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Welcome to the IBIS Open Forum
NEW IBIS Version 8.0 is approved and available for download!
NEW 2026 Hybrid IBIS Summit @ IEEE SPI Registration
Register to join the meeting on-line or in-person in Turin, Italy on Wednesday, June 17, 2026
Our Specifications
I/O Buffer Information Specification (IBIS 8.0) (SAE/EIA-STD-656-B) (IEC-62014-1)
IBIS Interconnect Modeling Specification (ICM 1.1) (SAE/GEIA-STD-0001)
IBIS Interconnect SPICE Subcircuit Specification (IBIS-ISS 1.0)
Touchstone® File Format Specification (Touchstone 2.1)
Our Sponsors
The IBIS Open Forum is the industry organization responsible for the management of the IBIS specifications and standards including IBIS, IBIS-AMI, IBIS-ISS, ICM, and Touchstone. The Open Forum meets every three weeks by teleconference. Membership is open to all interested companies. If you are interested in joining the IBIS Open Forum, please contact the IBIS Open Forum Chair or any of the IBIS Officers.
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