RE: [IBIS] Query on IBIS model of Flipchip IO cell

Typically the parasitics provided in the IBIS format .pkg file characterize 
the package from the die bumps all the way to the BGA balls.  Therefore you 
shouldn't need 2 .pkg files (which I don't think is supported anyway) as the 
contributions of both the die bumps and BGA balls are included in the package model.

-Ray Anderson
Senior signal Integrity Staff Engineer
Xilinx Inc.


-----Original Message-----
From: owner-ibis@server.eda.org on behalf of Richa AHUJA
Sent: Thu 2/12/2009 11:14 PM
To: ibis@server.eda.org
Subject: [IBIS] Query on IBIS model of Flipchip IO cell
 
Hello All,

I've a query regarding IBIS models of Flipchip IO cells.
How can we model the behavior of device used for connection between bump 
pad and flipchip IO pin?
If this is done through package model file, then is it possible to 
handle 2 package files with an IBIS model?
(1 package file for bump pad to IO pin connection and 2nd package file 
for package parasitics at bump pad pin)

Thanks & Regards,
Richa


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