Re: How to model the L and C of bondwire

Hi,

You can use a lumped LRC model for a typical bond wire.
The values are in the range of L=2nH, C=0.5pF, R=200mohm.

Hope this helps,
Nihat
Motorola, Munich - Germany

> From medtron!relay.medtronic.com!hsin-huei.lin@uunet.uu.net Thu Jul 20 20:22:24 1995
> X-Mailer: Novell GroupWise 4.1
> Date: Thu, 20 Jul 1995 12:32:22 -0500
> From: Hsin-Huei Lin <hsin-huei.lin@medtronic.com>
> To: ibis@vhdl.org
> Subject: How to model the L and C of bondwire
> Content-Length: 352
>
> Everyone,
> I am trying to include the R/L/C of bondwire as part of the package
> parameter to the ASIC that is mounted on Hybrid substrate. I know the Resistence
> spec. but the vendors are not able to provide the L and C to me. Does anyone
> got some number that I can use? Any help is appreciated. Thank you.
>
> Hsin-Huei Lin
> Medtronic, Inc.
> (612)574-4641
>
>
>
Received on Fri Jul 21 01:12:18 1995