From owner-ibis  Mon Mar  1 07:59:25 1999
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From: gedlund@us.ibm.com
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Subject: IBIS package modeling questions
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Hello All,

My understanding is that there are five levels of package modeling in IBIS:

1.  R_pkg, L_pkg, C_pkg
2.  R_pin, L_pin, C_pin
3.  Coupled lumped model using  the [Resistance/Inductance/Capacitance
Matrix] keywords
4.  Distributed (segmented) package model using subparameters under the
[Pin Numbers] keyword
5.  EBD

Are levels 3 and 4 mutually exclusive, i.e. is it possible to create a
coupled, distributed package model?

I assume the existence of modeling data at levels 3 and 4 overrides data at
levels 1 and 2.  Is this true?

Thanks for your time.

Greg Edlund
Advisory Engineer, Critical Net Analysis
IBM
3650 Hwy. 52 N, Dept. HDC
Rochester, MN 55901
gedlund@us.ibm.com


From owner-ibis  Mon Mar  1 08:59:56 1999
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From: bob_ross@mentorg.com (Bob Ross)
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Date: Mon, 1 Mar 99 08:53:36 PST
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To: gedlund@us.ibm.com, ibis-users@vhdl.org
Subject: Re:  IBIS package modeling questions

Greg:

My responses are in your text.

Bob Ross
Mentor Graphics

> From owner-ibis@server.eda.org Mon Mar  1 07:59 PST 1999
> From: gedlund@us.ibm.com
> To: ibis-users@vhdl.org
> Date: Mon, 1 Mar 1999 09:53:31 -0600
> Subject: IBIS package modeling questions

> Hello All,

> My understanding is that there are five levels of package modeling in IBIS:

> 1.  R_pkg, L_pkg, C_pkg
> 2.  R_pin, L_pin, C_pin
> 3.  Coupled lumped model using  the [Resistance/Inductance/Capacitance
> Matrix] keywords
> 4.  Distributed (segmented) package model using subparameters under the
> [Pin Numbers] keyword
> 5.  EBD

> Are levels 3 and 4 mutually exclusive, i.e. is it possible to create a
> coupled, distributed package model?

Levels 3 and 4 as you define them are mutually exclusive.  Within the
current Version 3.2 level of IBIS you can only have a single stage
of coupled package information, or multiple sections (segmented) of 
uncoupled package information consisting of discrete and distributed
elements.

> I assume the existence of modeling data at levels 3 and 4 overrides data at
> levels 1 and 2.  Is this true?

Yes.  Information in 2 overrides default information in 1.  Any information
in 3 or 4 overrides information in 1 or 2.

> Thanks for your time.

> Greg Edlund
> Advisory Engineer, Critical Net Analysis
> IBM
> 3650 Hwy. 52 N, Dept. HDC
> Rochester, MN 55901
> gedlund@us.ibm.com




From owner-ibis  Mon Mar  1 09:18:42 1999
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Date: Mon, 01 Mar 1999 11:15:10 -0500
From: "Robert Goodrich" <ra3862@email.sps.mot.com>
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Subject: IBIS Training Suggestions??
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To All:
I was hoping someone could suggest an IBIS training course that is
tailored towards someone in the IC industry that will be heading up the
IBIS model creation effort in their group.  I have used s2ibis2 to
create a model from simulation data and read the spec./cookbook, but
feel somewhat inadequate when pressed to explain the finer details of an
IBIS model.  Also, I would like some exposure to the bigger picture -
how IBIS models are used.

I have searched out several courses on the web, but would appreciate
suggestions.
--Rob
--

Rob Goodrich
Circuit Design - Advanced Imaging Technology (AIT)
Motorola SPS, I&E Solutions
6501 William Cannon Drive West MD: OE37
Austin, TX 78735
ra3862@email.sps.mot.com
(512) 895-7341


From owner-ibis  Mon Mar  1 11:55:21 1999
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To: "Robert Goodrich" <ra3862@email.sps.mot.com>
Cc: ibis-users@eda.org
Subject: Re: IBIS Training Suggestions?? 
In-reply-to: Your message of "Mon, 01 Mar 1999 11:15:10 EST."
             <36DABCFE.A81F1461@email.sps.mot.com> 
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Date: Mon, 01 Mar 1999 11:49:57 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>


Hello Bob:

   The IBIS East Users Group is in the process of putting together an
IBIS training course that may address your concerns.  I don't know the
exact status, but Dr. Ed Sayre of Northeast Systems Assoc. is the head of
this effort, and you can contact him thru his admin Kathy Brenda 
(brenda@nesa.com) (sorry, I can't find his direct contact number right now).

   Also, you might try contacting your simulation software vendor. I know 
that many CAE vendors offer IBIS training courses as part of the 
training on their software.


     Regards,
     Stephen Peters
     Intel Corp.
     Vice Chair, IBIS Open Forum


> To All:
> I was hoping someone could suggest an IBIS training course that is
> tailored towards someone in the IC industry that will be heading up the
> IBIS model creation effort in their group.  I have used s2ibis2 to
> create a model from simulation data and read the spec./cookbook, but
> feel somewhat inadequate when pressed to explain the finer details of an
> IBIS model.  Also, I would like some exposure to the bigger picture -
> how IBIS models are used.
> 
> I have searched out several courses on the web, but would appreciate
> suggestions.
> --Rob
> --
> 
> Rob Goodrich
> Circuit Design - Advanced Imaging Technology (AIT)
> Motorola SPS, I&E Solutions
> 6501 William Cannon Drive West MD: OE37
> Austin, TX 78735
> ra3862@email.sps.mot.com
> (512) 895-7341
> 


From owner-ibis  Mon Mar  1 13:47:44 1999
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Subject: Re: IBIS Training Suggestions??
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Bob, Stephen:  The Mentor Graphics Interconnectix group offers a 1 day IBIS 
training class, which I believe is separate from their software, so can be 
taken by anyone.
Regards,
Fabrizio Zanella
EMC, Hardware Engineering
fzanella@emc.com
508-435-2075, x4645
-------------
Original Text
From: "Stephen Peters" <sjpeters@ichips.intel.com>, on 3/1/99 2:49 PM:
To: smtp@Eng@EMCHOP1["Robert Goodrich" <ra3862@email.sps.mot.com>]
Cc: smtp@Eng@EMCHOP1[<ibis-users@eda.org>]

Hello Bob:

   The IBIS East Users Group is in the process of putting together an
IBIS training course that may address your concerns.  I don't know the
exact status, but Dr. Ed Sayre of Northeast Systems Assoc. is the head of
this effort, and you can contact him thru his admin Kathy Brenda 
(brenda@nesa.com) (sorry, I can't find his direct contact number right 
now).

   Also, you might try contacting your simulation software vendor. I know 
that many CAE vendors offer IBIS training courses as part of the 
training on their software.


     Regards,
     Stephen Peters
     Intel Corp.
     Vice Chair, IBIS Open Forum


> To All:
> I was hoping someone could suggest an IBIS training course that is
> tailored towards someone in the IC industry that will be heading up the
> IBIS model creation effort in their group.  I have used s2ibis2 to
> create a model from simulation data and read the spec./cookbook, but
> feel somewhat inadequate when pressed to explain the finer details of an
> IBIS model.  Also, I would like some exposure to the bigger picture -
> how IBIS models are used.
> 
> I have searched out several courses on the web, but would appreciate
> suggestions.
> --Rob
> --
> 
> Rob Goodrich
> Circuit Design - Advanced Imaging Technology (AIT)
> Motorola SPS, I&E Solutions
> 6501 William Cannon Drive West MD: OE37
> Austin, TX 78735
> ra3862@email.sps.mot.com
> (512) 895-7341
> 


a

From owner-ibis  Mon Mar  1 14:48:31 1999
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From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
To: "\"ibis-users@eda.org\" " <ibis-users@eda.org>,
        "\"Robert Goodrich\" "
	 <ra3862@email.sps.mot.com>
Subject: RE: IBIS Training Suggestions??
Date: Mon, 1 Mar 1999 14:42:00 -0800 
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I will be teaching on the subject of IBIS modeling and model making in a 
three-day short course mid April.  My part will be only half day long
(4-hours),
the rest will be Signal Integrity, and related items by other presenters.
Here 
is the URL for more information:

http://intermix.engr.arizona.edu/~epd/#CSSI

Arpad
============================================================================
===

To All:
I was hoping someone could suggest an IBIS training course that is
tailored towards someone in the IC industry that will be heading up the
IBIS model creation effort in their group.  I have used s2ibis2 to
create a model from simulation data and read the spec./cookbook, but
feel somewhat inadequate when pressed to explain the finer details of an
IBIS model.  Also, I would like some exposure to the bigger picture -
how IBIS models are used.

I have searched out several courses on the web, but would appreciate
suggestions.
--Rob
--

Rob Goodrich
Circuit Design - Advanced Imaging Technology (AIT)
Motorola SPS, I&E Solutions
6501 William Cannon Drive West MD: OE37
Austin, TX 78735
ra3862@email.sps.mot.com
(512) 895-7341
From owner-ibis  Tue Mar  2 11:13:28 1999
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From: bob_ross@mentorg.com (Bob Ross)
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Message-Id: <9903021907.AA07106@bob>
To: ibis-users@eda.org, ibis@eda.org, si-list@silab.eng.sun.com
Subject: AGENDA - EUROPEAN IBIS SUMMIT MEETING

To All:

Below is the Agenda showing the planned sequence of presentations.  Exact
times are not given since we will be flexible to allow discussions,
unscheduled topics and questions topics.  The General Questions and
Discussions Topic shown in the AGENDA may occur at any time.

See you in Munich!

Best Regards
Bob Ross
Mentor Graphics


                               A G E N D A
          E U R O P E A N   I B I S   S U M M I T   M E E T I N G

                    12 PM - 6 PM, Tuesday, March 9, 1999

                         ASTRON HOTEL/Neue Messe
                        Eggenfeldener Strasse 100
                             Munich, Germany 

   Co-sponsored by Mentor Graphics, INCASES, High Design Technology (HDT)

AGENDA:

  12:00:  LUNCH (Provided to all participants)

  13:00   MEETING BEGINS

    Current IBIS Activities and Issues
      Bob Ross, Mentor Graphics

    Detecting Typical Bugs in IBIS Models
      Werner Rissiek, INCASES Engineering

    Validation of an Enhanced Two Waveform Behavioral Model
      Bernhard Unger, Siemens AG

    IBIS Version 3.2 Update
      Stephen Peters, Intel

    General Questions and Discussions
      - IBIS Interpretation

  15:00    BREAK

    IBIS Management and CHECK at Siemens ICN
      Gerald Bannert, Siemens

    DOGEN, An Internal Model Library Management Tool
      Hans Pichlmaier, Siemens

    IBIS Future Requirements
      Stephen Peters, Intel

    Future Requirements on Frequency Dependent Package and MCM Modeling
      Werner Rissiek, INCASES Engineering

    General Questions and Discussions
      - Future Requirements
      - Any other topic of interest
      - Meeting Wrapup

  18:00    END OF MEETING





From owner-ibis  Tue Mar  2 12:01:38 1999
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From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
To: "\"ibis-users@eda.org\" " <ibis-users@eda.org>,
        "\"ibis@eda.org\" "
	 <ibis@eda.org>,
        "\"si-list@silab.eng.sun.com\" "
	 <si-list@silab.eng.sun.com>
Subject: SI opening at Intel, Folsom, CA
Date: Tue, 2 Mar 1999 11:55:00 -0800 
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Intel Corporation has an immediate opening for a signal integrity engineer
at
the Platform Component Division (PCD) in Folsom California.  If you are 
qualified and interested please contact and/or send resume to Henri Maramis
via
EMAIL or phone at henri.maramis@intel.com (916) 356-6413.

Responsibilities:

Designs and performs analog simulations of system level interconnects for PC
based platforms.  Prepares I/O buffer models, transmission line models, and
packaging parasitic models for accurate correlated simulations.  Performs
system level critical path timing, pre and post layout analyses.  Uses 
engineering judgment in data analysis to establish design process and CAD
tool
flow.  U.S. typically requires a Bachelor's Degree in Elec. Eng. or Comp.
Eng.
+3 years experience, or a Master's Degree +2 years experience.

Skills:

Knowledge/experience with IBIS models and simulation/timing tools, such as
HSPICE, Quad Design, Cadence SpecctraQuest, Interconnectix, and Timing
Designer.
Extended coursework in electromagnetic fields and waves, and transmission
line
analysis.  Knowledge of PC based system architecture, high speed bus
interfaces,
and high performance signaling techniques.  This includes bus and system
timing,
signal integrity analysis, cross talk analysis, ground bounce analysis,
power
integrity analysis, as well as board layout techniques.
From owner-ibis  Wed Mar  3 00:09:11 1999
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Date: Wed, 03 Mar 1999 10:01:14 +0200
From: Dan Aleksandrowicz <dan@galileo.co.il>
Organization: GALILEO Technology Ltd.
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Subject: Re: SI opening at Intel, Folsom, CA
References: <199903021956.TAA08129@thalia.fm.intel.com>
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Hi There.

I know we have discuss this issue in the past in respect of product features.
And though this kind head hunting is defiantly IS NOT equivalent to product
promotion, I am still a bit reserved about using this open channel for head
hunting.

If any one disagrees to my opinion, I can definitely understand it. There might

be a better solution by using the IBIS web site, though, this might lead to
other
legal difficulties. I would like if we could find a common solution to this
need.

Thanks.



Muranyi, Arpad wrote:

> Intel Corporation has an immediate opening for a signal integrity engineer
> at
> the Platform Component Division (PCD) in Folsom California.  If you are
> qualified and interested please contact and/or send resume to Henri Maramis
> via
> EMAIL or phone at henri.maramis@intel.com (916) 356-6413.
>



--
                \\|//
                (o o)
~~~~~~~~~~~~oOOo~(_)~oOOo~~~~~~~~~~~~~~~~~~~
Dan Aleksandrowicz
Galileo Technology
Giron 15, Yahud - Israel
email:dan@galileo.co.il
Tel: +972 3 6320220    (-
     Ext. 324         |__|
                      |__|
                     #|oo| |--|   ___
           _  _    |--|  | |  |\ |oo|)        /\
       __  \\ \\   |------------\| #|--\     _||-
   ____\ \__\\_\\__|_||_________________\___|   |__v-___
   \                                                   /
    \      "Smoke on the water. Fire in the sky."     /
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~



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<HTML>
Hi There.

<P>I know we have discuss this issue in the past in respect of product
features.
<BR>And though this kind head hunting is defiantly IS NOT equivalent to
product
<BR>promotion, I am still a bit reserved about using this open channel
for head hunting.

<P>If any one disagrees to my opinion, I can definitely understand it.
There might
<BR>be a better solution by using the IBIS web site, though, this might
lead to other
<BR>legal difficulties. I would like if we could find a common solution
to this need.

<P>Thanks.
<BR>&nbsp;
<BR>&nbsp;

<P>Muranyi, Arpad wrote:
<BLOCKQUOTE TYPE=CITE>Intel Corporation has an immediate opening for a
signal integrity engineer
<BR>at
<BR>the Platform Component Division (PCD) in Folsom California.&nbsp; If
you are
<BR>qualified and interested please contact and/or send resume to Henri
Maramis
<BR>via
<BR>EMAIL or phone at henri.maramis@intel.com (916) 356-6413.
<BR>&nbsp;</BLOCKQUOTE>
&nbsp;
<PRE>--&nbsp;
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; \\|//
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; (o o)
~~~~~~~~~~~~oOOo~(_)~oOOo~~~~~~~~~~~~~~~~~~~
Dan Aleksandrowicz
Galileo Technology&nbsp;
Giron 15, Yahud - Israel
email:dan@galileo.co.il
Tel: +972 3 6320220&nbsp;&nbsp;&nbsp; (-&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;
&nbsp;&nbsp;&nbsp;&nbsp; Ext. 324&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; |__|
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; |__|
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; #|oo| |--|&nbsp;&nbsp; ___
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; _&nbsp; _&nbsp;&nbsp;&nbsp; |--|&nbsp; | |&nbsp; |\ |oo|)&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; /\
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; __&nbsp; \\ \\&nbsp;&nbsp; |------------\| #|--\&nbsp;&nbsp;&nbsp;&nbsp; _||-
&nbsp;&nbsp; ____\ \__\\_\\__|_||_________________\___|&nbsp;&nbsp; |__v-___
&nbsp;&nbsp; \&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; /
&nbsp;&nbsp;&nbsp; \&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; "Smoke on the water. Fire in the sky."&nbsp;&nbsp;&nbsp;&nbsp; /
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~</PRE>
&nbsp;</HTML>

--------------FAEF2BE6BE43CCF9ECA45A5A--

From owner-ibis  Wed Mar  3 01:20:35 1999
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Message-ID: <9BADB79F06B3D211974800A0C92BD8A0080FE0@exchange2.via.com.tw>
From: Weber Chuang <WeberChuang@via.com.tw>
To: ibis-users@eda.org
Subject: RE : SI opening at Intel, Folsom, CA
Date: Wed, 3 Mar 1999 17:19:42 +0800 
MIME-Version: 1.0
X-Mailer: Internet Mail Service (5.5.2232.9)
Content-Type: text/plain

Dear IBIS gurus,

  In my memory, most people seem to accept such job openings in si-list if
not from head hunters, but might not be in the IBIS Forum. So it would be
much better if only si-list is used next time. Thanks!

  Best Regards

 Weber Chuang(ChingFu Chuang)
 Mgr. of  SI team.
 VIA Technologies, Inc.
 Taipei, Taiwan, ROC 
 TEL : 886-2-22185452  ext : 6522
 http://www.via.com.tw
 Very Innovative Architecture

> -----Original Message-----
> From:	Dan Aleksandrowicz [SMTP:dan@galileo.co.il]
> Sent:	Wednesday, March 03, 1999 4:01 PM
> To:	ibis-users@eda.org
> Subject:	Re: SI opening at Intel, Folsom, CA
> 
> Hi There.
> 
> I know we have discuss this issue in the past in respect of product
> features.
> And though this kind head hunting is defiantly IS NOT equivalent to
> product
> promotion, I am still a bit reserved about using this open channel for
> head
> hunting.
> 
> If any one disagrees to my opinion, I can definitely understand it. There
> might
> 
> be a better solution by using the IBIS web site, though, this might lead
> to
> other
> legal difficulties. I would like if we could find a common solution to
> this
> need.
> 
> Thanks.
> 
> 
> 
> Muranyi, Arpad wrote:
> 
> > Intel Corporation has an immediate opening for a signal integrity
> engineer
> > at
> > the Platform Component Division (PCD) in Folsom California.  If you are
> > qualified and interested please contact and/or send resume to Henri
> Maramis
> > via
> > EMAIL or phone at henri.maramis@intel.com (916) 356-6413.
> >
> 
> 
> 
> --
>                 \\|//
>                 (o o)
> ~~~~~~~~~~~~oOOo~(_)~oOOo~~~~~~~~~~~~~~~~~~~
> Dan Aleksandrowicz
> Galileo Technology
> Giron 15, Yahud - Israel
> email:dan@galileo.co.il
> Tel: +972 3 6320220    (-
>      Ext. 324         |__|
>                       |__|
>                      #|oo| |--|   ___
>            _  _    |--|  | |  |\ |oo|)        /\
>        __  \\ \\   |------------\| #|--\     _||-
>    ____\ \__\\_\\__|_||_________________\___|   |__v-___
>    \                                                   /
>     \      "Smoke on the water. Fire in the sky."     /
> ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
> 
>  << File: ATT00001.html >> 
From owner-ibis  Wed Mar  3 04:31:36 1999
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From: "Peterson, James F (FL51)" <jfpeterson@space.honeywell.com>
To: Dan Aleksandrowicz <dan@galileo.co.il>, ibis-users@eda.org
Subject: RE: SI opening at Intel, Folsom, CA
Date: Wed, 3 Mar 1999 07:26:05 -0500 
MIME-Version: 1.0
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hey there,
Head hunting hasn't dominated our reflector. If it did I would be concerned.
As long as it stays around the current level I believe it's another part of
this business we're in (it can even help some of us stay in business). It
was correctly described in the subject section so those not interested could
delete.
Jim Peterson
 

-----Original Message-----
From: Dan Aleksandrowicz [mailto:dan@galileo.co.il]
Sent: Wednesday, March 03, 1999 3:01 AM
To: ibis-users@eda.org
Subject: Re: SI opening at Intel, Folsom, CA


Hi There. 

