IBIS Virtual Summit with DesignCon 2021

August 19, 2021

Agenda

Minutes

Summit Recording (MP4)

All times PDT

8:00 AM	CHECK IN, INTRODUCTION TO MEETING Randy Wolff (Micron Technology, USA) (Chair, IBIS Open Forum)
8:10 AM	IBIS Chair’s Report Randy Wolff (Micron Technology, USA) (Chair, IBIS Open Forum)
8:25 AM	Checking and Converting Touchstone Files with TSCHK2 Mike LaBonte (The MathWorks, USA)
8:45 AM	Expectations for IBIS 7.1 Michael Mirmak (Intel Corp., USA)
9:00 AM	New Way to Improve Power Supply Induced Jitter Simulation Accuracy for IBIS Model Yifan Ding*, Yin Sun**, Zhiping Yang***, Chulsoon Hwang* (*Missouri S&T, USA; **Zhejiang University, China; ***Google (Waymo), USA) [Presented by Yifan Ding (Missouri S&T, USA)]
9:30 AM	FSV: An Introduction Alistair Duffy*, Gang Zhang** (*De Montford University (President, IEEE EMC Society), UK; **Harbin Institute of Technology, China) [Presented by Alistair Duffy (De Montford University, UK)]
10:00 AM	BREAK (10 minutes)
10:10 AM	Comparison of Interconnect Model Validation with FSV and SPS Metrics Alistair Duffy*, Gang Zhang**, Yuriy Shlepnev*** (*De Montford University, UK; **Harbin Institute  of Technology**, China; ***Simberian, USA) [Presented by Yuriy Shlepnev (Simberian, USA)]
10:40 AM	Secrets of IBIS-AMI Sampling Hansel Dsilva*, Michael Mirmak**, Todd Bermensolo**, Adam Gregory**** (*Achronix Semiconductor, **IBIS Enthusiast, ***Keysight Technologies, ****Samtec; USA) [Presented by Hansel Dsilva (Achronix Semiconductor, USA)]
11:25 AM	GDDR6X IBIS Modeling Randy Wolff*, Arpad Muranyi** (*Micron Technology, **Siemens EDA; USA) [Presented by Randy Wolff*, Arpad Muranyi** (*Micron Technology, **Siemens EDA; USA)]
11:55 AM	Next Generation IBIS-AMI Modeling Walter Katz (The MathWorks, USA)
12:25 PM	CLOSING REMARKS - Next IBIS Open Forum Meeting on August 27, 2021
12:30 PM	END OF MEETING

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