda-stds.org/pub/ibis/email/ E-mail since 1993 ------------------------------ Date: Thu, 11 Oct 2007 00:01:02 -0700 (PDT) From: Ibis Model Subject: [IBIS-Users] Calling a .pkg file to my IBIS file in the Simulator tool. - --0-1179939463-1192086062=:69884 Content-Type: text/plain; charset=iso-8859-1 Content-Transfer-Encoding: 8bit Hi I am facing some of the problem regarding the package file. I have downloaded an IBIS file together with the package model file (in .pkg format). I have a problem in adding my desired .pkg file into my current IBIS file when I perform my simulation. Below is the situation: I have an IBIS file with below [Component] section. Now I would like to add in a package file with the extension .pkg (which I also place in the same folder with the IBIS file) [Component] abc [Manufacturer] studio.Inc. [Package] |variable typ min max R_pkg 161.54m 5.44m 459.46m L_pkg 2.40nH 0.43nH 5.35nH C_pkg 1.48pF 0.75pF 2.84pF | [Pin] signal_name model_name R_pin L_pin C_pin 1 HSTL HSTL 2 SSTL SSTL However, I read somewhere in the IBIS Spec and I had tried calling the .pkg file by placing in the same folder as my IBIS file but to no avail. I have some errors as such: 1. I added in the [Package Model] keyword and define the package model name as QS-SMT-cer-8-pin-pkgs 2. Then I copied the .pkg file content and paste it under the [Component] section - [Define Package Model]. But I have errors doing this as the pin numbers in the .pkg files are different from the pin number in my original IBIS file ([Pin] name goes 1, 2, 3 ... ) I follow the guideline of defining the package model but I could not find a way of calling the .pkg file from my original IBIS file when I perform my simulation. How do I used an IBIS file and include the package model which is in another separate .pkg file when I perform my simulation? Which is the best way to avoid having errors in the IBIS file so that I can load my IC modeling in the simulator tools (with errors in the IBIS file, im not able to proceed) Will the original Lumped RLC value interfere the result after I added in the .pkg package model? Appreciate if someone can answer my question above with the correct step of calling a separate .pkg package file with my IBIS file in the simulator tool. Thanks. Timmy - --------------------------------- Fussy? Opinionated? Impossible to please? Perfect. Join Yahoo!'s user panel and lay it on us. - -- This message has been scanned for viruses and dangerous content by MailScanner, and is believed to be clean. - --0-1179939463-1192086062=:69884 Content-Type: text/html; charset=iso-8859-1 Content-Transfer-Encoding: 8bit

I am facing some of the problem regarding the package file. I have downloaded an IBIS file together with the package model file (in .pkg format). I have a problem in adding my desired .pkg file into my current IBIS file when I perform my simulation. Below is the situation:

I have an IBIS file with below [Component] section. Now I would like to add in a package file with the extension .pkg (which I also place in the same folder with the IBIS file)

[Component] abc

[Manufacturer]   studio.Inc.
[Package]
|variable        typ               min                  max
R_pkg          161.54m             5.44m              459.46m

L_pkg            2.40nH            0.43nH               5.35nH
C_pkg            1.48pF            0.75pF               2.84pF
|
[Pin]     signal_name          model_name           R_pin     L_pin     C_pin
1          HSTL                       HSTL

2 SSTL SSTL

However, I read somewhere in the IBIS Spec and I had tried calling the .pkg file by placing in the same folder as my IBIS file but to no avail. I have some errors as such:

1. I added in the [Package Model] keyword and define the package model name as QS-SMT-cer-8-pin-pkgs

2. Then I copied the .pkg file content and paste it under the [Component] section - [Define Package Model]. But I have errors doing this as the pin numbers in the .pkg files are different from the pin number in my original IBIS file ([Pin] name goes 1, 2, 3 ... ) I follow the guideline of defining the package model but I could not find a way of calling the .pkg file from my original IBIS file when I perform my simulation.

How do I used an IBIS file and include the package model which is in another separate .pkg file when I perform my simulation? Which is the best way to avoid having errors in the IBIS file so that I can load my IC modeling in the simulator tools (with errors in the IBIS file, im not able to proceed)

Will the original Lumped RLC value interfere the result after I added in the .pkg package model?

Appreciate if someone can answer my question above with the correct step of calling a separate .pkg package file with my IBIS file in the simulator tool. Thanks.

Timmy

Fussy? Opinionated? Impossible to please? Perfect. Join Yahoo!'s user panel and lay it on us.
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This message has been scanned for viruses and
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believed to be clean. - --0-1179939463-1192086062=:69884-- - -------------------------------------------------------------------- |For help or to subscribe/unsubscribe, e-mail majordomo@eda-stds.org |with the appropriate command message(s) in the body: | | help | subscribe ibis | subscribe ibis-users | unsubscribe ibis | unsubscribe ibis-users | |or e-mail a request to ibis-request@eda-stds.org. | |IBIS reflector archives exist under: | | http://www.eda-stds.org/pub/ibis/email_archive/ Recent | http://www.eda-stds.org/pub/ibis/users_archive/ Recent | http://www.eda-stds.org/pub/ibis/email/ E-mail since 1993 ------------------------------ End of ibis-users V1 #103 *************************