I know we have discuss this issue in the past in respect of product
features. 
And though this kind head hunting is defiantly IS NOT equivalent to product 
promotion, I am still a bit reserved about using this open channel for head
hunting. 


If any one disagrees to my opinion, I can definitely understand it. There
might 
be a better solution by using the IBIS web site, though, this might lead to
other 
legal difficulties. I would like if we could find a common solution to this
need. 


Thanks. 
  
  


Muranyi, Arpad wrote: 


Intel Corporation has an immediate opening for a signal integrity engineer 
at 
the Platform Component Division (PCD) in Folsom California.  If you are 
qualified and interested please contact and/or send resume to Henri Maramis 
via 
EMAIL or phone at henri.maramis@intel.com (916) 356-6413. 


  
-- 

                \\|//

                (o o)

~~~~~~~~~~~~oOOo~(_)~oOOo~~~~~~~~~~~~~~~~~~~

Dan Aleksandrowicz

Galileo Technology 

Giron 15, Yahud - Israel

email:dan@galileo.co.il

Tel: +972 3 6320220    (-                    

     Ext. 324         |__|

                      |__|

                     #|oo| |--|   ___

           _  _    |--|  | |  |\ |oo|)        /\

       __  \\ \\   |------------\| #|--\     _||-

   ____\ \__\\_\\__|_||_________________\___|   |__v-___

   \                                                   /

    \      "Smoke on the water. Fire in the sky."     /

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
  

From owner-ibis  Wed Mar  3 07:53:46 1999
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Message-ID: <36DD59C4.F3A08B28@vasthorizons.com>
Date: Wed, 03 Mar 1999 07:48:20 -0800
From: Scott McMorrow <scott@vasthorizons.com>
Organization: SiQual
X-Mailer: Mozilla 4.5 [en] (WinNT; U)
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CC: ibis-users@eda.org
Subject: Re: SI opening at Intel, Folsom, CA
References: <F40D462D6FF2D11182E800805F95330D028C2A09@fl51m01.space.honeywell.com>
Content-Type: multipart/mixed;
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Openings for a particular position and head hunting are two
different matters.  I have no problem with someone normally
associated with the reflector posting a job.

Besides, we take up more channel bandwidth and time
discussing the matter each time it comes up than the time
it takes to read and discard the message if one is not
interested.

Scott


"Peterson, James F (FL51)" wrote:

> hey there,
> Head hunting hasn't dominated our reflector. If it did I would be concerned.
> As long as it stays around the current level I believe it's another part of
> this business we're in (it can even help some of us stay in business). It
> was correctly described in the subject section so those not interested could
> delete.
> Jim Peterson
>
>
> -----Original Message-----
> From: Dan Aleksandrowicz [mailto:dan@galileo.co.il]
> Sent: Wednesday, March 03, 1999 3:01 AM
> To: ibis-users@eda.org
> Subject: Re: SI opening at Intel, Folsom, CA
>
> Hi There.
>
> I know we have discuss this issue in the past in respect of product
> features.
> And though this kind head hunting is defiantly IS NOT equivalent to product
> promotion, I am still a bit reserved about using this open channel for head
> hunting.
>
> If any one disagrees to my opinion, I can definitely understand it. There
> might
> be a better solution by using the IBIS web site, though, this might lead to
> other
> legal difficulties. I would like if we could find a common solution to this
> need.
>
> Thanks.
>
>
>
> Muranyi, Arpad wrote:
>
> Intel Corporation has an immediate opening for a signal integrity engineer
> at
> the Platform Component Division (PCD) in Folsom California.  If you are
> qualified and interested please contact and/or send resume to Henri Maramis
> via
> EMAIL or phone at henri.maramis@intel.com (916) 356-6413.
>
>
> --
>
>                 \\|//
>
>                 (o o)
>
> ~~~~~~~~~~~~oOOo~(_)~oOOo~~~~~~~~~~~~~~~~~~~
>
> Dan Aleksandrowicz
>
> Galileo Technology
>
> Giron 15, Yahud - Israel
>
> email:dan@galileo.co.il
>
> Tel: +972 3 6320220    (-
>
>      Ext. 324         |__|
>
>                       |__|
>
>                      #|oo| |--|   ___
>
>            _  _    |--|  | |  |\ |oo|)        /\
>
>        __  \\ \\   |------------\| #|--\     _||-
>
>    ____\ \__\\_\\__|_||_________________\___|   |__v-___
>
>    \                                                   /
>
>     \      "Smoke on the water. Fire in the sky."     /
>
> ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
>

--------------5E8D9AA1D127CBF08542EB19
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adr:;;;;;;
version:2.1
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title:Principal Engineer
fn:Scott McMorrow
end:vcard

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From owner-ibis  Wed Mar  3 09:10:55 1999
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Date: Wed, 03 Mar 1999 09:05:37 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>


Hello All:

   For everyone's information, the official IBIS open forum policy
regarding job postings is as follows (quote is from an earlier e-mail 
from the IBIS Open Forum Chair): 

"We have established a policy that the IBIS reflectors are not to
be used for recruitment activities because of our membership
with EIA (which disallows this) and because the IBIS activity
and participation is company sponsored."

   Remember that the SI list is available for job postings. Thanks
for your cooperation.

          Regards,
          Stephen Peters
          Intel Corp.
          Vice Chair, IBIS Open Forum


From owner-ibis  Wed Mar  3 10:23:11 1999
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From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
To: "\"ibis@eda.org\" " <ibis@eda.org>,
        "\"ibis-users@eda.org\" "
	 <ibis-users@eda.org>
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Date: Wed, 3 Mar 1999 10:17:00 -0800 
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I apologize for the posting on these two reflectors, I was not aware of this

policy.

Arpad
============================================================================
=

Hello All:

   For everyone's information, the official IBIS open forum policy
regarding job postings is as follows (quote is from an earlier e-mail
from the IBIS Open Forum Chair):

"We have established a policy that the IBIS reflectors are not to
be used for recruitment activities because of our membership
with EIA (which disallows this) and because the IBIS activity
and participation is company sponsored."

   Remember that the SI list is available for job postings. Thanks
for your cooperation.

          Regards,
          Stephen Peters
          Intel Corp.
          Vice Chair, IBIS Open Forum
From owner-ibis  Wed Mar  3 11:46:11 1999
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Date: Wed, 3 Mar 1999 13:40:16 -0600
Subject: IBIS Users Group Minutes 2/26/99
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IBIS Users Group Minutes 2/26/99


Participants on 2/26/99

Compaq              Bob Haller
Hyperlynx           Matt Flora
IBM                 Mike Cohen, Greg Edlund
LSI Logic           Scott King
Mentor Graphics          Bob Ross
National Semiconductor   Milt Schwartz
NESA                Ed Sayre
TDA Systems              Dima Smolyansky

Thanks to Bob Ross and Mentor Graphics for funding the phone bridge.

Next conference call:

Date:                    3/19/99
Time:                    8:00 - 9:55 am PST
Phone number:       (805) 240-9673
Passcode:           773000


PART I:  IBIS ACCURACY SUBCOMMITTEE

Matt Flora, Ed Sayre, and Bob Ross expressed opinions in favor of keeping
the name "IBIS Accuracy Subcommittee."  The group agreed to keep this name
for 1999.  The group also agreed that Greg Edlund will continue in his
position of chairman of the IBIS Accuracy Subcommittee for 1999 (in the
absence of any other interested parties).  Greg Edlund will also continue
as editor of the IBIS Accuracy Specification document itself.  The group
decided to leave the meeting time stand at 8:00 PST.

IBIS ACCURACY SPECIFICATION 1.2 REVISIONS

There are two main improvements in version 1.2 of the IBIS Accuracy
Specification:  1) updating the correlation section to reflect the new
correlation strategy presented at the DesignCon99 IBIS Summit and 2)
updating the measurement section to facilitate future expansions.  Greg
Edlund will begin work on these changes and distribute a new copy of the
spec for review.

ACCURACY-RELATED BIRD(S)

Bob Ross suggested that we post a note to the reflector soliciting response
from the IBIS community on whether or not a BIRD should attempt to define
our new test loads in a machine-readable format.  Action item taken.

EIA APPROVAL

Bob Haller will lead the effort to obtain EIA approval for the IBIS
Accuracy Specification in 1999.  Bob Ross has alerted Patty Rusher to
expect the IBIS Accuracy Specification to be submitted to the EIA in 1999.

There was discussion around which version of the IBIS Accuracy
Specification to submit to the EIA.  Bob Ross suggested that we configure
the spec so as not to be dependent on a new BIRD and proceed.  Greg Edlund
argued that we should proceed with version 1.2, including the changes
mentioned above.  The group did not reach a decision on this point.

IBIS ACCURACY SPECIFICATION 2.0 DEVELOPMENT

Bob Ross commented that most EDA vendors presently consider IBIS 1.1
datasheets as inaccurate and recommended that we don't focus on which
version of IBIS to cover.

Mike Cohen highlighted two areas in which his group is seeing the need for
accuracy development:  VT tables and multi-staged drivers.  The IBIS
Accuracy Subcommittee needs to come up with a list of possible additions to
the IBIS Accuracy Specification and then prioritize the list.

TEST BOARD

Bob Haller commented that a few simple changes to the test board would
bring significant enhancements.  Bob Haller and Greg Edlund agreed to
exchange ideas for test board changes off-line.

Milt Schwartz mentioned that National Semiconductor has a board shop that
may be able to help with the test board.  He agreed to pursue a quote.
There was some discussion about making as many as 50 test boards to
distribute to interested parties.

Greg Edlund has agreed to write an application note for the test board
(someday).

Bob Haller said that the current version of the test board could be used as
a spring-board to include other part types.

ACCURACY ACTION ITEMS

1.  Status: open.  Opened: 2/26/99  Owner: Greg Edlund.  Edit measurement
and correlation sections of the IBIS Accuracy Specification and distribute
the new document.

2.  Status: open.  Opened: 2/26/99  Owner: Greg Edlund.  Write email to the
reflector soliciting input on the contents of an accuracy-related BIRD.  At
issue is whether or not to include a machine-readable description of the
test loads described in the IBIS Accuracy Specification.

3.  Status: open.  Opened: 2/26/99  Owner: Peter LaFlamme.  Make VCX16244
SPICE model and IBIS datasheet available on the accuracy web page.

4.  Status: open.  Opened: 2/26/99  Owner: Bob Haller, Greg Edlund.
Discuss test board changes off-line.

5.  Status: open.  Opened: 2/26/99  Owner: Milt Schwarz.  Get quote for
building revision 3 of the test board.

6.  Status: open.  Opened: 2/26/99  Owner: Greg Edlund.  Write test board
application note.

7.  Status: open.  Opened: 2/26/99  Owner: Greg Edlund.  Send out a note to
the reflector suggesting possible candidates for accuracy development in
1999.



PART II:  EDUCATION SUBCOMMITTEE

Ed Sayre has contacted a university professor who has expressed an interest
in developing an IBIS curriculum.  Ed estimates the project will take 6-9
months to produce a first cut.  He may solicit small grants cover costs.
Bob Ross cautioned that any educational effort should have IBIS 2.1 as a
baseline.


Greg Edlund
Advisory Engineer, Critical Net Analysis
IBM
3650 Hwy. 52 N, Dept. HDC
Rochester, MN 55901
gedlund@us.ibm.com


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Date: Mon, 08 Mar 99 16:37:10 +0000
From: "Owen Power"<power@cmemory.ie>
Subject: Compact Flash memory cards 
Sender: "Owen Power"<power@cmemory.ie>
To: "'ibis-users@eda.org'"<ibis-users@eda.org>
MIME-Version: 1.0

Hi 
	does anyone out there know of any test system available to test Compact Flash memory cards (10/20 Mbytes) with 84-Mbit Flash memory Chips. Any information would be greatly appreciated.

Regards Owen Power
Owen Power
Dane-Elec Manufacturing
PH: 353-91-504208(Direct)
PH: 353-91-553000
FAX: 353-91-504234
power@dane-elec.ie


From owner-ibis  Mon Mar  8 15:26:31 1999
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Date: Mon, 8 Mar 1999 15:16:11 -0800 (PST)
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To: ibis_users@eda.org
Subject: ibischk3
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Hi:

I am upgraiding ibis 2.1 parser in hspice to ibis 3.2
It seems to me ibischk3 has problems which ibischk2 did not
have: namely it has memory leaks and
UMR (uninitialised memory read). It does not necesserily mean
any error, but it would be certaintly better to avoid any UMR, etc.

I have attached 2 randomly taken log files (output of purify)
which shows the problems.

Any comments suggestions?
I did not try to fix this myself.

One more thing:
The very 1st version of the parser, V01 (files v01.c, v01.c)
is used for IBIS 1.1 ( why ??? - it was NOT used in IBIS 2.1 )
in the current release (3.2). It is not good because the same IBIS file
may have versions 1.1, or 2.1, or 3.2
(because of the back compatibility). And it should be processed
by the same code (othervise subtle differences in the code
can result in differences in the way how IBIS files are processed by
the purser depending on the version number). IBIS parser 1.1 and 2.1
should be kept for historical purpose only, we do not need 2 or more
parsers for the same file.

Any comments?

thanks

Nik

--------------------------------------
 Nikolai Bannov
 Avant! Corporation 
 46871 Bayside Parkway
 Fremont, CA 94538

 tel: 510-413-8634
 fax: 510-413-8080

 email: nikolai@avanticorp.com
--------------------------------------

----------
X-Sun-Data-Type: default
X-Sun-Data-Description: default
X-Sun-Data-Name: pure_ibis3_log1
X-Sun-Charset: us-ascii
X-Sun-Content-Lines: 267

****  Purify instrumented _pureibs3 (pid 6327 at Mon Mar  8 14:55:40 1999)
  * Purify 4.1 Solaris 2, Copyright (C) 1992-1997 Rational Software Corp. All rights reserved. 
  * For contact information type: "purify -help"
  * For TTY output, use the option "-windows=no"
  * Command-line: _pureibs3 test2 
  * Options settings: -purify \
    -purify-home=/net/engage/usr2/CM/pure/purify-4.1-solaris2 
  * Purify licensed to ADS SOFTWARE INC
  * Purify checking enabled.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (192 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:501]
	acdc_CheckModel [cdc.c:539]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (263 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:501]
	acdc_CheckModel [cdc.c:539]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (192 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:504]
	acdc_CheckModel [cdc.c:539]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (263 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:504]
	acdc_CheckModel [cdc.c:539]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (196 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:501]
	acdc_CheckModel [cdc.c:540]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (278 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:501]
	acdc_CheckModel [cdc.c:540]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (196 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:504]
	acdc_CheckModel [cdc.c:540]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (278 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:504]
	acdc_CheckModel [cdc.c:540]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (193 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:501]
	acdc_CheckModel [cdc.c:541]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (283 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:501]
	acdc_CheckModel [cdc.c:541]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (193 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:504]
	acdc_CheckModel [cdc.c:541]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (283 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessWave [cdc.c:272]
	acdc_CheckModelProcess [cdc.c:504]
	acdc_CheckModel [cdc.c:541]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe56c on the stack.
  * Address 0xefffe56c is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (65 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessTestLoad [cdc.c:196]
	acdc_CheckModelProcess [cdc.c:506]
	acdc_CheckModel [cdc.c:539]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe5ec on the stack.
  * Address 0xefffe5ec is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (56 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessTestLoad [cdc.c:196]
	acdc_CheckModelProcess [cdc.c:506]
	acdc_CheckModel [cdc.c:539]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe5ec on the stack.
  * Address 0xefffe5ec is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (66 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessTestLoad [cdc.c:196]
	acdc_CheckModelProcess [cdc.c:506]
	acdc_CheckModel [cdc.c:540]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe5ec on the stack.
  * Address 0xefffe5ec is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (57 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessTestLoad [cdc.c:196]
	acdc_CheckModelProcess [cdc.c:506]
	acdc_CheckModel [cdc.c:540]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe5ec on the stack.
  * Address 0xefffe5ec is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (65 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessTestLoad [cdc.c:196]
	acdc_CheckModelProcess [cdc.c:506]
	acdc_CheckModel [cdc.c:541]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe5ec on the stack.
  * Address 0xefffe5ec is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
UMR: Uninitialized memory read (57 times):
  * This is occurring while in:
	acdc_Interesction [cdc.c:81]
	acdc_VI_Given_VIC_VR [cdc.c:130]
	acdc_CheckModelProcessTestLoad [cdc.c:196]
	acdc_CheckModelProcess [cdc.c:506]
	acdc_CheckModel [cdc.c:541]
	acdc_CheckAllModels [cdc.c:562]
  * Reading 4 bytes from 0xefffe5ec on the stack.
  * Address 0xefffe5ec is 4 bytes below frame pointer in function acdc_Interesction.

****  Purify instrumented _pureibs3 (pid 6327)  ****
Current file descriptors in use: 5
FIU: file descriptor 0: <stdin>
FIU: file descriptor 1: <stdout>
FIU: file descriptor 2: <stderr>
FIU: file descriptor 26: <reserved for Purify internal use>
FIU: file descriptor 27: <reserved for Purify internal use>

****  Purify instrumented _pureibs3 (pid 6327)  ****
Purify: Searching for all memory leaks...

Memory leaked: 0 bytes (0%); potentially leaked: 0 bytes (0%)

Purify Heap Analysis (combining suppressed and unsuppressed blocks)
                         Blocks      Bytes
              Leaked          0          0
  Potentially Leaked          0          0
              In-Use          0          0
  ----------------------------------------
     Total Allocated          0          0

****  Purify instrumented _pureibs3 (pid 6327)  ****
  * Program exited with status code 0.
  * 18 access errors, 3176 total occurrences.
  * 0 bytes leaked.
  * 0 bytes potentially leaked.
  * Basic memory usage (including Purify overhead):
      806204 code
      111276 data/bss
      352256 heap (peak use)
        4408 stack
  * Shared library memory usage (including Purify overhead):
      135729 libm.so.1_pure_p3_c0_410_551 (shared code)
        5872 libm.so.1_pure_p3_c0_410_551 (private data)
      804233 libc.so.1_pure_p3_c0_410_551 (shared code)
       34892 libc.so.1_pure_p3_c0_410_551 (private data)
        1640 libdl.so.1_pure_p3_c0_410_551 (shared code)
           4 libdl.so.1_pure_p3_c0_410_551 (private data)
        9576 libinternal_stubs.so.1 (shared code)
         324 libinternal_stubs.so.1 (private data)

----------
X-Sun-Data-Type: default
X-Sun-Data-Description: default
X-Sun-Data-Name: pure_ibis3_log2
X-Sun-Charset: us-ascii
X-Sun-Content-Lines: 81

****  Purify instrumented _pureibs3 (pid 6346 at Mon Mar  8 15:02:57 1999)
  * Purify 4.1 Solaris 2, Copyright (C) 1992-1997 Rational Software Corp. All rights reserved. 
  * For contact information type: "purify -help"
  * For TTY output, use the option "-windows=no"
  * Command-line: _pureibs3 series.ibs 
  * Options settings: -purify \
    -purify-home=/net/engage/usr2/CM/pure/purify-4.1-solaris2 
  * Purify licensed to ADS SOFTWARE INC
  * Purify checking enabled.

