To=20 All:

This is the first=20 Announcement for the DesignCon 2008 IBIS Summit

Meeting held at the= =20 Santa Clara Convention Center in Santa Clara,

California.

Cisco Systems is spon= soring=20 the event, but we welcome additional

sponsors to cover som= e of=20 the meeting expenses and the free lunch and

refreshments.

Also note that VIP di= scounts=20 are offered for all DesignCon 2008

conference packages= =20 (including free exhibition admission) through

links given below. Many IBIS members are also active= ly=20 participating

and presenting materi= al in=20 the DesignCon program.

Best=20 Regards,

Syed

---------------------= - --------------------------------------------------

= ; &n= bsp; =20 IBIS SUMMIT

= ; &n= bsp; =20 FIRST CALL FOR

= ; = =20 PARTICIPATION & PRESENTATIONS

---------------------= - --------------------------------------------------

= ; =20 I B I S S U M M= I=20 T M E E T I N=20 G

Time/Date: Thursday, February 7, 2008 8:00 A= M to=20 5:00 PM

Santa Clara Convention=20 Center

= ;5101=20 Great America Parkway,

= ; =20 Santa Clara, California, USA

Room: =20 TBD

Content: Presentations and=20 Discussions

Purpose: Solicit and Exchange = IBIS=20 Model Related Information and

= ; =20 ideas.

Sponsors: Cisco Systems, Internationa= l=20 Engineering Consortium (DesignCon)

= ; =20 We are seeking more co-sponsors.&n= bsp;=20 Please contact Syed Huq

= ; =20 <shuq@cisco.com>. The=20 Benefits to sponsors include

= ; =20 recognition at the meeting and acknowledgement in the=20 Calls

= ; =20 for Papers and meeting minutes.

= ; =20 Your financial support strengthens the organization=20 by

= ; =20 allowing IBIS to focus resources on industry=20 activities

= ; =20 rather than raising money, and you will receive=20 generous

thanks=20 for your support.

DesignCon 2007=20 Conference:

= ; =20 February 4 - 7, 2008

= ; =20 Santa Clara=20 Convention=20 Center

= ; =20 Santa Clara,= =20 CA

= ; =20 http://www.designcon.com/2008/

= ; =20 IBIS Summit participants can register at disc= ounted=20 rates

= ; =20 through this link:

= ; =20 http://www.designcon.com/2008/register/ibis_reg.html

= ; =20 However, please also notify Syed Huq=20 (shuq@cisco.com)

= ; =20 if you are planning to attend the IBIS Summit.

Conference=20 Schedule:

=20 http://www.designcon.com/2008/conference/schedule.html

IBIS Booth: Come visi= t the=20 IBIS Booth to meet attendees and pick up

= ; =20 IBIS information.

BACKGROUND=

DesignCon is the prem= ier=20 annual Silicon Valley event for the=20 electronic

design automation (ED= A) and=20 semiconductor industry. Topi= cs of=20 current

interest to the EIA I= BIS=20 Open Forum are addressed at DesignCon.

This meeting will be= =20 conducted as a formal IBIS Summit Meeting.

Presentations are exp= ected=20 to be available and archived in an electronic format, and minutes of the me= eting=20 will be issued. Any pending formal decisions (votes) will be announced at l= east=20 two weeks prior to the meeting.

CALL FOR=20 PARTICIPANTS

People involved in IB= IS=20 Model development, EDA tool development, and

digital circuit desig= n are=20 invited to participate in the Summit meeting.

If you plan to partic= ipate,=20 please register with the information below:

Name:

E-mail=20 address:

Company:<= /P>

Telephone:

Send=20 to:

Syed Huq=20 <shuq@cisco.com>

Registration deadline= is=20 Wednesday, January 30, 2008 to receive the

free=20 lunch.

You can also register= =20 through the DesignCon link and also get VIP

discounted rates at= =20 DesignCon. But please also n= otify=20 Syed that

you are=20 registering.

CALL FOR=20 PRESENTATIONS

We are seeking presen= tations=20 from individuals who have experiences

of interest to the IB= IS=20 modeling community. In the p= ast,=20 these have

included, but not lim= ited=20 to:

Demonstrations of modeling= =20 techniques

Explanations of behavioral= =20 algorithms

Descriptions of difficultie= s=20 encountered

Model=20 correlation

Modeling building=20 experiences

Comparisons to other modeli= ng=20 methods

New technologies for modeli= ng=20 buffers and component

New technologies for modeli= ng=20 packaging and interconnect

Algorithmic modeling=20 topics

Etc.

