Subject: [IBIS-Users] IBIS bump question
From: Eric Hsu (ehsu@netlogicmicro.com)
Date: Fri Nov 22 2002 - 12:20:18 PST
Hi all,
For a wire-bond package, the RLC of the bondwire is generally considered
to be part of the package. For a flip-chip package, is there a convention
for how the bump parasitics should be handled? Is the bump to be
considered part of the package, or part of the die(C_comp)?
Regards,
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