Subject: RE: [IBIS-Users] IBIS bump question
From: Tom Dagostino (tom@teraspeed.com)
Date: Fri Nov 22 2002 - 13:59:09 PST
I started to say the bump C should be part of the package but in reflection
it seems to be part of the die. I'd vote for as part of C_comp because it
is part of the metalization on the die.
Tom Dagostino
Device Modeling Division
Teraspeed Consulting Group LLC
2926 SE Yamhill St.
Portland, OR 97214
(503) 430-1065
tom@teraspeed.com
http://www.teraspeed.com
-----Original Message-----
From: owner-ibis-users@server.eda.org
[mailto:owner-ibis-users@server.eda.org]On Behalf Of Eric Hsu
Sent: Friday, November 22, 2002 12:20 PM
To: ibis-users@server.eda.org
Subject: [IBIS-Users] IBIS bump question
Hi all,
For a wire-bond package, the RLC of the bondwire is generally considered
to be part of the package. For a flip-chip package, is there a convention
for how the bump parasitics should be handled? Is the bump to be
considered part of the package, or part of the die(C_comp)?
Regards,
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