Presentations may be= =20 addressed to any and all levels of IBIS experience,

from beginning to=20 advanced.

Presentation=20 Format:

A conference laptop with LC= D=20 projection. Power Point or= =20 Acrobat

electronic formats are favo= red and=20 will pre-loaded on the

Windows-based meeting lapto= p prior=20 to the meeting.

Time: Usually 15-30= =20 Minutes

Electronic=20 Archival:

Presentations will be archi= ved=20 under the IBIS Summits site

and also must be submitted = in time=20 for uploading and copying.

Final submission deadline= =20 is:

Wednesday, Janu= ary 30,=20 2008

Otherwise, you should bring= 50=20 copies.

If you plan a present= ation,=20 please supply the following information

as soon as=20 possible:

Tentative=20 Title:

Presenter:

E-mail=20 address:

Company:<= /P>

Telephone:

Estimated=20 Time:

Send=20 to:

Bob= Ross=20 <bob@teraspeed.com>

AGENDA

The agenda includes= =20 presentations, discussions, breaks, and a FREE

lunch. The agenda details will be develo= ped as=20 proposals are

received.<= /SPAN>

LIST OF NEARBY=20 HOTELS

The Hotel and Travel = Link=20 provides a conference hotel discount, and

use internet search e= ngines=20 other good lodging deals:

=20 http://www.designcon.com/2008/conference/hotel_and_travel.html<= /o:p>

---------------------= - --------------------------------------------

To All:

This is the third=20 Announcement for the DesignCon 2008 IBIS Summit

Meeting held at the= =20 Santa Clara Convention Center in Santa Clara,

California. A few tentative presentations are= listed=20 in the

Announcement.

Cisco Systems is spon= soring=20 the event, but we welcome additional

sponsors to cover som= e of=20 the meeting expenses and the free lunch and

refreshments.

Also note that VIP di= scounts=20 are offered for all DesignCon 2008

conference packages= =20 (including free exhibition admission) through

links given below. Many IBIS members are also active= ly=20 participating

and presenting materi= al in=20 the DesignCon program.

Best=20 Regards,

Syed

---------------------= - --------------------------------------------------

= ; &n= bsp; =20 IBIS SUMMIT

= ; &n= bsp; =20 THIRD CALL FOR

= ; = =20 PARTICIPATION & PRESENTATIONS

---------------------= - --------------------------------------------------

= ; =20 I B I S S U M M= I=20 T M E E T I N=20 G

Time/Date: Thursday, February 7, 2008 8:00 A= M to=20 5:00 PM

Santa Clara Convention=20 Center

= ; =20 5101 Great America Parkway,

= ; =20 Santa Clara, California, USA

Room: =20 TBD

Content: Presentations and=20 Discussions

Purpose: Solicit and Exchange = IBIS=20 Model Related Information and

= ; =20 Ideas.

Sponsors: Cisco Systems, Internationa= l=20 Engineering Consortium (DesignCon)

= ; =20 We are seeking more co-sponsors.&n= bsp;=20 Please contact Syed Huq

= ; =20 <shuq@cisco.com>. The=20 Benefits to sponsors include

= ; =20 recognition at the meeting and acknowledgement in the=20 Calls

= ; =20 for Papers and meeting minutes.

= ; =20 Your financial support strengthens the organization=20 by

= ; =20 allowing IBIS to focus resources on industry=20 activities

= ; rather=20 than raising money, and you will receive generous

= ; =20 thanks for your support.

DesignCon 2007=20 Conference:

= ; =20 February 4 - 7, 2008

= ; =20 Santa Clara=20 Convention=20 Center

= ; =20 Santa Clara,= =20 CA

= ; =20 http://www.designcon.com/2008/

= ; =20 IBIS Summit participants can register at disc= ounted=20 rates

= ; =20 through this link:

= ; =20 http://www.designcon.com/2008/register/ibis_reg.html

= ; =20 However, please also notify Syed Huq at the address=20 below

= ; =20 if you are planning to attend the IBIS Summit.

Conference=20 Schedule:

=20 http://www.designcon.com/2008/conference/schedule.html

IBIS Booth: Come visi= t the=20 IBIS Booth to meet attendees and pick up

= ; =20 IBIS information.

