What about using an EBD? Regards, Mic. Wednesday, June 13, 2007, 4:49:57 PM, you wrote: > > > No I mean a package on package device. Two packages on top of each > other is soldered to the PCB and both > > drivers/receivers are included at the same time, not like an > [Model Selector]. > > > Apperantly we do these package on package components for customers > who need models of the devices. > > > Best /Anders > > From: Syed Huq (shuq) [mailto:shuq@cisco.com] > Sent: den 13 juni 2007 16:46 > To: Anders Ekholm (KI/EAB); IBIS reflector > Subject: RE: [IBIS] Package on package modelling. > > > For multiple IOs in the same device... > > If you mean a programmable buffer, then that can be handled using > the [Model Selector] keyword in IBIS. > > (pg29 of spec) > > - Syed > > From: owner-ibis@eda.org [mailto:owner-ibis@eda.org] On Behalf Of Anders Ekholm (KI/EAB) > Sent: Wednesday, June 13, 2007 3:52 AM > To: IBIS reflector > Subject: [IBIS] Package on package modelling. > > > I hope I'm not repeating any dicussions, but I did not find any > info in the archives. > > Have we had any discussions on modelling package on package > devices in IBIS. That would mean modelling the package with forks > > And 2 or possibly more IO's in the same device. > > I realise that this could probably be done by using VHDL-AMS or > possible verilog-AMS, but than that model would contain two or more > drivers and principly one > > Pad IO connected to the wrapper IBIS script, how would a simulator > control which of the drivers to simulate ? > > It might also be done by a wrapped SPICE model with the same > issues how will the simulator control which IO to switch. > > Another resort would be go to a multi board simulation construct > with two or more diffferent IBIS models, but that would be simulator > dependent. > > How does the Open IBIS forum suggest to model and distribute a > model of a package on package component from the component vendor ? > > Best /Anders > > --------------------------------------------------------------- > Anders Ekholm > Senior Specialist Signal Integrity > CDU and DXU HW design > > Ericsson Product Development Unit BTS > SE-164 80 Stockholm, Sweden > Tel: +46 8 404 27 58 > Fax: +46 8 757 23 40 > email: anders.ekholm@ericsson.com > --------------------------------------------------------------- -- -- This message has been scanned for viruses and dangerous content by MailScanner, and is believed to be clean. -------------------------------------------------------------------- |For help or to subscribe/unsubscribe, e-mail majordomo@eda-stds.org |with the appropriate command message(s) in the body: | | help | subscribe ibis <optional e-mail address, if different> | subscribe ibis-users <optional e-mail address, if different> | unsubscribe ibis <optional e-mail address, if different> | unsubscribe ibis-users <optional e-mail address, if different> | |or e-mail a request to ibis-request@eda-stds.org. | |IBIS reflector archives exist under: | | http://www.eda-stds.org/pub/ibis/email_archive/ Recent | http://www.eda-stds.org/pub/ibis/users_archive/ Recent | http://www.eda-stds.org/pub/ibis/email/ E-mail since 1993Received on Wed Jun 13 07:58:10 2007
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