****  Purify instrumented _pureibs3 (pid 6346)  ****
Current file descriptors in use: 5
FIU: file descriptor 0: <stdin>
FIU: file descriptor 1: <stdout>
FIU: file descriptor 2: <stderr>
FIU: file descriptor 26: <reserved for Purify internal use>
FIU: file descriptor 27: <reserved for Purify internal use>

****  Purify instrumented _pureibs3 (pid 6346)  ****
Purify: Searching for all memory leaks...

Memory leaked: 32 bytes (100%); potentially leaked: 0 bytes (0%)

MLK: 12 bytes leaked in 3 blocks
  * This memory was allocated from:
	malloc         [rtlib.o]
	CMN_malloc     [cmn.c:345]
	CMN_ArgParsePlus [cmn.c:647]
	s_parseVds     [smos.c:265]
	SMOS_ReceiveLine [smos.c:138]
	MDL_ReceiveLine [mdl.c:889]
  * Block of 4 bytes (3 times); last block at 0x107848

MLK: 12 bytes leaked in 3 blocks
  * This memory was allocated from:
	malloc         [rtlib.o]
	CMN_malloc     [cmn.c:345]
	CMN_ArgParsePlus [cmn.c:687]
	s_parseVds     [smos.c:265]
	SMOS_ReceiveLine [smos.c:138]
	MDL_ReceiveLine [mdl.c:889]
  * Block of 4 bytes (3 times); last block at 0x107ec0

MLK: 8 bytes leaked in 2 blocks
  * This memory was allocated from:
	malloc         [rtlib.o]
	CMN_malloc     [cmn.c:345]
	DRVSH_New      [drvsh.c:92]
	MDL_ReceiveLine [mdl.c:713]
	s_sendLineVer3 [parse.c:817]
	PARSE          [parse.c:416]
  * Block of 4 bytes (2 times); last block at 0x107b00

Purify Heap Analysis (combining suppressed and unsuppressed blocks)
                         Blocks      Bytes
              Leaked          8         32
  Potentially Leaked          0          0
              In-Use          0          0
  ----------------------------------------
     Total Allocated          8         32

****  Purify instrumented _pureibs3 (pid 6346)  ****
  * Program exited with status code 0.
  * 0 access errors, 0 total occurrences.
  * 32 bytes leaked.
  * 0 bytes potentially leaked.
  * Basic memory usage (including Purify overhead):
      806204 code
      111276 data/bss
       49152 heap (peak use)
        4416 stack
  * Shared library memory usage (including Purify overhead):
      135729 libm.so.1_pure_p3_c0_410_551 (shared code)
        5872 libm.so.1_pure_p3_c0_410_551 (private data)
      804233 libc.so.1_pure_p3_c0_410_551 (shared code)
       34892 libc.so.1_pure_p3_c0_410_551 (private data)
        1640 libdl.so.1_pure_p3_c0_410_551 (shared code)
           4 libdl.so.1_pure_p3_c0_410_551 (private data)
        9576 libinternal_stubs.so.1 (shared code)
         324 libinternal_stubs.so.1 (private data)

From owner-ibis  Mon Mar  8 15:38:47 1999
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From: nikolai@avanticorp.com
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Date: Mon, 8 Mar 1999 15:28:33 -0800 (PST)
Message-Id: <199903082328.PAA06496@iris.src.avanticorp.com>
To: ibis_users@eda.org
Subject: it was my mistake
X-Sun-Charset: US-ASCII

re:

:-) I am upgraiding ibis 2.1 parser in hspice to ibis 3.2
:-) It seems to me ibischk3 has problems which ibischk2 did not
:-) have: namely it has memory leaks and
:-) UMR (uninitialised memory read). It does not necesserily mean
:-) any error, but it would be certaintly better to avoid any UMR, etc.

.... etc

I think I've sent this to a wrong place, sorry for that

Nik
From owner-ibis  Tue Mar  9 06:41:11 1999
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Sender: laplan@tellabs.com
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Date: Tue, 09 Mar 1999 08:35:01 -0600
From: Sandra Laplanche <laplan@tellabs.com>
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To: ibis-users@eda.org
CC: laplan@tellabs.com
Subject: How to model a bidirectional trisate device with the input grounded.
Content-Type: multipart/mixed; boundary="------------404E71479D4"

This is a multi-part message in MIME format.

--------------404E71479D4
Content-Type: text/plain; charset=us-ascii
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To whom it may concern:

My question is how to create an .s2i file for a bidirectional tristate
device connected like this.  The input (IN) is connected to GND within
the chip, the CIN is directed into the chip and is not accessible to me.
The OUT is the output pin and it is the only one that is accessible to
me. The OEN line is the output enable which is also internal to the chip
hence not accessible and it is active low.  Hence, the OEN is the only
signal that can cause a transition at the output pin.  I need also need
the .s2i file to generate an rising and falling curve.  I have attached
the hspice file.




              /|
      CIN____/ |____ 
             \ |    |
              \|    | 
                    |
            |\      |
     IN ____| \_____|_____ OUT
       |    | /
      ----  |/o                
       --     |
              |
              |
               OEN



Pleae reply to laplan@tellabs.com

--------------404E71479D4
Content-Type: text/plain; charset=us-ascii; name="fsel.sp"
Content-Transfer-Encoding: 7bit
Content-Disposition: inline; filename="fsel.sp"

* Subcircuit pc3b05 PAD I OEN CIN
*.SUBCKT pc3b05 PAD I OEN CIN 

.LIB '/home/tellabf/vlsitool/vlsi_tech_libraries/hspice_vcmn4/vcmn4.lib' TY
.INCLUDE '/home/tellabf/vlsitool/vlsi_tech_libraries/hspice_vcmn4/vcmn4.inc'

M1      U15_U12_U6_drain U15_oenb VDD     VDD     P   L=.40U  
+  W=12.00U  
M2      U15_oenb OEN     VDD     VDD     P   L=.40U  W=12.00U  
M3      U15_U12_U6_drain U15_oenb VSS     VSS     N   L=.40U  W=9.60U 
M4      U15_U12_U7_drain U15_oenb U15_U12_U6_drain VSS     N   L=.40U 
+   W=9.60U  
M5      U15_bulkdriver VDD     U15_U12_U7_drain VSS     N   L=.40U  
+  W=9.60U  
M6      U15_bulkdriver U15_U12_U6_drain U15_U12_U10_sour VSS     N   
+  L=.40U  W=9.60U  
M7      U15_U12_U10_sour U26_padinv U15_oenb VSS     N   L=.40U  
+  W=9.60U  
M8      U15_oenb OEN     VSS     VSS     N   L=.40U  W=9.60U  
M9      U15_n_gate I       VSS     VSS     N   L=.40U  W=19.20U  
M10     U15_p_gate U15_oenb U15_n_gate VSS     N   L=.40U  W=19.20U  
M11     U15_p_gate I       VDD     VDD     P   L=.40U  W=24.00U  
M12     U15_n_gate OEN     U15_p_gate VDD     P   L=.40U  W=24.00U  
M13     U15_n_gate OEN     VSS     VSS     N   L=.40U  W=9.60U  
M14     U15_p_gate U15_oenb VDD     VDD     P   L=.40U  W=12.00U  
M15     U18_pad5vtol VDD     PAD     VSS     N   L=1.00U  W=49.95U  
M16     U18_floatbulk U15_bulkdriver VDD    U18_floatbulk P   L=.50U 
+   W=40.00U  
M17     U15_bulkdriver VDD    PAD     U18_floatbulk P   L=.50U  
+  W=10.00U  
M18     U16_pfb VDD    PAD     U18_floatbulk P   L=.50U  W=10.00U  
M19     U17_nbw VSS    VSS    VSS     N   L=.40U  W=48.00U  
M20     U17_nfb U18_pad5vtol U17_nbw VSS     N   L=.40U  W=48.00U  
M21     U17_nfb VSS    VDD    VDD     P   L=.40U  W=6.00U  
M22     U26_padinv U18_pad5vtol VDD     VDD     P   L=.40U  W=24.00U  
M23     U18_pad5vtol U26_padinv VDD     VDD     P   L=.50U  W=.90U  
M24     CIN     U26_padinv VDD     VDD     P   L=.40U  W=36.00U  
M25     U26_padinv U18_pad5vtol VSS     VSS     N   L=.40U  W=9.60U  
M26     CIN     U26_padinv VSS     VSS     N   L=.40U  W=19.20U  
M27     U16_pfb PAD     U16_M72$5_source U18_floatbulk P   L=.50U  
+  W=10.00U  
M28     U16_pfb PAD     U16_M72$4_source U18_floatbulk P   L=.50U  
+  W=10.00U  
M29     U16_pfb PAD     U16_M72$3_source U18_floatbulk P   L=.50U  
+  W=10.00U  
M30     U16_pfb PAD     U16_M72$2_source U18_floatbulk P   L=.50U  
+  W=10.00U  
M31     U16_pfb PAD     U16_M72$1_source U18_floatbulk P   L=.50U  
+  W=10.00U  
M32     U16_pfb PAD     U16_M72$0_source U18_floatbulk P   L=.50U  
+  W=10.00U  
M33     U16_M72$5_source VDD    VDD    U18_floatbulk P   L=.50U  
+  W=10.00U  
M34     U16_M72$4_source VDD    VDD    U18_floatbulk P   L=.50U  
+  W=10.00U  
M35     U16_M72$3_source VDD    VDD    U18_floatbulk P   L=.50U  
+  W=10.00U  
M36     U16_M72$2_source VDD    VDD    U18_floatbulk P   L=.50U  
+  W=10.00U  
M37     U16_M72$1_source VDD    VDD    U18_floatbulk P   L=.50U  
+  W=10.00U  
M38     U16_M72$0_source VDD    VDD    U18_floatbulk P   L=.50U  
+  W=10.00U  
M39     U16_U1_drain U15_oenb VSS    VSS     N   L=.40U  W=9.60U  
M40     U16_pfb VDD    U16_U1_drain VSS     N   L=.40U  W=9.60U  
M41     PAD     U17_nfb U19_M62$5_source VSS     N   L=.50U  W=54.00U 
M42     PAD     U17_nfb U19_M62$4_source VSS     N   L=.50U  W=54.00U 
M43     PAD     U17_nfb U19_M62$3_source VSS     N   L=.50U  W=54.00U 
M44     PAD     U17_nfb U19_M62$2_source VSS     N   L=.50U  W=54.00U 
M45     PAD     U17_nfb U19_M62$1_source VSS     N   L=.50U  W=54.00U 
M46     PAD     U17_nfb U19_M62$0_source VSS     N   L=.50U  W=54.00U 
M47     U19_M62$5_source U15_n_gate VSS    VSS     N   L=.50U  
+  W=54.00U  
M48     U19_M62$4_source U15_n_gate VSS    VSS     N   L=.50U  
+  W=54.00U  
M49     U19_M62$3_source U15_n_gate VSS    VSS     N   L=.50U  
+  W=54.00U  
M50     U19_M62$2_source U15_n_gate VSS    VSS     N   L=.50U  
+  W=54.00U  
M51     U19_M62$1_source U15_n_gate VSS    VSS     N   L=.50U  
+  W=54.00U  
M52     U19_M62$0_source U15_n_gate VSS    VSS     N   L=.50U  
+  W=54.00U  
M53     U21_M61$11_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M54     U21_M61$10_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M55     U21_M61$9_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M56     U21_M61$8_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M57     U21_M61$7_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M58     U21_M61$6_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M59     U21_M61$5_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M60     U21_M61$4_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M61     U21_M61$3_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M62     U21_M61$2_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M63     U21_M61$1_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M64     U21_M61$0_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
+  W=66.80U  
M65     PAD     U16_pfb U21_M61$11_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M66     PAD     U16_pfb U21_M61$10_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M67     PAD     U16_pfb U21_M61$9_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M68     PAD     U16_pfb U21_M61$8_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M69     PAD     U16_pfb U21_M61$7_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M70     PAD     U16_pfb U21_M61$6_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M71     PAD     U16_pfb U21_M61$5_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M72     PAD     U16_pfb U21_M61$4_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M73     PAD     U16_pfb U21_M61$3_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M74     PAD     U16_pfb U21_M61$2_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M75     PAD     U16_pfb U21_M61$1_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M76     PAD     U16_pfb U21_M61$0_drain U18_floatbulk P   L=.50U  
+  W=66.80U  
M79     U25_MNUN3$1_drai U25_R1_r1 VSS    VSS     N   L=.50U  
+  W=54.00U  
M80     U25_MNUN3$0_drai U25_R1_r1 VSS    VSS     N   L=.50U  
+  W=54.00U  
M81     PAD     U25_R2_r2 U25_MNUN3$1_drai VSS     N   L=.50U  
+  W=54.00U  
M82     PAD     U25_R2_r2 U25_MNUN3$0_drai VSS     N   L=.50U  
+  W=54.00U  
R77 U25_R1_r1 VSS 1.2000K  $[NW] 
R78 VDD U25_R2_r2 1.2000K  $[NW] 

.END


--------------404E71479D4--

From owner-ibis  Wed Mar 10 20:52:45 1999
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From: "SHRIPAD RAJ" <adsraj@hotmail.com>
To: ibis-users@eda.org
Subject: Getting min max waveforms
Date: Wed, 10 Mar 1999 20:46:54 PST
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IBIS gurus,

While  generating min and max V-T tables in an IBIS model, is it 
necessary to change the level and edge rate of the stimulus?

Thanks

Shripad
Get Your Private, Free Email at http://www.hotmail.com
From owner-ibis  Thu Mar 11 09:05:31 1999
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Date: Thu, 11 Mar 1999 10:59:38 -0800
Subject: Re: Getting min max waveforms
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My thoughts:

The level of the stimulus should (at least for CMOS) be 0 to VCC and
vary with VCC.

If the VT models are going to be accurate, then you should be simulating
enough of the output driver that the edge rate should be a secondary
effect (ie. if you are close to the internal edge rate of the part then
the output answer should not be affected).

This is all assuming that you are generating the VT curves from a SPICE
or other analog simulation.



SHRIPAD RAJ wrote:

> IBIS gurus,
>
> While  generating min and max V-T tables in an IBIS model, is it
> necessary to change the level and edge rate of the stimulus?
>
> Thanks
>
> Shripad
> Get Your Private, Free Email at http://www.hotmail.com



From owner-ibis  Thu Mar 11 15:29:40 1999
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From: gedlund@us.ibm.com
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The IBIS Accuracy Subcommittee has been considering submitting a new BIRD
that would allow for a wider variety of golden waveforms to be included in
an IBIS datasheet (model).  Right now these new golden waveforms would
correspond to the additional test loads described in section 3 of the IBIS
Accuracy Specification, but we will certainly be adding more test loads to
the list as we examine different kinds of I/O buffers and their associated
electrical behavior.  At the 2/26 IBIS Users Group conference call, Bob
Ross suggested we run this by the IBIS reflector to solicit your input, so
here it is.  The two main questions are:

1)  Is it necessary to describe the test loads in a machine-readable
fashion, similar to the distributed package model and EBD options already
present in IBIS?  Or should we opt for the more simple approach of adding a
waveform with comments describing the test load?

2)  How does one distinguish between a golden waveform (w/ package) and a
regular old VT table (w/o package) in IBIS?

For those of you who were not at the DesignCon99 Summit, the IBIS Accuracy
Subcommittee presented a two-stage approach to documenting the correlation
results of an IBIS datasheet.  Both stages involve embedding a golden
waveform, derived from SPICE, into the IBIS datasheet.  The semiconductor
vendor can correlate the lab data to these golden waveforms and report the
correlation results in the "accuracy trailer," a comment section appended
to the IBIS datasheet.  Using these same golden waveforms, the user can
correlate behavioral simulations and take up any significant discrepancies
with the simulator vendor.  Question 1 above refers to automating the
second step of the correlation process.  Of course, the user can always
capture the test load manually using the simulator's schematic capture
tool.

Greg Edlund
Advisory Engineer, Critical Net Analysis
IBM
3650 Hwy. 52 N, Dept. HDC
Rochester, MN 55901
gedlund@us.ibm.com


From owner-ibis  Thu Mar 11 18:49:14 1999
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From: "Chris Rokusek" <crokusek@viewlogic.com>
To: <gedlund@us.ibm.com>, <ibis-users@vhdl.org>
Subject: Re: accuracy BIRD
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Greg,

Golden Waveforms are a great idea!

>1)  Is it necessary to describe the test loads in a machine-readable
>fashion, similar to the distributed package model and EBD options already
>present in IBIS?  Or should we opt for the more simple approach of adding a
>waveform with comments describing the test load?

A "machine readable" format is prefered in order to facilitate automated
validation.

You mention using SPICE as the waveform creator so are transmission lines
and package info really needed?

If you're going to standardize the golden waveform loads, I suggest:

  1) No Transmission lines (we're not testing the accuracy of T-Line
modeling or
     T-line extraction parameters are we?).

  2) No package parasitics (or they are spelled out explicity within the
waveform).

  3) A Shunt R to the Positive Rail, the Negative Rail and halfway in
between.  R should be
     near the impedence of the Transmission line the driver expects to see.

  4) A Shunt C=50pF may prove informative also.


>2)  How does one distinguish between a golden waveform (w/ package) and a
>regular old VT table (w/o package) in IBIS?

I claim that a regular old VT table **IS** a golden waveform.

It doesn't seem appropriate to place waveforms that use a particular package
"within the [Model] block" using IBIS since a particular [Model] block may
be used in with different packages.  The [Model] block is meant to represent
the output stage w/o (independent of) the package parasitics.

If waveforms with particular package parameters are generated then they
would have to be spelled out in some parseable format at the location of the
waveform.  Otherwise, there is the danger that someone will edit the package
information at the top of the .ibs file and not re-generate the waveforms.

Regards,

Chris Rokusek
Viewlogic Systems





From owner-ibis  Fri Mar 12 15:06:32 1999
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Hi Fred and Chris,

Thanks for taking the time to provide some input.

Yes, Fred, what we had in mind was additional VT tables that contain
waveforms you would measure at the pin of a DUT, including the package.  We
have defined some new test loads in section 3 of the IBIS Accuracy Spec,
and we would like to describe these test loads as well.

Chris, the Accuracy Subcommittee felt it was important to define some more
complex loads.  We added the open-ended transmission line and the
transmission line + receiver loads to facility checking of reflection
coefficients and clamp diodes.  I think it is necessary to have waveforms
that include the package because the package is there when you make the
measurements to do the correlation.  But we don't need to describe the
package since it's already a part of the IBIS datasheet.

On the question of "golden waveforms" vs. "regular old VT tables," Stephen
Peters mentioned that there is a difference between the two.  Golden
waveforms have the package while regular old VT tables do not.  Is there
any syntactical construct within IBIS to differentiate between the two?
Care to embellish here, Stephen?

Thanks all.

Greg



gedlund@us.ibm.com wrote:
>
> The IBIS Accuracy Subcommittee has been considering submitting a new BIRD
> that would allow for a wider variety of golden waveforms to be included
in
> an IBIS datasheet (model).  Right now these new golden waveforms would
> correspond to the additional test loads described in section 3 of the
IBIS
> Accuracy Specification, but we will certainly be adding more test loads
to
> the list as we examine different kinds of I/O buffers and their
associated
> electrical behavior.  At the 2/26 IBIS Users Group conference call, Bob
> Ross suggested we run this by the IBIS reflector to solicit your input,
so
> here it is.  The two main questions are:
>
> 1)  Is it necessary to describe the test loads in a machine-readable
> fashion, similar to the distributed package model and EBD options already
> present in IBIS?  Or should we opt for the more simple approach of adding
a
> waveform with comments describing the test load?

I presume you mean another v/t curve in text fashion and the load
description along
with which package parasitics you are using. IBIS allows up to 100 v/t
curves so the
bird may be only to add parasitic package information.
>
> 2)  How does one distinguish between a golden waveform (w/ package) and a
> regular old VT table (w/o package) in IBIS?

This presumably is where you may need an additional key work in the v/t
data. Not
so hard to do.
>
> For those of you who were not at the DesignCon99 Summit, the IBIS
Accuracy
> Subcommittee presented a two-stage approach to documenting the
correlation
> results of an IBIS datasheet.  Both stages involve embedding a golden
> waveform, derived from SPICE, into the IBIS datasheet.  The semiconductor
> vendor can correlate the lab data to these golden waveforms and report
the
> correlation results in the "accuracy trailer," a comment section appended
> to the IBIS datasheet.  Using these same golden waveforms, the user can
> correlate behavioral simulations and take up any significant
discrepancies
> with the simulator vendor.  Question 1 above refers to automating the
> second step of the correlation process.  Of course, the user can always
> capture the test load manually using the simulator's schematic capture
> tool.
>
> Greg Edlund
> Advisory Engineer, Critical Net Analysis
> IBM
> 3650 Hwy. 52 N, Dept. HDC
> Rochester, MN 55901
> gedlund@us.ibm.com

--
Fred Balistreri
fred@apsimtech.com

http://www.apsimtech.com



Greg,

Golden Waveforms are a great idea!

>1)  Is it necessary to describe the test loads in a machine-readable
>fashion, similar to the distributed package model and EBD options already
