RE: [IBIS] IBIS-ISS Package Modeling : The Physics of a Package Model

Romi,

Thanks for your note. The good news is that
BIRD 125 together with BIRD 145 could do that.

Thanks,

Arpad
===============================================

From: owner-ibis@eda.org [mailto:owner-ibis@eda.org] On Behalf Of Romi Mayder
Sent: Monday, July 23, 2012 2:33 PM
To: Walter Katz; ibis@eda.org
Subject: RE: [IBIS] IBIS-ISS Package Modeling : The Physics of a Package Model

Hi Walter, Arpad,

I am interested in expanding the definition below of the package to include passive elements mounted on the substrate such as discrete decoupling capacitors, series inductors, etc . . .

In light of IBIS v5.0 supporting BIRDs 95/98, I believe that any new package modeling BIRDs should include explicit support for the Pull_Up and Power_Clamp nodes.

Kind Regards
Romi

From: owner-ibis@eda.org<mailto:owner-ibis@eda.org> [mailto:owner-ibis@eda.org]<mailto:[mailto:owner-ibis@eda.org]> On Behalf Of Walter Katz
Sent: Friday, July 20, 2012 1:27 PM
To: ibis@eda.org<mailto:ibis@eda.org>
Subject: [IBIS] IBIS-ISS Package Modeling : The Physics of a Package Model

All,

Rather than discussing the possible IBIS solutions for package models, I would like to describe the physics of the problem, and then ask some questions of what part of the physics need to be implemented.

I would like to frame these questions with an example:

Package
150 VDD Pins
150 VSS Pins
100 Single Ended Channel Pins
Die Bump Pads
200 VDD Bump Pads
200 VSS Bump Pads
100 Single Ended Channel Bump Pads
Die Buffer Pads
100 VDD Buffer Pads
100 VSS Buffer Pads
100 Single Ended Channel Buffer Pads

Complete Package Model (describes the full physics of the package interconnect)
150 VDD Pins
150 VSS Pins
100 Single Ended Channel Pins
200 VDD Bump Pads
200 VSS Bump Pads
100 Single Ended Channel Bump Pads
900 total ports

Complete On-Die Model (describes the full physics of the die interconnect)
200 VDD Bump Pads
200 VSS Bump Pads
100 Single Ended Channel Bump Pads
100 VDD Buffer Pads
100 VSS Buffer Pads
100 Single Ended Channel Buffer Pads

A Full Simulation will consist of
Board and all of the stuff on the Board
1 Package model instance
1 on-die model instance
100 IBIS buffers

Connections that need to be rectified
400 connections between Board and Package Model
500 connections between Package Model and On-Die Model
300 connections between On-Die Model and 100 Buffer Models

Questions to IC Vendors:
Is this setup is a completer representation of the problem?
Is it practical to produce the Package Model and On-Die Model in this level of detail?
Do you want/need to use a subset of the on-die VDD and VSS Bump Pads in your On-Die Model?
Do you want to be able to represent the VDD and VSS Bump Pads as two nodes?
Do you already include the interconnect between the Channel Bump Pads and Channel Buffer Pads in your Buffer Model?
Do you need interconnect between VDD and VSS Bump Pads and VDD and VSS Buffer Pads, or is it sufficient to "tie" each VDD and VSS Buffer Pad to specific VDD and VSS Bump Pads.
Do you want to be able to distribute Package and On-Die Models for slices (subsets) of the 100 Channels?
Do you want to be able to distribute multiple Package and On-Die Models with different combinations of the choices above?

Walter

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Received on Mon Jul 23 12:43:22 2012