IBIS Representation for Branching Conductors

From: MIKE LAMSON MIKL
 
Subj: IBIS Representation for Branching Conductors
 
 
An IBIS question:
I have a package that has a power distribution bus over the chip that is
connected to two external pins. The bus also has many points where it is
wire bonded to the chip. There is also a similar ground bus in the same
package. This is a common lead frame design used in DRAM memories. Can
this be readily represented by an IBIS format? A SPICE file can be easily
generated for this. Can this be converted to IBIS?
 
Thanks and regards,
 
Mike Lamson
m-lamson@ti.com
 
 
Received on Fri Sep 5 14:42:22 1997