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All IBISians (SI experts by Default !!)
I would like to pose the following SI question, and solicit help from
those who actually know the answer or have a very good idea of how to
estimate it by scaling from previous experience:
Assume one GND and one power plane in a PCB separated by say 10 mil,
with a dielectric constant of say 4. assume that the power plane has a
via opening where current is injected thru the via down to the GND
plane. Let's say that the current is 10 Amps. with a riserime of 1 ns.
Assume nominal via diameter. The drawing below shows the structure:
| Vcc
---------------- | ------------------
| GND 10 mil, Er=4
-----------------|-------------------
What I would like to hear from anybody who actually has experienced
GND plane bounce, is:
*howmuch do you expect the GND plane (not the via stem) to bounce up
(locally) given the above assumptions, and
*howfar away from the via (radially) do you expect the bounce to drop
to 10% of the peak which occurs right where the via meets the plane ?
I would apprciate a good guess (and Why: perhaps from previous
experience), or direction as to "who ?" you think could answer such a
question. I know that I might need to do a 3-D or radial transmission
line analysis of the system, but I'm really just looking for a quick
answer.
Thanks for taking the time to read or answer this question.
Samie Samaan
Intel Corp.
Received on Mon Aug 21 11:32:19 1995
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