BACKGROUND=

DesignCon is the prem= ier=20 annual Silicon Valley event for the=20 electronic

design automation (ED= A) and=20 semiconductor industry. Topi= cs of=20 current

interest to the EIA I= BIS=20 Open Forum are addressed at DesignCon.

This meeting will be= =20 conducted as a formal IBIS Summit Meeting.

Presentations are exp= ected=20 to be available and archived in an electronic

format, and minutes o= f the=20 meeting will be issued. Any pending formal

decisions (votes) wil= l be=20 announced at least two weeks prior to the

meeting.

CALL FOR=20 PARTICIPANTS

People involved in IB= IS=20 Model development, EDA tool development, and

digital circuit desig= n are=20 invited to participate in the Summit meeting.

If you plan to partic= ipate,=20 please register with the information below:

Name:

E-mail=20 address:

Company:<= /P>

Telephone:

Send=20 to:

Syed Huq=20 <shuq@cisco.com>

Registration deadline= is=20 Wednesday, January 30, 2008 to receive the

free=20 lunch.

You can also register= =20 through the DesignCon link and also get VIP

discounted rates at= =20 DesignCon. But please also n= otify=20 Syed that

you are=20 registering.

CALL FOR=20 PRESENTATIONS

We are seeking presen= tations=20 from individuals who have experiences

of interest to the IB= IS=20 modeling community. In the p= ast,=20 these have

included, but not lim= ited=20 to:

Demonstrations of modeling= =20 techniques

Explanations of behavioral= =20 algorithms

Descriptions of difficultie= s=20 encountered

Model=20 correlation

Modeling building=20 experiences

Comparisons to other modeli= ng=20 methods

New technologies for modeli= ng=20 buffers and component

New technologies for modeli= ng=20 packaging and interconnect

Algorithmic modeling=20 topics

Etc.

Presentations may be= =20 addressed to any and all levels of IBIS experience,

from beginning to=20 advanced.

Presentation=20 Format:

A conference laptop with LC= D=20 projection. Power Point or= =20 Acrobat

electronic formats are favo= red and=20 will pre-loaded on the

= =20 Windows-based meeting laptop prior to the meeting.=

Time: Usually 15-30= =20 Minutes

Electronic=20 Archival:

Presentations will be archi= ved=20 under the IBIS Summits site

and also must be submitted = in time=20 for uploading and copying.

Final submission deadline= =20 is:

Wednesday, Janu= ary 30,=20 2008

Otherwise, you should bring= 50=20 copies.

If you plan a present= ation,=20 please supply the following information

as soon as=20 possible:

Tentative=20 Title:

Presenter:

E-mail=20 address:

Company:<= /P>

Telephone:

Estimated=20 Time:

Send=20 to:

Bob= Ross=20 <bob@teraspeed.com>

AGENDA

The agenda includes= =20 presentations, discussions, breaks, and a FREE

lunch. The agenda details will be develo= ped as=20 proposals are

received. Here are a few tentative topics o= r=20 titles that have been

submitted:=

Yuriy Shelpnev,=20 Simberian

"Building Advanced Transmission L= ine and=20 Via-hole Models for

Serial Channels with 10 GBps and= =20 Higher Data=20 Rates"

Bob Ross, Teraspeed Consulting=20 Group

"Touchstone Syntax for Versions 1= .0 and=20 2.0"

Sam Chitwood,=20 Sigrity

"Proper IBIS Package Modeling Tec= hniques=20 and Usage in Ideal-PDS

and SSO=20 Simulations"

Randy Wolff, Micron=20 Technology

"Modeling DDR3 with= =20 IBIS"

Luis Boluna, Kelvin Qui,Cisco Systems,

“ 6G+ SerDes Mo= deling &=20 Channel Simulation using IBISv4.2 (*AMS)”

Todd Westerhoff, Signal Integrity= =20 Software (SiSoft)

Fangyi Rao*, Chad Morgan**, Vuk B= orich*,=20 Sanjeev Gupta*,

*Agilent Technologies= and=20 **Tyco Electronics

“New Interconnect Models Re= moves=20 Simulation Uncertainty”

Lance Wang, IO Methodology, Valid= ation=20 Topic

Syed Huq, Cisco Systems, IBIS Web= Page=20

LIST OF NEARBY=20 HOTELS

The Hotel and Travel = Link=20 provides a conference hotel discount, and

use internet search e= ngines=20 other good lodging deals:

http://www.designcon.com/2008/conf= erence/hotel_and_travel.html

---------------------= - --------------------------------------------