>present in IBIS?  Or should we opt for the more simple approach of adding
a
>waveform with comments describing the test load?

A "machine readable" format is prefered in order to facilitate automated
validation.

You mention using SPICE as the waveform creator so are transmission lines
and package info really needed?

If you're going to standardize the golden waveform loads, I suggest:

  1) No Transmission lines (we're not testing the accuracy of T-Line
modeling or
     T-line extraction parameters are we?).

  2) No package parasitics (or they are spelled out explicity within the
waveform).

  3) A Shunt R to the Positive Rail, the Negative Rail and halfway in
between.  R should be
     near the impedence of the Transmission line the driver expects to see.

  4) A Shunt C=50pF may prove informative also.


>2)  How does one distinguish between a golden waveform (w/ package) and a
>regular old VT table (w/o package) in IBIS?

I claim that a regular old VT table **IS** a golden waveform.

It doesn't seem appropriate to place waveforms that use a particular
package
"within the [Model] block" using IBIS since a particular [Model] block may
be used in with different packages.  The [Model] block is meant to
represent
the output stage w/o (independent of) the package parasitics.

If waveforms with particular package parameters are generated then they
would have to be spelled out in some parseable format at the location of
the
waveform.  Otherwise, there is the danger that someone will edit the
package
information at the top of the .ibs file and not re-generate the waveforms.

Regards,

Chris Rokusek
Viewlogic Systems


From owner-ibis  Fri Mar 12 16:06:43 1999
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Date: Fri, 12 Mar 1999 16:00:33 -0800 (PST)
From: Syed Huq <shuq@cisco.com>
Reply-To: Syed Huq <shuq@cisco.com>
Subject: Re: accuracy BIRD
To: ibis-users@vhdl.org, gedlund@us.ibm.com
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Hi,

Since the V/T tables allow keywords such as C_dut, R_dut, L_dut, doesn't
that imply that it DOES use the package numbers. I am a bit confused about
Stephen's statement below regarding old VT tables..

Syed.
Cisco Systems, Inc

> 
> On the question of "golden waveforms" vs. "regular old VT tables," Stephen
> Peters mentioned that there is a difference between the two.  Golden
> waveforms have the package while regular old VT tables do not.  Is there
> any syntactical construct within IBIS to differentiate between the two?
> Care to embellish here, Stephen?
> 
> Thanks all.
> 
> Greg
> 
> 
>

From owner-ibis  Fri Mar 12 20:00:24 1999
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Date: Fri, 12 Mar 1999 21:54:22 -0800
Subject: Re: accuracy BIRD
To: gedlund@us.ibm.com
Cc: ibis-users@vhdl.org
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Actually,
I feel that any waveforms that completely describe the test conditions are
valid QA applicable "Golden" Waveforms. The important thing is being able to
test the simulation back to the original IBIS data. Thus, even the model
generation VT curves do supply a certain valuable form of test and QA
criterion. Of course, Any additional waveforms with more complex packaging add
additional test and sanity.

see, I agreed with everyone.

jon


gedlund@us.ibm.com wrote:

> Hi Fred and Chris,
>
> Thanks for taking the time to provide some input.
>
> Yes, Fred, what we had in mind was additional VT tables that contain
> waveforms you would measure at the pin of a DUT, including the package.  We
> have defined some new test loads in section 3 of the IBIS Accuracy Spec,
> and we would like to describe these test loads as well.
>
> Chris, the Accuracy Subcommittee felt it was important to define some more
> complex loads.  We added the open-ended transmission line and the
> transmission line + receiver loads to facility checking of reflection
> coefficients and clamp diodes.  I think it is necessary to have waveforms
> that include the package because the package is there when you make the
> measurements to do the correlation.  But we don't need to describe the
> package since it's already a part of the IBIS datasheet.
>
> On the question of "golden waveforms" vs. "regular old VT tables," Stephen
> Peters mentioned that there is a difference between the two.  Golden
> waveforms have the package while regular old VT tables do not.  Is there
> any syntactical construct within IBIS to differentiate between the two?
> Care to embellish here, Stephen?
>
> Thanks all.
>
> Greg
>
> gedlund@us.ibm.com wrote:
> >
> > The IBIS Accuracy Subcommittee has been considering submitting a new BIRD
> > that would allow for a wider variety of golden waveforms to be included
> in
> > an IBIS datasheet (model).  Right now these new golden waveforms would
> > correspond to the additional test loads described in section 3 of the
> IBIS
> > Accuracy Specification, but we will certainly be adding more test loads
> to
> > the list as we examine different kinds of I/O buffers and their
> associated
> > electrical behavior.  At the 2/26 IBIS Users Group conference call, Bob
> > Ross suggested we run this by the IBIS reflector to solicit your input,
> so
> > here it is.  The two main questions are:
> >
> > 1)  Is it necessary to describe the test loads in a machine-readable
> > fashion, similar to the distributed package model and EBD options already
> > present in IBIS?  Or should we opt for the more simple approach of adding
> a
> > waveform with comments describing the test load?
>
> I presume you mean another v/t curve in text fashion and the load
> description along
> with which package parasitics you are using. IBIS allows up to 100 v/t
> curves so the
> bird may be only to add parasitic package information.
> >
> > 2)  How does one distinguish between a golden waveform (w/ package) and a
> > regular old VT table (w/o package) in IBIS?
>
> This presumably is where you may need an additional key work in the v/t
> data. Not
> so hard to do.
> >
> > For those of you who were not at the DesignCon99 Summit, the IBIS
> Accuracy
> > Subcommittee presented a two-stage approach to documenting the
> correlation
> > results of an IBIS datasheet.  Both stages involve embedding a golden
> > waveform, derived from SPICE, into the IBIS datasheet.  The semiconductor
> > vendor can correlate the lab data to these golden waveforms and report
> the
> > correlation results in the "accuracy trailer," a comment section appended
> > to the IBIS datasheet.  Using these same golden waveforms, the user can
> > correlate behavioral simulations and take up any significant
> discrepancies
> > with the simulator vendor.  Question 1 above refers to automating the
> > second step of the correlation process.  Of course, the user can always
> > capture the test load manually using the simulator's schematic capture
> > tool.
> >
> > Greg Edlund
> > Advisory Engineer, Critical Net Analysis
> > IBM
> > 3650 Hwy. 52 N, Dept. HDC
> > Rochester, MN 55901
> > gedlund@us.ibm.com
>
> --
> Fred Balistreri
> fred@apsimtech.com
>
> http://www.apsimtech.com
>
> Greg,
>
> Golden Waveforms are a great idea!
>
> >1)  Is it necessary to describe the test loads in a machine-readable
> >fashion, similar to the distributed package model and EBD options already
> >present in IBIS?  Or should we opt for the more simple approach of adding
> a
> >waveform with comments describing the test load?
>
> A "machine readable" format is prefered in order to facilitate automated
> validation.
>
> You mention using SPICE as the waveform creator so are transmission lines
> and package info really needed?
>
> If you're going to standardize the golden waveform loads, I suggest:
>
>   1) No Transmission lines (we're not testing the accuracy of T-Line
> modeling or
>      T-line extraction parameters are we?).
>
>   2) No package parasitics (or they are spelled out explicity within the
> waveform).
>
>   3) A Shunt R to the Positive Rail, the Negative Rail and halfway in
> between.  R should be
>      near the impedence of the Transmission line the driver expects to see.
>
>   4) A Shunt C=50pF may prove informative also.
>
> >2)  How does one distinguish between a golden waveform (w/ package) and a
> >regular old VT table (w/o package) in IBIS?
>
> I claim that a regular old VT table **IS** a golden waveform.
>
> It doesn't seem appropriate to place waveforms that use a particular
> package
> "within the [Model] block" using IBIS since a particular [Model] block may
> be used in with different packages.  The [Model] block is meant to
> represent
> the output stage w/o (independent of) the package parasitics.
>
> If waveforms with particular package parameters are generated then they
> would have to be spelled out in some parseable format at the location of
> the
> waveform.  Otherwise, there is the danger that someone will edit the
> package
> information at the top of the .ibs file and not re-generate the waveforms.
>
> Regards,
>
> Chris Rokusek
> Viewlogic Systems



From owner-ibis  Mon Mar 15 09:59:55 1999
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Subject: Re: accuracy BIRD 
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             <199903130000.QAA24887@jasper.cisco.com> 
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From: Stephen Peters <sjpeters@ichips.intel.com>


Hello Syed, Greg:

  Sorry for the delayed response -- I was out of the office back week and
am just now getting back to my mail.  To elaborate:  I was trying to make
a distinction between at V/T table that is created by an output driving a
pure, non-reactive impedance, and a V/T table created with the output driving
a more complex load.  The *former* V/T table contains the data the simulator
needs/uses when building the output model.  Specifically, it describes how
the pullup and pulldown transistor turn on/off, and does not -- indeed, should
not -- contain any extra time constants due to reactive elements.   In the
latter case (complex, reactive impedences) the inclusion of these waveforms
is a check.  Given the model that was build with the first V/T tables, the 
question is can the simulator produce the waveform of the second case.

Hope this helps clarify things.

 Regards,
 Stephen Peters
 Intel Corp.


> Hi,
> 
> Since the V/T tables allow keywords such as C_dut, R_dut, L_dut, doesn't
> that imply that it DOES use the package numbers. I am a bit confused about
> Stephen's statement below regarding old VT tables..
> 
> Syed.
> Cisco Systems, Inc
> 
> > 
> > On the question of "golden waveforms" vs. "regular old VT tables," Stephen
> > Peters mentioned that there is a difference between the two.  Golden
> > waveforms have the package while regular old VT tables do not.  Is there
> > any syntactical construct within IBIS to differentiate between the two?
> > Care to embellish here, Stephen?
> > 
> > Thanks all.
> > 
> > Greg
> > 
> > 
> >


From owner-ibis  Mon Mar 15 10:15:04 1999
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From: Ken Willis <kwillis@cadence.com>
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Cadence is looking for a software developer at the Chelmsford, MA
campus, to work on board and package level high speed interconnect
design software. We are looking for familiarity with SPICE and high
speed design issues. The open position is focused on software for
creating, manipulating, and simulating SI models that use a combination
of SPICE and IBIS-style behavioral model constructs, so the ability
to develop models is important.

Qualifications:
- BSEE or MSEE
- familiarity with Unix and Microsoft Windows NT
- 3+ years of software development experience in C/C++
- experience developing SPICE or behavioral signal integrity models

Some travel is required. An engineer that is strong in both signal
integrity issues and team software development would be ideal. Please
contact me at:

Ken Willis
Manager, High Speed Interconnect Design R&D
Cadence Design Systems
Chelmsford, MA 01824
kwillis "at" cadence "dot" com
From owner-ibis  Mon Mar 15 10:23:42 1999
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Whoops! I posted this to the reflector I was NOT going to post to.
Sorry about that.

Ken

Ken Willis wrote:
> 
> Cadence is looking for a software developer at the Chelmsford, MA
> campus, to work on board and package level high speed interconnect
> design software. We are looking for familiarity with SPICE and high
> speed design issues. The open position is focused on software for
> creating, manipulating, and simulating SI models that use a combination
> of SPICE and IBIS-style behavioral model constructs, so the ability
> to develop models is important.
> 
> Qualifications:
> - BSEE or MSEE
> - familiarity with Unix and Microsoft Windows NT
> - 3+ years of software development experience in C/C++
> - experience developing SPICE or behavioral signal integrity models
> 
> Some travel is required. An engineer that is strong in both signal
> integrity issues and team software development would be ideal. Please
> contact me at:
> 
> Ken Willis
> Manager, High Speed Interconnect Design R&D
> Cadence Design Systems
> Chelmsford, MA 01824
> kwillis "at" cadence "dot" com
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Stephen,

Thanks for the insight.  This clears up my question, and I believe Syed's,
too.  Actually, I went back and re-read section 3.2.2 of the Cookbook, and
you said it quite well there.  The simulator NEEDS the no-load VT tables to
generate a realistic stimulus, if you will.  The VT tables with a complex
load are icing on the cake and useful for verifying simulator results.

What the Accuracy Subcommittee is proposing is some new complex loads that
involve transmission lines.  (And we'll probably come up with more when we
start looking at more advanced drivers.)  We can use these extra loads to
validate both lab results AND simulator results against the "golden
waveforms" in the IBIS datasheet - a cool thing.  The real question is,
should we add some new keywords and/or subparameters to describe these new
loads, thereby facilitating automated simulation and correlation, or should
we count on comments to describe the load.  I like the automated approach
myself, but I agree with Bob Ross:  let's not make the IBIS Accuracy Spec
dependent on which of the two approaches we choose to use.  That way we can
proceed with getting it approved.

Thank you all for your input.

Greg Edlund
Advisory Engineer, Critical Net Analysis
IBM
3650 Hwy. 52 N, Dept. HDC
Rochester, MN 55901
gedlund@us.ibm.com


---------------------- Forwarded by Gregory R Edlund/Rochester/IBM on
03/15/99 12:06 PM ---------------------------


Stephen Peters <sjpeters@ichips.intel.com> on 03/15/99 11:54:07 AM

To:   Syed Huq <shuq@cisco.com>
cc:   ibis-users@vhdl.org, Gregory R Edlund/Rochester/IBM
Subject:  Re: accuracy BIRD






Hello Syed, Greg:

  Sorry for the delayed response -- I was out of the office back week and
am just now getting back to my mail.  To elaborate:  I was trying to make
a distinction between at V/T table that is created by an output driving a
pure, non-reactive impedance, and a V/T table created with the output
driving
a more complex load.  The *former* V/T table contains the data the
simulator
needs/uses when building the output model.  Specifically, it describes how
the pullup and pulldown transistor turn on/off, and does not -- indeed,
should
not -- contain any extra time constants due to reactive elements.   In the
latter case (complex, reactive impedences) the inclusion of these waveforms
is a check.  Given the model that was build with the first V/T tables, the
question is can the simulator produce the waveform of the second case.

Hope this helps clarify things.

 Regards,
 Stephen Peters
 Intel Corp.


> Hi,
>
> Since the V/T tables allow keywords such as C_dut, R_dut, L_dut, doesn't
> that imply that it DOES use the package numbers. I am a bit confused
about
> Stephen's statement below regarding old VT tables..
>
> Syed.
> Cisco Systems, Inc
>
> >
> > On the question of "golden waveforms" vs. "regular old VT tables,"
Stephen
> > Peters mentioned that there is a difference between the two.  Golden
> > waveforms have the package while regular old VT tables do not.  Is
there
> > any syntactical construct within IBIS to differentiate between the two?
> > Care to embellish here, Stephen?
> >
> > Thanks all.
> >
> > Greg
> >
> >
> >





From owner-ibis  Mon Mar 15 12:30:46 1999
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From: "Chris Rokusek" <crokusek@viewlogic.com>
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Subject: Re: accuracy BIRD
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Greg,

I understand why you want to distinguish between the a waveform with and
without packaging parasitics.  However, there is a another problem that I
think the "Golden Waveforms" specification you are coming up with can solve
with little impact.

The problem is that many model makers do NOT read the cookbook.  Often the
most important waveforms (w/o the parasitics) are not present.  If there is
going to yet another document that model makers will refer to when building
models, that document may suffer this same fate as the IBIS Cookbook.  A
model maker may read one document and not the other.

If both documents are referring to the construction of VT waveforms, they
should probably be rolled into ONE document so that the "publicity" of one
is leveraged by the other.  It creates one-stop-shopping for the model
maker.  We want to make it easy for the model maker.

Stephen, do you approve/dissaprove of combining the documents?

If you must create a seperate document, then I think the "Golden Waveforms"
should INCLUDE the specification for waveforms found in the cookbook (w/o
parasitics) as the most important waveforms.  So the LEVEL I would be w/o
parasitics, LEVEL II be with.  At a minimum the new spec must make an
"imperative reference" to the cookbook for 3.2.2.

The bottom line is if a user only reads this new Accuracy specification and
not the Cookbook then all is lost because the maker wouldn't include the
most important waveforms and your goals would not be attainable (nor would
ours).

Thanks for your consideration,

Chris Rokusek
Viewlogic Systems


-----Original Message-----
From: gedlund@us.ibm.com <gedlund@us.ibm.com>
To: ibis-users@vhdl.org <ibis-users@vhdl.org>
Date: Monday, March 15, 1999 11:39 AM
Subject: Re: accuracy BIRD


>Stephen,
>
>Thanks for the insight.  This clears up my question, and I believe Syed's,
>too.  Actually, I went back and re-read section 3.2.2 of the Cookbook, and
>you said it quite well there.  The simulator NEEDS the no-load VT tables to
>generate a realistic stimulus, if you will.  The VT tables with a complex
>load are icing on the cake and useful for verifying simulator results.
>
>What the Accuracy Subcommittee is proposing is some new complex loads that
>involve transmission lines.  (And we'll probably come up with more when we
>start looking at more advanced drivers.)  We can use these extra loads to
>validate both lab results AND simulator results against the "golden
>waveforms" in the IBIS datasheet - a cool thing.  The real question is,
>should we add some new keywords and/or subparameters to describe these new
>loads, thereby facilitating automated simulation and correlation, or should
>we count on comments to describe the load.  I like the automated approach
>myself, but I agree with Bob Ross:  let's not make the IBIS Accuracy Spec
>dependent on which of the two approaches we choose to use.  That way we can
>proceed with getting it approved.
>
>Thank you all for your input.
>
>Greg Edlund
>Advisory Engineer, Critical Net Analysis
>IBM
>3650 Hwy. 52 N, Dept. HDC
>Rochester, MN 55901
>gedlund@us.ibm.com
>
>
>---------------------- Forwarded by Gregory R Edlund/Rochester/IBM on
>03/15/99 12:06 PM ---------------------------
>
>
>Stephen Peters <sjpeters@ichips.intel.com> on 03/15/99 11:54:07 AM
>
>To:   Syed Huq <shuq@cisco.com>
>cc:   ibis-users@vhdl.org, Gregory R Edlund/Rochester/IBM
>Subject:  Re: accuracy BIRD
>
>
>
>
>
>
>Hello Syed, Greg:
>
>  Sorry for the delayed response -- I was out of the office back week and
>am just now getting back to my mail.  To elaborate:  I was trying to make
>a distinction between at V/T table that is created by an output driving a
>pure, non-reactive impedance, and a V/T table created with the output
>driving
>a more complex load.  The *former* V/T table contains the data the
>simulator
>needs/uses when building the output model.  Specifically, it describes how
>the pullup and pulldown transistor turn on/off, and does not -- indeed,
>should
>not -- contain any extra time constants due to reactive elements.   In the
>latter case (complex, reactive impedences) the inclusion of these waveforms
>is a check.  Given the model that was build with the first V/T tables, the
>question is can the simulator produce the waveform of the second case.
