Summit backdrop

IBIS IEEE SPI 2026

European Hybrid IBIS Summit with IEEE SPI 2026

Turin, Italy — June 17, 2026

All times CEST (UTC +2)

Summit Recording Part1 (MP4)

Summit Recording Part2 (MP4)

14:00SIGN IN
14:05 Welcome Douglas Burns (SI-Clarity, USA)
Outgoing Chair, IBIS Open Forum
14:10 IBIS Chair’s Report Douglas Burns (SI-Clarity, USA)
Outgoing Chair, IBIS Open Forum
14:30 Comparative Analysis of C comp Extraction Technique for High-Fidelity IBIS I/O Buffer Modeling
Rahul Kumar (STMicroelectronics, India)
Manish Bansal (STMicroelectronics, India)
Manishka Mishra (STMicroelectronics, India)
[Presented by Manishka Mishra]
14:50 IBIS for I3C serial transmission
Fabio Brina (STMicroelectronics)
15:10 Power Integrity Modeling BIRDS 234 and 235
Arpad Muranyi (Siemens EDA, USA)
Walter Katz (MathWorks, USA)
15:30 IBIS Interconnect Task Group Update: Touchstone 3.0 Features & Progress
Michael Mirmak (Intel, USA)
Chair, Interconnect Task Group
15:50BREAK (20 minutes)
16:10 Accurate SI/PI Analysis of Differential Interfaces: Addressing Limitations in Power Aware IBIS Modeling Methodology
Raushan Kumar (STMicroelectronics, India)
Manish Bansal (STMicroelectronics, India)
[Presented by Raushan Kumar]
16:30 IBIS Importance for SI and PI
Douglas Burns (SI-Clarity, USA)
16:45CLOSING REMARKS — Next IBIS Open Forum Meeting Friday, July 10, 2026
16:50END OF SUMMIT