Re: How to determine per length RLC in a board

From: Yaping Zhou <y.zhou@motorola.com>
Date: Tue Jun 05 2001 - 11:00:20 PDT

Alan & Vinu:

Thank your for your reply.

I am actually interested in package modeling, is "good decoupling" usually a
good assumption in high-speed devices with a limited on-chip decoupling
capacitance?

Yaping

----- Original Message -----
From: "Alan Hilton-Nickel" <ahilton@transmeta.com>
To: "Yaping Zhou (r3aadv)" <y.zhou@motorola.com>
Cc: <ibis-users@eda.org>
Sent: Tuesday, June 05, 2001 12:26 PM
Subject: Re: How to determine per length RLC in a board

Yaping,

In the SIG-GND-PWR, the PWR plane is not a return path for the signal
layer. I suggest you model it as SIG-GND (microstrip). The high-speed
currents will always use the GND plane, assuming good decoupling between
PWR and GND.

Alan

Yaping Zhou wrote:
>
> Hi, All:
>
> If the stackup in a board is a symmetric stripline structure
(GND-SIG-PWR),
> the characteristic impedance is the same for switching high and low, and
the
> per length RLC are also the same for both switching cases.
>
> How to determine the per length RLC in a board with a stackup like
> SIG-GND-PWR? The characteristic impedance and per length RLC are
> switching-dependent, but there is no way to put two values for each trace
in
> an ebd file.
>
> Intel uses ebd to describe packages used for Pentium processors,I have the
> same question there on the way to determine RLC values.
>
> Your help is appreciated.
>
> Thanks,
>
> --
> **************************************
> Yaping Zhou (r3aadv)
> (512) 933-5803
> Motorola Semiconductor Products Sector
> Final Manufacturing Technology Center
> Ed Bluestein, Austin, Texas
> **************************************

 
Received on Tue Jun 5 11:01:16 2001

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