>
>Hope this helps clarify things.
>
> Regards,
> Stephen Peters
> Intel Corp.
>
>
>> Hi,
>>
>> Since the V/T tables allow keywords such as C_dut, R_dut, L_dut, doesn't
>> that imply that it DOES use the package numbers. I am a bit confused
>about
>> Stephen's statement below regarding old VT tables..
>>
>> Syed.
>> Cisco Systems, Inc
>>
>> >
>> > On the question of "golden waveforms" vs. "regular old VT tables,"
>Stephen
>> > Peters mentioned that there is a difference between the two.  Golden
>> > waveforms have the package while regular old VT tables do not.  Is
>there
>> > any syntactical construct within IBIS to differentiate between the two?
>> > Care to embellish here, Stephen?
>> >
>> > Thanks all.
>> >
>> > Greg
>> >
>> >
>> >
>
>
>
>
>
>

From owner-ibis  Mon Mar 15 13:09:29 1999
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From: Fred Balistreri <fred@apsimtech.com>
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gedlund@us.ibm.com wrote:
> 
> Stephen,
> 
> Thanks for the insight.  This clears up my question, and I believe Syed's,
> too.  Actually, I went back and re-read section 3.2.2 of the Cookbook, and
> you said it quite well there.  The simulator NEEDS the no-load VT tables to
> generate a realistic stimulus, if you will.  The VT tables with a complex
> load are icing on the cake and useful for verifying simulator results.
> 
> What the Accuracy Subcommittee is proposing is some new complex loads that
> involve transmission lines.  (And we'll probably come up with more when we
> start looking at more advanced drivers.)  We can use these extra loads to
> validate both lab results AND simulator results against the "golden
> waveforms" in the IBIS datasheet - a cool thing.  The real question is,
> should we add some new keywords and/or subparameters to describe these new
> loads, thereby facilitating automated simulation and correlation, or should
> we count on comments to describe the load.  I like the automated approach
> myself, but I agree with Bob Ross:  let's not make the IBIS Accuracy Spec
> dependent on which of the two approaches we choose to use.  That way we can
> proceed with getting it approved.
> 
> Thank you all for your input.
> 
> Greg Edlund
> Advisory Engineer, Critical Net Analysis
> IBM
> 3650 Hwy. 52 N, Dept. HDC
> Rochester, MN 55901
> gedlund@us.ibm.com
> 
> ---------------------- Forwarded by Gregory R Edlund/Rochester/IBM on
> 03/15/99 12:06 PM ---------------------------
> 
> Stephen Peters <sjpeters@ichips.intel.com> on 03/15/99 11:54:07 AM
> 
> To:   Syed Huq <shuq@cisco.com>
> cc:   ibis-users@vhdl.org, Gregory R Edlund/Rochester/IBM
> Subject:  Re: accuracy BIRD
> 
> Hello Syed, Greg:
> 
>   Sorry for the delayed response -- I was out of the office back week and
> am just now getting back to my mail.  To elaborate:  I was trying to make
> a distinction between at V/T table that is created by an output driving a
> pure, non-reactive impedance, and a V/T table created with the output
> driving
> a more complex load.  The *former* V/T table contains the data the
> simulator
> needs/uses when building the output model.  Specifically, it describes how
> the pullup and pulldown transistor turn on/off, and does not -- indeed,
> should
> not -- contain any extra time constants due to reactive elements.   In the
> latter case (complex, reactive impedences) the inclusion of these waveforms
> is a check.  Given the model that was build with the first V/T tables, the
> question is can the simulator produce the waveform of the second case.
> 
> Hope this helps clarify things.
> 
>  Regards,
>  Stephen Peters
>  Intel Corp.
> 
> > Hi,
> >
> > Since the V/T tables allow keywords such as C_dut, R_dut, L_dut, doesn't
> > that imply that it DOES use the package numbers. I am a bit confused
> about
> > Stephen's statement below regarding old VT tables..
> >
> > Syed.
> > Cisco Systems, Inc
> >
> > >
> > > On the question of "golden waveforms" vs. "regular old VT tables,"
> Stephen
> > > Peters mentioned that there is a difference between the two.  Golden
> > > waveforms have the package while regular old VT tables do not.  Is
> there
> > > any syntactical construct within IBIS to differentiate between the two?
> > > Care to embellish here, Stephen?
> > >
> > > Thanks all.
> > >
> > > Greg
> > >
> > >
> > >
Actually there is always a load on the IBIS models I have seen. The load
is typically 50 ohms to gnd or vcc. Because of this the simulation 
vendors must extrapolate the no load answer. The DC loads are presumably
put there to determine turn off and turn on currents. One other comment.
The load is always a complex impedance. This is because c_comp is
required. 

Best Regards,
 

-- 
Fred Balistreri
fred@apsimtech.com

http://www.apsimtech.com
From owner-ibis  Mon Mar 15 15:23:58 1999
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Subject: IBIS Users Group Agenda 3/19/99
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IBIS Users Group Agenda

Date:               3/19/99
Time:               8:00 - 9:55 am PST
Phone number:  1-805-240-9673
Pass code:          773000


8:00 CHECK-IN

Introduction of new participants
Date for next conference call
Announcements
Corrections to previous meeting's minutes
Additions to the agenda


8:15 GENERAL BUSINESS

Receive an update from IBIS connector specification group.
Discuss need for further face to face IBIS user group meetings.
Discuss further project possibilities for the user group.


8:35 EDUCATION

Receive update from Ed Sayre.


8:55 IBIS ACCURACY SUBCOMMITTEE

Note:  The Accuracy Working Group should make decisions and assign work
during this meeting.  We should strive to conduct actual editing activities
off-line for the sake of productivity.

IBIS ACCURACY SPECIFICATION 1.2 REVISIONS

Greg Edlund will have a first pass at 1.2 available before the next
meeting.

ACCURACY-RELATED BIRD(S)

Discuss reactions from the IBIS community.
Decide on direction:
1) write BIRD now WITHOUT machine-readable description of test load
2) write BIRD later WITH machine-readable description of test load
In either case, IBIS Accuracy Spec 1.2 could proceed to EIA for approval.

EIA APPROVAL

Receive update from Bob Haller and Bob Ross.
Decide on which version of the spec to bring to EIA for approval.

IBIS ACCURACY SPECIFICATION 2.0 DEVELOPMENT

Review list of possible topics:
1. VT tables (This is a necessity.)
2. Additional model types, i.e. GTL, ECL, open source, etc.
3. Effect of R_load on simulation accuracy
4. Package modeling and simultaneous switching noise
5. Diode stored charge effects
6. Multi-staged drivers
7. Dynamic clamping

Take suggestions and priorities.

Proposal from Greg Edlund:  Bob Haller, Peter LaFlamme, and Greg Edlund
should each run Bob Ross' SPICE deck (from email entitled "IBIS to SPICE
Discussion") and understand fully how it works!  This will help us
understand VT tables.

TEST BOARD

Receive update from Bob Haller and Greg Edlund.  Bob Haller, Greg Edlund,
and Peter LaFlamme will compile a list of changes (very limited) should we
identify a design resource.
Receive update from Milt Schwartz.

ACCURACY ACTION ITEMS

Review list and add new items.

1.  Status: open.  Opened: 2/26/99  Owner: Greg Edlund.  Edit measurement
and correlation sections of the IBIS Accuracy Specification and distribute
the new document.

2.  Status: CLOSED.  Opened: 2/26/99  Owner: Greg Edlund.  Write email to
the
reflector soliciting input on the contents of an accuracy-related BIRD.  At
issue is whether or not to include a machine-readable description of the
test loads described in the IBIS Accuracy Specification.

3.  Status: open.  Opened: 2/26/99  Owner: Peter LaFlamme.  Make VCX16244
SPICE model and IBIS datasheet available on the accuracy web page.

4.  Status: CLOSED.  Opened: 2/26/99  Owner: Bob Haller, Greg Edlund.
Discuss test board changes off-line.

5.  Status: open.  Opened: 2/26/99  Owner: Milt Schwarz.  Get quote for
building revision 3 of the test board.

6.  Status: open.  Opened: 2/26/99  Owner: Greg Edlund.  Write test board
application note.

7.  Status: CLOSED.  Opened: 2/26/99  Owner: Greg Edlund.  Send out a note
to
the reflector suggesting possible candidates for accuracy development in
1999.


9:05 EDUCATION

Receive update from Ed Sayre.


9:55 SIGN-OFF


Greg Edlund
Advisory Engineer, Critical Net Analysis
IBM
3650 Hwy. 52 N, Dept. HDC
Rochester, MN 55901
gedlund@us.ibm.com


From owner-ibis  Mon Mar 15 15:33:48 1999
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From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
To: "\"gedlund@us.ibm.com\" " <gedlund@us.ibm.com>,
        "\"Fred Balistreri\" "
	 <fred@apsimtech.com>
Cc: "\"ibis-users@vhdl.org\" " <ibis-users@vhdl.org>
Subject: RE: accuracy BIRD
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Fred,

There is really no such thing as "no load answer".  The 50 Ohm resistor was 
invented because the transmission lines look like a resistor for the time 
duration while the wave is traveling down the line and back.  So the driver 
really never drives a "no load"...

Arpad
============================================================================
=


Actually there is always a load on the IBIS models I have seen. The load
is typically 50 ohms to gnd or vcc. Because of this the simulation
vendors must extrapolate the no load answer. The DC loads are presumably
put there to determine turn off and turn on currents. One other comment.
The load is always a complex impedance. This is because c_comp is
required.

Best Regards,


--
Fred Balistreri
fred@apsimtech.com

http://www.apsimtech.com
From owner-ibis  Mon Mar 15 15:42:24 1999
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From owner-ibis  Mon Mar 15 16:51:54 1999
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To: ibis-users@vhdl.org
Subject: ecl
X-Sun-Charset: US-ASCII


Hi IbiS Gurus

I am wondering if anybody can point me at a site(s) where I can
find ibis files with ECL models of all 4 ECL types.

If there is an expert in ECL-syntax could you please spend a minute
looking at this:

this is legal:
--------------
|Variable                  typ    min    max
[Voltage Range]            0.0    0.0    0.0
[Pulldown Reference]       0.0    0.0    0.0
[Power Clamp Reference]    0.0    0.0    0.0
[GND Clamp Reference]      -3.3   -3.0   -3.8


this is legal:
--------------
|Variable                   typ    min    max
[Voltage Range]             3.3    3.0    3.8
[Pulldown Reference]        3.3    3.0    3.8
[Power Clamp Reference]     3.3    3.0    3.8
[Gnd Clamp Reference]       0.0    0.0    0.0


howabout this?
-------------
|Variable                   typ    min    max
[Voltage Range]             3.3    3.0    3.8
[Pullup Reference]          3.3    3.0    3.8
[Power Clamp Reference]     3.3    3.0    3.8
[Gnd Clamp Reference]       0.0    0.0    0.0

I changed [Pulldown Reference] -> [Pullup Reference],
[Pulldown Reference] is omitted, so it defaults to zero.

ibischk3 does not complain, no warnings, no errors

what specs say:
|               When tabulating data for ECL models, the data in the
|               [Pulldown] table is measured with the output in the 'logic
|               low' state.  In other words, the data in the table represents
|               the V/I characteristics of the output when the output is at
|               the most negative of its two logic levels.  Likewise, the data
|               in the [Pullup] table is measured with the output in the
|               'logic one' state and represents the V/I characteristics when
|               the output is at the most positive logic level.  Note that in
|               BOTH of these cases, the data is referenced to the Vcc supply
|               voltage, using the equation:  Vtable = Vcc - Voutput.
|

It's ambiguous, because we have [Pullup Reference], [Pulldown Reference], [Voltage Range]
but not Vcc

If my example is legal, there is no use for [Pulldown Reference], and it should be
always discarded. If my example is illegal, then specs and parser should
be corrected.

Any comments?

Thanks a lot

Nik
nikolai@avanticorp.com

From owner-ibis  Mon Mar 15 23:40:00 1999
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Hans Pichlmaier

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From owner-ibis  Tue Mar 16 08:46:02 1999
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Subject: Re: How to model a bidirectional trisate device with the input grounded.
To: laplan@tellabs.com (Sandra Laplanche)
Date: Tue, 16 Mar 1999 10:39:35 -0600 (CST)
Cc: ibis-users@eda.org, laplan@tellabs.com
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> Hi,
>
> Is anyone looking into my question which is described below?
>
>
> Thanks!
> 
> Sandra








> 
> This is a multi-part message in MIME format.
> 
> --------------404E71479D4
> Content-Type: text/plain; charset=us-ascii
> Content-Transfer-Encoding: 7bit
> 
> To whom it may concern:
> 
> My question is how to create an .s2i file for a bidirectional tristate
> device connected like this.  The input (IN) is connected to GND within
> the chip, the CIN is directed into the chip and is not accessible to me.
> The OUT is the output pin and it is the only one that is accessible to
> me. The OEN line is the output enable which is also internal to the chip
> hence not accessible and it is active low.  Hence, the OEN is the only
> signal that can cause a transition at the output pin.  I need also need
> the .s2i file to generate an rising and falling curve.  I have attached
> the hspice file.
> 
> 
> 
> 
>               /|
>       CIN____/ |____ 
>              \ |    |
>               \|    | 
>                     |
>             |\      |
>      IN ____| \_____|_____ OUT
>        |    | /
>       ----  |/o                
>        --     |
>               |
>               |
>                OEN
> 
> 
> 
> Pleae reply to laplan@tellabs.com
> 
> --------------404E71479D4
> Content-Type: text/plain; charset=us-ascii; name="fsel.sp"
> Content-Transfer-Encoding: 7bit
> Content-Disposition: inline; filename="fsel.sp"
> 
> * Subcircuit pc3b05 PAD I OEN CIN
> *.SUBCKT pc3b05 PAD I OEN CIN 
> 
> .LIB '/home/tellabf/vlsitool/vlsi_tech_libraries/hspice_vcmn4/vcmn4.lib' TY
> .INCLUDE '/home/tellabf/vlsitool/vlsi_tech_libraries/hspice_vcmn4/vcmn4.inc'
> 
> M1      U15_U12_U6_drain U15_oenb VDD     VDD     P   L=.40U  
> +  W=12.00U  
> M2      U15_oenb OEN     VDD     VDD     P   L=.40U  W=12.00U  
> M3      U15_U12_U6_drain U15_oenb VSS     VSS     N   L=.40U  W=9.60U 
> M4      U15_U12_U7_drain U15_oenb U15_U12_U6_drain VSS     N   L=.40U 
> +   W=9.60U  
> M5      U15_bulkdriver VDD     U15_U12_U7_drain VSS     N   L=.40U  
> +  W=9.60U  
> M6      U15_bulkdriver U15_U12_U6_drain U15_U12_U10_sour VSS     N   
> +  L=.40U  W=9.60U  
> M7      U15_U12_U10_sour U26_padinv U15_oenb VSS     N   L=.40U  
> +  W=9.60U  
> M8      U15_oenb OEN     VSS     VSS     N   L=.40U  W=9.60U  
> M9      U15_n_gate I       VSS     VSS     N   L=.40U  W=19.20U  
> M10     U15_p_gate U15_oenb U15_n_gate VSS     N   L=.40U  W=19.20U  
> M11     U15_p_gate I       VDD     VDD     P   L=.40U  W=24.00U  
> M12     U15_n_gate OEN     U15_p_gate VDD     P   L=.40U  W=24.00U  
> M13     U15_n_gate OEN     VSS     VSS     N   L=.40U  W=9.60U  
> M14     U15_p_gate U15_oenb VDD     VDD     P   L=.40U  W=12.00U  
> M15     U18_pad5vtol VDD     PAD     VSS     N   L=1.00U  W=49.95U  
> M16     U18_floatbulk U15_bulkdriver VDD    U18_floatbulk P   L=.50U 
> +   W=40.00U  
> M17     U15_bulkdriver VDD    PAD     U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M18     U16_pfb VDD    PAD     U18_floatbulk P   L=.50U  W=10.00U  
> M19     U17_nbw VSS    VSS    VSS     N   L=.40U  W=48.00U  
> M20     U17_nfb U18_pad5vtol U17_nbw VSS     N   L=.40U  W=48.00U  
> M21     U17_nfb VSS    VDD    VDD     P   L=.40U  W=6.00U  
> M22     U26_padinv U18_pad5vtol VDD     VDD     P   L=.40U  W=24.00U  
> M23     U18_pad5vtol U26_padinv VDD     VDD     P   L=.50U  W=.90U  
> M24     CIN     U26_padinv VDD     VDD     P   L=.40U  W=36.00U  
> M25     U26_padinv U18_pad5vtol VSS     VSS     N   L=.40U  W=9.60U  
> M26     CIN     U26_padinv VSS     VSS     N   L=.40U  W=19.20U  
> M27     U16_pfb PAD     U16_M72$5_source U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M28     U16_pfb PAD     U16_M72$4_source U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M29     U16_pfb PAD     U16_M72$3_source U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M30     U16_pfb PAD     U16_M72$2_source U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M31     U16_pfb PAD     U16_M72$1_source U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M32     U16_pfb PAD     U16_M72$0_source U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M33     U16_M72$5_source VDD    VDD    U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M34     U16_M72$4_source VDD    VDD    U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M35     U16_M72$3_source VDD    VDD    U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M36     U16_M72$2_source VDD    VDD    U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M37     U16_M72$1_source VDD    VDD    U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M38     U16_M72$0_source VDD    VDD    U18_floatbulk P   L=.50U  
> +  W=10.00U  
> M39     U16_U1_drain U15_oenb VSS    VSS     N   L=.40U  W=9.60U  
> M40     U16_pfb VDD    U16_U1_drain VSS     N   L=.40U  W=9.60U  
> M41     PAD     U17_nfb U19_M62$5_source VSS     N   L=.50U  W=54.00U 
> M42     PAD     U17_nfb U19_M62$4_source VSS     N   L=.50U  W=54.00U 
> M43     PAD     U17_nfb U19_M62$3_source VSS     N   L=.50U  W=54.00U 
> M44     PAD     U17_nfb U19_M62$2_source VSS     N   L=.50U  W=54.00U 
> M45     PAD     U17_nfb U19_M62$1_source VSS     N   L=.50U  W=54.00U 
> M46     PAD     U17_nfb U19_M62$0_source VSS     N   L=.50U  W=54.00U 
> M47     U19_M62$5_source U15_n_gate VSS    VSS     N   L=.50U  
> +  W=54.00U  
> M48     U19_M62$4_source U15_n_gate VSS    VSS     N   L=.50U  
> +  W=54.00U  
> M49     U19_M62$3_source U15_n_gate VSS    VSS     N   L=.50U  
> +  W=54.00U  
> M50     U19_M62$2_source U15_n_gate VSS    VSS     N   L=.50U  
> +  W=54.00U  
> M51     U19_M62$1_source U15_n_gate VSS    VSS     N   L=.50U  
> +  W=54.00U  
> M52     U19_M62$0_source U15_n_gate VSS    VSS     N   L=.50U  
> +  W=54.00U  
> M53     U21_M61$11_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M54     U21_M61$10_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M55     U21_M61$9_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M56     U21_M61$8_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M57     U21_M61$7_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M58     U21_M61$6_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M59     U21_M61$5_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M60     U21_M61$4_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M61     U21_M61$3_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M62     U21_M61$2_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M63     U21_M61$1_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M64     U21_M61$0_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M65     PAD     U16_pfb U21_M61$11_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M66     PAD     U16_pfb U21_M61$10_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M67     PAD     U16_pfb U21_M61$9_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M68     PAD     U16_pfb U21_M61$8_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M69     PAD     U16_pfb U21_M61$7_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M70     PAD     U16_pfb U21_M61$6_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M71     PAD     U16_pfb U21_M61$5_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M72     PAD     U16_pfb U21_M61$4_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M73     PAD     U16_pfb U21_M61$3_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M74     PAD     U16_pfb U21_M61$2_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M75     PAD     U16_pfb U21_M61$1_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M76     PAD     U16_pfb U21_M61$0_drain U18_floatbulk P   L=.50U  
> +  W=66.80U  
> M79     U25_MNUN3$1_drai U25_R1_r1 VSS    VSS     N   L=.50U  
> +  W=54.00U  
> M80     U25_MNUN3$0_drai U25_R1_r1 VSS    VSS     N   L=.50U  
> +  W=54.00U  
> M81     PAD     U25_R2_r2 U25_MNUN3$1_drai VSS     N   L=.50U  
> +  W=54.00U  
> M82     PAD     U25_R2_r2 U25_MNUN3$0_drai VSS     N   L=.50U  
> +  W=54.00U  
> R77 U25_R1_r1 VSS 1.2000K  $[NW] 
> R78 VDD U25_R2_r2 1.2000K  $[NW] 
> 
> .END
> 
> 
> --------------404E71479D4--
> 
> 

From owner-ibis  Tue Mar 16 09:06:44 1999
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unsubscribe
From owner-ibis  Tue Mar 16 09:41:27 1999
