RE: Re[2]: [IBIS] Package on package modelling.

ICM could also describe coupling and
frequency dependent losses...

Arpad
====================================== 

-----Original Message-----
From: owner-ibis@server.eda.org [mailto:owner-ibis@server.eda.org] On Behalf Of Syed Huq (shuq)
Sent: Wednesday, June 13, 2007 8:03 AM
To: Michael Schaeder; Anders Ekholm (KI/EAB)
Cc: IBIS reflector
Subject: RE: Re[2]: [IBIS] Package on package modelling.

It seems that if the two package databases were combined into one (Example, an .mcm file), then it could be possible to do a EBD of the package (with no coupling info).

- Syed 

-----Original Message-----
From: Michael Schaeder [mailto:michael.schaeder@pad.zuken.de] 
Sent: Wednesday, June 13, 2007 7:58 AM
To: Anders Ekholm (KI/EAB)
Cc: Syed Huq (shuq); IBIS reflector
Subject: Re[2]: [IBIS] Package on package modelling.


What about using an EBD?

Regards, Mic.

Wednesday, June 13, 2007, 4:49:57 PM, you wrote:
>
>  
> No I  mean a package on package device. Two packages on top of each 
> other is soldered  to the PCB and both
>  
> drivers/receivers are included at the same time, not like an [Model 
> Selector].
>  
>
> Apperantly we do these package on package components for customers who 
> need models of the devices.
>  
>
> Best  /Anders
>
>  From: Syed Huq (shuq) [mailto:shuq@cisco.com]
> Sent: den 13 juni 2007 16:46
> To: Anders Ekholm (KI/EAB);  IBIS reflector
> Subject: RE: [IBIS] Package on package  modelling.
>
>  
> For  multiple IOs in the same device...
>  
> If  you mean a programmable buffer, then that can be handled using the 
> [Model  Selector] keyword in IBIS.
>  
> (pg29 of spec)
>  
> -  Syed
>
>  From: owner-ibis@eda.org  [mailto:owner-ibis@eda.org] On Behalf Of 
> Anders Ekholm  (KI/EAB)
> Sent: Wednesday, June 13, 2007 3:52 AM
> To: IBIS  reflector
> Subject: [IBIS] Package on package  modelling.
>
>  
> I hope I'm not repeating any dicussions, but I did not find any info 
> in the archives.
>  
> Have we had any discussions on modelling package on  package devices 
> in IBIS. That would mean modelling the package with  forks
>  
> And 2 or possibly more IO's in the same  device. 
>  
> I realise that this could probably be done by using  VHDL-AMS or 
> possible verilog-AMS, but than that model would contain two or more 
> drivers and principly one
>  
> Pad IO connected to the wrapper IBIS script, how  would a simulator 
> control which of the drivers to simulate ?
>  
> It might also be done by a wrapped SPICE model with  the same issues 
> how will the simulator control which IO to switch.
>  
> Another resort would be go to a multi board  simulation construct with 
> two or more diffferent IBIS models, but that would  be simulator 
> dependent.
>  
> How does the Open IBIS forum suggest to model and  distribute a model 
> of a package on package component from the component vendor  ?
>  
> Best /Anders
>  
> ---------------------------------------------------------------
> Anders Ekholm
> Senior Specialist Signal Integrity
> CDU and DXU HW design
>  
> Ericsson Product Development Unit BTS
> SE-164 80 Stockholm, Sweden
> Tel: +46 8 404 27 58
> Fax: +46 8 757 23 40
> email: anders.ekholm@ericsson.com
> ---------------------------------------------------------------
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