Booklet (PDF)
Minutes: m110819.pdf 13:00 SIGN IN 13:05 MEETING WELCOMES -
Randy WOLFF (Micron Technology, USA) -
Satoshi NAKAMIZO (Keysight Technologies Japan K.K., Japan) 13:08
2019 Asian IBIS Summit (TOKYO) Meeting Welcomes
Satoshi NAKAMIZO (Keysight Technologies Japan K.K., Japan) 13:08
Introduction of JEITA EC Center (for reference)
Satoshi NAKAMIZO (Keysight Technologies Japan K.K., Japan) 13:08
Introduction of JEITA EC Center (in Japanese)
Satoshi NAKAMIZO (Keysight Technologies Japan K.K., Japan) 13:15
IBIS Chair's Report
Randy WOLFF (Micron Technology, USA) 13:30
Expectations for the New Package Model Specification of IBIS Version 7.0
Masaki KIRINAKA, Akiko TSUKADA (Fujitsu Interconnect Technologies Limited, Japan)
[Presented by Masaki KIRINAKA (Fujitsu Interconnect Technologies Limited, Japan)] 14:00
The On Die Decap Modeling Proposal (BIRD198)
Megumi ONO*, Atsushi TOMISHIMA**
(*Socionext Inc., **Toshiba Electronic Devices & Storage Corporation; Japan)
[Presented by Megumi ONO (Socionext Inc., Japan)] 14:35 IBIS File Format Links
Bob ROSS (Teraspeed Labs, USA)
[Presented by Randy WOLFF (Micron Technology, USA)] 15:00 BREAK 15:20 How to Obtain Buffer Impedance from IBIS
Lance WANG (Zuken, USA) 15:50 A Potential Application of IBIS Models to CISPR25 Based EMI Analysis of DCDC Converter
Kazuyuki SAKATA*, Koji ICHIKAWA**, Miyoko GOTO***, Toshiki KANAMOTO****
(*Renesas Electronics Corporation, **DENSO CORP., ***Ricoh Corp, ****Hirosaki University; Japan)
[Presented by Kazuyuki SAKATA (Renesas Electronics Corporation, Japan)] 16:10 IBIS-AMI & COM Co-design for 25G Serdes
Nan HOU*, Amy ZHANG*, Guohua WANG*, David ZHANG*, Anders EKHOLM**
(Ericsson, *PRC, **Sweden)
[Presented by Anders EKHOLM (Ericsson, Sweden)] 16:50 CONCLUDING ITEMS 17:00 END OF IBIS SUMMIT MEETING |