Re:

Janne,

Let us separate the power and ground parasitics into 3 categories:

- package parasitics
- bond wire parasitics
- on-die interconnect parasitics

IBIS has multiple methods for handling package parasitics. One of them, the
[Define Package Model] section, can include bond wire parasitics. There is no
good solution for on-die interconnect yet, but the IBIS committee has begun
considering this. The summary is that a good portion of the path from power
and ground pins to the buffers they supply is covered by IBIS, but not all of it.

I would expect that most, if not all, IBIS simulators will use the power and
ground parasitic information if it is present in an IBIS file.

Mike LaBonte

janne.ikavalko@nokia.com wrote:
>
> Hi Everybody!
>
> It came to my mind, that how does simulation with IBIS models take into
> account
> parasitics which comes from power supply and ground pins and bonding wires?
> As I understand only signal line's pin and bonding parasitics are included
> into the simulation.
> However, I think that in real life parasitics from power supply and ground
> bonding wires has some effect also.
>
> My current opinion is that effect from power supply and ground bonding wires
> are not taken into account. Connection to power supply and ground are
> considered ideal.
> Am I right?
>
> I tried to find information about this from IBIS specifications, but I
> couldn't find any.
>
> What is Your opinion, how (much) does this effect to the correctness of the
> simulation result?
>
>
> Best Regards,
> Janne Ikavalko
>
> -- Janne Ikavalko
> -- NMP Tampere, Finland
> -- GSM +358 50 3655120
> -- Janne.Ikavalko@nokia.com
Received on Mon Mar 20 05:43:41 2000