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X-Mailer: exmh version 2.0delta 6/3/97
To: nikolai@avanticorp.com
cc: ibis-users@vhdl.org
Subject: Re: ecl 
In-reply-to: Your message of "Mon, 15 Mar 1999 16:41:20 PST."
             <199903160041.QAA09826@iris.src.avanticorp.com> 
Mime-Version: 1.0
Content-Type: text/plain; charset=us-ascii
Date: Tue, 16 Mar 1999 09:36:00 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>


Hello Nik:

   Very briefly, the examples below are 'legal' in that they are valid syntax.
This is why they pass the parser. The question is -- are they correct?
Here is how I would describe traditional (positive supply = 0v) 10K or
100K ECL logic.

ECL logic has no active pulldown transistor, and it's logic
levels are referenced to the most positive supply.  Also, remember
that if the [Pullup Reference] keyword is not explicitly used, [Voltage
Range] becomes the pullup reference.  Therefore, the simplest way
to set the references would be*:

|Variable                  typ    min    max
[Voltage Range]            0.0    0.0    0.0  | sets the references for both
                                              | logic levles
[Power Clamp Reference]    0.0    0.0    0.0  | included assuming the device
                                              | has an input clamp to VCC

  The important thing to note is that you do NOT need a pulldown reference. 
A [Pulldown Reference] is required only when the devices output has an active
pulldowns structure (i.e. can sink current), AND the reference for that 
pulldown
device is something other than 0v (traditional ground).  With an open-emitter
logic family like ECL, the pulldown simply does not apply.

(*Alternatively, you may want to use the [Voltage Range] keyword to document
the VEE supply conditions.  In this case use the [Pullup Reference] keyword
as follows:

|Variable                   typ    min    max
[Voltage Range]             -4.5  -4.0    -5.0  | 100k ECL
[Pullup Reference]          0.0    0.0    0.0   | overrides [Voltage Range]
[Power Clamp Reference]     0.0    0.0    0.0
)

Finally, for completeness, a 3.3v PECL device is shown.

|Variable                   typ    min    max
[Voltage Range]             3.3    3.0    3.6
[Power Clamp Reference]     0.0    0.0    0.0

Again, all that needs to be specified is the most positive logic rail, and
both the [Pullup] and [Pulldown] curves are referenced against it.

Hope this helps.

    Regards,
    Stephen Peers
    Intel Corp.


Nikoli wrote:
> 
> Hi IbiS Gurus
> 
> I am wondering if anybody can point me at a site(s) where I can
> find ibis files with ECL models of all 4 ECL types.
> 
> If there is an expert in ECL-syntax could you please spend a minute
> looking at this:
> 
> this is legal:
> --------------
> |Variable                  typ    min    max
> [Voltage Range]            0.0    0.0    0.0
> [Pulldown Reference]       0.0    0.0    0.0
> [Power Clamp Reference]    0.0    0.0    0.0
> [GND Clamp Reference]      -3.3   -3.0   -3.8
> 
> 
> this is legal:
> --------------
> |Variable                   typ    min    max
> [Voltage Range]             3.3    3.0    3.8
> [Pulldown Reference]        3.3    3.0    3.8
> [Power Clamp Reference]     3.3    3.0    3.8
> [Gnd Clamp Reference]       0.0    0.0    0.0
> 
> 
> howabout this?
> -------------
> |Variable                   typ    min    max
> [Voltage Range]             3.3    3.0    3.8
> [Pullup Reference]          3.3    3.0    3.8
> [Power Clamp Reference]     3.3    3.0    3.8
> [Gnd Clamp Reference]       0.0    0.0    0.0
> 
> I changed [Pulldown Reference] -> [Pullup Reference],
> [Pulldown Reference] is omitted, so it defaults to zero.
> 
> ibischk3 does not complain, no warnings, no errors
> 
> what specs say:
> |               When tabulating data for ECL models, the data in the
> |               [Pulldown] table is measured with the output in the 'logic
> |               low' state.  In other words, the data in the table represents
> |               the V/I characteristics of the output when the output is at
> |               the most negative of its two logic levels.  Likewise, the data
> |               in the [Pullup] table is measured with the output in the
> |               'logic one' state and represents the V/I characteristics when
> |               the output is at the most positive logic level.  Note that in
> |               BOTH of these cases, the data is referenced to the Vcc supply
> |               voltage, using the equation:  Vtable = Vcc - Voutput.
> |
> 
> It's ambiguous, because we have [Pullup Reference], [Pulldown Reference], [Voltage Range]
> but not Vcc
> 
> If my example is legal, there is no use for [Pulldown Reference], and it should be
> always discarded. If my example is illegal, then specs and parser should
> be corrected.
> 
> Any comments?
> 
> Thanks a lot
> 
> Nik
> nikolai@avanticorp.com


From owner-ibis  Tue Mar 16 11:13:02 1999
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Date: Tue, 16 Mar 1999 10:55:28 -0800
From: Mark Nguyen <mark@apsimtech.com>
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from the IBIS-User reflector mailing list.

To IBIS-reflector maintenance person:

People are using:  ibis-users@eda.org and ibis-users@vhdl.org
to unsubscribe.  Is this the correct method?

I thought the correct email address is  ibis-request@eda.org.


Best regards,

Mark Nguyen
http://www.apsimtech.com


From owner-ibis  Tue Mar 16 11:35:35 1999
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Date: Tue, 16 Mar 1999 11:28:42 -0800 (PST)
From: Syed Huq <shuq@cisco.com>
Reply-To: Syed Huq <shuq@cisco.com>
Subject: Re: How to model a bidirectional trisate device with the input grounded.
To: laplan@tellabs.com
Cc: ibis-users@eda.org
MIME-Version: 1.0
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Hello,

You could try the following syntax:
(Partial .s2i file)
|  Spice_node   signal    model_name  R_pin L_pin C_pin
|-------------------------------------------------------
[Pin]
1    0          GND        GND
2    PAD       MY_IO      Trisate
->   IN    ENBL
IN   I  input  dummy1
ENBL OEN enable dummy2
3   VDD          PWR      POWER
|
|------------------------------------------------------
|

[model] Tristate
[model type] I/O
[Polarity] Non-Inverting
[Enable] active-low
[model file] mymodel.typ mymodel.min mymodel.max
[Rising waveform]  50 0 NA NA NA NA NA NA NA
[Falling waveform] 50 3.3 NA NA NA NA NA NA NA
[Rising waveform]  50 3.3 NA NA NA NA NA NA NA
[Falling waveform] 50 0.0 NA NA NA NA NA NA NA

[model] dummy1
[nomodel]

[model] dummy2
[nomodel]

The mymodel.typ,min,max refers to your process corner models.

You should also refer to the /doc section of s2ibis2 for detailed description
of s2i syntax.

Also look under the /examples dir and see ex2 and ex3 for Tri-state buffer
modeling.

Regards,
Syed.
Cisco Systems, Inc 

> X-SMAP-Received-From: outside
> From: laplan@tellabs.com
> Subject: Re: How to model a bidirectional trisate device with the input 
grounded.
> To: laplan@tellabs.com (Sandra Laplanche)
> Date: Tue, 16 Mar 1999 10:39:35 -0600 (CST)
> Cc: ibis-users@eda.org, laplan@tellabs.com
> MIME-Version: 1.0
> Content-Transfer-Encoding: 7bit
> 
> > Hi,
> >
> > Is anyone looking into my question which is described below?
> >
> >
> > Thanks!
> > 
> > Sandra
> 
> 
> 
> 
> 
> 
> 
> 
> > 
> > This is a multi-part message in MIME format.
> > 
> > --------------404E71479D4
> > Content-Type: text/plain; charset=us-ascii
> > Content-Transfer-Encoding: 7bit
> > 
> > To whom it may concern:
> > 
> > My question is how to create an .s2i file for a bidirectional tristate
> > device connected like this.  The input (IN) is connected to GND within
> > the chip, the CIN is directed into the chip and is not accessible to me.
> > The OUT is the output pin and it is the only one that is accessible to
> > me. The OEN line is the output enable which is also internal to the chip
> > hence not accessible and it is active low.  Hence, the OEN is the only
> > signal that can cause a transition at the output pin.  I need also need
> > the .s2i file to generate an rising and falling curve.  I have attached
> > the hspice file.
> > 
> > 
> > 
> > 
> >               /|
> >       CIN____/ |____ 
> >              \ |    |
> >               \|    | 
> >                     |
> >             |\      |
> >      IN ____| \_____|_____ OUT
> >        |    | /
> >       ----  |/o                
> >        --     |
> >               |
> >               |
> >                OEN
> > 
> > 
> > 
> > Pleae reply to laplan@tellabs.com
> > 
> > --------------404E71479D4
> > Content-Type: text/plain; charset=us-ascii; name="fsel.sp"
> > Content-Transfer-Encoding: 7bit
> > Content-Disposition: inline; filename="fsel.sp"
> > 
> > * Subcircuit pc3b05 PAD I OEN CIN
> > *.SUBCKT pc3b05 PAD I OEN CIN 
> > 
> > .LIB '/home/tellabf/vlsitool/vlsi_tech_libraries/hspice_vcmn4/vcmn4.lib' TY
> > .INCLUDE '/home/tellabf/vlsitool/vlsi_tech_libraries/hspice_vcmn4/vcmn4.inc'
> > 
> > M1      U15_U12_U6_drain U15_oenb VDD     VDD     P   L=.40U  
> > +  W=12.00U  
> > M2      U15_oenb OEN     VDD     VDD     P   L=.40U  W=12.00U  
> > M3      U15_U12_U6_drain U15_oenb VSS     VSS     N   L=.40U  W=9.60U 
> > M4      U15_U12_U7_drain U15_oenb U15_U12_U6_drain VSS     N   L=.40U 
> > +   W=9.60U  
> > M5      U15_bulkdriver VDD     U15_U12_U7_drain VSS     N   L=.40U  
> > +  W=9.60U  
> > M6      U15_bulkdriver U15_U12_U6_drain U15_U12_U10_sour VSS     N   
> > +  L=.40U  W=9.60U  
> > M7      U15_U12_U10_sour U26_padinv U15_oenb VSS     N   L=.40U  
> > +  W=9.60U  
> > M8      U15_oenb OEN     VSS     VSS     N   L=.40U  W=9.60U  
> > M9      U15_n_gate I       VSS     VSS     N   L=.40U  W=19.20U  
> > M10     U15_p_gate U15_oenb U15_n_gate VSS     N   L=.40U  W=19.20U  
> > M11     U15_p_gate I       VDD     VDD     P   L=.40U  W=24.00U  
> > M12     U15_n_gate OEN     U15_p_gate VDD     P   L=.40U  W=24.00U  
> > M13     U15_n_gate OEN     VSS     VSS     N   L=.40U  W=9.60U  
> > M14     U15_p_gate U15_oenb VDD     VDD     P   L=.40U  W=12.00U  
> > M15     U18_pad5vtol VDD     PAD     VSS     N   L=1.00U  W=49.95U  
> > M16     U18_floatbulk U15_bulkdriver VDD    U18_floatbulk P   L=.50U 
> > +   W=40.00U  
> > M17     U15_bulkdriver VDD    PAD     U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M18     U16_pfb VDD    PAD     U18_floatbulk P   L=.50U  W=10.00U  
> > M19     U17_nbw VSS    VSS    VSS     N   L=.40U  W=48.00U  
> > M20     U17_nfb U18_pad5vtol U17_nbw VSS     N   L=.40U  W=48.00U  
> > M21     U17_nfb VSS    VDD    VDD     P   L=.40U  W=6.00U  
> > M22     U26_padinv U18_pad5vtol VDD     VDD     P   L=.40U  W=24.00U  
> > M23     U18_pad5vtol U26_padinv VDD     VDD     P   L=.50U  W=.90U  
> > M24     CIN     U26_padinv VDD     VDD     P   L=.40U  W=36.00U  
> > M25     U26_padinv U18_pad5vtol VSS     VSS     N   L=.40U  W=9.60U  
> > M26     CIN     U26_padinv VSS     VSS     N   L=.40U  W=19.20U  
> > M27     U16_pfb PAD     U16_M72$5_source U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M28     U16_pfb PAD     U16_M72$4_source U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M29     U16_pfb PAD     U16_M72$3_source U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M30     U16_pfb PAD     U16_M72$2_source U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M31     U16_pfb PAD     U16_M72$1_source U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M32     U16_pfb PAD     U16_M72$0_source U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M33     U16_M72$5_source VDD    VDD    U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M34     U16_M72$4_source VDD    VDD    U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M35     U16_M72$3_source VDD    VDD    U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M36     U16_M72$2_source VDD    VDD    U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M37     U16_M72$1_source VDD    VDD    U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M38     U16_M72$0_source VDD    VDD    U18_floatbulk P   L=.50U  
> > +  W=10.00U  
> > M39     U16_U1_drain U15_oenb VSS    VSS     N   L=.40U  W=9.60U  
> > M40     U16_pfb VDD    U16_U1_drain VSS     N   L=.40U  W=9.60U  
> > M41     PAD     U17_nfb U19_M62$5_source VSS     N   L=.50U  W=54.00U 
> > M42     PAD     U17_nfb U19_M62$4_source VSS     N   L=.50U  W=54.00U 
> > M43     PAD     U17_nfb U19_M62$3_source VSS     N   L=.50U  W=54.00U 
> > M44     PAD     U17_nfb U19_M62$2_source VSS     N   L=.50U  W=54.00U 
> > M45     PAD     U17_nfb U19_M62$1_source VSS     N   L=.50U  W=54.00U 
> > M46     PAD     U17_nfb U19_M62$0_source VSS     N   L=.50U  W=54.00U 
> > M47     U19_M62$5_source U15_n_gate VSS    VSS     N   L=.50U  
> > +  W=54.00U  
> > M48     U19_M62$4_source U15_n_gate VSS    VSS     N   L=.50U  
> > +  W=54.00U  
> > M49     U19_M62$3_source U15_n_gate VSS    VSS     N   L=.50U  
> > +  W=54.00U  
> > M50     U19_M62$2_source U15_n_gate VSS    VSS     N   L=.50U  
> > +  W=54.00U  
> > M51     U19_M62$1_source U15_n_gate VSS    VSS     N   L=.50U  
> > +  W=54.00U  
> > M52     U19_M62$0_source U15_n_gate VSS    VSS     N   L=.50U  
> > +  W=54.00U  
> > M53     U21_M61$11_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M54     U21_M61$10_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M55     U21_M61$9_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M56     U21_M61$8_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M57     U21_M61$7_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M58     U21_M61$6_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M59     U21_M61$5_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M60     U21_M61$4_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M61     U21_M61$3_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M62     U21_M61$2_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M63     U21_M61$1_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M64     U21_M61$0_drain U15_p_gate VDD    U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M65     PAD     U16_pfb U21_M61$11_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M66     PAD     U16_pfb U21_M61$10_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M67     PAD     U16_pfb U21_M61$9_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M68     PAD     U16_pfb U21_M61$8_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M69     PAD     U16_pfb U21_M61$7_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M70     PAD     U16_pfb U21_M61$6_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M71     PAD     U16_pfb U21_M61$5_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M72     PAD     U16_pfb U21_M61$4_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M73     PAD     U16_pfb U21_M61$3_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M74     PAD     U16_pfb U21_M61$2_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M75     PAD     U16_pfb U21_M61$1_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M76     PAD     U16_pfb U21_M61$0_drain U18_floatbulk P   L=.50U  
> > +  W=66.80U  
> > M79     U25_MNUN3$1_drai U25_R1_r1 VSS    VSS     N   L=.50U  
> > +  W=54.00U  
> > M80     U25_MNUN3$0_drai U25_R1_r1 VSS    VSS     N   L=.50U  
> > +  W=54.00U  
> > M81     PAD     U25_R2_r2 U25_MNUN3$1_drai VSS     N   L=.50U  
> > +  W=54.00U  
> > M82     PAD     U25_R2_r2 U25_MNUN3$0_drai VSS     N   L=.50U  
> > +  W=54.00U  
> > R77 U25_R1_r1 VSS 1.2000K  $[NW] 
> > R78 VDD U25_R2_r2 1.2000K  $[NW] 
> > 
> > .END
> > 
> > 
> > --------------404E71479D4--
> > 
> > 
> 

From owner-ibis  Tue Mar 16 12:44:20 1999
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Dear Mark Nguyen,

>To IBIS-reflector maintenance person:
>
>People are using:  ibis-users@eda.org and ibis-users@vhdl.org
>to unsubscribe.  Is this the correct method?
>
>I thought the correct email address is  ibis-request@eda.org.

You are correct.  Unfortunately, messages sent out over the reflectors don't have instructions for unsubscribing appended to them. It would be nice ...

Regards,
Matthew Flora
IBIS Open Forum Secretary
(425) 869-2320 PH
(425) 881-1008 FAX
mbflora@hyperlynx.com
HyperLynx, 17641 NE 67th Court, Redmond, WA 98052 USA

From owner-ibis  Wed Mar 17 05:52:36 1999
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Reply-To: <m-lamson@ti.com>
From: "Mike Lamson" <m-lamson@ti.com>
To: <ibis-users@vhdl.org>
Subject: IBIS Package Model
Date: Wed, 17 Mar 1999 07:46:27 -0600
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Does anyone know how to represent RLC in IBIS for a ground plane with
multiport nodes?  The issues is the capacitance.  The inductance and
resistance can be described between any two ports of the plane but how to
represent the capacitance in IBIS is a mystery.  If the total plane
capacitance is used, it gets repeated for each port which over estimates it
in the model.

Thanks,

Mike Lamson
m-lamson@ti.com


From owner-ibis  Wed Mar 17 15:47:15 1999
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From: gedlund@us.ibm.com
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Subject: IBIS Package Model
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Mike,

Can you elaborate a little more?  It sounds like you're trying to model the
ground plane in a package as a non-ideal return path.  Usually we make the
assumption in transmission line analysis that the return terminals are
connected to ideal ground, but this doesn't work when you're modeling power
rail collapse on an IC due to package inductance.  It sounds like you want
a package model with two ports for each signal conductor and more than two
ports for the ground conductor.  Is this the case?  If so, you're talking
about a 3-D package model since a package model based on a 2-D cross
section would only have two ports for a non-ideal ground.

The quick answer is that IBIS can do coupled lumped package models or
uncoupled distributed package models, but not coupled distributed package
models.  In my experience, I've used multiple lumped segments to describe a
package; these were based on multiple unique 2-D cross sections with
non-ideal grounds.  However, I've never seen anyone derive a coupled
distributed package model from a 3-D field analysis.

Greg Edlund
Advisory Engineer, Critical Net Analysis
IBM
3650 Hwy. 52 N, Dept. HDC
Rochester, MN 55901
gedlund@us.ibm.com


---------------------- Forwarded by Gregory R Edlund/Rochester/IBM on
03/17/99 05:21 PM ---------------------------


"Mike Lamson" <m-lamson@ti.com> on 03/17/99 07:46:27 AM

Please respond to m-lamson@ti.com

To:   ibis-users@vhdl.org
cc:    (bcc: Gregory R Edlund/Rochester/IBM)
Subject:  IBIS Package Model





Does anyone know how to represent RLC in IBIS for a ground plane with
multiport nodes?  The issues is the capacitance.  The inductance and
resistance can be described between any two ports of the plane but how to
represent the capacitance in IBIS is a mystery.  If the total plane
capacitance is used, it gets repeated for each port which over estimates it
in the model.

Thanks,

Mike Lamson
m-lamson@ti.com





From owner-ibis  Wed Mar 17 15:49:27 1999
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Subject: IBIS Accuracy Specification 2.0 development
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The IBIS Accuracy Subcommittee is planning for version 2.0 of the IBIS
Accuracy Specification.  It is our intention to bring the IBIS Accuracy
Specification up-to-speed with IBIS in the next 1-2 years.  However, we
will be working with limited resources and will need to prioritize.  Here
is a list of possible topics to include in version 2.0:

1. VT tables (This is a necessity.)
2. Additional model types, i.e. GTL, ECL, open source, etc.
3. Effect of R_load on simulation accuracy
4. Package modeling and simultaneous switching noise
5. Diode stored charge effects
6. Multi-staged drivers
7. Dynamic clamping

I generated this list from browsing through IBIS 3.2 and reading "Practical
Issues with IBIS Models," by Bob Ross.  If you can think of things to add
to this list or have any thoughts on how to prioritize it, please email the
users reflector.


Greg Edlund
Advisory Engineer, Critical Net Analysis
IBM
3650 Hwy. 52 N, Dept. HDC
Rochester, MN 55901
gedlund@us.ibm.com


From owner-ibis  Wed Mar 17 18:09:37 1999
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gedlund@us.ibm.com wrote:
> 
> Mike,
> 
> Can you elaborate a little more?  It sounds like you're trying to model the
> ground plane in a package as a non-ideal return path.  Usually we make the
> assumption in transmission line analysis that the return terminals are
> connected to ideal ground, but this doesn't work when you're modeling power
> rail collapse on an IC due to package inductance.  It sounds like you want
> a package model with two ports for each signal conductor and more than two
