RE: [IBIS] Package on package modelling.

No I mean a package on package device. Two packages on top of each other
is soldered to the PCB and both
drivers/receivers are included at the same time, not like an [Model
Selector].
 
Apperantly we do these package on package components for customers who
need models of the devices.
 
Best /Anders

________________________________

From: Syed Huq (shuq) [mailto:shuq@cisco.com] 
Sent: den 13 juni 2007 16:46
To: Anders Ekholm (KI/EAB); IBIS reflector
Subject: RE: [IBIS] Package on package modelling.


For multiple IOs in the same device...
If you mean a programmable buffer, then that can be handled using the
[Model Selector] keyword in IBIS.
(pg29 of spec)
 
- Syed

________________________________

From: owner-ibis@eda.org [mailto:owner-ibis@eda.org] On Behalf Of Anders
Ekholm (KI/EAB)
Sent: Wednesday, June 13, 2007 3:52 AM
To: IBIS reflector
Subject: [IBIS] Package on package modelling.



I hope I'm not repeating any dicussions, but I did not find any info in
the archives. 

Have we had any discussions on modelling package on package devices in
IBIS. That would mean modelling the package with forks

And 2 or possibly more IO's in the same device. 

I realise that this could probably be done by using VHDL-AMS or possible
verilog-AMS, but than that model would contain two or more drivers and
principly one

Pad IO connected to the wrapper IBIS script, how would a simulator
control which of the drivers to simulate ? 

It might also be done by a wrapped SPICE model with the same issues how
will the simulator control which IO to switch. 

Another resort would be go to a multi board simulation construct with
two or more diffferent IBIS models, but that would  be simulator
dependent.

How does the Open IBIS forum suggest to model and distribute a model of
a package on package component from the component vendor ?

Best /Anders 

--------------------------------------------------------------- 
Anders Ekholm 
Senior Specialist Signal Integrity 
CDU and DXU HW design 

Ericsson Product Development Unit BTS 
SE-164 80 Stockholm, Sweden 
Tel: +46 8 404 27 58 
Fax: +46 8 757 23 40 
email: anders.ekholm@ericsson.com 
--------------------------------------------------------------- 





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