Everyone,
I am trying to include the R/L/C of bondwire as part of the package
parameter to the ASIC that is mounted on Hybrid substrate. I know the Resistence
spec. but the vendors are not able to provide the L and C to me. Does anyone
got some number that I can use? Any help is appreciated. Thank you.
Hsin-Huei Lin
Medtronic, Inc.
(612)574-4641
Received on Thu Jul 20 10:39:27 1995
This archive was generated by hypermail 2.1.8 : Fri Jun 03 2011 - 09:52:28 PDT