> ports for the ground conductor.  Is this the case?  If so, you're talking
> about a 3-D package model since a package model based on a 2-D cross
> section would only have two ports for a non-ideal ground.
> 
> The quick answer is that IBIS can do coupled lumped package models or
> uncoupled distributed package models, but not coupled distributed package
> models.  In my experience, I've used multiple lumped segments to describe a
> package; these were based on multiple unique 2-D cross sections with
> non-ideal grounds.  However, I've never seen anyone derive a coupled
> distributed package model from a 3-D field analysis.
> 
> Greg Edlund
> Advisory Engineer, Critical Net Analysis
> IBM
> 3650 Hwy. 52 N, Dept. HDC
> Rochester, MN 55901
> gedlund@us.ibm.com
> 
> ---------------------- Forwarded by Gregory R Edlund/Rochester/IBM on
> 03/17/99 05:21 PM ---------------------------
> 
> "Mike Lamson" <m-lamson@ti.com> on 03/17/99 07:46:27 AM
> 
> Please respond to m-lamson@ti.com
> 
> To:   ibis-users@vhdl.org
> cc:    (bcc: Gregory R Edlund/Rochester/IBM)
> Subject:  IBIS Package Model
> 
> Does anyone know how to represent RLC in IBIS for a ground plane with
> multiport nodes?  The issues is the capacitance.  The inductance and
> resistance can be described between any two ports of the plane but how to
> represent the capacitance in IBIS is a mystery.  If the total plane
> capacitance is used, it gets repeated for each port which over estimates it
> in the model.
> 
> Thanks,
> 
> Mike Lamson
> m-lamson@ti.com
Full wave solvers will give you S parameters. These can be interpreted 
into SPICE Laplace transfer functions that retain the frequency effects.
Therefore its possible to have the behavior of the system modeled in
a simulator accurately. Other approaches involve FDTD and similiar
methods. However Mike's question pertains to IBIS. In that regard
Greg's answer seems correct. Lumped RLC circuits from 3d analysis can
become large and hard to handle by time domain simulation.  

Best Regards,
-- 
Fred Balistreri
fred@apsimtech.com

http://www.apsimtech.com
From owner-ibis  Thu Mar 18 06:33:14 1999
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Reply-To: <m-lamson@ti.com>
From: "Mike Lamson" <m-lamson@ti.com>
To: <ibis-users@vhdl.org>
Subject: FW: IBIS Package Model
Date: Thu, 18 Mar 1999 08:27:01 -0600
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Sorry for not providing enough info.  Yes, it is 3D model with signals, a
power plane, and a ground plane.  A certain set of loads on the chip bring
current in the power plane and return it on the ground plane (ignore the
signals for this case).  I can represent a number of input and output ports
on the ground and power planes with RL elements (both self and mutual).
There is a capacitance between the planes.  If I try to represent these
paths in IBIS, the meaning of the capacitance becomes an issue (I can't use
the total plane capacitance for each path).

This still may not be clear but someone once said that if you can phrase a
good question, you already know the answer.

Regards,

Mike Lamson

-----Original Message-----
From: Fred Balistreri [mailto:owner-ibis@server.eda.org]
Sent: Wednesday, March 17, 1999 9:48 PM
To: gedlund@us.ibm.com
Cc: ibis-users@vhdl.org
Subject: Re: IBIS Package Model


-MSG M#=   973754 FR=MS1P TO=MIKL   SENT=03/17/99  09:48 PM  TYPE=N
     R#=067 ST=C DIV=0003 CC=06960 BY=MS1P AT=03/17/99 09:48 PM

  To: gedlund@us.ibm.com                <gedlund@us.ibm.com>

Copy: ibis-users@vhdl.org               <ibis-users@vhdl.org>

From: Fred Balistreri                   <owner-ibis@server.eda.org>

Subj:  Re: IBIS Package Model

gedlund@us.ibm.com wrote:
>
> Mike,
>
> Can you elaborate a little more?  It sounds like you're trying to model
the
> ground plane in a package as a non-ideal return path.  Usually we make the
> assumption in transmission line analysis that the return terminals are
> connected to ideal ground, but this doesn't work when you're modeling
power
> rail collapse on an IC due to package inductance.  It sounds like you want
> a package model with two ports for each signal conductor and more than two
> ports for the ground conductor.  Is this the case?  If so, you're talking
> about a 3-D package model since a package model based on a 2-D cross
> section would only have two ports for a non-ideal ground.
>
> The quick answer is that IBIS can do coupled lumped package models or
> uncoupled distributed package models, but not coupled distributed package
> models.  In my experience, I've used multiple lumped segments to describe
a
> package; these were based on multiple unique 2-D cross sections with
> non-ideal grounds.  However, I've never seen anyone derive a coupled
> distributed package model from a 3-D field analysis.
>
> Greg Edlund
> Advisory Engineer, Critical Net Analysis
> IBM
> 3650 Hwy. 52 N, Dept. HDC
> Rochester, MN 55901
> gedlund@us.ibm.com
>
> ---------------------- Forwarded by Gregory R Edlund/Rochester/IBM on
> 03/17/99 05:21 PM ---------------------------
>
> "Mike Lamson" <m-lamson@ti.com> on 03/17/99 07:46:27 AM
>
> Please respond to m-lamson@ti.com
>
> To:   ibis-users@vhdl.org
> cc:    (bcc: Gregory R Edlund/Rochester/IBM)
> Subject:  IBIS Package Model
>
> Does anyone know how to represent RLC in IBIS for a ground plane with
> multiport nodes?  The issues is the capacitance.  The inductance and
> resistance can be described between any two ports of the plane but how to
> represent the capacitance in IBIS is a mystery.  If the total plane
> capacitance is used, it gets repeated for each port which over estimates
it
> in the model.
>
> Thanks,
>
> Mike Lamson
> m-lamson@ti.com
Full wave solvers will give you S parameters. These can be interpreted
into SPICE Laplace transfer functions that retain the frequency effects.
Therefore its possible to have the behavior of the system modeled in
a simulator accurately. Other approaches involve FDTD and similiar
methods. However Mike's question pertains to IBIS. In that regard
Greg's answer seems correct. Lumped RLC circuits from 3d analysis can
become large and hard to handle by time domain simulation.

Best Regards,
--
Fred Balistreri
fred@apsimtech.com

http://www.apsimtech.com

From owner-ibis  Fri Mar 19 05:30:02 1999
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Date: Fri, 19 Mar 1999 08:23:28 -0500
From: Mike LaBonte <mikelabonte@cadence.com>
Organization: Cadence Design Systems
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To: IBIS Users <ibis-users@vhdl.org>
Subject: duplicate models in a Driver Schedule
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It is not clear to me whether or not model names that appear in the
[Driver Schedule] section of an IBIS file must be unique. In the IBIS
spec example, a different model name is used on each line. But the
description text does not require that they must be unique.

So my question is, could a [Driver Schedule] section legally use
the same model name twice? Something like this:

[Driver Schedule]
| Model_name     Rise_on_dly  Rise_off_dly  Fall_on_dly  Fall_off_dly
  MODEL_OUT      0.0ns        NA            0.0ns        NA
  MODEL_OUT      0.5ns        NA            0.5ns        NA

In other words, what if both stages turn on/off at different times,
but are otherwise identical?

Mike LaBonte

P.S. Here is the ver_3.0.ibs example, for reference:

[Driver Schedule]
| Model_name     Rise_on_dly  Rise_off_dly  Fall_on_dly  Fall_off_dly
  MODEL_OUT      0.0ns        NA            0.0ns        NA
|
|                                  Examples of added multi-staged transitions
  M_O_SOURCE1     0.5ns        NA            0.5ns        NA
|              low (high-Z) to high        high to low (high-Z)
  M_O_SOURCE2    0.5n         1.5n          NA           NA
|               low to high to low           low (high-Z)
  M_O_DRAIN1     1.0n         NA            1.5n         NA
|              low to high (high-Z)        high (high-Z) to low
  M_O_DRAIN2     NA           NA            1.5n         2.0n
|                  high (high-Z)           high to low to high
|                                  Bus-hold stage
  M_O_DRAIN3     NA           1.0n          NA           0.5n
|              high (high-Z) to low        low to high (high-Z)
From owner-ibis  Fri Mar 19 13:36:51 1999
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From: bob_ross@mentorg.com (Bob Ross)
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Date: Fri, 19 Mar 99 13:30:55 PST
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To: ibis-users@eda.org, mikelabonte@cadence.com
Subject: Re:  duplicate models in a Driver Schedule

Mike:

It is permitted to use the same model several times under
[Driver Schedule], as you have shown.  There is no statement
in the Specification that prohibits this.  Also, ibischk3 permits
this syntax.

Bob Ross
Mentor Graphics


> Date: Fri, 19 Mar 1999 08:23:28 -0500
> From: Mike LaBonte <mikelabonte@cadence.com>
> To: IBIS Users <ibis-users@vhdl.org>
> Subject: duplicate models in a Driver Schedule


> It is not clear to me whether or not model names that appear in the
> [Driver Schedule] section of an IBIS file must be unique. In the IBIS
> spec example, a different model name is used on each line. But the
> description text does not require that they must be unique.

> So my question is, could a [Driver Schedule] section legally use
> the same model name twice? Something like this:

> [Driver Schedule]
> | Model_name     Rise_on_dly  Rise_off_dly  Fall_on_dly  Fall_off_dly
>   MODEL_OUT      0.0ns        NA            0.0ns        NA
>   MODEL_OUT      0.5ns        NA            0.5ns        NA

> In other words, what if both stages turn on/off at different times,
> but are otherwise identical?

> Mike LaBonte

> P.S. Here is the ver_3.0.ibs example, for reference:

> [Driver Schedule]
> | Model_name     Rise_on_dly  Rise_off_dly  Fall_on_dly  Fall_off_dly
>   MODEL_OUT      0.0ns        NA            0.0ns        NA
> |
> |                                  Examples of added multi-staged transitions
>   M_O_SOURCE1     0.5ns        NA            0.5ns        NA
> |              low (high-Z) to high        high to low (high-Z)
>   M_O_SOURCE2    0.5n         1.5n          NA           NA
> |               low to high to low           low (high-Z)
>   M_O_DRAIN1     1.0n         NA            1.5n         NA
> |              low to high (high-Z)        high (high-Z) to low
>   M_O_DRAIN2     NA           NA            1.5n         2.0n
> |                  high (high-Z)           high to low to high
> |                                  Bus-hold stage
>   M_O_DRAIN3     NA           1.0n          NA           0.5n
> |              high (high-Z) to low        low to high (high-Z)


From owner-ibis  Thu Mar 25 11:59:39 1999
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Date: Thu, 25 Mar 1999 11:48:45 -0800 (PST)
Message-Id: <199903251948.LAA01341@iris.src.avanticorp.com>
To: ibis-users@eda.org
Subject: For ecl- buffers experts
X-Sun-Charset: US-ASCII


To ecl- buffers experts:

For ecl buffers, can we have an ibis file with 
2 rising and 2 falling waveforms (RWF/FWF) ?

I would answer, why not?

However, IBIS specs contains Sec 9, "Notes on
data derivation methods", which specify how to derive
rising/falling waveforms. This part specifies, that
for ecl buffers, the termination voltage, Vterm = Vcc - 2V.
The only one termination voltage suggests only one
waveform. 

Unlike ECL part, CMOS buffers part recommends
2 termination voltages to use: Vdd and Vss, hence
we can derive 2 FWFs and 2 RWFs.

Any comments, suggestions

Thanks a lot

-------------------------------
 Nikolai Bannov
 Avant! Corporation 
 46871 Bayside Parkway
 Fremont, CA 94538

 tel: 510-413-8634
 fax: 510-413-8080
 email: nikolai@avanticorp.com
-------------------------------
From owner-ibis  Thu Mar 25 14:36:41 1999
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Date: Thu, 25 Mar 1999 16:30:33 -0600
Subject: IBIS Users Group Minutes 3/19/99
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IBIS Users Group Minutes 3/19/99


Participants on 3/19/99

Greg Edlund, IBM
Bob Haller, Compaq
Bob Ross, Mentor Grpahics
Fabrizio Zanella, EMC
Dima Smolyansky, TDA Systems


Next conference call:

Date:  4/9/99
Time:  8:00 - 9:55 am PST
Phone number:  to be announced
Pass code:  to be announced


CHECK-IN

There were no announcements, corrections to previous meeting's minutes, or
additions to the agenda.


GENERAL BUSINESS

Kellee Crisafulli provided an update from the Connector Group via email and
Fabrizio Zanella provided an update during the call.  The Connector Group
has met since DesignCon99.  They are currently discussing the topic of
frequency-dependent losses and are currently leaning toward not including
them in the first version of the connector BIRD.  This question needs to be
settled before issuing a BIRD.

Ed Sayre requested a discussion of the need for future face-to-face Users
Group meetings.  Bob Haller said he thought the last meeting was
well-attended and productive.  He goes on record as being in favor of a
face-to-face meeting.  Bob Haller will call Ed Sayre to set up the next
meeting.


PART I:  IBIS ACCURACY SUBCOMMITTEE

IBIS ACCURACY SPECIFICATION 1.2 REVISIONS

Greg Edlund will distribute version 1.2 of the spec in MS Word format
during the week of March 29.  IBIS Accuracy participants should review
version 1.2 and come prepared to discuss the changes during the next Users
Group conference call.

The group discussed what the version number should be.  Bob Haller reminded
us that the IBIS Accuracy Subcommittee had decided last year to make the
version of the IBIS Accuracy Spec track the version of IBIS itself.  Bob
Haller is in favor of keeping this convention.  Greg Edlund argued that we
may someday be mixing features from IBIS 2.1 and 3.2 in the same version of
the IBIS Accuracy spec, which might add confusion if we say we're tracking
with IBIS.  Bob Ross suggested that we keep bumping the version from 1.1 to
1.2, etc. until we are ready to take the spec to the Open Forum for a vote.

ACCURACY-RELATED BIRD(S)

There was some productive feedback from the IBIS users list regarding the
possibility of issuing a new BIRD that would describe the test loads
outlined in the IBIS Accuracy Spec.  Several people expressed opinions in
favor of a machine-readable format.  This is ultimately the direction in
which the IBIS Accuracy Subcommittee would like to go because it would
facilitate automated computation of behavioral vs. golden waveform
correlation metrics.  However, a new BIRD would entail more discussion at
the Open Forum.  Since we want to focus on approval of the IBIS Accuracy
Spec first, we decided to put off an new BIRD until later this year.  In
the meantime, we can use the existing VT capabilities of IBIS to capture
our new golden waveforms.

APPROVAL  PROCESS

Getting approval of the IBIS Accuracy Specification is a two-step process,
according to Bob Ross.  First, we need to bring the document before the
Open Forum for a vote.  Second, we proceed with formal approval by the EIA.
The group decided to take version 1.2 of the spec to the Open Forum, which
will be ready for review before the next Users Group conference call.

IBIS ACCURACY SPECIFICATION DEVELOPMENT

The group decided to put off any work on the next generation of the IBIS
Accuracy Specification until the first version is well into the approval
process.  Greg Edlund already sent an email to the users reflector on this
topic; this was a bit premature.  Action item #7 will remain open until it
is appropriate to bring this topic up for discussion again.

TEST BOARD

Bob Haller and Greg Edlund discussed the test board in a private
conversation and concluded that they did not have the bandwidth to pursue
changes in the test board at this time.  However, the changes that need to
be made are very minor and would probably only take 1-2 days of board
design time.  If National is able to volunteer some design (and/or fab)
resources, Bob and Greg would put in the necessary effort to help turn the
board design.  Greg Edlund notes that the test board tar file on the web
contains a list of errata.

ACCURACY ACTION ITEMS:  5 open, 3 closed

Review list and add new items.

1.  Status: open.  Opened: 2/26/99  Owner: Greg Edlund.  Edit measurement
and correlation sections of the IBIS Accuracy Specification and distribute
the new document.

2.  Status: CLOSED.  Opened: 2/26/99  Owner: Greg Edlund.  Write email to
the reflector soliciting input on the contents of an accuracy-related BIRD.
At issue is whether or not to include a machine-readable description of the
test loads described in the IBIS Accuracy Specification.

3.  Status: open.  Opened: 2/26/99  Owner: Peter LaFlamme.  Make VCX16244
SPICE model and IBIS datasheet available on the accuracy web page.

4.  Status: CLOSED.  Opened: 2/26/99  Owner: Bob Haller, Greg Edlund.
Discuss test board changes off-line.

5.  Status: open.  Opened: 2/26/99  Owner: Milt Schwarz.  Get quote for
building revision 3 of the test board.

6.  Status: open.  Opened: 2/26/99  Owner: Greg Edlund.  Write test board
application note.

7.  Status: open.  Opened: 2/26/99  Owner: Greg Edlund.  Send out a note to
the reflector suggesting possible candidates for accuracy development in
1999.

8.  Status: open:  Opened 3/19/99  Owner:  Bob Haller.  Call Ed Sayre to
set up next face-to-face Users Group meeting.


PART II:  EDUCATION SUBCOMMITTEE

There was no discussion about education as Ed Sayre was not present for the
call.


Greg Edlund
Advisory Engineer, Critical Net Analysis
IBM
3650 Hwy. 52 N, Dept. HDC
Rochester, MN 55901
gedlund@us.ibm.com


From owner-ibis  Thu Mar 25 16:55:09 1999
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X-Mailer: exmh version 2.0delta 6/3/97
To: nikolai@avanticorp.com
cc: ibis-users@eda.org
Subject: Re: For ecl- buffers experts 
In-reply-to: Your message of "Thu, 25 Mar 1999 11:48:45 PST."
             <199903251948.LAA01341@iris.src.avanticorp.com> 
Mime-Version: 1.0
Content-Type: text/plain; charset=us-ascii
Date: Thu, 25 Mar 1999 16:49:28 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>

> 
> To ecl- buffers experts:
> 
> For ecl buffers, can we have an ibis file with 
> 2 rising and 2 falling waveforms (RWF/FWF) ?
> 
> I would answer, why not?

  And I would reply, what's the point?  An ECL output is not a totem-pole
(pullup/pulldown) structure.  The two waveform approach is designed 
specifically to isolate a pullup xsistors characteristics from a
pulldown xsistor characteristics, as well as determine the amount of time
between one turning off and the other turning on.  This simply just
doesn't apply to the open-emitter output of an ECL device.

   Regards,
   Stephen Peters
   Intel Corp.


> 
> However, IBIS specs contains Sec 9, "Notes on
> data derivation methods", which specify how to derive
> rising/falling waveforms. This part specifies, that
> for ecl buffers, the termination voltage, Vterm = Vcc - 2V.
> The only one termination voltage suggests only one
> waveform. 
> 
> Unlike ECL part, CMOS buffers part recommends
> 2 termination voltages to use: Vdd and Vss, hence
> we can derive 2 FWFs and 2 RWFs.
> 
> Any comments, suggestions
> 
> Thanks a lot
> 
> -------------------------------
>  Nikolai Bannov
>  Avant! Corporation 
>  46871 Bayside Parkway
>  Fremont, CA 94538
> 
>  tel: 510-413-8634
>  fax: 510-413-8080
>  email: nikolai@avanticorp.com
> -------------------------------


From owner-ibis  Fri Mar 26 03:46:24 1999
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From: Andrew Ingraham <Andrew.Ingraham@digital.com>
To: ibis-users@eda.org
Subject: RE: For ecl- buffers experts
Date: Fri, 26 Mar 1999 06:40:55 -0500
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The pulldown is a required part of ECL; it doesn't operate without one.
ECL wouldn't work if you used a pullup to Vdd (Vcc) instead.

For CMOS, the pullups/pulldowns just give the buffer a load to work
into; and unlike ECL, CMOS can both source and sink output current.

Regards,
Andy

From owner-ibis  Fri Mar 26 11:16:30 1999
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Date: Fri, 26 Mar 1999 14:10:46 -0500
From: Mike LaBonte <mikelabonte@cadence.com>
Organization: Cadence Design Systems
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Regarding the c_comp issue discussed in the Mar 26 IBIS meeting,
related to BIRD 58, I would like to register my opinion in favor
of allowing for the use of separate c_comp values attributed to
each Driver Schedule stage.

Although c_comp may be named as such because of the original
intention that it encapsulate an overall component level capacitance,
the practical matter is that Driver Schedule stages are most
likely to correspond to actual transistors in an IO section. Each
transistor does have it's own effective die capacitance. The
