Re: More on BIRD #???

For whatever it is worth:

We studied this issue in deciding what to do with the DIE spec work. See the
files:

        pub/die/wrkshop2/electric.{mif,ps} (white paper on topic)
        pub/die/wrkshop2/trans_te.{mif,ps} (viewfoils on topic)

on vhdl.org (use same email request to archive@vhdl.org, ftp, etc. as for ibis).

We discovered and analyzed the various forms (even more detailed and
difficult than Bob Ward reports) but discovered most of the power / ground
bounce analysis tools could not handle the complexity. We decided to
simplify to what Kumar of Cadence (or Eric's extension) is proposing --
one power and one ground pin specification per signal pad. See the
DIE_PADS_SUPPLY_GROUPING (page 75 of the DIE Format Reference Manual ver 0.9;
in file pub/die/die0-9/die0-9.{rtf,ps} or on floppy given at Summit) for
our method of specification. By the way, it is a Level 1 setting also!

randy harr
randyh@milpitas.lmc.com
Received on Thu Dec 2 15:31:47 1993