[IBIS] Query on IBIS model of Flipchip IO cell

Hello All,

I've a query regarding IBIS models of Flipchip IO cells.
How can we model the behavior of device used for connection between bump 
pad and flipchip IO pin?
If this is done through package model file, then is it possible to 
handle 2 package files with an IBIS model?
(1 package file for bump pad to IO pin connection and 2nd package file 
for package parasitics at bump pad pin)

Thanks & Regards,
Richa


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