designer of the stage buffers may (should) have validated their
behavior individually, with c_comp intact. To then use them in a
scenario where the c_comp values are not used may not make sense.
(insert discussion of the aggregate capacitance for a cluster of
transistors vs. sum of individually calculated capacitances here).

Furthermore, IBIS could gain maximum flexibility by stating that
the c_comp values of individual stages are used in addition to
the c_comp that might be specified for the top-level model. In
this way, model designers can specify c_comp=0 for any portion
that is not to be used. This part of the proposal is debatable in
my own mind, simply because I have some difficulty producing an
elegant explanation of what the top-level capacitance represents,
when the`"transistor" capacitance is already accounted for. But it
offers flexibility. And it eliminates the requirement that simulators
ignore c_comp data present in the Model, which users may not be aware
of.

Mike LaBonte

Muranyi, Arpad wrote:
> 
> ****************************************************************************
> **
> ****************************************************************************
> **
> 
> BIRD ID#:        58
> ISSUE TITLE:     Driver Schedule keyword clarification
> REQUESTER:       Arpad Muranyi, Intel Corporation
> DATE SUBMITTED:  3/2/99
> DATE ACCEPTED BY IBIS OPEN FORUM:  pending
> 
> ****************************************************************************
> **
> ****************************************************************************
> **
> 
> STATEMENT OF THE ISSUE:
> 
> The [Driver Schedule] section of the latest IBIS specification (v3.2) does
> not provide enough information to the model maker and EDA tool vendor on
> essential details of this keyword.  The spec. can be interpreted in several
> different ways which can lead to serious discrepancies and consequences.
> 
> ****************************************************************************
> **
> 
> STATEMENT OF THE RESOLVED SPECIFICATIONS:
> 
> One paragraph from BIRD35.3 is included in the [Driver Schedule] usage rules
> section of the specification.  This portion seems to have been
> inadvertently left out from the spec. and explains the gray areas.
> 
> The additional words do not change the original intent behind this keyword.
> It is only added to spell out how the keyword must be used so that the model
> maker and EDA tool vendor could be in agreement on how the model works.
> 
> The new section is marked with a "*" character at the beginning of each
> line.
> 
> |===========================================================================
> ==
> |     Keyword:  [Driver Schedule]
> |    Required:  No
> | Description:  Describes the relative model switching sequence for
> referenced
> |               models to produce a multi-staged driver.
> | Usage Rules:  The [Driver schedule] keyword establishes a hierarchical
> order
> |               between models and should be placed under the [Model] which
> |               acts as the top-level model.  The scheduled models are then
> |               referenced from the top-level [Model] by the [Driver
> Schedule]
> |               keyword.
> |
> |*              The [Driver Schedule] keyword overrides any existing
> [Pullup],
> |*              [Pulldown] and [Ramp] or [Rising Waveform] and [Falling
> |*              Waveform] data for that model.  However, the required tables
> |*              for [Model] are still required for backwards compatibility
> |*              reasons for simulators which do not support multi-staged
> |*              switching.  This information can be used as a composite
> model
> |*              cross-check, although the resulting model may not perform in
> |*              the same manner as the multi-stage model.
> |
> |               The [Driver Schedule] table consists of five columns.  The
> |               first column contains the model names of other models that
> |               exists in the .ibs file.  The remaining four columns
> describe
> |               delays: Rise_on_dly, Rise_off_dly, Fall_on_dly, and
> |               Falling_off_dly.  All values are referenced to 0 seconds for
> |               the start of the rising transition and 0 seconds for the
> start
> |               of the falling transition.  All delays must be equal to or
> |               greater than 0.
> |
> |               The Rise_on_dly entry gives the beginning of the low-to-high
> 
> |               transition.  The Rise_off_dly entry may be given to end the
> |               low-to-high transition and initiate a high-to-low transition
> 
> |               during the rising cycle.  Similarly, the Fall_on_dly gives
> |               the beginning of the high-to-low transition.  The
> Fall_off_dly
> |               may be given to end the high-to-low transition and initiate
> a
> |               low-to-high transition.
> |
> |               Use 'NA' when no transition is applicable.  For each model,
> |               the transition sequence must be complete, i.e., it must
> start
> |               and end at the same state.
> |
> |               Only the [Pulldown] and [Pullup] tables and transition data
> |               [Ramp] or [Rising Waveform] and [Falling Waveform] data are
> |               used from each model that is referenced.  The [Model]
> keyword
> |               provides the specification information, [GND Clamp] and
> [POWER
> |               Clamp], and C_comp, regardless of information contained in
> |               the referenced models.
> |
> |               It is recommended that a "golden waveform" for the device
> |               consisting of a [Rising Waveform] table and a [Falling
> |               Waveform] table be supplied under the [Model] keyword to
> |               serve as a reference for validation.
> |
> |               No [Driver Schedule] may reference a model which itself has
> |               within it a [Driver Schedule] table keyword.
> |
> | Other Notes:  The added models typically consist of Open_sink (Open_drain)
> 
> |               or Open_source models to provide sequentially increased
> drive
> |               strengths.  The added drive may be removed within the same
> |               transition for a momentary boost or during the opposite
> |               transition.
> |
> |               The syntax also allows for reducing the drive strength.
> |
> |               Note that the Rise_on_dly, Rise_off_dly, Fall_on_dly,
> |               Fall_off_dly parameters are single value parameters, so
> |               typical, minimum and maximum conditions cannot be described
> |               with them directly.  In order to account for those effects,
> |               one can refer to the fastest waveform table with the delay
> |               number and then insert an appropriate amount of horizontal
> |               lead in section in those waveforms which need more delay.
> |
> |               Note: In a future release, the [Driver Schedule] keyword may
> |               be replaced by a newer method of specification that is
> |               consistent with some other planned extensions.  However, the
> |               [Driver Schedule] syntax will continue to be supported.
> |---------------------------------------------------------------------------
> --
> [Driver Schedule]
> | Model_name     Rise_on_dly  Rise_off_dly  Fall_on_dly  Fall_off_dly
>   MODEL_OUT      0.0ns        NA            0.0ns        NA
> |
> |                                  Examples of added multi-staged
> transitions
>   M_O_SOURCE1     0.5ns        NA            0.5ns        NA
> |              low (high-Z) to high        high to low (high-Z)
>   M_O_SOURCE2    0.5n         1.5n          NA           NA
> |               low to high to low           low (high-Z)
>   M_O_DRAIN1     1.0n         NA            1.5n         NA
> |              low to high (high-Z)        high (high-Z) to low
>   M_O_DRAIN2     NA           NA            1.5n         2.0n
> |                  high (high-Z)           high to low to high
> |
> |===========================================================================
> ==
> 
> ****************************************************************************
> **
> 
> ANALYSIS PATH/DATA THAT LED TO SPECIFICATION:
> 
> An attempt to build an IBIS 3.2 buffer model for a three-stage buffer using
> the [Driver Schedule] keyword failed.  The initial testing of this model
> with the tools of two EDA vendors showed only two of the three stages
> working.  This happened because the first stage of the buffer was placed
> into the "main" [Model] section of the IBIS model due to a personal
> interpretation of the IBIS 3.2 spec.  After consulting with several people,
> it became apparent that the specification does not mention some of the key
> information that is necessary to build a correct IBIS model for this kind of
> a buffer.
> 
> The following paragraph in BIRD35.3 contains the missing information which
> is necessary for making correct IBIS models using the [Driver Schedule]
> keyword.  This section seems to have been accidentally left out from the
> specification, and should be pasted into the appropriate location as shown
> above.  (Note that the first and second sentences are deleted because they
> do not provide new information in the context above).
> 
> "The new keyword [Driver Schedule] provides a syntax for sequencing other
> models.  This is given as a keyword under the [Model] keyword.  It overrides
> any existing [Pullup], [Pulldown] and [Ramp] or [Rising Waveform] and
> [Falling Waveform] data for that model.  However, the required tables for
> [Model] are still required for backwards compatibility reasons for
> simulators
> which do not support multi-staged switching.  This information can be used
> as a composite model cross-check, although the resulting model may not
> perform in the same manner as the multi-stage model."
> 
> ****************************************************************************
> **
> 
> ANY OTHER BACKGROUND INFORMATION:
> 
> Telephone conversation with Bob Ross on 2-26-99 confirmed that the IBIS
> specification is missing the description of some of the usage rules which
> were documented in BIRD35.3 and was implemented accordingly in ICX.
> 
> ****************************************************************************
> **
From owner-ibis  Fri Mar 26 17:10:39 1999
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From: "dennis lee" <dennis_w_lee@hotmail.com>
To: ibis-users@eda.org
Subject: Problems with S2IBIS2 Modelling
Date: Fri, 26 Mar 1999 17:04:55 PST
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Hi IBIS Users,

I'm relatively new at modelling IBIS and am using S2IBIS2 utility from
NCSU. I'm currently having problems with the below.

1. I have an IO buffer that have 4 input ports and one IO port. How do I
model this in S2IBIS file??

2. When I use a Open_sink model type, the returned results are only for
[Pulldown] and [dV/dt]. Why aren't there results returned for [Power
Clamps] and [Ground Clamps] as specified in the IBIS 2.1 specification?? 
                                                                          
Appreciate any help from any current S2IBIS2 users.

Regards,
Dennis
Get Your Private, Free Email at http://www.hotmail.com
From owner-ibis  Mon Mar 29 09:16:57 1999
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Date: Mon, 29 Mar 1999 12:11:23 -0500 (EST)
From: Ghanem Ghandour <s1136121@aix2.uottawa.ca>
To: ibis-users@vhdl.org
Subject: Seeking more information.
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Dear Sir or Madam:

I am a University graduate in Electrical Engineering.  I am very interested
in learning more about IBIS modeling.  If you would please let me know
where I can get more information about this subject.

Your input is really apriciated.

Sincerely,
Ghanem Ghandour

From owner-ibis  Mon Mar 29 12:14:14 1999
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To: Ghanem Ghandour <s1136121@aix2.uottawa.ca>
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Subject: Re: Seeking more information. 
In-reply-to: Your message of "Mon, 29 Mar 1999 12:11:23 EST."
             <Pine.A41.3.95q.990329120810.26198A-100000@aix2.uottawa.ca> 
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From: Stephen Peters <sjpeters@ichips.intel.com>

> Dear Sir or Madam:
> 
> I am a University graduate in Electrical Engineering.  I am very interested
> in learning more about IBIS modeling.  If you would please let me know
> where I can get more information about this subject.
> 
> Your input is really apriciated.
> 
> Sincerely,
> Ghanem Ghandour

Hello Ghanem:

   Please visit the IBIS web site at  http://www.eia.org/eig/ibis/ibis.htm
There you will find articles on IBIS, an FAQ, cookbooks and copies of the IBIS
specification itself.

    Best Regards,
    Stephen Peters
    Intel Corp.
    Vice Chair, EIA IBIS Open Forum


From owner-ibis  Mon Mar 29 18:11:05 1999
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To: Mike LaBonte <mikelabonte@cadence.com>, ibis@eda.org, ibis-users@eda.org
Subject: Re: BIRD 58
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Mike:

Thank you for your input.  You have some valid points regarding
allowing C_comp to be distributed.  This will work for creating
driver models as the summation of individual drivers.  The 
problem is that if the top-level model is an I/O model, we
would normally not put in a C_comp value = 0.  Then in the
Input mode, we would have to add up all of the C_comps in 
the lower level models to come up with the effective C_comp.

This is a possible workable solution that does not require
any Specification syntax change - just a few more words of
interpretation.  It would also support moving all of the
C_comp to the top-level for another method of building a
behavioral buffer by construction.

We will have to consider this.

Bob Ross
Mentor Graphics

Subject: Re: BIRD 58
Date: Fri, 26 Mar 1999 14:10:46 -0500
From: Mike LaBonte <mikelabonte@cadence.com>
To: ibis-users@vhdl.org



Regarding the c_comp issue discussed in the Mar 26 IBIS meeting,
related to BIRD 58, I would like to register my opinion in favor
of allowing for the use of separate c_comp values attributed to
each Driver Schedule stage.

Although c_comp may be named as such because of the original
intention that it encapsulate an overall component level capacitance,
the practical matter is that Driver Schedule stages are most
likely to correspond to actual transistors in an IO section. Each
transistor does have it's own effective die capacitance. The
designer of the stage buffers may (should) have validated their
behavior individually, with c_comp intact. To then use them in a
scenario where the c_comp values are not used may not make sense.
(insert discussion of the aggregate capacitance for a cluster of
transistors vs. sum of individually calculated capacitances here).

Furthermore, IBIS could gain maximum flexibility by stating that
the c_comp values of individual stages are used in addition to
the c_comp that might be specified for the top-level model. In
this way, model designers can specify c_comp=0 for any portion
that is not to be used. This part of the proposal is debatable in
my own mind, simply because I have some difficulty producing an
elegant explanation of what the top-level capacitance represents,
when the`"transistor" capacitance is already accounted for. But it
offers flexibility. And it eliminates the requirement that simulators
ignore c_comp data present in the Model, which users may not be aware
of.

Mike LaBonte
From owner-ibis  Wed Mar 31 08:14:14 1999
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OK, just when I think I know what C_comp is supposed to be I am led to
suspect a misunderstanding.  At the risk of asking a stupid question - I
think it is important for me to know the "bottom line" definition since
I am currently creating models for use by our customers.  The ver3_2
spec. (and previous versions) define C_comp as Si die capacitance.  From
the terminator model (and cookbook) I have assumed that meant the DC
capacitance to GND (substrate) looking at the actual pad (pad meaning
metal actually deposited on Si) for a given I, I/O, O etc. looking into
the placed and routed buffer.  From other sources (classes, people,
email) I keep hearing C_comp referred to as "component" Si die
capacitance.  This was recently described to me as total Si "chip"
capacitance.  Now, I don't know what that means - but it doesn't sound
like my assumption.  Is my understanding of what C_comp is supposed to
represent correct?

Thanks,
--Rob
--

Rob Goodrich
Circuit Design - Advanced Imaging Technology (AIT)
Motorola SPS, I&E Solutions
6501 William Cannon Drive West MD: OE37
Austin, TX 78735
ra3862@email.sps.mot.com
(512) 895-7341


From owner-ibis  Wed Mar 31 08:31:19 1999
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From: "Muranyi, Arpad" <arpad.muranyi@intel.com>
To: "'Robert Goodrich'" <ra3862@email.sps.mot.com>, ibis-users@eda.org
Subject: RE: C_comp Confusion
Date: Wed, 31 Mar 1999 08:25:38 -0800
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Rob,

C_comp is everything that you see when you look into the chip at the pad.
That includes pad capacitance, metal capacitance, transistor parasitics,
and everything you can think of.

Does this answer your question?

Arpad
=========================================================================

-----Original Message-----
From: Robert Goodrich [mailto:ra3862@email.sps.mot.com]
Sent: Wednesday, March 31, 1999 7:13 AM
To: ibis-users@eda.org
Subject: C_comp Confusion


OK, just when I think I know what C_comp is supposed to be I am led to
suspect a misunderstanding.  At the risk of asking a stupid question - I
think it is important for me to know the "bottom line" definition since
I am currently creating models for use by our customers.  The ver3_2
spec. (and previous versions) define C_comp as Si die capacitance.  From
the terminator model (and cookbook) I have assumed that meant the DC
capacitance to GND (substrate) looking at the actual pad (pad meaning
metal actually deposited on Si) for a given I, I/O, O etc. looking into
the placed and routed buffer.  From other sources (classes, people,
email) I keep hearing C_comp referred to as "component" Si die
capacitance.  This was recently described to me as total Si "chip"
capacitance.  Now, I don't know what that means - but it doesn't sound
like my assumption.  Is my understanding of what C_comp is supposed to
represent correct?

Thanks,
--Rob
--

Rob Goodrich
Circuit Design - Advanced Imaging Technology (AIT)
Motorola SPS, I&E Solutions
6501 William Cannon Drive West MD: OE37
Austin, TX 78735
ra3862@email.sps.mot.com
(512) 895-7341

From owner-ibis  Wed Mar 31 09:12:06 1999
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Yes it does - and thanks, now I don't have to change any of my models . . .
--Rob

Muranyi, Arpad wrote:

> Rob,
>
> C_comp is everything that you see when you look into the chip at the pad.
> That includes pad capacitance, metal capacitance, transistor parasitics,
> and everything you can think of.
>
> Does this answer your question?
>
> Arpad
> =========================================================================
>
> -----Original Message-----
> From: Robert Goodrich [mailto:ra3862@email.sps.mot.com]
> Sent: Wednesday, March 31, 1999 7:13 AM
> To: ibis-users@eda.org
> Subject: C_comp Confusion
>
> OK, just when I think I know what C_comp is supposed to be I am led to
> suspect a misunderstanding.  At the risk of asking a stupid question - I
> think it is important for me to know the "bottom line" definition since
> I am currently creating models for use by our customers.  The ver3_2
> spec. (and previous versions) define C_comp as Si die capacitance.  From
> the terminator model (and cookbook) I have assumed that meant the DC
> capacitance to GND (substrate) looking at the actual pad (pad meaning
> metal actually deposited on Si) for a given I, I/O, O etc. looking into
> the placed and routed buffer.  From other sources (classes, people,
> email) I keep hearing C_comp referred to as "component" Si die
> capacitance.  This was recently described to me as total Si "chip"
> capacitance.  Now, I don't know what that means - but it doesn't sound
> like my assumption.  Is my understanding of what C_comp is supposed to
> represent correct?
>
> Thanks,
> --Rob
> --
>
> Rob Goodrich
> Circuit Design - Advanced Imaging Technology (AIT)
> Motorola SPS, I&E Solutions
> 6501 William Cannon Drive West MD: OE37
> Austin, TX 78735
> ra3862@email.sps.mot.com
> (512) 895-7341


--

Rob Goodrich
Circuit Design - Advanced Imaging Technology (AIT)
Motorola SPS, I&E Solutions
6501 William Cannon Drive West MD: OE37
Austin, TX 78735
ra3862@email.sps.mot.com
(512) 895-7341


